BUILDING ON THE PAST, READY FOR THE FUTURE: - MEMC

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34 SPArTAnbUrg leArning DiSCovery In 1980, MEMC built a plant in Spartanburg, South Carolina, and began commercial production of 6” (150mm) wafers. when production began, the plant had ten thousand square feet of space and forty-five employees. Combined with the Malaysia plant and expansions at St. Peters, Spartanburg brought MEMC’s total manufacturing capacity to 330 million square inches per year, a 400 percent increase over that of 1978. John Kauffmann, currently senior vice president of worldwide Sales, Customer Service, and Marketing, started his career with Monsanto at the Spartanburg plant and recalls that there was a worldwide learning process that took place between plants. “At our plant we made an etched wafer so it wasn’t a completely finished product and we were shipping it to our plant in Japan. At that time, I was a technology leader and these wafers that we thought were really, really good opened up a learning exchange between how we did things in Spartanburg and how things were done in Japan.” It was such an all-encompassing learning experience that it led to a task force, which John spearheaded, to help improve the quality of the product coming out of the United States. Dr. Larry Shive, MEMC Senior Fellow, commented, “This work was far ahead of any previous or subsequent cleaning and was truly r e v o l u t i o n a r y. ” The process was developed by Wilbur Krusell and coworkers in 1982 and was first installed in St. Peters as the ozone rack cleaner Dr. Larry Shive. in 1983. It was then copied at MEMC factories around the world. Ozone cleaning technology is now a key cleaning step in every wafer and device factory in the world, giving device manufacturers a predictable and uniform oxide growth rate. MultIstrate sIlICon waFers A 1984 brochure entitled “Monsanto: Technology in Silicon” touts the advantages of their MultiStrate silicon wafers, a new class of multilayer products. By this time, device manufacturers were building thousands of ICs on a single chip, requiring improved circuit performance and yield. As a result, the electronic circuitry interacted more dynamically with the physical properties of the silicon. As the brochure said, “the cutting edge of semiconductor technology is now within the silicon.” MultiStrate silicon wafers were a new class of integrated silicon substrate products. The MultiStrate product line was a family of new epitaxial wafers for applications involving high-density silicon-gate CMOS and NMOS. Trademarked EpiStrate, this series of products John Kauffmann, senior vice president of worldwide Sales, Customer Service, and Marketing.
Inner diameter saw with back grinding capability, which reduced the amount of required lapping. combined the superior flatness of the basic Czochralski wafer with an epitaxial layer grown on the polished surface. With the MultiStrate product line, substrate characteristics could STC horizontal saw, late 1970s. be matched to the epitaxial process using a Monsanto proprietary technique for engineering the epitaxial/substrate interface to enhance largescale circuit performance and yield. wafers are inserted into and extracted from a warming oven, slowly allowing them to heat or cool to avoid dislocations in the crystal lattice. A Second Generation of Technology 35
Page 1: B u i l d i n g o n t h e p a s t ,
Page 4 and 5: Copyright © 2009 by MEMC All right
Page 6 and 7: 6 A C K N O w L E D G M E N T S The
Page 8 and 9: 8 This is the story about a large c
Page 10 and 11: 10 The first integrated circuit. Bo
Page 12 and 13: 12 Float Zone reactors for polysili
Page 14 and 15: 14 DiD yoU knoW? The Czochralski pr
Page 16 and 17: 1959 August 6, J. L. Christian, vic
Page 18 and 19: 18 in hiS oWn WorDS: Dr. roberT WAl
Page 20 and 21: 20 Dr. Robert Sandfort, who was nam
Page 22 and 23: 22 Distillation columns at the St.
Page 24 and 25: 24 business got off to a slow start
Page 26 and 27: 26 C H A P T E R T H R E E A Second
Page 28 and 29: 28 1970 The SEMI organization is fo
Page 30 and 31: 30 wafer lapping, 1975. The Milton
Page 32 and 33: 32 Zone refiner. 1 st Left to right
Page 36 and 37: 36 Mortin Sentman slicing wafers. P
Page 38 and 39: 38 In 1980, with the basic technolo
Page 40 and 41: 40 1979 Sony introduces the walkman
Page 42 and 43: 42 1986 MEMC builds the Utsunomiya,
Page 44 and 45: 44 Ralph Hartung, vice president, U
Page 46 and 47: 46 in the past several years, polys
Page 48 and 49: 48 Above: Epi reactor. Left: Epitax
Page 50 and 51: 50 Within a year of its merger with
Page 52 and 53: 1990 Tim Berners-Lee creates the wo
Page 54 and 55: 54 300mm double-sided polishing.
Page 56 and 57: 56 MEMC Southwest Groundbreaking Ce
Page 58 and 59: 58 M E M C A D V E R T I S E M E N
Page 60 and 61: 60 Dr. roberT fAlSTer: in hiS oWn W
Page 62 and 63: 62 A 300mm ingot is loaded onto a c
Page 64 and 65: 64 DiD yoU knoW? In October of 1995
Page 66 and 67: 66 2002 worldwide semiconductor mat
Page 68 and 69: 68 Hörde moved from COO to CEO in
Page 70 and 71: 70 70 MeMC goeS inTo oUTer SPACe! I
Page 72 and 73: 72 Lifestyles have changed dramatic
Page 74 and 75: May 2000 MEMC receives the C. Sheld
Page 76 and 77: 76 The people of MKC celebrate thei
Page 78 and 79: 78 2009 website www.memc.com percen
Page 80: 80 Ahmad Chatila, MEMC President an

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