S-380W / HD-38
S-380W / HD-38
S-380W / HD-38
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No. 26 Taishan RoadSuzhou New DistrictSuzhou JiangsuP.R. ChinaZTAIYO INK (SUZHOU) CO., LTD.Tel: +86-512-6665-5550Fax: +86-512-6665-5057Thermal Curable marking inkS-<strong><strong>38</strong>0W</strong> / <strong>HD</strong>-<strong>38</strong>Sep 2006Data Sheet No.:DAS-053005/055005-02
S-<strong><strong>38</strong>0W</strong> / <strong>HD</strong>-<strong>38</strong>1. FEATURE:S-<strong><strong>38</strong>0W</strong> / <strong>HD</strong>-<strong>38</strong> is a thermal curable marking ink, it suit both for liquid and solid epoxyresin, it has good adhesion with solder mask and can keep glossy in dicky environment.2. SPECTIFICATIONS:Product name:UL name:Color:Mixing ratio:Main agent: S-<strong><strong>38</strong>0W</strong>Hardener: <strong>HD</strong>-<strong>38</strong>Main agent:Hardener:Main agent: WhiteHardener: Light YellowMain agent: Hardener = 70∶30 (by wt.)Viscosity after mixing 220±20 dPa.s(Cone-plate viscometer 5min - ¹ /25℃)Specific Gravity:Post cure:Pot life:Shelf life:1.7±0.1 (after mixing)140℃×20min12Hrs. (stored at lustration print place and closed, 25℃ orbelow)180 days after production (stored at dark place,20℃ orbelow.)1Data Sheet No.:DAS-053005/055005-02
S-<strong><strong>38</strong>0W</strong> / <strong>HD</strong>-<strong>38</strong>3. PROCESS CONDITIONS:PROCESS CONDITION TOLERANCE WINDOWTest panels: FR-4 (thickness 1.6mm) -Pretreatment Acid rinse→ Buff scrubbing →Water rinse →dry -Print 150mesh [100-250mesh]Hold time: 10 min [10-20 min]Cure: 140℃ 20 min (Hot air convection oven) [140℃ 20-60 min]4. ATTENTION ON PROCESS:a) As to operation environment, it is necessary to control temperature、humidity and dust.b) Incompetent mixing will cause quality problem, such as gloss uneven and post cureproblem.c) The optimum coating thickness is 15 to 25 µm (after curing), Thinner coating tendsto lower the thermal resistance.d) If the viscosity is too high to print, can use solvent such as Diethylene GlycolMonoethyle Ether Acetate (Carbitol Acetate), the quantity of the solvent can notexceed 2%, (one Kg ink can add 20cc solvent at best), otherwise, it may causesteardrop and lower resistance to thermal.e) As every plant’s drying equipments, process condition and quality target is different,so the temperature and drying time may also have difference. Please do verificationtest to define the operating conditions.f) Insufficient cure of the ink can lower the thermal resistance, and excess cure canlower gold plating resistance. Furthermore, Curing condition of the marking inkshould affect the solder mask ink.CA: Diethylene glycol monomethyl ether acetate (B.P 217 deg. C)2Data Sheet No.:DAS-053005/055005-02
S-<strong><strong>38</strong>0W</strong> / <strong>HD</strong>-<strong>38</strong>5. INK PROPERTIES:ITEMTEST METHODRESULTMade in ChinaAdhesion Taiyo internal method Cross hatch peeling 100 / 100Pencil hardness Taiyo internal method No scratch on copper 6 HThermal resistance Rosin flux 260℃/10sec, 3cycles PassAcid resistanceAlkaline resistanceSolvent resistanceInsulation resistance10vol% H 2 SO 4 20℃/30min. (Dip)Tape peeling test10wt% NaOH 20℃/30min. (Dip)Tape peeling testPGM-Ac 20℃/30min. (Dip)Tape peeling testIPC comb type (B pattern)Humidification:25-65℃/90%RH/ DC100VCycling for 7daysMeasurement: DC500V 1min.PassPassPassInitial1.0×10 13 ohrmConditioned7.5×10 11 ohrmNote:a) The above-mentioned data is based on TAIYO INK (SUZHOU) Company’s laboratory test. Asevery plant’s equipments, environment and parameters have difference, the data is only for yourreference.b) Please work in accordance with MSDS.3Data Sheet No.:DAS-053005/055005-02
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