Henkel Electronics Assembly Solutions

Worldwide Manufacturing& OrganizationElectronics Group of HenkelCity of Industry, CaliforniaRancho Dominguez, CaliforniaPort Huron, MichiganDublin, IrelandLinton, UKHemel Hempstead, UKYantai,ChinaIrvine,CaliforniaBillerica,MassachusettsCanton, MassachusettsOlean, New YorkSalisbury, North CarolinaHokkaido,JapanIsogo, JapanAtsugi, JapanKakogawa, JapanSan Diego,CaliforniaOntario,CaliforniaEcatepec de Morelos,MexicoManaus, BrazilWesterlo,BelgiumScheemda,NetherlandsLianyungang,ChinaShanghai, ChinaIpoh, MalaysiaSeoul, KoreaTainan, TaiwanSao Paulo, BrazilKuala Lumpur, MalaysiaHeadquarters/Product DevelopmentProduct Development/ManufacturingProduct DevelopmentManufacturingAcross the Board,Around the Globe.www.henkel.com/electronicsCorporate Profile – Henkel CorporationHenkel is the world’s leading and most progressive provider ofqualified, compatible material sets for semiconductor packaging,printed circuit board (PCB) assembly and advanced solderingsolutions. As the only materials developer and formulator withvast technical expertise for all materials required for packageproduction and assembly, Henkel is uniquely positioned todeliver world-class materials products, process expertise andtotal solutions across the board to enable tomorrow’selectronic industry.

ContentsAssembly Market SolutionsAutomotive Electronics ...................... 6 - 7Consumer & Industrial Electronics. ............ 8 - 9Defense & Aerospace Electronics ........... 10 - 11Handheld Communications & Computing ..... 12 - 13Green and Portable Energy (GAPE) .............. 14LED Lighting ................................. 15Medical Electronics ....................... 16 - 17Radio Frequency Identification (RFID) ........ 18 - 19Wireless DataCom Infrastructure ............ 20 - 21Assembly MaterialsAdhesives ............................... 22 - 31Display Materials ......................... 32 - 35Inks & Coatings .......................... 36 - 37Micro-Encapsulants (CSP Underfills). ........ 38 - 39Micro-Encapsulants (COB Encapsulants) . . . . . . 40 - 42PCB Protection. .......................... 43 - 51Solder Materials .......................... 52 - 57Surface Mount Adhesives (Chipbonder). .... 58 - 59Thermal Management Materials. ............ 60 - 63Appendix .................................... 64Index ................................... 65 - 68

Material Solutions forElectronic Packagingand AssemblySemiconductor MaterialsDie AttachAdhesivesSemiconductorUnderfillsSemiconductorEncapsulantsThermalCompressionMaterialsCoating PowdersElectronic MoldingCompoundsSemiconductorMoldingCompoundsSolder and FluxMaterials2Please see LT-5013 for SemiconductorSolutions Guide

Assembly MarketSolutionsLiquid EncapsulantsDam and FillPotting CompoundsElectronic MoldingCompoundsFlip Chip inPackage UnderfillsCSP/BGAUnderfillsOptoelectronicsCoatingPowdersGasketingCompoundsDie AttachAdhesivesSiliconeEncapsulantsLiquid EncapsulantsGlob TopFlip Chip-on-BoardUnderfillsThermalManagementMaterialsConformalCoatingsPhotonic Componentand AssemblyMaterialsLow PressureMoldingsSemiconductorMolding CompoundsSurface MountAdhesivesSolder Materials5

Assembly MarketSolutionsAutomotive ElectronicsAddressing the needs of today’s advancedautomotive industry, Henkel has developed a broadrange of conductive paste and film adhesives,glob top and underfill encapsulants, conformalcoatings, sealants, potting encapsulants and solderproducts, technical and analytical test support,and customized formulations to meet increasinglydemanding requirements. Our solutions are usedin a wide range of vehicle electronic and sensorcomponents for common rail fuel systems, safetyelectronics, engine and powertrain management,infotainment, and lighting applications.ElectricallyConductivePastesABLEBOND ®8175QAdhesivesInsulatingPastesECCOBOND2332ThermallyConductivePastesECCOBONDE3503-1Inks andCoatingsElectricallyConductiveInksELECTRODAG725AECCOBONDCE3516LCLECCOBONDA164-1ECCOBONDE8502-1ECCOBONDCE3520-3ECCOBONDA316-48ECCOBONDTE3530ECCOBONDCE3535ECCOBONDA401LOCTITE ® 5404ECCOBONDCE8500ECCOBONDG909HYSOL ®QMI516LC6

Assembly MarketSolutionsAutomotive ElectronicsAutomotive ElectronicsMicro-EncapsulantsPCBProtectionThermalManagementMaterialsGlob TopsUnderfillsConformalCoatingsEncapsulants-PottingSealantsLow PressureMolding(Macromelt ® )SolderMaterialsSurfaceMountAdhesivesElectricallyConductiveFilmsHYSOL ® EO1060EMERSON &CUMINGE1172ALOCTITE ® 5290HYSOL ® EO1058LOCTITE ®NUVA-SIL ® 5089MACROMELT ®OM641MULTICORE ®LF318 SOLDER PASTELOCTITE ® 3616EMERSON &CUMINGCF3350HYSOL ® EO1062ECCOBONDEMERSON &CUMING E 3200E1216LOCTITE ® 5293HYSOL ® ES1902LOCTITE ® 5210MACROMELT ®OM646MULTICORE ®MF300 LIQUIDFLUXLOCTITE ® 3621HYSOL ® EO1072LOCTITE ® 5296STYCAST2850FTLOCTITE ® 5699MACROMELT ®OM652MULTICORE ®MFR301 LIQUID FLUXECCOCOATSC3613STYCASTE2534FRLOCTITE ® 5810FMACROMELT ®OM657MULTICORE ®C400CORED WIREECCOCOATUV7993STYCASTU2500MACROMELT ®OM673MULTICORE ®C502CORED WIREHYSOL ® PC18MHYSOL ® US2350MACROMELT ®OM6787

Assembly MarketSolutionsConsumer & IndustrialElectronicsConsumer and industrial applications requirematerials solutions that can meet the everchangingdemands for high reliability andimproved performance. With decades of materialsdevelopment expertise, Henkel offers a widerange of assembly and protection materials forchallenging industrial and consumer electronicsenvironments. We also offer advanced conformalcoatings to be used in protecting electronics circuitsfrom moisture, chemicals and other contaminants.But, we haven’t stopped there, with an unyieldingcommitment to sustainability, Henkel has developedmaterials that not only deliver the high reliabilityrequired, but also address the needs of ourenvironment. Halogen-free, lead-free, solvent-freeand low-VOC materials are all part of our portfolioand our ongoing promise to be environmentallyresponsible. All these innovative solutions willenable manufacturers to introduce products fasterto market and improve production efficiency.Consumer & IndustrialAdhesivesInks andCoatingsMicro-EncapsulantsElectricallyConductivePastesNon-ElectricallyConductivePastesThermallyConductivePastesElectricallyConductiveInksNon-ElectricallyConductiveInksGlob TopsUnderfillsECCOBOND56CECCOBOND45ECCOBOND2332LOCTITE ®3873ELECTRODAG479SSELECTRODAG452SSHYSOL ®FP4450HF(FILL)LOCTITE ®3119EMERSON &CUMINGE1216ECCOBOND59CECCOBONDG500HFLOCTITE ®5404ELECTRODAG6017SSELECTRODAGPM-404HYSOL ®FP4450LV(FILL)LOCTITE ®3129LOCTITE ®5421ECCOBONDG757HFECCOBOND282ELECTRODAGPR-406BMINICOM7000 BLUE AHYSOL ®FP4451(DAM)HYSOL ®EO1016ECCOBONDC990ECCOBOND104ECCOBONDTE3530ELECTRODAGPR-800ELECTRODAGPF-455BHYSOL ®FP6401(DAM)HYSOL ®EO1080ECCOBONDCE3103TRA-BOND2151ELECTRODAG725AHYSOL ®EO1088ECCOBONDCE3104WXLELECTRODAG976SSHVECCOBONDCE3535ELECTRODAG820BELECTRODAGPF-407C8

Assembly MarketSolutionsConsumer & IndustrialElectronicsConsumer & IndustrialPCBProtectionSolder &Surface MountAdhesivesThermalManagement& FilmsConformalCoatingsEncapsulants-PottingLowPressureMolding(Macromelt ® )FluxesSolderPastesSolderWiresSurfaceMountAdhesivesNon-ElectricallyConductiveFilmsPhaseChangeMaterialsThermalGreasesLOCTITE ®3900ECCOBONDA312-20STYCASTU2500MACROMELT ®MM6208SMULTICORE ®MF300MULTICORE ®LF620MULTICORE ®C400LOCTITE ®3609LOCTITE ®7360 (Cleaner)ABLEFILM ®550LOCTITE ®ISOSTRATELOCTITE ®NSWC100ECCOCOATPC355-1HYSOL ®EE1068HYSOL ®US0146MACROMELT ®MM Q-5375MULTICORE ®MF388MULTICORE ®LF700MULTICORE ®C502LOCTITE ®3616ECCOBONDD125FLOCTITE ®POWERSTRATEXTREMEECCOCOATUV7993HYSOL ®ES1002HYSOL ®US2350MACROMELT ®OM633MULTICORE ®MFR301LOCTITE ®3619ECCOBONDE6752LOCTITE ® PSX-D& PSX-PHYSOL ®PC28STDSTYCAST1090BLKHYSOL ®US5532MACROMELTUS5®OM638MULTICORE ®SC01(Cleaner)LOCTITE ®3621LOCTITE ®THERMSTRATEHYSOL ®PC18MSTYCAST2651-40MACROMELT ®OM682HYSOL ®PC62STYCAST2850FTMACROMELT ®OM687ECCOCOATU7510-1STYCASTE2534FR9

Assembly MarketSolutionsDefense & AerospaceElectronicsHenkel has more than 35 yearsof experience in supplying thedefense and aerospace industrywith Emerson & Cuming,Ablestik, Loctite®, Hysol® andMulticore® product solutions.We are qualified and specified byall major defense and aerospaceOEMs and contractors, andsupport our products througha worldwide sales, applicationengineering, research anddevelopment, and manufacturingnetwork.ConformalCoatingsNon-ConductiveECCOCOATUV7993EncapsulantsNon-ConductiveSTYCAST2651STYCAST2850FTConductiveABLEFILM ®5925EEMERSON &CUMINGCF3350FilmAdhesivesNon-ConductiveABLEFILM ®5020KABLEFILM ®550KTRA-DUCT2902LOCTITE ® 3880ConductiveABLEBOND ®85-1ABLEBOND ®8700EOur state-of-the-art products,certification to major defenseand aerospace specifications,and technical expertise ensurethat products built with Henkelelectronic assembly materialswill be both the highest inperformance and in reliability.We are committed to meetingand exceeding your requirementswith:STYCAST50500DSTYCAST50500-1HYSOL ®FP4451TDHYSOL ® FP4470HYSOL ® FP4460ABLEFILM ®ECF561EABLEFILM ®ECF564AABLEFILM ®ECF568ABLEFILM ®561KABLEFILM ®563KABLEFILM ®564KABLEBOND ®8175ECCOBOND56C/CAT 11ECCOBOND57CABLEBOND ®84-1LMISR4ABLEBOND ®84-1LMIT1ABLEBOND ®967-1ECCOBONDCE3103ECCOBONDCE8500ECCOBONDCE3104WXL• MIL-STD 883, Method 5011approved products• NASA outgassing ASTM E595-77/84/90 approved products• Proven film and pastetechnology in Defense andAerospace applications• Custom film pre-formmanufacturing capability• Low-risk supply chain10

Assembly MarketSolutionsDefense & AerospaceDefense & AerospaceElectronicsPasteAdhesivesPCTIMSolder &Surface MountAdhesivesUnderfillsNon-ConductiveThermal PadsNo-CleanTin LeadWater WashTin LeadCored WireLiquid FluxSurfaceMountAdhesiveCapillaryFlowsTRA-BOND2151ABLEBOND ®958-11LOCTITE ®ISOSTRATEMULTICORE ®MP218MULTICORE ®WS200MULTICORE ®381MULTICORE ®Hydro-X20LOCTITE ® 3616ABLEFILLUF8807ECCOBOND104ABLEBOND ®967-3LOCTITE ®POWERSTRATEXTREMEMULTICORE ®Hydro-XLOCTITE ® 3621EMERSON &CUMINGXE1218ABLEBOND ®724-14CECCOBOND315E3503-1LOCTITE ®SILVERSTRATEABLEBOND ®84-3ECCOBONDE8502-1ABLEBOND ®8700KTRA-BOND315F11211

Assembly MarketSolutionsHandheld Communications& ComputingHenkel designs and sells materials that improve the quality,robustness, use life and cost of laptops, mobile phones, MP3players, game consoles, digital cameras, memory cards, and arange of other handheld devices and associated products. Ourbroad portfolio of encapsulants, adhesives, solder pastes, inks andcoatings are used by designers and manufacturers during circuitassembly.AdhesivesInks &CoatingsWe offer innovative products optimized to provide theprocessibility needed for intricate handheld applications. Thematerials Snap Cure at low temperatures to keep pace with fastproduction cycle times and are highly stable, offering convenientstorage, staging and use conditions. We custom formulateand optimize current technology platforms to integrate withcustomers’ unique processes and needs, and continue to developfuture technology platforms that offer greater value to customersby combining new benefits with lower overall cost of use.ElectricallyConductivePastesECCOBONDXCE3111ECCOBONDCA3152Non-ElectricallyConductivePastesSTYCASTA312ElectricallyConductiveInksELECTRODAGPF-845Glob TopsHYSOL ®FP4450 (Fill)HYSOL ®FP4451TD (Dam)Henkel offers a wide range of underfills that improve themechanical robustness of CSP, BGA, LGA and WLSP components inmobile phones and other handheld devices, as well as underfillsthat dramatically improve the thermal cycle reliability of FlipChip assemblies. We also offer a large selection of solder paste andconductive adhesives used to interconnect components andcircuitry. Our line of thermal interface materials are usedfor a variety of thermal management challenges inlaptops and handhelds.Henkel has developed halogenfreeconductive inks used inmembranes for keyboardsto provide optimal ERperformance. Our coatingsprovide excellent moistureand environmentalprotection for delicatecircuitry in handheld devices.12

Assembly MarketSolutionsHandheld Communications& ComputingHandheldMicro-EncapsulantsPCBProtectionSolderMaterialsThermalManagementMaterialsUnderfills –Capillary FlowUnderfills –CornerbondUnderfills –EdgebondEpoxyFluxConformalCoatingsSolderPastesTackyFluxPhaseChangeMaterialsReworkable Non-ReworkableLOCTITE ®HYSOLThermal Cure UV Cure®3508FF6000XE1218 LOCTITE ®3513LOCTITE ®3536EMERSON& CUMING E1172A EMERSON &CUMING E1216 LOCTITE ®3128EMERSON &CUMING SB-50LOCTITE ®3705HYSOL ®UF3800EMERSON& CUMING EMERSON &CUMING E1926HYSOL ®FP4531ECCOCOATUV7993HYSOL ®PC40-UMMULTICORE ®LF700MULTICORE ®TFN600LOCTITE ®POWERSTRATEXTREMELOCTITE ®PSX-D &PSX-P13

Assembly MarketSolutionsGreen and PortableEnergy (GAPE)Henkel manufactures numerous assemblyand protection materials for the demandingrequirements of photovoltaic electronics. Whetheryour solar cells and modules are based on silicon,thin film, concentrator, dye sensitized or organictechnology, Henkel materials enable a robustassembly, providing the performance and reliabilityrequired. Our portfolio consists of thermallyconductive materials, electrically conductiveadhesives and inks, as well as fluxes, solders,encapsulation materials, dielectric adhesives andsealants for assembly of photovoltaic modules.Green and Portable EnergyAdhesivesSolderMaterialsPCB ProtectionThermalManagementMaterialsInks &CoatingsElectricallyConductivePastesLiquid FluxesConformalCoatingsPhase ChangeMaterialsThermallyConductivePastesElectricallyConductiveInksECCOBONDCE3103ECCOBONDCE3920MULTICORE ®MF200ECCOCOATSC3613LOCTITE ® PSX-D &PSX-PECCOBONDE8502-1ELECTRODAGPF-050ECCOBONDCE3103WLVECCOBONDCA3556HFMULTICORE ®X32-10iECCOBONDE3503-1ACHESONPM-500ECCOBONDCE3104WXLXCS80091-2ECCOBONDTE3530ECCOBONDCE3520-314

Assembly MarketSolutionsLED LightingLighting advancements are one of the mostpromising areas of electronics market growth.In fact, by some estimates, the LED market isprojected to grow at CAGR rates in the doubledigits over the next few years. Driven by the needfor high brightness (HB) LEDs and the requirementto manufacture these even more efficiently,opportunities in the lighting market abound.Success, however, depends on partnering with theright material supplier who can deliver both LEDassembly and protection solutions.With unmatched expertise in this market andnow empowered by the integration of the wellrespectedAblestik, Emerson & Cuming, Hysol®and Loctite® brands, Henkel offers a broad rangeof products to meet the increasingly demandingrequirements of LED-based lighting assembly andprotection. Our extended product line covers LEDencapsulant, die attach, PCB protection and thermalmanagement materials. High performance inksare also available for applications that dictate aprintable solution.LightingDie AttachEncapsulantModuleAssemblyMaterialsElectricallyConductivePastesNon-ElectricallyConductivePastesThermallyConductivePastesCastingMold LampCastingMold SMDCOBThermalInterfaceMaterialsConformalCoatingABLEBOND ®84-1AECCOBONDDX-10CHYSOL ®QMI529HTSTYCAST2017M4STYCASTNX-17HYSOL ®OT0149-3LOCTITE ® 3873LOCTITE ®NSWC100LOCTITE ® 5296ABLEBOND ®84-1LMISR4ECCOBONDDX-20CHYSOL ®QMI536HTSTYCASTE1847STYCASTNX-76LOCTITE ® 3874LOCTITE ® PSX-D& PSX-PECCOCOATUV7993ECCOBONDC850-6ECCOBONDE3503-1HYSOL ®QMI5030ECCOBOND3876TE3530HYSOL ®PC40-UMECCOBONDCE3103WLVECCOBONDS-3869ECCOBONDCE3104WXL15

Assembly MarketSolutionsMedical ElectronicsAccurate diagnosis, improved alternative treatments, patientmonitoring: electronic technology and related assembly materialsare having an ever-increasing impact on healthcare. They improveaccess to healthcare, enabling more accurate collection of patientdata for more precise treatment. They enable doctors to treatmore patients with less, reducing the costs and improving theeffectiveness of total healthcare and expanding the capability totreat chronic medical conditions. Implanting medical devices,as well as improving ease of use, requires a form factor that isachieved through advanced electronic components, materialsand assembly methods. Henkel combines local technical supportand applies materials developed for the most advanced electronicassembly processes to provide solutions for applications rangingfrom printing simple biological sensors to advanced implantablemicro-electronic assemblies.ElectricallyConductivePastesABLEBOND ®84-1LMISR4ECCOBONDCE3520-3AdhesivesNon-ElectricallyConductivePastesABLEBOND ®84-3ABLEBOND ®967-3ElectricallyConductiveInksELECTRODAG109ELECTRODAG479SSInks andCoatingsNon-ConductiveInksELECTRODAG452SSELECTRODAGPF-455BECCOBONDCE3535ABLEBOND ®2025DELECTRODAGPE-007ECCOBONDCE8500TRA-BOND2116ELECTRODAGPF-407AECCOBONDXCE3111TRA-BONDFDA2ELECTRODAGPF-407CHYSOL ®QMI516LCTRA-BONDFDA2TELECTRODAG725ATRA-BONDFDA1616

Assembly MarketSolutionsMedical ElectronicsMedical ElectronicsMicro-EncapsulantsPCBProtectionSolder &Surface MountAdhesivesGlob TopsUnderfills -CapillaryFlowsConformalCoatingsLowPressureMolding(Macromelt ® )SolderPastesFluxNo CleanSolderWiresSurfaceMountAdhesivesGeneralDamFillsLOCTITE ®3563LOCTITE ®5290MACROMELT ®MM6208MULTICORE ®LF318MULTICORE ®MF388MULTICORE ®C400LOCTITE ®3609LOCTITE ®7360 (Cleaner)HYSOL ®EO1060HYSOL ®FP4451HYSOL ®FP4450ABLEFILLUF8807LOCTITE ®5293MACROMELT ®OM652MULTICORE ®MP218MULTICORE ®MFR301MULTICORE ®Hydro-XLOCTITE ®3611ECCOBONDD125FHYSOL ®EO1062HYSOL ®FP4451TDHYSOL ®FP4450HFEMERSON &CUMINGE1172ALOCTITE ®5296MACROMELT ®OM657MULTICORE ®WS300LOCTITE ®3616ECCOBONDE6752HYSOL ®EO1072STYCAST50500DHYSOL ®FP4450LVEMERSON &CUMINGE1216ECCOCOATSC3613LOCTITE ®3619HYSOL ®FP4460STYCAST50500-1EMERSON &CUMINGXE1218ECCOCOATUV7993LOCTITE ®3621ECCOBONDUV9052HYSOL ®PC18M17

Assembly MarketSolutionsRadio FrequencyIdentification (RFID)Used for everything from toll booths to departmentstore inventory control to pet identification, RadioFrequency Identification (RFID) tags are devicescapable of uniquely identifying an object via a preprogrammedresponse when queried by an externalradio frequency wave.Today’s RFID tags consist of a graphic overlay and aninlay, with the inlay being the functional part of thetag and containing the die (used to carry the codedinformation) and the antenna (used to both transmitand receive RF signals). Critical to the assemblyof the tags and their robust in-field performanceis the selection of adhesives used to constructthese devices.Adhesive materials are used to attach diesonto antenna to build the inlays, which can beconstructed in one of two ways:2. An interconnect adhesive is first used to builda much larger packaged die (interposer or diestrap), which is then adhered onto an antenna.Both methods of assembly have been successfullyemployed to make active and passive RFID tags.Henkel’s line of RFID adhesives are advancing thiscritical technology by addressing the dichotomyof high-performance and lower-cost assembly thatdefines the RFID market. By formulating materialsthat offer increased throughput, exceptionalprocessability, simplified manufacturing techniquesand outstanding in-field reliability, Henkel isfacilitating higher yield, lower cost manufacturingfor modern RFID assembly.1. An interconnect adhesive is used to attach a smallbare die directly to an antenna.Die Strap AttachDirect Die AttachEncapsulantInterconnectAdhesiveAntenna Ink18

Assembly MarketSolutionsRadio FrequencyIdentification (RFID)RFIDAdhesivesInks &CoatingsElectricallyConductiveAdhesivesNon-ConductiveAdhesivesElectricallyConductiveInksECCOBONDCA3150XA80215-1ELECTRODAGPF-050ECCOBONDCA3152ACHESONPM-500ECCOBONDXCE311119

Assembly MarketSolutionsWireless DataComInfrastructureHenkel supplies high-performance assemblymaterials for electronics in wirelesstelecommunications infrastructure equipment.With our unique RF grounding adhesives, availablein both film and paste formats, we have earned aleading position in the assembly of base stationelectronics, as well as point-to-point and point-tomultipointradiolink devices, satellite electronics,wireless home/office equipment and fiber optics.adhesives in film and paste formats, thermalinterface materials for heat dissipation of highpower components, electrically conductive adhesivesas lead-free solder alternatives for active and passivecomponent attach, lid seal adhesives, and underfillsfor component reinforcement.Henkel products are used in the assembly of poweramplifiers, transmitters, receivers, couplers, andfilters, as well as RF modules such as system-inpackages,power transistors, oscillators, optical fiberand more.Our unique product line meets emerging marketdemands for improved RF performance innext-generation wireless telecommunicationsequipment, as well as increased thermal dissipationrequirements for achieving longer distancecommunication capabilities. Henkel’s solutionsfor these market challenges include RF grounding20

Assembly MarketSolutionsWireless DataComInfrastructureWDISatelliteFilmAdhesivesElectricallyConductivePastesElectricallyNon-ConductivePastesThermallyConductivePastesLightweightSyntacticEncapsulantsB-StagePastesHighTemperatureCoatingsABLEFILM ®561KABLEBOND ®84-1LMIABLEBOND ®84-3ABLEBOND ®8700KHYSOL ®ES1002ECCOBONDE1470ELECTRODAG503-62%ABLEFILM ®563KABLEBOND ®84-1LMIT1ECCOBONDE8502-1STYCAST1090SIABLEFILM ®5020KABLEBOND ®85-1ECCOBONDTE3530ABLEFILM ®5025EECCOBOND56CABLEFILM ®ECF561EECCOBONDCE8500WDIBase StationFilmAdhesivesElectricallyConductivePastesSolderAlternativeConductivePastesThermallyConductivePastesB-StagePastesThermalPadsNon-InsulatingThermalPadsElectricallyInsulatingThermalPadsElectricallyConductiveThermalPastesSolderPastesABLEFILM ®563KECCOBOND8177ECCOBONDCE3103WLVECCOBONDE3503-1ECCOBONDE1470LOCTITE ®THERMSTRATELOCTITE ®ISOSTRATELOCTITE ®SILVERSTRATELOCTITE ® PSX-D & PSX-PMULTICORE ®LF318ABLEFILM ®ECF561EECCOBOND8177-0ECCOBONDCE3104WXLECCOBONDE8502-1EMERSON &CUMINGCF3350ECCOBONDCE8500ECCOBONDCE3535ECCOBONDTE353021

ASSEMBLYMaTERIALSAdhesivesHenkel’s diverse portfolio of adhesive and sealantsolutions includes advanced materials technologiesto address today’s most demanding applications.From electrically conductive and non-conductivepaste adhesives through to thermally conductivedielectric materials, Henkel’s product line affordsmaximum performance and cost-efficiency.Our electrically conductive and non-conductive pasteadhesives are ideal for withstanding the thermal andphysical stresses of Defense, Automotive, Medicaland Consumer Electronic assembly applications,while our spot cure technologies enable high-speedassembly for RFID tags and other printed electronicdevices. Non-conductive paste systems in the Henkelportfolio include a series of one- and two-part roomtemperature, thermal and UV cure adhesives for theultimate in flexibility and performance.of thermally conductive dielectric pastes are themost trusted and reliable materials on the market.Providing outstanding adhesion and thermalperformance, Henkel offers both shimmed and nonshimmedformulations. For assembly specialiststhat require the utmost in accuracy, our shimmedadhesives contain engineered spacers for moreprecise bondline control.For manufacturers that require both adhesive andthermal dissipation functionality, Henkel’s lineNon-Conductive AdhesivesFast CureAdhesivesFlexibleAdhesivesUV CureGeneralAdhesivesRoomTemperatureCureTwo-ComponentECCOBONDE3200ECCOBONDG909ECCOBONDUV9000ECCOBONDA164-1ECCOBONDDX-10CECCOBONDA316-48TRA-BOND2115TRA-BONDF112TRA-BONDFDA2TABLEBOND ®967-3ECCOBONDG757HFECCOBONDA401ECCOBONDDX-20CTRA-BOND2116TRA-BONDF113SCTRA-BONDFDA16ECCOBOND45ABLEBOND ®84-3ECCOBOND2332TRA-BONDF114ECCOBOND104ABLEBOND ®958-11ECCOBONDE1470TRA-BONDFDA2ECCOBOND285ABLEBOND ®2025DECCOBONDS-3869TRA-BONDF123ECCOBONDG500HFTRA-BONDF25322

ASSEMBLYMaTERIALSAdhesivesNon-Conductive AdhesivesNON-CONDUCTIVE ADHESIVES – FAST CURE ADHESIVESPRODUCTECCOBOND E3200DESCRIPTIONA very fast and low temperature curing one-componentadhesive, with good flexibility, chemical and humidityresistance.MILSTANDARD883, METHOD5011APPROVEDNASAOUTGASSINGASTM E595-77/84/90APPROVEDNON-CONDUCTIVE ADHESIVES – FLEXIBLE ADHESIVESECCOBOND G909ECCOBOND G757HFOne-component, thixotropic, flexible epoxy adhesive withhigh peel and tensile lap shear strength over a broadtemperature range.One-component epoxy adhesive providing high mechanicalstrength; stable contact resistance on Cu and 100% Sn.NON-CONDUCTIVE ADHESIVES – UV CUREECCOBOND UV9000Thixotropic, UV curing, solvent-resistant sealant for goldand plastic substrates.NON-CONDUCTIVE ADHESIVES – GENERAL ADHESIVESABLEBOND ® 84-3ABLEBOND ® 958-11Exceptionally low thermal resistance. Superior contactresistance and adhesion stability on Sn, SnPb and OSP Cu.Very low weight loss & bleed during cure.An electrically insulating adhesive designed to absorbstresses produced when bonding large ICs.CURETYPECURE SCHEDULESVISCOSITY(cPs)TENSILESTRENGTHLAP SHEAR(PSI)SHELF LIFEThermal 5 min. @ 120°C 150,000 – 90 days @-18°C to 25°CHeat 90 min. @ 100°C20 min. @ 150°CYes Yes Heat 60 min. @ 150°C10 min. @ 175°CPaste 2,900 3 months @4ºCHeat 1 hr. @ 150°C Paste 1,740 4 months @-40°CUV 5 sec. @ 80 W/cm 30,000 – 6 months@ RT50,000 6,800 4 months @-40°CYes Heat 1 hr. @ 150°C 45,000 2,700 1 year @-40°CPOT LIFE24 hrs.2 weeks1 week1 week––ECCOBOND A164-1ECCOBOND A401ABLEBOND ® 2025DGood adhesion and peel strength to metal, glass, plastics;excellent thermal shock resistance.Good thermal conductivity; good high temperatureresistance; bonds well to metal, glass, plastics, andceramics.A hybrid chemistry die attach adhesive designed for PBGA,FlexBGA and for stacking BGA packages.Heat 60 min. @ 120°C20 min. @ 160°CHeat 60 min. @ 120°C5 min. @ 180°CHeat30 min. ramp to175ºC; Hold 15 min.@ 175ºC4 months @8°C6 months @0°C11,000 10,000 1 year @-40°CECCOBOND DX-10C Epoxy base clear type. Low viscosity. Heat 60 min. @ 140°C℃ 3,000 6 months @-20°CECCOBOND DX-20C Epoxy base. Heat 60 min. @ 170°C℃ 12,000,10 RPMECCOBOND 2332ECCOBOND E1470One-component, slightly thixotropic, solventless epoxyadhesive with high peel and tensile strength when cured attemperatures as low as 100°C.B-stage capable adhesive designed for component andlid attach applications. Bonds well to engineering plasticssuch as LCP as well as silicon & metals such as aluminum.Heat 20 min. @ 150°C90 min. @ 100°CHeatB-stage: 45 min.@ 100°CFinal cure: 5 min.@ 180°C6 months @-20°C70,000 3,140 6 months @8°C12,000 >1,900 3 months @-20°CECCOBOND S-3869 Hybrid type. Heat 120 min. @ 160°C 6,200,3 8 days10 RPMECCOBOND G500HF A one-component, high strength epoxy adhesive. Heat 5 min. @ 175°C Paste 17,000 4 months @25°C4 monthsSTYCAST A316-48A one-component, oxide-filled, pourable epoxy adhesivewith exceptional thermal stability.Heat 5 min. @ 120°C 50,000 17,300 3 months@ RT24 hrs.24 hrs.24 hrs.24 hrs.1 week3 months23

ASSEMBLYMaTERIALSAdhesivesElectrically Conductive AdhesivesELECTRICALLY CONDUCTIVE ADHESIVESSnap CureHeat CureRoomTemperatureCureTwo-ComponentECCOBONDCA3150Tin & Tin LeadCompatibleAdhesivesGeneralConductiveAdhesivesLOCTITE ® 3888ECCOBOND57CECCOBONDCA3152ECCOBONDCE3103WLVLOCTITE ® 3880ABLEBOND ®8175ECCOBONDC850-6LHYSOL ®QMI516LCLOCTITE ® 5421ECCOBOND56CECCOBONDCE3126ECCOBONDCE3103ABLEBOND ®84-1ABLEBOND ®8700EECCOBONDC990HYSOL ®QMI529HTTRA-DUCT2958TRA-DUCT2902ECCOBONDXCE3111ECCOBONDCE3104WXLABLEBOND ®84-1LMIECCOBONDC850-6ECCOBONDCE3516LCLXCS80091-2ECCOBONDCA3556HFECCOBONDCE3535ABLEBOND ®84-1LMIT1ECCOBOND8177ECCOBONDCE3520-3ABLEBOND ®85-1ECCOBOND8177-0ECCOBONDCE3920For Thermally ConductiveAdhesives, go to page 60.ECCOBONDCE850026

ASSEMBLYMaTERIALSAdhesivesElectrically Conductive AdhesivesCONDUCTIVE ADHESIVES – SNAP CUREPRODUCT DESCRIPTION CURE TYPE CURE SCHEDULESECCOBOND CA3150ECCOBOND CA3152ECCOBOND CE3126ECCOBOND XCE3111ECCOBOND CA3556HFSnap curable, low temperature cure, electricallyconductive adhesive with excellent adhesion andreliability of Cu and Al substrates.Snap curable, low temperature cure, electricallyconductive adhesive with excellent adhesion andreliability of Cu and Al substrates.Snap curable anisotropic adhesive is especially suitedin applications where throughput is critical. Thisproduct is typically used for very fine pitch flip chipinterconnections where electrical conductivity is desiredin only one direction.One-component, snap curable, electricallyconductive adhesive.One-component, highly flexible, conductive adhesivefor applications with large CTE mismatches betweensubstrates.VISCOSITY(cPs)VOLUMERESISTIVITY(OHM.CM)SHELF LIFEPOT LIFEThermal 10 sec. @ 130°C 17,000

ASSEMBLYMaTERIALSAdhesivesElectrically Conductive AdhesivesCONDUCTIVE ADHESIVES – Heat CURE (Continued)PRODUCTDESCRIPTIONGENERAL CONDUCTIVE ADHESIVES (Continued)ABLEBOND ® 85-1 Gold-filled, high reliability conductive adhesive for criticalapplications.MILSTANDARD883, METHOD5011APPROVEDNASAOUTGASSINGASTM E595-77/84/90APPROVEDCURETYPECURE SCHEDULESYes Heat 1 hr. @ 150°C2 hr.s @ 125°CVISCOSITY(cPs)VOLUMERESISTIVITY(OHM.CM)SHELF LIFEN/A 0.0008 12 months @-40°CECCOBOND C850-6 Strong hot adhesion and good anti-migration. 30 min. @ 150°C 100,000 0.00094 6 months @-20°CABLEBOND ® 8175ABLEBOND ® 8700EAn electrically conductive adhesive for solder replacementand microelectronic interconnect applications.An electrically conductive epoxy adhesive with high shearstrength after thermal cycling.Yes 30 min. @ 150°C 55,000 0.0005 6 months @-10°CYes Yes Heat 1 hr. @ 175°C 19,000 0.0002 12 months @-20°CECCOBOND C850-6L Low viscosity version of C850-6. Heat 60 min. @ 120°C 80,000 0.00094 6 months @-20°CECCOBOND 8177ECCOBOND 8177-0ECCOBOND CE8500Fast, low temperature cure, electrically & thermallyconductive adhesive. Ideally suited for low stress die &component attach, this adhesive has a unique silver particlesize allowing very thin bond lines.Enhanced thermal conductivity, fast cure, low stress dieand component attach adhesive optimized for GaAs MMICattach.One-component, low stress adhesive for mismatched CTEapplications. High thermal conductivity.Heat 4 min. @ 130°C 12,000 1 x 10 -4 12 months @-40°CHeat 6 min. @ 130°C(hotplate) 4 min. @150°C (hotplate)10 min. @ 150°C(convection)Heat 40 min. @ 150°C90 min. @ 120°C65,000 6 x 10 -4 12 months @-40°C130,000 0.0002 4 months @-18°CECCOBOND C850-6L Low viscosity version of C850-6. Heat 60 min. @ 120°C 80,000 0.00094 6 months @-20°CECCOBOND C990 One-component, silver-filled epoxy adhesive. Heat 1 hr. @ 150°C20 sec. @ 270°CECCOBONDCE3516LCLECCOBONDCE3520-3ECCOBOND CE3920XCS80091-2One-component, non-bleeding, epoxy adhesive with lowoutgassing, eliminating wicking and bridging under smallcomponents.One-component, low stress Ni-filled adhesive formismatched CTE; good shielding properties.Electrically conductive adhesive for thin film PV assemblywith superior contact resistance stability. Viscosityoptimized for dispensing.One-component, highly flexible conductive adhesivefor applications with large CTE mismatches betweensubstrates.0.001 5 months @8°CHeat 30 min. @ 140°C 70,000 0.0003 6 months @-18°CHeat 1 hr. @ 120°C30 min. @ 150°C73,000 0.2 6 months @-18°CHeat 3 min. @ 150°C 148,000 0.0008 6 months @-40°CHeat 35 min. @ 140°C 30000 -500000.00004 5 months @-40°CHYSOL ® QMI516LC Low temperature cure, silver-filled adhesive. Heat 90 min. @ 80°C Paste

ASSEMBLYMaTERIALSAdhesivesElectrically Conductive AdhesivesCONDUCTIVE ADHESIVES – ROOM TEMPERATURE CUREPRODUCTLOCTITE ® 3888LOCTITE ® 5421TRA-DUCT 2958DESCRIPTIONA room temperature or heat curable, silver-filledadhesive designed for electronic interconnectapplications requiring a combination of good mechanicaland electrical properties.RTV silicone provides EMI/RFI shielding on electronicdevice enclosures.Two-part, smooth paste of specially refined andprocessed epoxy and silver components, recommendedfor electronic, microelectronic, and die-attach bondingand sealing applications that require superior electricaland mechanical properties. It has a long pot life,and is free of contaminating solvents and additives,develops strong durable, void-free, electrically andthermally conducting bonds, seals and coatings – after aREQUIRED high temperature cure cycle.MILSTANDARD883, METHOD5011APPROVEDNASAOUTGASSINGASTM E595-77/84/90APPROVEDCURETYPEThickPasteCURE SCHEDULESVISCOSITY(cPs)VOLUMERESISTIVITY(OHM.CM)SHELF LIFEPOT LIFE2 hrs. @ 65°C Paste

ASSEMBLYMaTERIALSAdhesivesAdhesive FilmsElectrically Insulating Adhesive FilmsPRODUCTABLEFILM ® 550ABLEFILM ® 566KAPTONDESCRIPTIONA high strength adhesive that bondswell to gold and other difficult-tobondsurfaces.566KAPTON contains a polyamidecarrier providing high insulationresistance. With a low temperaturecure and excellent flexibility it isparticularly suitable for bondingprinted wiring boards.TENSILESTRENGTH, LAPSHEAR (PSI)THERMAL CONDUCTIVITY(W/mK)VOLUMERESISTIVITY(OHM.CM)PRIMARY CURECYCLESTORAGE LIFEFILMTHICKNESSAVAILABLE(MILS)5,700 0.2 1 x 10 14 30 min. @ 150°C 1 year @ -40°C 4, 5, 62,300 0.2 1 x 10 15 3 hrs. @ 90°C 1 year @ -40°C 4, 5, 8Thermally Conductive Adhesive FilmsPRODUCTABLEFILM ® 561KABLEFILM ® 563KABLEFILM ® 506ABLEFILM ® 550KABLEFILM ® 566KABLEFILM ® 5020KDESCRIPTION561K provides high adhesionstrength with excellent flexibility forbonding mismatched CTE materials.563K is an electrically insulatingfilm with high thermal conductivityand adhesion strength. It is availableeither unsupported or with afiberglass carrier.A flexible film adhesive designed forbonding TCE mismatched materials.Slight tack can simplify assembly.Combines high adhesion strengthwith very good thermal conductivityin a fiberglass supported filmadhesive available in a wide range ofthicknesses.566K offers low temperature curein a thermally conductive adhesivewith excellent flexibility and adhesion.A high purity adhesive with excellentadhesion to gold-plated surfaces,particularly suited for use in hermeticpackages. It is certified toMIL-STD-883, Method 5011.TENSILESTRENGTH, LAPSHEAR (PSI)THERMAL CONDUCTIVITY(W/mK)VOLUMERESISTIVITY(OHM.CM)PRIMARY CURECYCLESTORAGE LIFEFILMTHICKNESSAVAILABLE(MILS)3,300 0.9 9 x 10 12 30 min. @ 150°C 1 year @ -40°C 4, 5, 63,000 1 1 x 10 13 30 min. @ 150°C 1 year @ -40°C 2, 3, 4, 5, 61,200 0.9 7 x 10 12 1 hr. @ 150°C 6 months @-40°C4, 5, 63,300 0.8 7 x 10 12 30 min. @ 150°C 1 year @ -40°C 4, 5, 6, 7, 82,200 0.8 1 x 10 13 2 hrs. @ 100°C 1 year @ -40°C 4, 5, 63,000 0.7 8 x 10 14 1 hr. @ 150°C 1 year @ -40°C 4, 5, 631

ASSEMBLYMaTERIALSDisplay MaterialsWith materials solutions for many facets of flatpanel display (FPD) production, Henkel deliversa variety of Loctite®, Hysol®, P3®, Eccoseal andElectrodag branded products that enable highlyefficient manufacturing and excellent reliability.For color filter production, the P3® line of cleaners,developers and strippers ensures that the essentialFPD color filters are prepared properly and are verystable for the subsequent module assembly process.With both off-the-shelf and customer-developedmaterials, Henkel’s FPD line of materials enablehighly efficient, advanced product manufacture.Module and panel assembly materials are also partof Henkel’s core competency. The Loctite® brandof UV curable temporary bonding and endsealmaterials are used to deliver a robust, completepanel assembly. In addition, Henkel has developedpin terminal bonding, overcoat and flexible printedcircuit (FPC) materials to help reinforce and facilitateexceptional and reliable product-to-host connection.The Hysol® QMI brand of through-hole bondingmaterials delivers a reliable panel assembly withits flexibility and low temperature curability. Thenewly joined Eccoseal brand provides UV cureand low temperature, fast cure perimeter sealantsfor displays requiring extreme protection againstmoisture, such as organic light-emitting diode(OLED) displays and electronic paper displays (EPD).The Electrodag brand provides thick polymer filmink for many applications including ITO-coated film.For display applications, a thermoplastic resin-basedconductive ink is used to deliver a reliable printedbusbar for touch screens with its low temperatureprocess profile, wide range of flexibility and stableelectric conductivity.Display MaterialsGlassCleanersEdgeStrippersColor FilterDevelopersDisplaySealantsPin Terminal/TemporaryBondingITO/COGOvercoatsReworkStrippersCleanersafter LCInjectionP3 SilironAPXP3 SilironRPP3 PoleveHMP3 DisperseCOP3 DisperseHALOCTITE ®3702LOCTITE ®350LOCTITE ®3780LOCTITE ®3106P3 Poleve458P3 Allpass7750P3 SilironEP3 SilironSAP3 PoleveHP2P3 DisperseCRMP3 DisperseHALFECCOBONDLOCTITE ®E 3730 3200LOCTITE ®352LOCTITE ®3781LOCTITE ®3523P3 Poleve496P3 AllpassWS-HGP3 SilironIOP3 SilironTKAP3 PoleveSHP3 DisperseDXP3 DisperseJALOCTITE ®3733LOCTITE ®3523LOCTITE ®3782LOCTITE ®3720P3 Poleve517P3 Kaltfin20P3 DisperseGRXP3 DisperseKLOCTITE ®3781LOCTITE ®3719LOCTITE ®3736P3 Poleve720P3 DisperseHP3 DisperseSECCOSEAL7200LOCTITE ®3751LOCTITE ®3851P3 Poleve927P3 DisperseUT175LOCTITE ®3779P3 Poleve93032

ASSEMBLYMaTERIALSGLASS CLEANERSDisplay MaterialsPRODUCT DESCRIPTION TYPE pH, 3% 20°C TEMP, C CONCENTRATION, % USAGEP3 Siliron APX Neutral type; low damage to glass. Neutral 8.5 40°C - 60°C 1-10 US, Dipping,Shower, BrushP3 Siliron E Low foaming, glass substrate for flat panel display (FPD). Inorganic 11.5 Room Temp - 70°C 1-5 US, Dipping,Shower, BrushP3 Siliron IO Low foaming, glass substrate for FPD; non-nitrogen. Inorganic 12.5 Room Temp - 60°C 1-5 US, Dipping,Shower, BrushP3 Siliron RP Glass substrate for FPD; after-polishing cleaner. Organic 12.5 Room Temp - 60°C 1-5 US, Dipping,Shower, BrushP3 Siliron SA Low foaming, glass substrate for FPD; strong alkaline. Inorganic 13.5 Room Temp - 60°C 1-5 US, Dipping,Shower, BrushP3 Siliron TKA Glass substrate for FPD; pre-cleaning of deposition. Organic 12.5 45°C - 60°C 1-5 US, Dipping,Shower, BrushEDGE STRIPPERSPRODUCT DESCRIPTION TYPE pH TEMP, C CONCENTRATION, % USAGEP3 Poleve HM Edge stripper. Organic 12 Room Temp 1 SprayInorganic 2.5 Room Temp 3 SprayInorganic >12 Room Temp 1 SprayInorganic >12 Room Temp 1 SprayInorganic >12 Room Temp 1 SprayInorganic 9-11 Room Temp 5 SprayInorganic 9-11 Room Temp 5 SprayInorganic >12 Room Temp 50 SprayOrganic >12 Room Temp Undiluted Solution Spray33

ASSEMBLYMaTERIALSDisplay MaterialsDISPLAY SEALANTSPRODUCT DESCRIPTION VISCOSITY, cPsTACK-FREE PERFORMANCETIME, sec.CURING CONDITION,mW/cm 2DEPTH, mmDEPTH OF CURETIME @ CURING CONDITIONLOCTITE ® 3702 TFT 12,000 4 40 4.4 50 sec. @ 40 mW/cm 2 92 (DMA) 87LOCTITE ® 3730 TFT 25,000 ≤15 40 2.5 50 sec. @ 40 mW/cm 2 80 (DMA) 82LOCTITE ® 3733 TN/STN 13,000 ≤15 40 ≥2.5 20 sec. @ 100 mW/cm 2 97 (DMA) 86LOCTITE ® 3781 TN/STN 12,000 2 100 3.7 20 sec. @ 100 mW/cm 2 68 (DMA) 82PRODUCT DESCRIPTION VISCOSITY, mPa CURING CONDITIONSHRINKAGE duringcure, %WATER VAPORPERMEATION RATE,g mil/inch 2 dayECCOSEAL 7200 EPD 2,600 30 min. @ 70°C 2.3 9 70 (DMA) 67PIN TERMINAL/TEMPORARY BONDINGPRODUCT DESCRIPTION VISCOSITY, cPsTACK-FREE PERFORMANCETIME, sec.CURING CONDITION,mW/cm 2DEPTH, mmDEPTH OF CURETIME @ CURING CONDITIONLOCTITE ® 350 TN/STN 5,000 N/A N/A N/A N/A N/A N/ALOCTITE ® 352 TN/STN 20,500

ASSEMBLYMaTERIALSREWORK STRIPPERSDisplay MaterialsPRODUCT APPLICATION TYPE pH TEMP, C CONCENTRATION, % USAGEP3 Poleve 458 Positive-type photo resist stripper for color filter, array Organic Solvent N/A 50°C - 80°C Undiluted Solution US, Dipping, Showerboard.P3 Poleve 496 Positive-type photo resist stripper for array board or Organic Semi-Aqua 12-14 50°C - 80°C Undiluted Solution Dipping, Showersemiconductor.P3 Poleve 517 Positive-type photo resist stripper for array board. Organic Semi-Aqua 12-14 50°C - 80°C Undiluted Solution Dipping, ShowerP3 Poleve 720P3 Poleve 927P3 Poleve 930Positive-type photo resist stripper for array board orsemiconductor.Negative-type photo resist for color filter and forrework.Negative-type photo resist for color filter and forrework.CLEANERS AFTER LC INJECTIONOrganic Aqua 12-14 50°C - 80°C Undiluted Solution Dipping, ShowerInorganic 12-14 50°C - 80°C Undiluted Solution US, Dipping, Shower,BrushInorganic 12-14 50°C - 80°C Undiluted Solution US, Dipping, Shower,BrushPRODUCT APPLICATION TYPE pH TEMP, C CONCENTRATION, % USAGEP3 Allpass 7750 Cleaner for after liquid crystal injection. Semi-Aqua Neutral 40°C - 60°C Undiluted Solution Ultrasonic Dipping,Water FlushingP3 Allpass WS-HG Cleaner for after liquid crystal injection and particle. Water Neutral 40°C - 60°C Undiluted Solution Ultrasonic Dipping,Water FlushingP3 Kaltfin 20 Cleaner after liquid crystal injection. Solvent Neutral Room Temp Concentrated Solution Ultrasonic Dipping, IPARinsing35

ASSEMBLYMaTERIALSInks & CoatingsFor decades, Henkel’s product range of conductive,dielectric and other functional polymer thick filminks have been used to apply selective coatings ona variety of flexible and rigid substrates, via screen,flexographic and rotogravure printing methods.Inks & CoatingsThey can be effectively dried or cured through heator UV radiation. Henkel’s conductive (silver, silver/silverchloride, carbon-based), dielectric andother functional (e.g., electroluminescingpigments–based) inks are used for theproduction of:• Flexible circuits for membrane touch switchesand keyboards for desktop and notebook PCs• Heating elementsELECTRODAG461SSELECTRODAG479SSELECTRODAG503-62%Silver InksACHESONPM-500ELECTRODAGEL-411ELECTRODAGPE-007Carbon InksELECTRODAG109ELECTRODAG6017SSELECTRODAGPF-407CDielectric InksELECTRODAG452SSELECTRODAGPD-038ELECTRODAGPF-455B• Automotive sensorsELECTRODAG725AELECTRODAGPF-050ELECTRODAGPR-406BELECTRODAGPM-404• Biosensors and EKG/ECG electrodes• Antennas for contactless smartcards andRFID labels• Touch screensELECTRODAG820BELECTRODAG976SSHVELECTRODAGPF-845ELECTRODAGPF-407AELECTRODAGPR-800MINICOM7000 BLUE A• EL lamps• Printed circuit boards andpotentiometers36

ASSEMBLYMaTERIALSELECTRICALLY CONDUCTIVE INKS – SILVER INKSPRODUCT DESCRIPTION APPLICATION CURE SCHEDULESACHESON PM-500ELECTRODAG 461SSWater-based silver ink for flexographic printing onpaper and plastic film.Screen printable silver ink for ITO treated plasticfilm.Printed antennas for RFID labels, bio andmedical sensors.Busbar in touch screens and computer/palmtoppanels. Electrode/busbar in El lamps.ELECTRODAG 479SS Screen printable silver ink for PET film. Conductive traces in membrane touch switchesand other flexible circuitry.ELECTRODAG 503-62%ELECTRODAG 725AELECTRODAG 820BELECTRODAG 976SSHVELECTRODAG EL-411ELECTRODAG PE-007ELECTRODAG PF-050ELECTRODAG PF-845High temperature resistant, silver conductivecoating.Screen printable, economical silver ink for PET film.Excellent flexibility.Screen printable, silver-filled polymer thick filmink. Excellent for producing notebook and fullsize computer keyboards on treated or untreatedsubstrates.Screen printable silver ink for rigid printed circuitboards.Screen printable silver ink for ITO treated plasticfilm. Good fine line printing capability.Silver/silver chloride ink for flexographic/rotogravureprinting on plastic film.Screen printable silver ink for plastic film and papersubstrates. Highly conductive, superior fine lineprintability.Screen printable silver ink for PET film. Excellentflexibility and crease resistance.Inks & CoatingsSHEET RESISTANCE -OHM/SQUARE/25µSHELF LIFE1 min. @ 120°C

ASSEMBLYMaTERIALSMicro-Encapsulants(CSP Underfills)Henkel offers innovative capillary flow underfillencapsulants for Flip Chip, CSP and BGA devices.These are highly flowable, high purity, onecomponentencapsulants. They form a uniform andvoid-free underfill layer to improve the reliabilityperformance by redistributing stress away fromthe solder interconnects as well as enhancingmechanical performance. We have formulationsthat quickly fill very small gap/pitch parts that offerfast cure capabilities, have a long pot and shelf life,and are reworkable. Reworkability allows for costsavings by allowing the removal of the underfill toenable re-use of a board.Flip Chip applications require assistance withredistributing stress away from the solder joints toextend thermal aging and cycle life. A CSP or BGAapplication requires an underfill to improve themechanical integrity of the assembly during a bend,vibration or drop test. Henkel’s Flip Chip underfillsare formulated with a high loading of specialtyfillers to achieve low CTEs yet maintain the abilityto flow fast in small gaps, possessing high glasstransition temperatures and high modulus. OurCSP underfills are designed with little to no fillerloading, a choice of glass transition temperatures,and modulus to match the intended application.For certain applications, Loctite® Cornerbond andEdgebond technologies allow for a cost-effectiveunderfill solutions. The Cornerbond technology isapplied at all four corners of the package and thencan be cured during the normal solder reflow cycle,allowing for a more efficient process. The material’sself-centering characteristic ensures high assemblyreliability and outstanding yield rates.CSP UnderfillsCapillaryFlowsCornerbondEdgebondsEpoxy FluxesFlip Chip onFlex/BoardReworkableNon-ReworkableLOCTITE ® 3508 Thermal Cure UV CureHYSOL ® FF6000HYSOL ® FP4526LOCTITE ® 3500HYSOL ® UF3800LOCTITE ® 3593 LOCTITE ® 3128 LOCTITE ® 3705HYSOL ® FP4531LOCTITE ® 3513STYCASTA312EMERSON &CUMINGE1172AEMERSON &CUMINGSB-50ABLEFILLUF8807LOCTITE ® 3536EMERSON &CUMINGXE1218EMERSON &CUMINGE1216HYSOL ® FP4530LOCTITE ® 3563EMERSON &CUMINGE1926HYSOL ® FP0114HYSOL ® DC0114EMERSON &CUMINGE1172A38

ASSEMBLYMaTERIALSUNDERFILLS – CAPILLARY FLOW – REWORKABLEPRODUCT DESCRIPTION VISCOSITY(cPs)LOCTITE ® 3500A reworkable room temperature flow underfill for CSP & BGA devices. It cures at low temperatures and is afast cure underfill providing superior processing advantages.Micro-Encapsulants(CSP Underfills)POTLIFE203 14daysCURESCHEDULESLOCTITE ® 3513 Single-component epoxy used as a reworkable underfill for CSPs or BGAs. 4,000 48 hrs. 10 min. @ 150°C15 min. @ 120°C30 min. @ 100°CLOCTITE ® 3536LOCTITE ® 3563HYSOL ® UF3800STYCAST A312EMERSON & CUMINGXE1218CSP/BGA reworkable underfill designed to cure rapidly at low temperatures. Once cured provides excellentprotection for solder joints against mechanical stress such as shock, drop and vibration.A rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, suchas CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 μm.A high reliability, good reworkability, room temperature dispensable underfill. Compatible with most commonsolder pastes.A one-component, unfilled solventless epoxy underfill encapsulant, fast curing and excellent chemical andheat resistance.Reworkable, Snap Cure, void-free, fast flowing underfill that also provides excellent adhesion andreliability benefits.1,800 14days5,000 to12,0008 to 12hrs.Tg(°C)CTE 1(ppm/°C)STORAGE TEMP2 min. @ 130°C 16 77 2°C - 8°C69 63 2°C - 8°C5 min. @ 120°C 53 63 2°C - 8°C2 min. @ 130°C7 min. @ 150 °C 130 35 -40ºC375 3 days 8 min. @ 130°C 69 523,000 7 min. @ 160°C 2 months @25°C1,100 10 10 min. @ 110°C 60 75 -20°CdaysUNDERFILLS – CAPILLARY FLOW – NON-REWORKABLELOCTITE ® 3593 Non-reworkable underfill for high mechanical reliability. Fast flow and Snap Cure for improved process time. 4,500 7 days 5 min. @ 150°C 110 50 2°C to 8°CEMERSON & CUMINGE1216EMERSON & CUMINGE1926An innovative capillary flow underfill for CSP, BGA, or Flip Chip devices. Designed for high volume assemblyoperations that require an underfill that flows very fast, fully cures in the length of one reflow oven, andprovides a void-free underfill area.A wafer-level underfill that provides excellent thermal reliability and cures relatively fast compared tostandard first level underfills.UNDERFILLS – CORNERBONDLOCTITE ® 3508Lead-free, one-component epoxy corner bond adhesive. Applied pre-reflow and allows self-alignment ofSMT components during reflow operation. Used for lead-free applications.UNDERFILLS – EDGE BONDS – THERMAL CURELOCTITE ® 3128EMERSON & CUMINGSB-50One-component heat-cured epoxy adhesive designed to cure at low temperatures. Gives excellent adhesionon a wide range of materials.Innovative high mechanical reliability and reworkable edge bond material designed for CSP and BGA devices.SB-50 is designed for high volume assembly processes that require a material that does not flow underthe component and will cure at low temperatures.UNDERFILLS – EDGE BONDS – UV CURELOCTITE ® 3705UV-cured adhesive designed for bonding electronics components on PCBs. Thixotropic nature reducesmigration of product. Excellent adhesion to a wide range of substrate. Bonds in seconds upon exposure toUV light.UNDERFILLS – EPOXY FLUXESHYSOL ® FF6000FF6000 is a tacky flux with the additional features and benefits of an epoxy. It is formulated to provideboth fluxing action during reflow and a cured adhesive bond after reflow in a Pb-free process – with noadditional processing.6,000 5 days 3 min. @ 165°C 115 34 -20°C6,500 48 hrs. 20 min. @ 150°C 125 40 -20°C50,000 30daysCassonViscosity12 Pa-s2weeksLead-free profile 155 55 2°C to 8°C20 min. @ 80°C60 min. @ 60°C45 40 -15°C119,000 4 days 4 min. @ 120°C 30 70 -20°C40,000 30days4,600 24 hrs. Pb-free solderreflow profile @260°CUV Cured -44 157 2°C to 8°C30 88UNDERFILLS – Flip chip on flex and flip chip-on-boardHYSOL ® FP4526 Ceramic packages and FC on flex, Hi-Pb and no-lead applications; not for JEDEC performance. 4,700 36 hrs. 30 min. @ 165ºC 133 33 -40ºCHYSOL ® FP4531 Fast flow encapsulant for Flip Chip underfill applications with a gap of 1 mil. 10,000 24 hrs. 7 min. @ 160ºC 161 28 -40ºCABLEFILL UF8807 One-component, high flow liquid underfill encapsulant with superior moisture resistance. 17,000 8 hrs. 35 min. @ 165°C 135 21/80 12 months @-40°CHYSOL ® FP4530 Snap Cure Flip Chip underfill for FC on flex. Designed for small gaps (25 microns) 3,000 24 hrs. 7 min. @ 160ºC 148 44 -40ºCHYSOL ® FP0114 Fine filler version of FP4526 for gap of 25 microns. 5,000 36 hrs. 30 min. @ 165ºC 135 33 -40ºCHYSOL ® DC0114 Die edge coating to prevent silicon chipping in HDD applications 20,000 – 30 min. @ 165ºC 135 70 –EMERSON & CUMING An innovative reworkable capillary flow underfill. E1172A is a fast flow, Snap Cure underfill. It is a onecomponent20,000 48 hrs. 6 min. @ 165ºC 30 30 -40ºCE1172Aepoxy chemistry that is non-anhydride curing for enhanced moistureresistance.39

ASSEMBLYMaTERIALSMicro-Encapsulants(COB Encapsulants)Encapsulants are used to provide environmentalprotection and add mechanical strength towire bonded devices. Two different applicationtechnologies are employed for the protectiveencapsulation of wire bonded die:• Glob top technology requires an encapsulant witha fine-tuned rheology, as the flow capabilitiesmust allow the wires to be covered without theencapsulant flowing beyond the chip.• Dam and fill technology, where the dam is usedto limit the flow of the low viscosity fill material,allowing its use with fine pitch wire leads.Henkel’s Hysol® and Eccobond encapsulantsare available as either thermal or ultraviolet curematerials and are designed for the highest reliabilityin that they offer low coefficient of thermalexpansion, high glass transition temperature, andlow ionic content. These encapsulants have beenengineered to provide protection to wire bonds,leads, aluminium and silicon dies from harshenvironments, mechanical damage and corrosion.Formulated from epoxy, polyurethane, acrylate (UVcurable) and silicone chemistries, these systems haveproven reliability for electronic insulation. Henkelencapsulants offer excellent elevated temperaturestability and thermal shock resistance, outstandingelectrical insulation at both room and elevatedtemperatures, minimal shrinkage and low stressduring cure, as well as excellent chemical resistance.Our encapsulants have been designed to offer highthroughput and low-cost assembly processes.40

ASSEMBLYMaTERIALSMicro-Encapsulants(COB Encapsulants)Chip-on-Board (COB) EncapsulantsDamFillGlob TopsUV CureThermal CureHYSOL ® FP4451HYSOL ® FP4450ECCOBONDUV9052LOCTITE ® 3118HYSOL ® EO1062HYSOL ® FP4451TDHYSOL ® FP4450HFECCOBONDUV9085LOCTITE ® 3119HYSOL ® EO1072HYSOL ® FP6401HYSOL ® FP4450LVLOCTITE ® 3129HYSOL ® EO1080STYCAST50500DHYSOL ® FP4470HYSOL ® EO1016HYSOL ® FP4323STYCAST50500-1HYSOL ® EO1060HYSOL ® FP4460HYSOL ® EO1061HYSOL ® OT0149-3Chip-on-Board – DAM MATERIALSPRODUCT DESCRIPTION CURE SCHEDULES FLOW SPEED VISCOSITY (cPs) Tg (°C) CTE 1 (ppm/°C) % FILLERHYSOL ® FP4451 Industry standard damming material for BGAs. 30 min. @ 125°C90 min. @ 165°CHYSOL ® FP4451TDTall dam version of FP4451 for applicationsrequiring a taller, narrower dam. Ionicallycleaner also.30 min. @ 125°C90 min. @ 165°CN/A 900,000 145 24 72N/A 300,000 150 21 73HYSOL ® FP6401 High purity, liquid flexible damming material. 30 min. @ 165°C N/A 300,000 0 77 9STYCAST 50500DFor protection of wire bonds, consider this highpurity material as either a dam or a glob top.Chip-on-Board – FILL MATERIALSHYSOL ® FP4450 Industry standard fill material for dam and fillor cavity down BGAs.HYSOL ® FP4450HF High flow version of FP4450LV usingsynthetic filler for use in fine wire and lowalpha application.HYSOL ® FP4450LV Low viscosity, high purity, low stress liquidencapsulant.HYSOL ® FP4470 High adhesion version of FP4450 for 260°CL3 JEDEC performance.STYCAST 50500-1For protection of wire-bonded ICS, considerthis flowable material for a fill.2 hrs. @ 150°C N/A 125,000 70 80 7530 min. @ 125°C90 min. @ 165°C30 min. @ 125°C90 min. @ 165°C30 min. @ 125°C90 min. @ 165°C30 min. @ 125°C90 min. @ 165°CMedium 50,000 155 22 73Very High 32,000 160 19 73Not Tested 35,000 160 18 72.5High 48,000 148 18 751 hr. @ 150°C High 35,000 140 20 7541

ASSEMBLYMaTERIALSMicro-Encapsulants(COB Encapsulants)GLOB TOP MATERIALS – UV CUREPRODUCT DESCRIPTION CURE SCHEDULES VISCOSITY (cPs)ECCOBOND UV9052ECCOBOND UV9085A one-component, dual cure (UV& moisture) adhesive designedas a lead encapsulant.Designed as a faster curing, highthixotropic adhesive that givesgood flow control and adhesionfor a thick bondline.5 sec. using a300 W/in D bulbMoisture cure @ambient temperature5 sec. using a300 W/in D bulbHardness after UV &Moisture Cure (Shore D)STORAGE TEMP6,400

ASSEMBLYMaTERIALSPCB ProtectionWhile Henkel is providing the leading materialsused inside advanced packages and on sophisticatedassemblies, we also deliver next-generation Loctite®and Eccocoat brand conformal coating materialsto ensure superior product protection. Manyapplications expose printed circuit boards (PCBs)to harsh environments and Henkel is committedto delivering materials that provide extraordinaryenvironmental and thermal cycling protection.Our advanced conformal coating materials protectPCBs from thermal shock, moisture corrosivematerials, and a variety of other adverse conditionsto ensure long product life cycles in harsh marine,automotive, aerospace and consumer electronicsapplications. We also keep the environment top ofmind with every formulation, which is why Henkelhas migrated to solvent-free, low-VOC materialsand processes. Loctite® and Eccocoat conformalcoatings areavailable in solventfreeand fast curematerials, enablingprocess efficiencyand environmentalresponsibility.PCB ProtectionConformalCoatingsEncapsulants-PottingUrethaneAcrylatesAcrylics Urethanes Silicones EpoxyUrethanesSealantsECCOCOATUV7993LOCTITE ®3900ECCOCOATPC355-1LOCTITE ®5290One-ComponentTwo-ComponentRT CureTwo-ComponentHeat CureSTYCASTU2500LOCTITE ®NUVA-SIL ®5089HYSOL ®PC40-UMHYSOL ® PC62ECCOCOATU7510-1LOCTITE ®5293HYSOL ®EO1058HYSOL ®EE1068/HD3404HYSOL ®EE0079/HD0070STYCAST2850FT/CAT 11HYSOL ®US0146LOCTITE ®5210HYSOL ®PC18MLOCTITE ®5296ECCOBONDA312-20HYSOL ®ES1002ECCOBOND104STYCASTE2534FRHYSOL ®US0154LOCTITE ®5699HYSOL ®PC28STDECCOCOATSC3613HYSOL ®EO1088HYSOL ®ES1902STYCAST2017M4STYCASTNX-17HYSOL ®US2050LOCTITE ®5810FHYSOL ®PC29MSTYCASTE1847STYCAST1090BLKSTYCAST2561/CAT 11HYSOL ®US2350STYCASTNX-76STYCAST1090SISTYCAST2651-40HYSOL ®US5532STYCAST2850FT/CAT 23LV43

ASSEMBLYMaTERIALSPCB ProtectionConformal CoatingsCONFORMAL COATINGS – URETHANE ACRYLATESPRODUCT DESCRIPTION RESIN TYPE CURE SCHEDULES VISCOSITY (cPs)ECCOCOAT UV7993HYSOL ® PC40-UMSolvent-free one-component dual cureconformal coating.Solvent-free, low-viscosity, rapid gel,UV-moisture cure, one-componentconformal coating.CONFORMAL COATINGS – ACRYLICSLOCTITE ® 3900HYSOL ® PC62This air-dry coating is designed for smallproduction runs. It may be applied byspray, dip or brush procedures. Aerosol –fast cure. Note: Not sold in Europe.Non-toluene based, rapid drying, onecomponentacrylic for non-atomizedspraying applications.CONFORMAL COATINGS – URETHANESECCOCOAT PC355-1HYSOL ® PC18MHYSOL ® PC28STDECCOCOAT U7510-1HYSOL ® PC29MLead-free, transparent, one-componentprotective varnish system that is dry tothe touch in under 30 minutes.Flexible solvent-based, one-componenturethane coating. Provides good thermalshock resistance. MIL-I-46058C.Convenient aerosol packaging, oxygencure,printed circuit board coating system.Lead-free, transparent, one-componentprotective varnish system that is dry tothe touch in under 30 minutes.Thin-film printed circuit board coatingwith good toughness and high flexibility.Note: Not sold in Europe.CONFORMAL COATINGS – SILICONESECCOCOAT SC3613LOCTITE ® 5290LOCTITE ® 5293LOCTITE ® 5296Heat curable, optically clear, high purity,one-component coating to be applied bybrush, dip or flow coating.Solvent-free, low viscosity, UV/moisturecure silicone suited to brush, dip andselective coating.Repairable, solvent-free, mediumviscosity, UV/moisture cure silicone suitedto brush, dip and selective coating.Heat cure silicone can be applied withbrush, dip, or spray. High reliability forautomotive. Clear.Urethane AcrylateOne-ComponentUrethane AcrylateOne-ComponentDIELECTRICSTRENGTH (V/mil)SERVICE TEMP RANGE5 sec. UV + 4 days @ RT 120 1,200 -40°C to +105°C10 sec. UV + 3 days @ RT 1,100 2,000 -40°C to +135°CAcrylic One-Component Air Dry: 5 min. Aerosol 1,652 -40°C to 125°CAcrylic One-Component 45 min. @ 75°C 50 2,000 -40°C to +125°CUrethane One-Component 1 hr. @ 80°C 300 N/A -40°C to +130°CUrethane One-Component 2 hrs. @ 60°C 350 1,200 Continuous up to 110°CUrethane One-Component 2 hrs. @ 60°C 35 1,500 Continuous up to 110°CUrethane One-Component 2.5 hrs. @ 25°C 2,750 N/A -30°C to +130°CUrethane Two-Component 2 hrs. @ 100°C 225 1,500 Continuous up to 125°CSilicone One-Component 30 min. @ 120°C 3,500 400 -40°C to 200°CSilicone One-Component 20 sec. @ 70 mW/cm 2 +72 hrs. RTSilicone One-Component 20 sec. @ 70 mW/cm 2 +72 hrs. RT300 500 -55°C to 200°C600 406 -40°C to 200°CSilicone One-Component Heat 7 min. @ 125°C 200 524 -40°C to 200°C44

ASSEMBLYMaTERIALSPCB ProtectionEncapsulants – PottingEnsuring that electronics products function as theyare designed to is just one piece of the materialssolution Henkel delivers. Protecting printed circuitboards and electronic assemblies from thermalcycling and adverse environmental conditions is theother critical component for product durability andreliability. Under the leading Hysol® and Stycastbrands, Henkel offers several PCB protectionproducts to minimize external product stress andmaximize performance. Our portfolio of conformalcoatings keeps moisture, humidity and other adverseconditions from deteriorating printed circuit boardsused in harsh marine, automotive, aerospace andconsumer electronics applications. Henkel alsostrives to keep environmental consciousness at theforefront of all our product development efforts,which is why we have moved toward solvent-free,low-VOC materials and processes.Henkel’s potting and encapsulation compoundsprotect PCBs and electrical devices by enhancingmechanical strength, offering electrical insulation,and protecting against vibration and shock.ENCAPSULANTS-POTTING – EPOXY – One componentHYSOL ® EO1058 ECCOBOND A312-20 HYSOL ® EO1088 STYCAST E1847 STYCAST NX-76Viscosity, cPs @ 25°C 50,000 20,000 62,000 680 800Working Time @ 25°C 10 days 4 months N/A N/A N/AGel Time 12 min. @ 121°C 35 sec. @ 160°C 3.5 min. @ 121°C 90 min. @ 110°C+ 2 hrs. @ 140°CRecommended Cure Cycle 2 hrs. @ 140°C 15 min. @ 120°C 30 min. @ 150°C N/A 3 hrs. @ 85°C+ 4 hrs. @ 145°CAlternate Cure Cycle 3 hrs. @ 125°C 3 min. @ 160°C 2 hrs. @ 120°C N/A N/AColor Black Black Black N/A Opaque WhiteSpecific Gravity 1.65 1.23 1.56 N/A 1.3Hardness, Shore D 90 80 88 N/A 88Tg, °C 140 N/A 125 135 125CTE below Tg, ppm/°C 24 N/A 35 N/A 68CTE above Tg, ppm/°C 150 N/A 125 N/A 110Tensile Strength (psi) 10,000 N/A N/A N/A N/AElongation, % 1.96 N/A N/A N/A 4.5Dielectric Strength, v/mil 579 N/A N/A N/A N/AVolume Resistivity, ohm.cm: @ 25°C@ 125°CDielectric Constant, 25°C: 1 kHz100 kHzDissipation Factor, 25°C:Dielectric Constant, 125°C:Dissipation Factor, 125°C:1 kHz100 kHz1 kHz100 kHz1 kHz100 kHz1.4 x 10 164 x 10 14N/A9.5 x 10 14 8 x 10 10 N/A3.83.70.10.0134.273.780.0080.012Flammability Rating N/A Class B N/A N/A N/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/A45

ASSEMBLYMaTERIALSPCB ProtectionEncapsulants – PottingENCAPSULANTS-POTTING – EPOXY – Two component – RT CUREViscosity, cPs@ 25°C, Resin@ 25°C, Hardener@ 25°C, MixedHYSOL ® EE1068/HD340430,0002514,000HYSOL ® ES1002 HYSOL ®28,0006,30019,500ES19024,70050290STYCAST1090BLK135,000255,000STYCAST1090SIN/A253,000STYCAST 2850FT/CAT 23LVPot Life @ 25°C N/A 60 min. 60 min. 60 min. 30 min. 60 min.Gel Time @ 25°C 80 5 hrs. 10 sec. UV 4 hrs. 3 hrs. 4 hrs.Recommended Cure Cycle 24 hrs. @ 25°C 36 to 48 hrs. @ 25°C 24 hrs. @ 25°C 24 hrs. @ 25°C 24 hrs. @ 25°C 24 hrs. @ 25°CAlternate Cure Cycle 2 hrs. @ 60°C 3 hrs. @ 60°C 2 hrs. @ 60°C 2 hrs. @ 60°C N/A 2 hrs. @ 60°CColorMix RatioResinHardenerMixedBy Weight (R:H)By Volume (R:H)BlackAmberBlack100:5100:9BlackTanBlack1:11:1Water WhiteLight AmberWater White100:41.72:1BlackAmberBlack100:18.5100:14.5Specific Gravity 1.50 1.55 1.08 0.85 N/A 2.19Hardness, Shore D 90 88 80 75 N/A 92Tg °C N/A 50 44 N/A N/A 68CTE below Tg, ppm/°C N/A 66 68 N/A N/A 39.4CTE above Tg, ppm/°C N/A 150 199 N/A N/A 111.5Tensile Strength (psi) 6,000 2,670 7,900 3,900 2,180 N/AElongation, % 1.5 6 3.7 N/A N/A N/AFlexural Strength (psi) 12,000 4,975 10,000 6,900 4,060 15,300Dielectric Strength (psi) 1300 1135 1390 N/A 373 375Volume Resistivity, ohm.cmDielectric Constant @25°CDissipation Factor @ 25°CDielectric Constant @105°CDissipation Factor @105°C@ 25°C@ 105°C1 kHz100 kHz1 kHz100 kHz1 kHz100 kHz1 kHz100 kHzN/AN/A4.504.500.010.01N/AN/AN/AN/A6.38 x 10 14 1.27 x 10 16>10 139.28 x 10 10 2.3 x 10 13 N/A4.604.200.0300.0208.607.000.300.09Thermal Conductivity W/mK 0.4 0.64 0.17 0.19 0.17 1.1Flammability Rating Passes 94 V-0 @ 6.5 mm 94V-0 @ 3.3 mm None None None NoneENCAPSULANTS-POTTING – EPOXY – Two component – HEAT CUREECCOBOND 104PRODUCT DESCRIPTION CURE SCHEDULESA two-component epoxy adhesive with outstanding physical anddielectric properties and service temperatures up to 230°C.3.80N/A0.008N/AN/AN/AN/AN/AN/AN/AN/A0.05N/AN/AN/AN/AVISCOSITY(cPs)BlackAmberBlack100:23N/A>10 13N/A3.10N/A0.01N/AN/AN/AN/AN/ASERVICE TEMPRANGESHORE DHARDNESS225,000255,600BlackAmberBlack100:7.5100:17.5>10 15N/AN/AN/AN/AN/AN/AN/AN/AN/ASHELF LIFE6 hrs. @ 120°C N/A - >90 6 months @25°CHYSOL ® EE0079/HD0070 Two-part epoxy system used for bonding leads on electronic devices. 2 hrs. @ 60°C 1,500 up to 105°C 85 12 monthsSTYCAST 2017M4 Epoxy encapsulant developed for lamp type, blue LED. 45 min. @ 130°C+ 2 hrs. @ 130°CSTYCAST 2561/CAT 11STYCAST 2850FT/CAT 11For excellent adhesion, low outgassing and certification toMIL-I-16923, consider this encapsulant.For high thermal conductivity and low outgassing, consider thisencapsulant.730 - 88 6 months @25°C1 hr. @ 120°C 25,000 -75°C to +175°C 88 6 months1 hr. @ 120°C 5,600 -40°C to +150°C 93 12 months46

ASSEMBLYMaTERIALSPCB ProtectionEncapsulants – PottingSTYCAST 2651-40STYCAST E2534FROne/Two Components Two TwoViscosity, cPs @ 25°C 30,000 300,000 - 400,000Working Time @ 25°C 30 min. for Cat 9; 4 hrs. for Cat 11 N/AGel Time N/A N/ARecommended Cure Cycle 24 hrs. @ 25°C for Cat 9;2 hrs. @ 100°C for Cat 1115-24 hrs. @ 25°C for Cat 9;16 hrs. @ 75°C for Cat 11Alternate Cure Cycle 1 hr. @ 65°C for Cat 9 2 hrs. @ 65°C for Cat 9;2 hrs. @ 100°C for Cat 11Color Black BlueMix Ratio 100:9 for Cat 9;100:11 for Cat 11100:4 for Cat 9;100:5 for Cat 11Specific Gravity 1.45 and 1.55 2.1Hardness, Shore D >85 >90Tg, °C N/A 76 (Cat 9); 115 (Cat 11)CTE below Tg, ppm/°C 45 39 (Cat 9); 37 (Cat 11)CTE above Tg, ppm/°C N/A N/ATensile Strength (psi) N/A 11.06 MpaElongation, % 0.2 - 0.4 N/ADielectric Strength, v/mil 17.7 KV/mm N/AFlammability Rating N/A V-0PRODUCT DESCRIPTION CURE SCHEDULES VISCOSITY (cPs)STYCAST NX-17 Good adhesion to PPA 2 hrs. @ 90°C+ 4 hrs. @ 145°CSHORE DHARDNESSSHELF LIFE780 93 3 months @0°C to 5°C47

ASSEMBLYMaTERIALSPCB ProtectionEncapsulants – PottingENCAPSULANTS-POTTING – URETHANESSTYCAST U2500 HYSOL ® US0146 HYSOL ® US0154 HYSOL ® US2050 HYSOL ® US2350 HYSOL ® US5532Viscosity, cPs, @ 25°C – UA (Resin) 12,500 40 55 2,000 55 75UB (Hardener) 50 940 5,000 500 1,300 11,000US (Mixed) 6,000 205 2,500 1,500 2,400 2,000Working Time @ 25°C 120 35 200 3 45 10Gel Time @ 25°C 60 60 400 5 90 15Recommended Cure Cycle 24 hrs. @ 25°C 4 hrs. @ 85°C 16 to 24 hrs. @ 25°C 48 hrs. @ 25°C 24 hrs. @ 23°C 24 hrs. @ 25°CAlternate Cure Cycle 4 hrs. @ 60°C 48 hrs. @ 25°C 5 hrs. @ 70°C 1 hr. @ 85°C 1 hr. @ 85°C 2 hrs. @ 70°CColor: UA (Resin) Black Amber Amber Clear Brown AmberUB (Hardener) Amber Amber Black Clear Black WhiteUS (Mixed) Black Amber Black Clear Black WhiteMix Ratio: By Weight (R:H) 100:7 1:1 14.1:100 100:55 21.2:100 15:100By Volume (R:H) 100:8.5 10:11 14.7:100 1.78:1 1:4 18.2:100Specific Gravity 1.35 1.04 1.3 1.05 1:4 1:5.5Hardness, Shore A 72 50 70 90 85 80Tg, °C -53 -21 -15 5 0 N/ACTE below Tg, ppm/°C N/A 147 10 55 115 N/ACTE above Tg, ppm/°C N/A 230 43 230 155 N/ATensile Strength (psi) 435 185 150 2,500 476 1,500Elongation, % 82 140 50 170 65 113Moisture Absorption, 24 hr., % 0.75 0.11 0.06 0.66 0.09 0.15Weight Loss after 168 hrs. @ 105°C, % N/A 0.53 0.95 0.41 0.19 0.19Dielectric Strength, v/mil N/A 1,175 700 1,050 954 1,150Volume Resistivity, ohm.cm @ 25°C 4 x 10 11 4.20 x 10 13 1.00 x 10 14 3.30 x 10 14 6.12 x 10 13 7.1 x 10 13Dielectric Constant, 25°C: 1 kHz N/A 6.8 6 2.4 5.1 N/ADissipation Factor, 25°C: 1 kHz N/A 0.171 0.15 0.07 0.13 N/AFlammability Rating N/A N/A 94V-0 @ 9.5 mm 94V-2 @ 6.1 mm 94V-0 @ 12.2 mm48

ASSEMBLYMaTERIALSPCB ProtectionSealantsLoctite® silicone gasketing materials offer precise,reliable sealing for electronic enclosures, ensuringthat housing modules are tightly secured andcomponentry is protected. Loctite® siliconeencapsulants are specially formulated to isolatesensitive fine-pitch leads from potentially damagingthermal cycling conditions. Like all Henkelproducts, these materials have been designed forease-of-use and are conveniently packaged fordispense operations.SEALANTSPRODUCT DESCRIPTION RESIN TYPE CURE SCHEDULESLOCTITE ® NUVA-SIL ®5089LOCTITE ® 5210LOCTITE ® 5699LOCTITE ® 5810FUV-curing silicone for electronics module sealing.Ideal for high-speed potting. On-line pressuretesting possible immediately after cure.An ultra-fast curing, non-corrosive RTV siliconedesigned for potting, wire tracking, selectivesealing, vibration dampening, and repair/reworkapplications on PCBs.Non-corrosive silicone paste for forming use as aflange sealant in rigid housings, shows excellentoil resistance.Single-component, non-silicone, oxime-free,polyacrylate-based adhesive/sealant withfluorescent tracer that cures with moisture atroom temperature. Primarily designed for flangesealing with excellent oil resistance.AlkoxyUV Moisture 60 sec. @70 mW/cm 2VISCOSITY(cPs)TENSILE STRENGTH,LAP SHEAR (PSI)ELONGATION (%)SHORE A HARDNESS100,000 145 190 >25Alkoxy Moisture 24 hrs. @ 25°C N/A 410 230 48Oxime 7 days @ RT Paste 348 >100 55Polyacrylate 7 days @ RT 45 140 >150 3049

ASSEMBLYMaTERIALSPCB ProtectionLow Pressure Molding (Macromelt ® )Henkel’s renowned Macromelt® low-pressuremolding solution is delivering superior sealingadhesion and excellent temperature and solventresistance. The simplicity of these materials is theiradvantage: because the entire Macromelt® operationtakes place at low pressure, cycle time is short andfine or fragile circuitry is not damaged, deliveringmeasurable improvements over that of traditionalpotting or encapsulating processes. PCB and circuitryprotection is essential in modern, challengingapplications; and Henkel delivers manufacturersproven, reliable solutions and peace-of-mind.Advantages:• Complete watertight encapsulation• Fast cycle time (15 to 45 seconds)• Low capital equipment costs• Safe, one component, UL 94V-0 approved• Low pressure and high speed molding forelectronics encapsulationApplications:• Automotive sensors• Hall effect sensors• Circuit board protection• Strain relief• Switches• Battery sealingMacromelt ®PolyamidePolyolefinHighTemperatureResistanceAdhesion toPlasticsIncreasedHardnessExcellentAdhesion toMetals,Plastics, ToughSurfacesAmberBlackAmberBlackAmberBlackOpaque WhiteMACROMELT ®OM673MACROMELT ®OM678MACROMELT ®OM633MACROMELT ®OM638MACROMELT ®OM641MACROMELT ®OM646MACROMELT ®MM Q-5375MACROMELT ®OM682MACROMELT ®OM687MACROMELT ®OM652MACROMELT ®OM657MACROMELT ®MM6208MACROMELT ®MM6208S50

ASSEMBLYMaTERIALSLow Pressure Molding (Macromelt ® )polyamide, HIGH TEMPERATURE RESISTANCEPCB ProtectionPRODUCT DESCRIPTION COLOR PERFORMANCE TEMP SHORE A HARDNESS SOFTENING POINTMACROMELT ® OM673MACROMELT ® OM678Moldable polyamide with good adhesion for higher temperatureapplications such as in an automotive under-hood.AmberMACROMELT ® OM682 Moldable polyamide for the most demanding high humidityAmberapplications such as on the inside of an automobile tire.MACROMELT ® OM687 Formulated for very low water vapor transmission. BlackPOLYAMIDE, ADHESION TO PLASTICSMACROMELT ® OM633MACROMELT ® OM638MACROMELT ® OM652MACROMELT ® OM657MACROMELT ® MM6208MACROMELT ® MM6208SMoldable polyamide with service temperature up to 125°C, suchas in an automotive firewall.Moldable polyamide where excellent adhesion and coldtemperature flexibility are important, such as in an automotiveexterior. Also used extensively in white goods.Moldable polyamide with excellent adhesion to tough substrates.Great flexibility offers incredible strain relief on cables andwires. Ideal for encapsulation of heat producing components inappliance and consumer electronics. UL RTI 95°C.POLYAMIDE, INCREASED HARDNESSMACROMELT ® OM641MACROMELT ® OM646Moldable polyamide where strength and hardness are neededsuch as in memory sticks and computer connectors.BlackAmberBlackAmberBlackAmberBlackAmber-40°C to +140°C 90 187°C ± 5°C-40°C to +150°C 88 188°C ± 5°C-40°C to +125°C 90 175°C ± 5°C-40°C to +125°C 77 157°C - 165°C-40°C to +130°C 78 155°C ± 5°C-40°C to +125°C 92 175°C ± 5°CPOLYOLEFIN, EXCELLENT ADHESION TO METALS, PLASTICS, TOUGH SURFACESMACROMELT ® MM Q-5375Moldable polyolefin for demanding moisture and solventresistance. Excellent adhesion to the most difficult substrates.BlackOpaque White -30°C to +100°C 55 139°C ± 5°C51

ASSEMBLYMaTERIALSSolder MaterialsWith a variety of formulations for various wavesoldering processes, Multicore® brand highperformance liquid flux technology is compatiblewith dual-wave and lead-free processes, deliveringoutstanding results. From no-clean to low-residueto VOC-free, Multicore® brand fluxes deliver uniqueproperties for individualized manufacturing needs.Henkel’s flux formulation teams are unmatchedwhen it comes to expertise and ingenuity – twocharacteristics that are essential to the developmentof modern, lead-free and environmentallyresponsible processes. Through careful processanalysis and a complete understanding of chemicalinteractions and manufacturing requirements,Henkel has developed a broad range of Multicore®brand liquid fluxes to suit a variety of applications.Solder MaterialsFluxesSolder PastesSolder WiresNo Clean VOC-Free Water WashNo CleanLead FreeNo CleanTin LeadWater WashNo CleanWater WashMULTICORE ®MF388MULTICORE ®MF300MULTICORE ®Hydro-X20MULTICORE ®LF318MULTICORE ®MP218MULTICORE ®WS200MULTICORE ®C400MULTICORE ®Hydro-XMULTICORE ®MFR301MULTICORE ®LF620MULTICORE ®WS300MULTICORE ®C502MULTICORE ®LF70052

ASSEMBLYMaTERIALSSolder MaterialsFluxesFLUXES – NO CLEANPRODUCT DESCRIPTION SOLIDS CONTENT (%)MULTICORE ®MF388MULTICORE ®MFR301FLUXES – VOC-FREESustained activity in high preheats for dualwave and lead-free processes. High PTH fill,low residues. High reliability. Solvent-basedflux may be thinned with IPA.Higher solids, halide-free flux for betterwetting on reduced solderability surfaces andto minimize bridging on complex geometries.Fully lead-free and dual wave compatible.Solvent-based flux may be thinned with IPA.PRODUCT DESCRIPTION SOLIDS CONTENT (%)MULTICORE ®MF300General purpose, VOC-free (water-based),no-clean, halide-free and resin-free flux withspecial formulation to minimize solder balling.Compatible with lead-free processes.FLUXES – WATER WASHACID VALUE(MG KOH/G)IPC/J-STD-004 CLASSIFICATIONAPPLICATION3.5 20 ROL0 Spray6.0 40 ROM0 Spray/FoamACID VALUE(MG KOH/G)PRODUCT DESCRIPTION SOLIDS CONTENT (%) ACID VALUE(MG KOH/G)MULTICORE ®Hydro-X20A high activity, water washable flux designedfor the soldering of the most difficultelectronic assemblies. Unique activatorpackage enables a wider process windowand the soldering of all common electronicsurfaces with ease. Residues are readilyand completely removable by water washafter soldering.IPC/J-STD-004 CLASSIFICATIONAPPLICATION4.6 37 ORM0 Spray/FoamIPC/J-STD-004 CLASSIFICATIONAPPLICATION20 24 ORH1 Spray/Foam53

ASSEMBLYMaTERIALSSolder MaterialsSolder PastesAs the world’s leading developer of advancedsolder paste materials, Henkel delivers decadesof technology and expertise for optimizedprocess performance. With groundbreaking newformulations to provide an easy transition tolead-free as well as proven, traditional tin-leadformulations, Multicore® brand solder materials areenabling the production of some of today’s mostadvanced products. Our portfolio of solder pastematerials addresses a variety of manufacturingrequirements and offers performance characteristicsunmatched by any other materials supplier. Lowvoidinglead-free solder pastes, no-clean pastes,water-wash pastes and crossover pastes for mixedmetalmanufacturing are all part of our vastoffering. Supporting ultra-fine pitch printing athigh speed, delivering long open and abandon timesand pin-testability across all types of assembliesand surface finishes, Multicore® pastes deliver theflexibility modern electronics firms require to staycompetitive. Our materials also offer outstandingresistance to high temperature and high humidity,providing multinational firms with the confidencethey need to deploy Multicore® materials on a globallevel with consistent performance. Plus, all of ourproducts are supported locally with outstandingtechnical expertise and are backed by Henkel’s globalinfrastructure and inimitable resource base.54

ASSEMBLYMaTERIALSSolder MaterialsSOLDER PASTES – NO CLEAN LEAD FREEPRODUCT DESCRIPTION ALLOYMULTICORE ®LF318Solder PastesA halide-free, no-clean, Pb-free solder paste that hasexcellent humidity resistance and a broad process window forboth reflow and printing. Offers high tack to resist componentmovement during high-speed placement, long printerabandon times and excellent solderability over a wide rangeof reflow profiles in air and N2 reflow ovens and across awide range of surface finishes including Ni/Au, immersion Sn,Immersion Ag and OSP Cu. Proflow compatible. Available withboth AGS (20-45µm, equivalent to IPC type 3) and DAP (20-38µm, equivalent to IPC type 4) powder.96SC (95.5Sn 3.8Ag 0.7Cu, SAC387,217C) 97SC (96.5Sn 3.0Ag 0.5Cu,SAC305, 217C)% METALLOADINGTACK, g/mm 288.5 and 89.0 1.8 AGS (Type 3 powder)2.3 DAP (Type 4 powder)PRINT SPEED,mm/sIPC/J-STD-004CLASSIFICATION25 - 150 ROL0MULTICORE ®LF620Halide-free, no clean, low voiding, Pb-free solder paste withexcellent humidity resistance and broad process window.Suitable for both reflow and printing.96SC (95.5Sn 3.8Ag 0.7Cu, 217°C)97SC (96.5Sn 3.0Ag 0.5Cu, 217°C)88.5 2.3 25 - 150 ROL0MULTICORE ®LF700A halide-free, no clean, Pb-free solder paste with a broadprocess window for printing, reflow and humidity resistance.SOLDER PASTES – NO CLEAN TIN-LEADMULTICORE ®MP218High activity, soft residue, colorless, halide-free, no-cleansolder paste that displays outstanding resistance to hightemperature and humidity environments. Suitable for a largerange of assembly processes, including rheo pump, proflow,large high-den.SOLDER PASTES – WATER WASHMULTICORE ®WS200MULTICORE ®WS300High performance, water-washable solder paste. Residuesare readily removed with DI water, without the need for asaponifier. WS200 has good open time with excellent printdefinition and soldering activity.Flux system specially formulated for lead-free alloys. Highperformance, water washable solder paste. Residuesare easily removed with DI water, without the need for asaponifier. Good open time with excellent print definitionand soldering.96SC (SAC387) 97SC (SAC305) 88.5 2.4 70 - 150 ROL0Sn62/Sn63/63S4 (Anti-Tombstoning)89.5 and901.6 25 - 150 ROL0Sn62/Sn63/63S4 (Anti-Tombstoning) 88.5 0.8 25 - 100 0RH196SC (SAC387)97SC (SAC305)87 0.8 25 - 100 ORH155

ASSEMBLYMaTERIALSSolder MaterialsSolder WiresThe Multicore® portfolio of cored solder wirefeatures the award-winning multiple flux coretechnology that ensures the even and consistentdistribution of flux throughout the solder wire.This mainstay in Henkel’s line of solder productsdelivers ease of use and outstanding performance fortoday’s delicate hand soldering assembly and reworkoperations.Formulated with a variety of different alloyselections, Multicore® cored wires supporttraditional tin-lead manufacturing operations aswell as modern lead-free processes. Our fast-wettingmaterials deliver excellent solder joint integrity andoutstanding long-term performance.SOLDER WIRES – NO CLEANPRODUCT DESCRIPTION ALLOY OPTIONS (Tin/Lead) ALLOY OPTIONS* (LEAD FREE) IPC/J-STD-004 CLASSIFICATIONMULTICORE ® C400MULTICORE ® C502Halide-free, no-clean, clear residue,increased flux content for improved wetting.No-clean, clear residue, medium activity fluxwith good wetting on difficult substrates.SOLDER WIRES – WATER WASHSN62 60/40 63/37 SAC305 (97SC) SAC387 (96SC) 99C ROL0SN62 60/40 63/37 SAC305 (97SC) SAC387 (96SC) 99C ROM1PRODUCT DESCRIPTION SOLIDS CONTENT (%) ACID VALUE (MG KOH/G) IPC/J-STD-004 CLASSIFICATIONMULTICORE ® Hydro-X High activity, water washable flux withSN62 60/40 63/37 SAC305 (97SC) SAC387 (36SC) 99C ORH1excellent wetting on difficult substrates.56

ASSEMBLYMaTERIALSSolder MaterialsSolder AccessoriesSolder AccessoriesSolderMasksMini Cleaners(Pen)Mini Fluxers(Flux Pen)Tip TinnersWicksMULTICORE ®Spot-OnMULTICORE ®MCF800No CleanWater WashVOC-FreeMULTICORE ®TTC-LFMULTICORE ®NC-00MULTICORE ®SC01MULTICORE ®MFR301MULTICORE ®Hydro-X20MULTICORE ®MF300MULTICORE ®NC-AAMULTICORE ®X32-10iMULTICORE ®NC-ABMULTICORE ®NC-BBSOLDER MASKPRODUCTMULTICORE ® Spot-OnCLEANERSPRODUCTMULTICORE ® MCF800MULTICORE ® SC01DESCRIPTIONTemporary solder used with circuit boards prior to soldering. Willwithstand flux and soldering. Suitable for use with hand or pneumaticapplications.DESCRIPTIONDesigned for the effective removal of all types of soldering processresidues from circuit boards, screens, fixtures, and equipment. Flash pointof 105ºC makes it ideal for use in heated cleaning systems.Designed for the stencil cleaning and hand cleaning of process solderingresidues. A highly effective cleaner that dries rapidly (fast evaporation).MINI FLUXERS/MINI CLEANER (FLUX PENS)PRODUCTMULTICORE ® Flux Pen MF300MULTICORE ® Flux Pen MFR301MULTICORE ® Flux Pen Hydro-X20MULTICORE ® Cleaner Pen SC01MULTICORE ® X32-10iDESCRIPTIONControlled release flux and cleaner pen applicators. Rangeof compatible flux types available. Ideal for controlledapplications of flux when carrying out SMT rework. Cleanerpen easily removes residues.Low solids synthetic resin flux meets global demand forultra-low residue medium activity flux.TIP TINNERPRODUCTMULTICORE ® TTC-LFLead-Free Tip TinnerWICKSSIZE REFERENCEMULTICORE ® NC-00MULTICORE ® NC-AAMULTICORE ® NC-ABMULTICORE ® NC-BBDESCRIPTIONHandy, non-abrasive, solder iron tip tinner. Easily wets hotsolder irons leaving a brightly tinned tip. Improves handsoldering efficiency and extends tip life. Adhesive pad allowseasy mounting on or near the solder iron holder.APPROXIMATE WIDTH0.8 mm (0.03 in.)1.5 mm (0.06 in.)2.2 mm (0.08 in.)2.7 mm (0.10 in.)57

ASSEMBLYMaTERIALSSurface Mount Adhesives(Chipbonder )As the first commercially available adhesive toaddress the emerging surface-mount market inthe 1980s, Loctite® Chipbonder and Eccobondproducts today are the industry standard for mixedtechnologyand double-sided SMT applications.Henkel offers a wide range of Chipbonder andEccobond products to meet the diversity andchallenges of today’s manufacturing requirements.Developed using in-process analysis ensures thatHenkel’s surface mount adhesives can address highspeedassembly processes while delivering lead-freecompatibility with no loss in productivity. Theportfolio includes formulations for low-temperaturescreen printing and dispensing.Surface Mount AdhesivesScreen Print/Pin TransfersDispenseAdhesivesCleanersLOCTITE ® 3616LOCTITE ® 3609ECCOBONDD125FLOCTITE ® 7360LOCTITE ® 3627LOCTITE ® 3619ECCOBONDE6752LOCTITE ® 362158

ASSEMBLYMaTERIALSSURFACE MOUNT ADHESIVES – SCREEN PRINT/PIN TRANSFERPRODUCT DESCRIPTION COLOR CURE SCHEDULES APPLICATION STORAGE TEMP SHELF LIFELOCTITE ® 3616LOCTITE ® 3627High speed stencil print adhesive. Compatible withDEK ® Proflow ® and MPM ® Rheopump ® . Ultra-lowmoisture pickup. Pin transfer capable also.High speed stencil print adhesive. Compatible withDEK ® Proflow ® and MPM ® Rheopump ® . Recommendedproduct for DEK ® Proflow ® Pumprint process.Red 90 sec. @ 150°C2 - 3 min. @ 125°CRed 90 sec. @ 150°C3 - 4 min. @ 125°CSURFACE MOUNT ADHESIVES – DISPENSE ADHESIVESLOCTITE ® 3609LOCTITE ® 3619LOCTITE ® 3621ECCOBONDD125FECCOBONDE6752For medium to high speed dispense applications.Excellent green strength for large components.Ultra-low temperature cure, high speed syringedispense.High performance for ultra-high speed syringe dispense.Recommended product for Dispense Jet. Superiorhumidity resistance and electrical properties. Roomtemperature storage capable.Red 90 sec. @ 150°C3 - 4 min. @ 125°CRed 2 min. @ 100°C5 - 6 min. @ 85°CRed 90 sec. @ 150°C3 - 4 min. @ 125°CReduced “popcorn” effect upon cure. Yellow 20 - 30 min. @ 100°C7 - 20 min. @ 110°C2 - 10 min. @ 120°CA one-component, low temperature cure, surface mountadhesive that can be applied easily without stringing.Surface Mount Adhesives(Chipbonder)Red 20 - 30 min. @ 100°C10 - 20 min. @ 110°C3 - 10 min. @ 120°CStencil Print(60 - 150 mm/s)Stencil Print(60 - 150 mm/s)General PurposeSyringe DispenseHigh Speed SyringeDispense 40,000+DPH CapableVery High SpeedSyringe Dispense47,000 DPHCapableScreen or StencilPrinting5°C ± 3°C 9 months5°C ± 3°C 6 months5°C ± 3°C 6 months5°C ± 3°C 10 months5°C ± 3°C or 8°C to21°C for 30 days10 months5°C ± 3°C 8 monthsDispensing 5°C ± 3°C 8 monthsSURFACE MOUNT ADHESIVES: CLEANERSPRODUCT DESCRIPTION SOLVENT TYPE FLASH POINTLOCTITE ® 7360Nozzle and dispense machine component cleaner.Excellent for removal of uncured adhesive from theboard without causing the adhesive to gel. Availablein environmentally responsible pump spray nonaerosolcan for nozzle cleaning.Aliphatic EsterBlendCORROSIVEPROPERTIESOZONE DEPLETIONPOTENTIAL100°C None None59

ASSEMBLYMaTERIALSThermal ManagementMaterialsHenkel’s thermal materials scientists have developedsome unique and user-friendly products to addressthe requirements of today’s thermal transferpriorities. The Loctite® line of Phase Change ThermalInterface Materials (PCTIM) offers exceptionallylow thermal impedance between heat dissipatingdevices and the surface to which the componentis mounted. The premiere product in this line-up,Loctite® Powerstrate Xtreme adheres to heatsinks or components without heating, deliveringamazing ease-of-use without compromising thermalperformance.Henkel offers a wide range of thermally conductivefilm adhesives that are ideal for bonding largeareas or complex shapes. With customizedpreforms, adhesive can be placed precisely whereneeded, whether around through-holes or on anyarea requiring a specialized pattern, deliveringexceptional accuracy and enhanced performance.Offering the perfect blend of high thermalconductivity with varying degrees of flexibilityand adhesion, Henkel’s thermally enhanced filmproducts have been specially formulated for heatsink or thermal dissipation applications.Thermal Management MaterialsPhase ChangeMaterialsThermalGreasesAdhesiveFilmsAdhesivePastesLOCTITE ®ISOSTRATELOCTITE ®NSWC100ElectricallyInsulatingElectricallyConductiveShimming PastesNon-ShimmingPastesLOCTITE ®POWERSTRATEXTREMESTYCASTTC4ABLEFILM ® 506EMERSON &CUMINGCF3350Room TemperatureCureHeat CureRoom TemperatureCureHeat CureLOCTITE ® PSX-D& PSX-PSTYCASTTC8MABLEFILM ® 561KABLEFILM ® 5025ELOCTITE ® 315LOCTITE ® 5404LOCTITE ® 383ABLEBOND ®8700KLOCTITE ®SILVERSTRATELOCTITE ® TG100ABLEFILM ®563KABLEFILM ®ECF561ELOCTITE ® 3873HYSOL ®QMI536HTLOCTITE ® 384ECCOBOND282LOCTITE ®THERMSTRATEHYSOL ®QMI5030LOCTITE ® 3874ECCOBONDE3503-1For Electrically ConductiveAdhesives, go to page 26TRA-BOND2151ECCOBONDTE3530ECCOBONDE8502-160

ASSEMBLYMaTERIALSPhase Change MaterialsPRODUCTLOCTITE ®ISOSTRATELOCTITE ®POWERSTRATEXTREMELOCTITE ®PSX-D &PSX-PLOCTITE ®SILVERSTRATELOCTITE ®THERMSTRATEThermal GreasesPRODUCTLOCTITE ®NSWC100Thermal ManagementMaterialsThermally Conductive Adhesive Films – Electrically InsulatingPRODUCTABLEFILM ® 506ABLEFILM ® 561KABLEFILM ® 563KDESCRIPTIONFlexible film adhesive designed for bondingTCE mismatched materials. Slight tack cansimplify assembly.High adhesion strength with excellent flexibilityfor bonding mismatched CTE materials.Electrically insulating film with high thermalconductivity and adhesion strength. Availableeither unsupported or with a fiberglass carrier.TENSILE STRENGTHLAP SHEAR (PSI)THERMALCONDUCTIVITY (W/mK)VOLUMERESISTIVITY(OHM.CM)PRIMARY CURECYCLESHELF LIFEFILM THICKNESSAVAILABLE (MILS)1,200 0.9 7 x 10 12 1 hr. @ 150°C 6 months @ -40°C 4, 5, 63,300 0.9 9 x 10 12 30 min. @ 150°C 1 year @ -40°C 4, 5, 63,000 1 1 x 10 13 30 min. @ 150°C 1 year @ -40°C 2, 3, 4, 5, 6Thermally Conductive Adhesive Films – Electrically ConductivePRODUCTEMERSON & CUMINGCF3350ABLEFILM ® 5025EABLEFILM ® ECF561EDESCRIPTIONIndustry standard electrically insulating phasechange material.Unsupported film with superior thermal performanceeven at low pressure. Direct attach to heat sink atroom temperature without adhesive.Repeatable phase change thermal interface material.Supplied as a paste that can be stenciled, needledispensed, screen printed, or applied manually ontoa heat sink, baseplate or other surfaces.Excellent thermal performance particularly at higherpressures. Typically used on RF devices and SCRswhere electrical conductivity is required (silver-filled).Industry standard phase change thermal interfacematerial. Suitable for power IGBTs, semiconductors,DC-DC converters and other electrically isolatedpackages.DESCRIPTIONNon-silicone, water cleanable thermalcompound.DESCRIPTIONSilver-filled film with an excellent balanceof adhesion strength, electrical and thermalconductivity, and processability. It is speciallysuited for RF applications.Sister formulation to CF3350 that has beencertified to MIL-STD-883, Method 5011.Most flexible of the fiberglass-supported,electrically conductive products.THERMALIMPEDANCE(°C-in. 2 /W @ 80 psi)THERMALCONDUCTIVITY (W/mK)TENSILE STRENGTHLAP SHEAR (PSI)THERMAL IMPEDANCE(°C-cm 2 /W @ 550 kPa)THERMALCONDUCTIVITY(W/mK)THERMALCONDUCTIVITY(W/mK)VOLUMERESISTIVITY(OHM.CM)PHASECHANGE TEMP(°C)PRIMARY CURECYCLEVOLUMERESISTIVITY(OHM.CM)SHELF LIFEDIELECTRICSTRENGTH(V/mil)0.12 0.78 0.45 60 N/A 4,500minimumFILM THICKNESSAVAILABLE(MILS)3,400 7 0.0002 30 min. @ 150°C 9 months @ 5°C 2, 42,500 6.5 0.0002 30 min. @ 150°C 6 months @ 5°C 2, 3, 4, 5, 62,000 1.6 0.0060 1 hr. @ 150°C 1 year @ -40°C 4, 5, 6THICKNESS(in)0.002 -0.0060.003 0.022 3.4 45 N/A N/A 0.0080.003 0.022 3.4 45 N/A N/A 0.0005 -0.010+0.003 0.022 3.14 51 2 N/A 0.0040.022 0.143 1 60 1.0 x 10 12 N/A 0.0025 -0.008VOLUME RESISTIVITY(OHM.CM)DIELECTRICSTRENGTH (V/mil)THICKNESS (in)1.4 1.9 x 10 15 250 minimum 0.0005 to 0.010+STYCAST TC4 Thermally conductive, high temperature1.5 1 x 10 13 500 0.0005 to 0.010+silicone thermal grease.STYCAST TC8M High thermal conductivity, high2.3 1 x 10 13 500 0.0005 to 0.010+temperature thermal grease.LOCTITE ® TG100 Ultra-high performance thermal grease. 3.4 N/A N/A 0.0005 to 0.010+61

ASSEMBLYMaTERIALSThermal ManagementMaterialsTHERMALly CONDUCTIVE ADHESIVES – SHIMMING – ROOM TEMPERATURE CUREPRODUCTLOCTITE ® 315DESCRIPTIONA self-shimming, thermally conductive, one-partadhesive for bonding electrical components toheat sinks with an insulating gap.MILSTANDARD883, METHOD5011APPROVEDNASAOUTGASSINGASTM E595-77/84/90APPROVEDCURE TYPEActivator orHeatCURE SCHEDULESTHERMALly CONDUCTIVE ADHESIVES – SHIMMING – Heat CURELOCTITE ® 3873LOCTITE ® 5404HYSOL ® QMI536HTHYSOL ® QMI5030Self-shimming, use with activator 7387. Highbonding strength for heat sink application.Self-shimming, flexible silicone adhesive forhigh temperature resistant applications such asceramic boards.Boron nitride–filled non-electrically conductivepaste.Unique product resulting from blend ofthermoset and thermoplastic resins.Activator orHeatVISCOSITY(cPs)THERMALCONDUCTIVITY(W/mK)VOLUMERESISTIVITY(OHM.CM)SHELF LIFE24-72 hrs. @ 20°C 600,000 0.81 1.3 x 10 12 9 months @5°CFixture time: 5 min. 200,000 1.25 4.3 x 10 14 21 months@ 5°CHeat 10 min. @ 150°C Paste 1.0 2.9 x 10 14 5 months @5°CHeat ≥8 sec. @ 150°C(SkipCure)15 min. @ 150°C (oven)13,000 0.9 1.0 x 10 13 12 monthsHeat 30 min. @ 175°C (oven) 5,500 25 0.00004 12 monthsTHERMALly CONDUCTIVE ADHESIVES – NON-SHIMMING – ROOM TEMPERATURE CURELOCTITE ® 383LOCTITE ® 384TRA-BOND 2151High strength, room temperature curingadhesive for permanent assemblies.Repairable, room temperature curing adhesiveutilized for parts subject to disassembly.Thermal conductive electrical insulatingcompound.YesActivator orHeatActivator orHeatActivator orHeatTHERMALLY CONDUCTIVE ADHESIVES – NON-SHIMMING – HEAT CURELOCTITE ® 3874 No-bead containing version of 3873. Activator(7387) orHeatABLEBOND ® 8700KECCOBOND 282ECCOBOND E3503-1ECCOBOND TE3530ECCOBOND E8502-1Mil standard certified, high performance,syringe dispensible, one-component, thermallyconductive, epoxy adhesive.One-component, silk screenable, viscous epoxywith high thermal conductivity.Smooth paste assuring minimum bondlinethickness for lower overall thermal resistance.One-component, low temperature curing,thermally conductive epoxy adhesive.This low modulus, thermally conductive,modified epoxy adhesive is ideally suited formanagement of large CTE mismatch & bondingof stress sensitive components.Yes Yes Heat 60 min. @ 175°C2 hrs. @ 160ºC24-72 hrs. @ 20°C 500,000 0.6 5.2 x 10 11 9 months @5°C24-72 hrs. @ 20°C 100,000 0.76 1.3 x 10 12 9 months @5°C24 hrs. @ 25°C 40,000 0.95 2.10 x 10 15 35 min.24 hrs. @ 25°C 5 min./24-72 hrs.@ 20°CHeat 4 hrs. @ 100°C 280,000 -380,000Heat 30 min. @ 100°C10 min. @ 120°C5 min. @ 150°C1.25 4.3 x 10 14 10 months@ 5°C45,000 0.5 3 x 10 14 9 months @-40°C1.3 1.0 x 10 15 3 months60,000 1 1.0 x 10 14 6 months @-18°C to-25°CHeat 30 min. @ 100°C 60,000 2.3 1.0 x 10 15 6 months @-18°C to-25°CHeat 90 min. @ 120°C60 min. @ 150°C15 min. @ 175°C45,000 0.6 4.07 x 10 13 6 months @-18°C to-25°C62

ASSEMBLYMaTERIALSThermal ManagementMaterialsMiscellaneousThermallyConductiveActivatorsClean-UpSolventsLOCTITE ® 7387LOCTITE ® 7360MISCELLANEOUS ADHESIVES –THERMALLY CONDUCTIVE ACTIVATORSPRODUCTLOCTITE ® 7387DESCRIPTIONActivator used in combination with Loctite ® brands315, 383, 384.MISCELLANEOUS ADHESIVES – CLEAN-UP SOLVENTSPRODUCT DESCRIPTION SOLVENT TYPE FLASH POINTLOCTITE ® 7360Nozzle and dispense machine componentcleaner. Excellent for removal of uncuredadhesive from the board without causing theadhesive to gel. Available in environmentallyresponsible pump spray non-aerosol can fornozzle cleaning.Aliphatic Ester Blend 100°C63

appendixSolder Form AvailabilityMulticore ®CodeAlloyMelting Point°CRoHSSolderPasteBarSolderCoredWireSolidWire97SC SAC305 or Sn96.5/Ag3.0/Cu0.5 217 Yes Yes yes yes yes96SC SAC387 or Sn95.5/Ag3.8/Cu0.7 217 Yes Yes no yes yesBi58 Sn42/Bi58 138 Yes yes no yes no95A Sn95/Sb5 236 - 242 Yes yes no yes no96S Sn96.5/Ag3.5 221 Yes yes no yes no99C Sn99.3/Cu0.7 227 Yes no yes yes noSAV1 Sn50.0/Pb48.5/Cu1.5 183 - 215 no no no yes noSn60 Sn60/Pb40 183 - 188 no no no yes noSn62 Sn62/Pb36/Ag2 179 no Yes no yes no63S4 Sn62.8/Pb36.8/Ag0.4 179 - 183 no Yes no no noSn63 Sn63/Pb37 183 no Yes yes yes yesHMP Sn5Pb93.5/Ag1.5 296 - 301 no Yes no yes noMulticore ® PowderDescriptionPowder Size(Microns)IPC J-STD-006DesignationHelpful ConversionsBAS 53 - 75 Type 2AGS 25 - 45 Type 3DAP 20 - 38 Type 4KBS 10 - 25 Type 5LAW 5 - 15 Type 6Inch Mil Micron Millimeter0.001 1 25.4 0.02540.002 2 50.8 0.05080.003 3 76.2 0.07620.004 4 101.6 0.10160.005 5 127 0.1270.006 6 152.4 0.1524DegreeCelsiusDegreeFahrenheit-40 -40-10 140 3225 7730 86100 212179 354183 361217 423300 57264

IndexELECTRODAG 452SS................................................... 8, 16, 36, 37ELECTRODAG 461SS............................................................. 36, 37ELECTRODAG 479SS................................................... 8, 16, 36, 37ELECTRODAG 503-62%................................................... 21, 36, 37ELECTRODAG 725A.................................................. 6, 8, 16, 36, 37ELECTRODAG 820B........................................................... 8, 36, 37ELECTRODAG 976SSHV..................................................... 8, 36, 37ELECTRODAG 6017SS....................................................... 8, 36, 37ELECTRODAG EL-411............................................................ 36, 37ELECTRODAG PD-038............................................................ 36, 37ELECTRODAG PE-007...................................................... 16, 36, 37ELECTRODAG PF-050................................................ 14, 19, 36, 37ELECTRODAG PF-407A.................................................... 16, 36, 37ELECTRODAG PF-407C................................................ 8, 16, 36, 37ELECTRODAG PF-455B................................................ 8, 16, 36, 37ELECTRODAG PF-845...................................................... 12, 36, 37ELECTRODAG PM-404....................................................... 8, 36, 37ELECTRODAG PR-406B..................................................... 8, 36, 37ELECTRODAG PR-800........................................................ 8, 36, 37EMERSON & CUMING CF3350......................... 7, 10, 21, 30, 60, 61EMERSON & CUMING E1172A............................... 7, 13, 17, 38, 39EMERSON & CUMING E1216............................. 7, 8, 13, 17, 38, 39EMERSON & CUMING E1926........................................... 13, 38, 39EMERSON & CUMING SB-50........................................... 13, 38, 39EMERSON & CUMING XE1218............................. 11, 13, 17, 38, 39HYSOL® DC0114....................................................................... 38, 39HYSOL® EE0079/HD0070...................................................... 43, 46HYSOL® EE1068................................................................................ 9HYSOL® EE1068/HD3404...................................................... 43, 46HYSOL® EO1016................................................................... 8, 41, 42HYSOL® EO1058................................................................... 7, 43, 45HYSOL® EO1060............................................................. 7, 17, 41, 42HYSOL® EO1061....................................................................... 41, 42HYSOL® EO1062............................................................. 7, 17, 41, 42HYSOL® EO1072............................................................. 7, 17, 41, 42HYSOL® EO1080................................................................... 8, 41, 42HYSOL® EO1088................................................................... 8, 43, 45HYSOL® ES1002.............................................................. 9, 21, 43, 46HYSOL® ES1902.................................................................... 7, 43, 46HYSOL® FF6000.................................................................. 13, 38, 39HYSOL® FP0114........................................................................ 38, 39HYSOL® FP4323........................................................................ 41, 42HYSOL® FP4450HF............................................................... 8, 17, 41HYSOL® FP4450LV................................................................ 8, 17, 41HYSOL® FP4450.................................................................. 12, 17, 41HYSOL® FP4451TD....................................................... 10, 12, 17, 41HYSOL® FP4451.................................................................... 8, 17, 41HYSOL® FP4460............................................................ 10, 17, 41, 42HYSOL® FP4470........................................................................ 10, 41HYSOL® FP4526........................................................................ 38, 39HYSOL® FP4530........................................................................ 38, 39HYSOL® FP4531.................................................................. 13, 38, 39HYSOL® FP6401.......................................................................... 8, 41HYSOL® OT0149-3.............................................................. 15, 41, 42HYSOL® PC18M.......................................................... 7, 9, 17, 43, 44HYSOL® PC28STD................................................................. 9, 43, 44HYSOL® PC29M........................................................................ 43, 44HYSOL® PC40-UM........................................................ 13, 15, 43, 44HYSOL® PC62....................................................................... 9, 43, 44HYSOL® QMI516LC......................................................... 6, 16, 26, 28HYSOL® QMI529HT............................................................. 15, 26, 28HYSOL® QMI536HT............................................................. 15, 60, 62HYSOL® QMI5030................................................................ 15, 60, 62HYSOL® UF3800.................................................................. 13, 38, 39HYSOL® US0146................................................................... 9, 43, 48HYSOL® US0154....................................................................... 43, 48HYSOL® US2050....................................................................... 43, 48HYSOL® US2350............................................................... 7, 9, 43, 48HYSOL® US5532................................................................... 9, 43, 48LOCTITE® 315............................................................................ 60, 62LOCTITE® 350............................................................................ 32, 34LOCTITE® 352............................................................................ 32, 34LOCTITE® 383............................................................................ 60, 62LOCTITE® 384............................................................................ 60, 62LOCTITE® 3106.......................................................................... 32, 34LOCTITE® 3118.......................................................................... 41, 42LOCTITE® 3119...................................................................... 8, 41, 42LOCTITE® 3128.................................................................... 13, 38, 39LOCTITE® 3129...................................................................... 8, 41, 42LOCTITE® 3500.......................................................................... 38, 39LOCTITE® 3508.................................................................... 13, 38, 39LOCTITE® 3513.................................................................... 13, 38, 39LOCTITE® 3523.......................................................................... 32, 34LOCTITE® 3536.................................................................... 13, 38, 39LOCTITE® 3563.................................................................... 17, 38, 39LOCTITE® 3593.......................................................................... 38, 3966

IndexLOCTITE® 3609................................................................ 9, 17, 58, 59LOCTITE® 3611................................................................................ 17LOCTITE® 3616...................................................... 7, 9, 11, 17, 58, 59LOCTITE® 3619................................................................ 9, 17, 58, 59LOCTITE® 3621...................................................... 7, 9, 11, 17, 58, 59LOCTITE® 3627.......................................................................... 58, 59LOCTITE® 3702.......................................................................... 32, 34LOCTITE® 3705.................................................................... 13, 38, 39LOCTITE® 3719.......................................................................... 32, 34LOCTITE® 3720.......................................................................... 32, 34LOCTITE® 3730.......................................................................... 32, 34LOCTITE® 3733.......................................................................... 32, 34LOCTITE® 3736.......................................................................... 32, 34LOCTITE® 3751.......................................................................... 32, 34LOCTITE® 3779.......................................................................... 32, 34LOCTITE® 3780.......................................................................... 32, 34LOCTITE® 3781.......................................................................... 32, 34LOCTITE® 3782.......................................................................... 32, 34LOCTITE® 3851.......................................................................... 32, 34LOCTITE® 3873................................................................ 8, 15, 60, 62LOCTITE® 3874.................................................................... 15, 60, 62LOCTITE® 3880.................................................................... 10, 26, 27LOCTITE® 3888.......................................................................... 26, 29LOCTITE® 3900...................................................................... 9, 43, 44LOCTITE® 5210...................................................................... 7, 43, 49LOCTITE® 5290................................................................ 7, 17, 43, 44LOCTITE® 5293................................................................ 7, 17, 43, 44LOCTITE® 5296.......................................................... 7, 15, 17, 43, 44LOCTITE® 5404.................................................................. 6, 8, 60, 62LOCTITE® 5421...................................................................... 8, 26, 29LOCTITE® 5699...................................................................... 7, 43, 49LOCTITE® 5810F.................................................................... 7, 43, 49LOCTITE® 7360.......................................................... 9, 17, 58, 59, 63LOCTITE® 7387................................................................................ 63LOCTITE® ISOSTRATE............................................... 9, 11, 21, 60, 61LOCTITE® NSWC100....................................................... 9, 15, 60, 61LOCTITE® NUVA-SIL® 5089.................................................. 7, 43, 49LOCTITE® POWERSTRATE XTREME..................... 9, 11, 13, 60, 61LOCTITE® PSX-D & PSX-P......................... 9, 13, 14, 15, 21, 60, 61LOCTITE® SILVERSTRATE............................................. 11, 21, 60, 61LOCTITE® TG100....................................................................... 60, 61LOCTITE® THERMSTRATE.............................................. 9, 21, 60, 61MACROMELT® MM6208S...................................................... 9, 50, 51MACROMELT® MM6208...................................................... 17, 50, 51MACROMELT® MM Q-5375................................................... 9, 50, 51MACROMELT® OM633.......................................................... 9, 50, 51MACROMELT® OM638.......................................................... 9, 50, 51MACROMELT® OM641.......................................................... 7, 50, 51MACROMELT® OM646.......................................................... 7, 50, 51MACROMELT® OM652.................................................... 7, 17, 50, 51MACROMELT® OM657.................................................... 7, 17, 50, 51MACROMELT® OM673.......................................................... 7, 50, 51MACROMELT® OM678.......................................................... 7, 50, 51MACROMELT® OM682.......................................................... 9, 50, 51MACROMELT® OM687.......................................................... 9, 50, 51MINICO M7000 BLUE A...................................................... 8, 36, 37MULTICORE® 381............................................................................ 11MULTICORE® C400..................................................... 7, 9, 17, 52, 56MULTICORE® C502............................................................... 9, 52, 56MULTICORE® C502 CORED WIRE.................................................... 7MULTICORE® Hydro-X20............................................... 11, 52, 53, 57MULTICORE® Hydro-X................................................... 11, 17, 52, 56MULTICORE® LF318.................................................. 7, 17, 21, 52, 55MULTICORE® LF620.............................................................. 9, 52, 55MULTICORE® LF700........................................................ 9, 13, 52, 55MULTICORE® MCF800.................................................................... 57MULTICORE® MF200....................................................................... 14MULTICORE® MF300................................................... 7, 9, 52, 53, 57MULTICORE® MF388....................................................... 9, 17, 52, 53MULTICORE® MFR301.......................................... 7, 9, 17, 52, 53, 57MULTICORE® MP218..................................................... 11, 17, 52, 55MULTICORE® NC-00....................................................................... 57MULTICORE® NC-AA....................................................................... 57MULTICORE® NC-AB....................................................................... 57MULTICORE® NC-BB....................................................................... 57MULTICORE® SC01..................................................................... 9, 57MULTICORE® Spot-On.................................................................... 57MULTICORE® TFN600..................................................................... 13MULTICORE® TTC-LF...................................................................... 57MULTICORE® WS200.......................................................... 11, 52, 55MULTICORE® WS300.......................................................... 17, 52, 55MULTICORE® X32-10i................................................................ 14, 57P3 Allpass 7750....................................................................... 32, 35P3 Allpass WS-HG.................................................................. 32, 35P3 Disperse CO....................................................................... 32, 33P3 Disperse CRM.................................................................... 32, 3367

IndexP3 Disperse DX....................................................................... 32, 33P3 Disperse GRX..................................................................... 32, 33P3 Disperse HALF................................................................... 32, 33P3 Disperse HA....................................................................... 32, 33P3 Disperse H......................................................................... 32, 33P3 Disperse JA........................................................................ 32, 33P3 Disperse K.......................................................................... 32, 33P3 Disperse S.......................................................................... 32, 33P3 Disperse UT175.................................................................. 32, 33P3 Kaltfin 20............................................................................ 32, 35P3 Poleve 458......................................................................... 32, 35P3 Poleve 496......................................................................... 32, 35P3 Poleve 517......................................................................... 32, 35P3 Poleve 720......................................................................... 32, 35P3 Poleve 927......................................................................... 32, 35P3 Poleve 930......................................................................... 32, 35P3 Poleve HM.......................................................................... 32, 33P3 Poleve HP2........................................................................ 32, 33P3 Poleve SH.......................................................................... 32, 33P3 Siliron APX......................................................................... 32, 33P3 Siliron E.............................................................................. 32, 33P3 Siliron IO............................................................................ 32, 33P3 Siliron RP........................................................................... 32, 33P3 Siliron SA............................................................................ 32, 33P3 Siliron TKA......................................................................... 32, 33STYCAST 1090BLK............................................................. 9, 43, 46STYCAST 1090SI.............................................................. 21, 43, 46STYCAST 2017M4............................................................. 15, 43, 46STYCAST 2561/CAT 11....................................................... 43, 46STYCAST 2651-40.............................................................. 9, 43, 47STYCAST 2651.............................................................................. 10STYCAST 2850FT.................................................................. 7, 9, 10STYCAST 2850FT/CAT 11................................................... 43, 46STYCAST 2850FT/CAT 23LV................................................ 43, 46STYCAST 50500-1............................................................ 10, 17, 41STYCAST 50500D............................................................. 10, 17, 41STYCAST A312................................................................. 12, 38, 39STYCAST A316-48........................................................................ 23STYCAST E1847............................................................... 15, 43, 45STYCAST E2534FR......................................................... 7, 9, 43, 47STYCAST NX-17............................................................... 15, 43, 47STYCAST NX-76............................................................... 15, 43, 45STYCAST TC4......................................................................... 60, 61STYCAST TC8M...................................................................... 60, 61STYCAST U2500............................................................. 7, 9, 43, 48TRA-BOND 2115..................................................................... 22, 24TRA-BOND 2116............................................................... 16, 22, 24TRA-BOND 2151........................................................... 8, 11, 60, 62TRA-BOND F112............................................................... 11, 22, 24TRA-BOND F113SC................................................................ 22, 24TRA-BOND F114..................................................................... 22, 24TRA-BOND F123..................................................................... 22, 25TRA-BOND F253..................................................................... 22, 25TRA-BOND FDA2.............................................................. 16, 22, 24TRA-BOND FDA2T............................................................ 16, 22, 24TRA-BOND FDA16............................................................ 16, 22, 24TRA-DUCT 2902................................................................ 10, 26, 29TRA-DUCT 2958...................................................................... 26, 29XA80215-1........................................................................................ 19XCS80091-2......................................................................... 14, 26, 2868

Henkel –Your partner worldwideAMERICASHEADQUARTERS:UNITED STATES15350 Barranca ParkwayIrvine, CA 92618Tel: +1-949-789-2500Tel: +1-800-562-8483Henkel America20021 Susana RoadRancho Dominguez, CA 90221Tel: +1-310-764-4600Henkel America46 Manning RoadBillerica, MA 01821Tel: +1-978-436-9700Tel: +1-800-832-4929CANADAHenkel Canada2225 Meadowpine Blvd.Mississauga, Ontario L5N 7P2Tel: +1-905-814-6511Tel: +1-800-263-5043(within Canada)BRAZILHenkel BrazilAv. Prof. Vernon Krieble, 9106690-250 Itapevi,Sao Paulo, BrazilTel: +55 11 41 43 7000MexicoHenkel MexicoBoulevard Magnocentro No. 8Centro Urbano Interlomas, 52760Huixquilucan, Edo. de MexicoTel: +52 55 3300 3000ASIAHEADQUARTERS: ASIA928 Zhangheng Road,Zhangjiang Hi-Tech Park,Pudong New District,Shanghai, 201203, P. R. ChinaTel: +86 21 2891 8000AUSTRALIAHenkel AustraliaUnit 29 38-46 South Street,Rydalmere 2216,Sydney, AustraliaTel: +61 2 8844 4700CHINAHenkel China928 Zhangheng Road,Zhangjiang Hi-Tech Park,Pudong New District,Shanghai, 201203, P. R. ChinaTel: +86 21 2891 8000Henkel China332 Mei Gui South Road,Waigaoqiao FTZShanghai 200131 ChinaTel: +86 21 3898 4800Henkel Hong Kong15/F, Tower1, Landmark East,100 How Ming Street,Kwun Tong, Hong KongChinaTel: +852 2968-2977INDIAHenkel IndiaNo.1, Airport Service Road,Domlur Layout,Bangalore-560 071,IndiaTel: +91 80 2535 7771INDONESIAHenkel IndonésiaJalan Raya Jakarta BogorKM31.2,Cimanggis Depok 16953,IndonesiaTel: +62 21 8775 2196JAPANHenkel Japan27-7 Shin Isogo-cho, Isogo-ku,Yokohama, Japan 235-0017Tel: +81 45 758 1800Henkel Japan100 Kaneda, KanagawaAtsugi-shi, Japan 243-0807Tel: +81 46 294 2511Henkel Japan23-87 Asahidai, Kuriyama-cho,Yubari-gun,Hokkaido Japan 069-1507Tel: +81-123-72-3432KOREAHenkel Korea1st Floor, Mapo-tower,418, Mapo-dong, Mapo-gu,121-734 Seoul, KoreaTel: +82 2 3279 1730Henkel Korea6th Floor, Dae Ryung TechnoTown II569-21 Gasan-dong,Kumchun-gu,Seoul, KoreaTel: +822 6675-8000MALAYSIAHenkel MalaysiaLot 973, Jalan KampungBaru Hicom,Persiaran Tengku Ampuan,Lion Industrial Park, Sek 26,Shah Alam, 40400 Selangor,MalaysiaTel: +60 3 5192 6200Henkel Malaysia(M) Sdn Bhd., 88K-2Jalan Tun Dr Awang, Sri BukitJambul11900 Bayan Lepas,Penang, MalaysiaTel: +60 4-6435244Henkel Malaysia(M) Sdn Bhd., Lot 8 & 10Jalan Tukul 16/5,40000 Shah Alam,Selangor, MalaysiaTel: +60 3-55191105PHILIPPINESHenkel Philippines21/F, Asia Star Building,2402-2404 Asean Drive,Filinvest Corporate City,Alabang, Muntinlupa City 1781,PhilippinesTel: +632 859 3100Henkel Philippines2 Perfector Drive,Sta Maria Industrial EstateBagumbayan, Taguig,Metro Manila1600 PhilippinesTel: +632 837-5898SINGAPOREHenkel Singapore401, Commonwealth Drive#03-01/02,Haw Par Techno Centre,Singapore 149598Tel: +65 6266 0100Henkel SingaporeBlock 11, Kallang Place #07-10Kallang Basin Industrial EstateSingapore 339155Tel: +65 6297-1332Henkel SingaporeBlock 11, Kallang Place #07-05SingaporeTel: +(65) 62900820Fax: +(65) 62923347TAIWANHenkel Taiwan10/F, No.866, ZhongZheng Road,ZhongHe City, Taipei County 235,TaiwanTel: +886 2 2227 1988Henkel Taiwan508-51, Wen-sien Road, Section 1Jen-der, Tainan CountyTaiwan 717Tel: +886 6 366 1288Henkel TaiwanB-5F, No. 356 Sec 2Ching Nien RoadFeng Shan City,Kaoshiung, TaiwanTel: +886 7-776-2313THAILANDHenkel ThailandCentralworld, 35th Floor,999/9 Rama 1 Road,Patumwan, Bangkok, 10330,ThailandTel: +66 2 209 8000Henkel Thailandc/o NSC,40/14 Moo12 Bangna Trad RoadBangkaew, Bangplee,Samutprakarn 10540 ThailandTel: +662 3120530-45EUROPEAUSTRIAHenkel Central Eastern EuropeGmbHErdbergstrasse 29A-1030 ViennaTel: +43-1-71104-0BELGIUMHenkel Belgium N.V.Havenlaan 16B-1080 BrusselTel: +32-(0)2-42125 55Henkel Electronic Materials(Belgium) N.V.Nijverheidsstraat 7B-2260 Westerlo, BelgiumTel: +32 (0) 14 57 56 11BULGARIAHenkel Bulgaria E.O.O.D.Business Park SofiaBlock 2, 4th floorBG-1715 SofiaTel: +359 2 9151010CZECH REPUBLICHenkel CR, spol. s r.o.U Pruhonu 10CZ-170 04 Praha 7Tel: +420 2 20101401CROATIAHenkel Croatia d.o.o.Budmanijeva 1HR-10000 ZagrebTel. +85 1 6008-161DENMARKHenkel Norden AB,CopenhagenHorskaetten 3DK-2630 TaastrupTel: +45 43 30 13 01FINLANDHenkel Norden OyAyritie 12 a01510 VantaaTel: +358 020 122 311FRANCEHenkel France10, Avenue Eugene GazeauBP 40090F-60304 Senlis-CedexTel: +33 0344 216600GERMANYHenkel AG & Co. KGaAGutenbergstrasse 385748 GarchingTel.: +49-89-320800-1181Fax: +49-89-320800-1233HUNGARYHenkel Magyarország Kft.H-1113 BudapestDávid Ferenc u. 6.Tel.: +36 30 9192993ITALYHenkel Italia SpaVia Amoretti,7820157 Milano - ItalyTel: +39 02 357921NETHERLANDSHenkel Nederland B.V.Henkel TechnologiesPostbus 21003430 CM NieuwegeinTel: +31 030 607 38 50NORWAYHenkel NorwayPostboks:6405 Etterstad0604 OsloTel: +47 23 37 15 20POLANDHenkel Polska S.A.Domaniewska 41PL-02-672 WarszawaTel: +48 22 5656200ROMANIASee Henkel HungaryRUSSIARUSHENKKolokolnikov Pereulok., 11RU-107045 MoscowTel: +7 495 7455588SLOVAKIAHenkel Slovensko s.r.o.Zahradnicka 91P.O. Box 66SK-821 08 BRATISLAVATel: +421 2 50246402, 111SPAINHenkel Iberica, S.A.Pol. Ind. AlparracheCamino de Villaviciosa, 18 y 2028600 Navalcarnero,MadridTel: +34 91 860 90 00SWEDENHenkel Norden ABP.O. Box 120 80,SE-102 22 Stockholm,SwedenTel: +46 863443800SWITZERLANDSee Henkel GermanyTURKEYTürk Henkel Kimya Sanayi veTicaret A.S.Kayisdagi CadKaraman CiftligiYoluKar Plaza D Blok34752 Icerenköy - Istanbul,TurkeyTel: 0090 216 579 4000Fax: 0090 216 579 4092UKRAINEPOW Henkel UkraineSilver Centre4, Lepse Blvd.UA-03067 KievTel: +38 044 20145 77UK and irelandHenkel Ltd.Adhesives LimitedTechnologies HouseWood Lane End,Hemel HempsteadHertfordshire HP2 4RQTel: +44 (0)1442 278000Henkel Ltd. UKStation Road, LintonCambridge CB1 6NWTel: +44 1-223-893-771Henkel Corporation15350 Barranca ParkwayIrvine, CA 926181-949-789-25001-800-562-8483Across the Board,Around the Globe.www.henkel.com/electronics® and designate trademarks of Henkel Corporation or its Affiliates. ® = registered in the U.S.Patent and Trademark Office. © Henkel Corporation, 2009. All rights reserved. 5650/LT-5012 (5/2009)