Review on bolometer technologies - APC

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HERSCHEL PACS high impedance sensor photometer (200µm and 450µm)CEA-LETI Franceλ/4 cavity pixel8 x 256 pixelIndiumbumbsλ/4Si:P BImplantedAugrid8 subarrays each containing 256 bolometers.Thermistor impedance ~ 10GΩ to increase sensitivity andmatch the CMOS noiseA first electronic stage (impedance reduction) is located belowthe quarter wave cavity reflector, at 300 mK.CMOS transistors at 2K located a few cm below the pixelsperform the multiplexingCMOS-based fabrication process is well controlled.Direct imager, feedhorns or antennas are not neededGΩ impedance bolometers are vulnerable to E.M. interferenceDifficult to extend to wavelengths>1mmNew prototypes are develloped for the APEX ground telescope and the SPICA satellite mission(Candidate for the 30-210µm detector of the SPICA Fourrier Tranform Spectrometer SAFARI)
SCUBA 2 TES imager. (450µm and 850µm)Studies of stars, planets, galaxy formation in the early universeLarge-area surveys4 × 1280 pixel sub-arraysMoAu TES on Si 3N 4membrane (100mK).NEP 3·10 -17 W/√Hz and 15·10 -17 W/√Hz (@ 850 and 450µm)Time-domain multiplexing1280-pixel array chipOptimized absorption usingquarter wave Si slabSi slab
Page 5: Large number of experiments using s
Page 9 and 10: Feed-horns - λ/4 cavities - antenn
Page 11 and 12: JPL Antenna-coupled bolometer, and
Page 13 and 14: Pair-breaking detectors (STJ, MKID)
Page 15 and 16: 10% bandwidth around 675 GHzfully s
Page 18 and 19: LABOCA Large APEX Bolometer Camera

Review on bolometer technologies - APC

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