international directory of analysis/defect inspection equipment ...

INTERNATIONAL DIRECTORY OF ANALYSIS/DEFECT INSPECTION EQUIPMENT SUPPLIERSCompanyAddressb Phone > Fax Year Founded President CEO Other TitleNotes: Issue advertisers are listed inboldface type. All specifications weresupplied by the respective companies.CM=Consult ManufacturerModelV Introducedt OperationM=Manual,S=Semi-Automatic,A=Fully AutomaticC ConfigurationI=Inline,E=Either/Both,S=Stand-alone8 Footprint (WxD)(Metric and inches)T TechnologyAOI=Automated Optical Inspection,I=Interferometry, LI=Laser ImagingOI=OtherV Vision System2D=2 Dimensional,3D=3 Dimensional,B=Both 2D & 3D,GS=Gray Scale,P=Pseudo color,O=OtherTop Four ApplicationsCA=Component Alignment,CP=Component Placement (Pre and Post Reflow),DA=Die Attach, FA=Failure Analysis,LLI=Lead Level Inspection (Pre and Post Reflow),MSI=Module Substrate Inspect,PD=Process Development,PWB=Printed Wiring Board/Substrate,QC=Quality Control Screening,OP=Opto/MEMS, PI=Package Inspection,RD=Research & Development,RS=Reflowed Solder, SPV=Solder Paste Volume,SPS=Solder Paste Shape,SSB=Solder Shorts/Bridges,UBM=Underbump Metalization,WB=Wire Bond, WSH=Wafer Sorter/HandlerWeb Site Contactb Phone> Fax Additional OfficesAkroMetrix LLC2700 NE ExpresswayBuilding C-100Atlanta, GA 30345b 404.486.0880> 404.486.0890 1994 Patrick B. HassellTherMoiré Model PS200V August 2003t SC CMLineMoiré Model PS16V September 1999t S, AC CM8 635 x 1245mm(25" x 49")T I (Thermal loading)V B8 813 x 991mm(32" x 39")T IV BPWB, FA, QC, PD includingthermo-mechanical warpageduring reflow/temp cyclingPWB, FA, PD, PI includingchip-carrier coplanarity, flexsubstrate flatness, parts intray (JEDEC)warpfinder.com Angela Curry,Sales & Marketingangela@warpfinder.com Tokyo, JapanTakanori Miyata,Sales Managermiyata@cerma.co.jpb +81.3.386.36811ASC International1799 County Rd. 90, Suite 9Maple Plain, MN 55359b 888.478.2912 orb 763.478.6200> 763.478.6206 1992 Jon ArnesonSamsung VSS-3 Series AOIV 2003t AC SSamsung VSS-3 Series AOIV 2003t EC S8 1670 x 1180mm(66" x 46")T AOIV 3D, P8 1670 x 1180mm(66" x 46")T AOIV 2D, GSPD, QC, SPV, SPSPD, QC, SPV, SPSascinternational.com Mike Riddle,Director, Sales & Marketingmriddle@ascinternational.comb 763.478.6200 ext. 14ASG, Division of Jergens Inc.15700 S. Waterloo Rd.Cleveland, OH 44110b 800.486.6163> 216.481.4519 1942 Jack Schron Jr.IS-1000V CMt MC I, S8 CMProbe size: 159mm L,36.5mm DT OIV 2DCA, CP, FA, SSBjergensinc.com Matt Schron,Sales & Marketingmatt.schron@jergensinc.comb 216.486.6163 ext. 6433August Technology4900 West 78th St.Bloomington, MN 55435b 952.820.0080> 952.820.0060 1992 David Klenk Jeff O’Dell3Di SeriesV April 2001t AC S8 1422 x 1199mm(56" x 47")T OI (Rapid confocal sensor)V BPD, RS, SSB, UBMaugusttech.com John Pak,Product Managerjohn.pak@augusttech.comb 952.820.0080Camtek Ltd.Ramat Gabriel Industrial ParkP.O. Box 544Migdal Ha’Emek 23150, Israelb +972.4.6048100> +972.4.6440523 1987 Rafi AmitFalcon PDV 2004t AC SFalconV 2003t AC S8 1850 x 1280mm (73" x 50")T AOI, OI (Confocal chromaticsensor w/laser traingulation sensor)V B, GS, O (Gray scale scan,high-resolution color review)8 2000 x 1120mm (79" x 44")T AOI, OI (Confocal chromaticsensor w/laser traingulation sensor)V B, GS, O (Gray scale scan,high-resolution color review)SSB, RS, SPV, Surfaceinspection (solder and goldbumps and probe marks, plusdicing damage)SSB, RS, SPV, Surfaceinspection (solder and goldbumps and probe marks)camtek.co.ilUdi Efrat, Mktg. Comm. Mgr.udie@camtek.co.ilb +972.4.604.8321 USA: Camtek Ltd., 1600 Wyatt Dr.Santa Clara, CA 95054 Tommy Weiss,tweiss@camtekusa.comb 408.986.9540 > 408.986.9871EV GroupErich Thallner Strasse 1A-4780 Schaerding, Austriab +43.7712.5311.0> +43.7712.5311.4600 1980 Dr. Peter PodesserEVG40V 2001t M, S, AC SEVG20V 2000t MC S8 1350 x 850mm(53" x 33.5")T AOIV 2D, GS8 850 x 550mm(33.5" x 21.7")T OI (Manual optical inspection)V 2D, GSCA, PD, QC, OPFA, PD, QC, OPevgroup.comPaul Lindner, Vice President,Chief Technology Officerinfo@evgroup.comb +43.7712.5311.0 USA: EV Group Inc.3701 E. University Dr., Ste. 300Phoenix, AZ 85034 sales@evgroup.comb 602.437.9492> 602.437.943540Chip Scale Review October 2004 [ChipScaleReview.com]• August - September 2004 • [ChipScaleReview.com]

INTERNATIONAL DIRECTORY OF ANALYSIS/DEFECT INSPECTION EQUIPMENT SUPPLIERSCompanyAddressb Phone > Fax Year Founded President CEO Other TitleNotes: Issue advertisers are listed inboldface type. All specifications weresupplied by the respective companies.CM=Consult ManufacturerModelV Introducedt OperationM=Manual,S=Semi-Automatic,A=Fully AutomaticC ConfigurationI=Inline,E=Either/Both,S=Stand-alone8 Footprint (WxD)(Metric and inches)T TechnologyAOI=Automated Optical Inspection,I=Interferometry, LI=Laser ImagingOI=OtherV Vision System2D=2 Dimensional,3D=3 Dimensional,B=Both 2D & 3D,GS=Gray Scale,P=Pseudo color,O=OtherTop Four ApplicationsCA=Component Alignment,CP=Component Placement (Pre and Post Reflow),DA=Die Attach, FA=Failure Analysis,LLI=Lead Level Inspection (Pre and Post Reflow),MSI=Module Substrate Inspect,PD=Process Development,PWB=Printed Wiring Board/Substrate,QC=Quality Control Screening,OP=Opto/MEMS, PI=Package Inspection,RD=Research & Development,RS=Reflowed Solder, SPV=Solder Paste Volume,SPS=Solder Paste Shape,SSB=Solder Shorts/Bridges,UBM=Underbump Metalization,WB=Wire Bond, WSH=Wafer Sorter/HandlerWeb Site Contactb Phone> Fax Additional OfficesGöpel Electronic GmbHGöschwitzer Str. 58/60D-07745 Jena, Germanyb +49.3641.68960> +49.3641.689644 1991 Holger Göpel Manfred Schneider, Thomas Wenzel (VPs)OptiCon AdvancedLineV CMt M, S, AC EOptiCon SpeedLineV CMt M, S, AC E8 CMT AOIV 2D, GS, P, O (Real color picture)8 CMT AOIV 2D, GS, P, O (Real color picture)PWB, CA, CP, FAPWB (automated opticalinspection), CA, CP, FAgoepel.com Jens Kokott,sales@goepel.comb +49.3641.68960> +49.3641.689644ICOS Vision Systems NVResearch Park, Haasrode, Zone 1Esperantolaan 8B-3001 Heverlee, Belgiumb +32.16.39.82.20> +32.16.40.00.67 1982 Anton de ProftCI-9x50V 2002t AC SWIV 2004t AC S8 1660 x 1250mm(66" x 50")T AOIV B8 590 x 1050mm(23" x 41")T AOIV 2DPI (BGA, CSP, LGA, Socket,QFN, TSOP, QFP, J-Lead), RDWSHicos.be Geert De Smedt,Product Managergeert.desmedt@icos.beb +32.16.39.82.42 Ignace Verhamme,Product Managerignace.verhamme@icos.beb +32.16.39.82.93LPKF Laser & Electronics28220 SW Boberg Rd.Wilsonville, OR 97070b 800.345.LPKF> 503.682.7151 1976 Bill BoggsLPKF ScanCheck 1+V June 2003t SC S8 1600 x 1000mm(63" x 39")T OI (Transmitted light)V 2D, GSSolder paste stencilinspection, QC, FAlpkfusa.com Stephan Schmidt,General Managerinfo@lpkfusa.comb 503.454.4202Machine Vision Products Inc.5940 Darwin Ct.Carlsbad, CA 92008b 760.438.1138> 760.438.0660 1993 George T. Ayoub, Phy.D.AutoInspector 1820 Ultra IIV February 2002t AC I8 CMT CMV B, GSCP, RS, SPV, SSBvisionpro.comSusan Silveira,Manager, Marketing Operationssusan@visionpro.comMatec Micro Electronics301 Oxford Valley Rd., Ste. 703BYardley, PA 19067b 215.369.8077> 215.369.9577 2002 Kenneth BishopModel PSS-18V June 2002t MC S8 915 x 915mm(36" x 36")T OI (Ultrasound)V B, GS, PSSB, FA, QC, PD, DA, PI, MSImatec.com Jim Stradling,Director of Salesjstradling@matec.comb 215.369.8077Nikon1300 Walt Whitman Rd.Melville, NY 11747Nexiv VMR-3020V CMt M, SC S8 2400 x 1400mm(94.5" x 55.1")T AOIV CMMSI, PI, UBM, PDnexiv.net/nexivEric Flemeric@nicon.neteflem@nikon.netPhoseon Technology14974 NW Greenbrier Pkwy.Beaverton, OR 97006b 503.439.6446> 503.439.6408 2002 Mark OwenWafer Bond InspectionSystem MX 1000V June 2003t A C SInfrared InspectionSystem MX 10V July 2004t M C S8 1025 x 860mm(40" x 34")T OI (NIR and vision)V 2D, GS8 460 x 310mm(18" x 12")T OI (NIR and vision)V 2D, GSOP, MSI, PI, QCQC, PI, PD, FAphoseon.com Tom Molamphy, Director,North American Sales & Mktg.tom_molamphy@phoseon.comb 971.249.0361Chip Scale Review • August - September 2004 • [ChipScaleReview.com] October 2004 [ChipScaleReview.com] 41

INTERNATIONAL DIRECTORY OF ANALYSIS/DEFECT INSPECTION EQUIPMENT SUPPLIERSCompanyAddressb Phone > Fax Year Founded President CEO Other TitleNotes: Issue advertisers are listed inboldface type. All specifications weresupplied by the respective companies.CM=Consult ManufacturerModelV Introducedt OperationM=Manual,S=Semi-Automatic,A=Fully AutomaticC ConfigurationI=Inline,E=Either/Both,S=Stand-alone8 Footprint (WxD)(Metric and inches)T TechnologyAOI=Automated Optical Inspection,I=Interferometry, LI=Laser ImagingOI=OtherV Vision System2D=2 Dimensional,3D=3 Dimensional,B=Both 2D & 3D,GS=Gray Scale,P=Pseudo color,O=OtherTop Four ApplicationsCA=Component Alignment,CP=Component Placement (Pre and Post Reflow),DA=Die Attach, FA=Failure Analysis,LLI=Lead Level Inspection (Pre and Post Reflow),MSI=Module Substrate Inspect,PD=Process Development,PWB=Printed Wiring Board/Substrate,QC=Quality Control Screening,OP=Opto/MEMS, PI=Package Inspection,RD=Research & Development,RS=Reflowed Solder, SPV=Solder Paste Volume,SPS=Solder Paste Shape,SSB=Solder Shorts/Bridges,UBM=Underbump Metalization,WB=Wire Bond, WSH=Wafer Sorter/HandlerWeb Site Contactb Phone> Fax Additional OfficesRVSI Electronics425 Rabro Dr. EastHauppauge, NY 11788b 631.273.9700> 631.273.1167 1976 Mim Havener Bob MichaelsWS-3500V July 2004t AC SLS-8000V July 2003t AC E8 1280 x 2980mmT LI, OIV B8 123" x 56"T LI, OIV B, O (In-tray 3D laser inspection)PD, QC, SSB, UBMPI (BGA, CSP, QFN, BCC, QFP,TSOP, PLCC, Sockets), SSBrvsi.com Bob Michaels, VP–Salesbmichaels@rvsi.comb 631.273.9700 Rodney Tache,Product Managerrtache@rvsi.comb 631.273.9700 ext. 355SolVision Inc.2111 Boul FernandLafontaine, Suite 130Longueuil, Quebec, Canadab 450.679.9542> 450.679.9477 1994 Alain CoulombeModel 2004V July 2004t A (tray-to-tray)C I, S (automated tray-to-tray)8 1600 x 1219mmT OI (FMI technology)V B, O (FMI technology that isCCD-based with projector)PI (BGA, CSP, TSOP, QFP,QFN, leaded, leadless and balldevices)solvision.net Ronny Thériault,Sales Managerrtheriault@solvision.netb 450.679.2878Sonoscan Inc.2149 E. Pratt Blvd.Elk Grove Village, IL 60007b 800.950.2638b 847.437.6400> 847.437.1550 1973 Dr. Lawrence W. KesslerModel SAM D-9001 TurboV 2003t M, SC SModel AW2000–WaferV 2001t AC I8 1830 x 760mm(72" x 30")T OI (scanning acoustic microscopy)V B, GS, P8 1830 x 760mm(72" x 30")T OI (scanning acoustic microscopy)V B, GS, PQC, FA, PI, RD for plastic,ceramic, flip chips, BGAsQC, OP, WSH, bond quality inbonded waferssonoscan.com Ed Foley, VP–Sales & Mktg.efoley@sonoscan.comb 847.437.6400 ext. 225 John Ippen,Director of Salesjippen@sonoscan.comb 847.437.6400View Engineering Inc.1650 N. Voyager Ave.Simi Valley, CA 93063b 877.767.8439b 805.578.5000> 805.578.5249 1976 Steven RossoSummitV 2003t SC ABenchmarkV 2003t SC A8 450 x 450mm(18" x 18")T AOIV 3D, GS8 300 x 150mm (10" x 6.5")to 450 x 450mm (18" x 18")T AOIV 3D, GSQC, PWB, CP, SPVQC, PWB, CP, SPVvieweng.com Vijay Patel,Product Managervpatel@vieweng.comb 805.578.5036Visicon InspectionTechnologies LLC870 H Napa Valley Corporate WayNapa, CA 94558 1999 Dan FreifeldSentryV 2004t SC S8 CMT AOIV 2D, GSCP, FA, QC, OPvisicontech.com Bryan Tipper, Sales Engineerbtipper@visicontech.comb 707.259.1300> 707.259.1366ViTechnologyParc Technologique de Sophia Antipolis,ZI des Trois Moulins, Rue Henri Laugier,06600 Antibes, Franceb +33.493.951.811> +33.493.950.931 1990 Gilles VicardVi-3KV 2004t AC I8 1000 x 1100mm(39" x 43")T AOIV 2DCA, CP, LLI, PDvitechnology.com Mark Norris, Executive VPmnorris@vitechnology.comb +65.6747.6550 > +65.6747.6558 USA: 26 Ward Hill Ave., Ste. BHaverhill, MA 01835b 978.372.1230 > 978.372.176742Chip Scale Review October 2004 [ChipScaleReview.com]• August - September 2004 • [ChipScaleReview.com]