A Log Amplifier Based Linearization Scheme for Thermocouples

A Log Amplifier Based Linearization Scheme for Thermocouples A Log Amplifier Based Linearization Scheme for Thermocouples

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Sensors & TransducersVolume 100January 2009www.sensorsportal.com ISSN 1726-5479Editor-in-Chief: professor Sergey Y. Yurish, phone: +34 696067716, fax: +34 93 4011989, e-mail: editor@sensorsportal.comEditors <strong>for</strong> Western EuropeMeijer, Gerard C.M., Delft University of Technology, The NetherlandsFerrari, Vittorio, Universitá di Brescia, ItalyEditors <strong>for</strong> North AmericaDatskos, Panos G., Oak Ridge National Laboratory, USAFabien, J. Josse, Marquette University, USAKatz, Evgeny, Clarkson University, USAAbdul Rahim, Ruzairi, Universiti Teknologi, MalaysiaAhmad, Mohd Noor, Nothern University of Engineering, MalaysiaAnnamalai, Karthigeyan, National Institute of Advanced Industrial Scienceand Technology, JapanArcega, Francisco, University of Zaragoza, SpainArguel, Philippe, CNRS, FranceAhn, Jae-Pyoung, Korea Institute of Science and Technology, KoreaArndt, Michael, Robert Bosch GmbH, GermanyAscoli, Giorgio, George Mason University, USAAtalay, Selcuk, Inonu University, TurkeyAtghiaee, Ahmad, University of Tehran, IranAugutis, Vygantas, Kaunas University of Technology, LithuaniaAvachit, Patil Lalchand, North Maharashtra University, IndiaAyesh, Aladdin, De Mont<strong>for</strong>t University, UKBahreyni, Behraad, University of Manitoba, CanadaBaoxian, Ye, Zhengzhou University, ChinaBar<strong>for</strong>d, Lee, Agilent Laboratories, USABarlingay, Ravindra, RF Arrays Systems, IndiaBasu, Sukumar, Jadavpur University, IndiaBeck, Stephen, University of Sheffield, UKBen Bouzid, Sihem, Institut National de Recherche Scientifique, TunisiaBenachaiba, Chellali, Universitaire de Bechar, AlgeriaBinnie, T. David, Napier University, UKBischoff, Gerlinde, Inst. Analytical Chemistry, GermanyBodas, Dhananjay, IMTEK, GermanyBorges Carval, Nuno, Universidade de Aveiro, PortugalBousbia-Salah, Mounir, University of Annaba, AlgeriaBouvet, Marcel, CNRS – UPMC, FranceBrudzewski, Kazimierz, Warsaw University of Technology, PolandCai, Chenxin, Nanjing Normal University, ChinaCai, Qingyun, Hunan University, ChinaCampanella, Luigi, University La Sapienza, ItalyCarvalho, Vitor, Minho University, PortugalCecelja, Franjo, Brunel University, London, UKCerda Belmonte, Judith, Imperial College London, UKChakrabarty, Chandan Kumar, Universiti Tenaga Nasional, MalaysiaChakravorty, Dipankar, Association <strong>for</strong> the Cultivation of Science, IndiaChanghai, Ru, Harbin Engineering University, ChinaChaudhari, Gajanan, Shri Shivaji Science College, IndiaChen, Jiming, Zhejiang University, ChinaChen, Rongshun, National Tsing Hua University, TaiwanCheng, Kuo-Sheng, National Cheng Kung University, TaiwanChiang, Jeffrey (Cheng-Ta), Industrial Technol. Research Institute, TaiwanChiriac, Horia, National Institute of Research and Development, RomaniaChowdhuri, Arijit, University of Delhi, IndiaChung, Wen-Yaw, Chung Yuan Christian University, TaiwanCorres, Jesus, Universidad Publica de Navarra, SpainCortes, Camilo A., Universidad Nacional de Colombia, ColombiaCourtois, Christian, Universite de Valenciennes, FranceCusano, Andrea, University of Sannio, ItalyD'Amico, Arnaldo, Università di Tor Vergata, ItalyDe Stefano, Luca, Institute <strong>for</strong> Microelectronics and Microsystem, ItalyDeshmukh, Kiran, Shri Shivaji Mahavidyalaya, Barshi, IndiaDickert, Franz L., Vienna University, AustriaDieguez, Angel, University of Barcelona, SpainDimitropoulos, Panos, University of Thessaly, GreeceDing Jian, Ning, Jiangsu University, ChinaDjordjevich, Alexandar, City University of Hong Kong, Hong KongKo, Sang Choon, Electronics and Telecommunications Research Institute,Editorial Advisory BoardEditor South AmericaCosta-Felix, Rodrigo, Inmetro, BrazilEditor <strong>for</strong> Eastern EuropeSachenko, Anatoly, Ternopil State Economic University, UkraineEditor <strong>for</strong> AsiaOhyama, Shinji, Tokyo Institute of Technology, JapanDonato, Nicola, University of Messina, ItalyDonato, Patricio, Universidad de Mar del Plata, ArgentinaDong, Feng, Tianjin University, ChinaDrljaca, Predrag, Instersema Sensoric SA, SwitzerlandDubey, Venketesh, Bournemouth University, UKEnderle, Stefan, University of Ulm and KTB Mechatronics GmbH,GermanyErdem, Gursan K. Arzum, Ege University, TurkeyErkmen, Aydan M., Middle East Technical University, TurkeyEstelle, Patrice, Insa Rennes, FranceEstrada, Horacio, University of North Carolina, USAFaiz, Adil, INSA Lyon, FranceFericean, Sorin, Balluff GmbH, GermanyFernandes, Joana M., University of Porto, PortugalFrancioso, Luca, CNR-IMM Institute <strong>for</strong> Microelectronics andMicrosystems, ItalyFrancis, Laurent, University Catholique de Louvain, BelgiumFu, Weiling, South-Western Hospital, Chongqing, ChinaGaura, Elena, Coventry University, UKGeng, Yanfeng, China University of Petroleum, ChinaGole, James, Georgia Institute of Technology, USAGong, Hao, National University of Singapore, SingaporeGonzalez de la Rosa, Juan Jose, University of Cadiz, SpainGranel, Annette, Goteborg University, SwedenGraff, Mason, The University of Texas at Arlington, USAGuan, Shan, Eastman Kodak, USAGuillet, Bruno, University of Caen, FranceGuo, Zhen, New Jersey Institute of Technology, USAGupta, Narendra Kumar, Napier University, UKHadjiloucas, Sillas, The University of Reading, UKHashsham, Syed, Michigan State University, USAHernandez, Alvaro, University of Alcala, SpainHernandez, Wilmar, Universidad Politecnica de Madrid, SpainHomentcovschi, Dorel, SUNY Binghamton, USAHorstman, Tom, U.S. Automation Group, LLC, USAHsiai, Tzung (John), University of Southern Cali<strong>for</strong>nia, USAHuang, Jeng-Sheng, Chung Yuan Christian University, TaiwanHuang, Star, National Tsing Hua University, TaiwanHuang, Wei, PSG Design Center, USAHui, David, University of New Orleans, USAJaffrezic-Renault, Nicole, Ecole Centrale de Lyon, FranceJaime Calvo-Galleg, Jaime, Universidad de Salamanca, SpainJames, Daniel, Griffith University, AustraliaJanting, Jakob, DELTA Danish Electronics, DenmarkJiang, Liudi, University of Southampton, UKJiang, Wei, University of Virginia, USAJiao, Zheng, Shanghai University, ChinaJohn, Joachim, IMEC, BelgiumKalach, Andrew, Voronezh Institute of Ministry of Interior, RussiaKang, Moonho, Sunmoon University, Korea SouthKaniusas, Eugenijus, Vienna University of Technology, AustriaKatake, Anup, Texas A&M University, USAKausel, Wilfried, University of Music, Vienna, AustriaKavasoglu, Nese, Mugla University, TurkeyKe, Cathy, Tyndall National Institute, IrelandKhan, Asif, Aligarh Muslim University, Aligarh, IndiaKim, Min Young, Koh Young Technology, Inc., Korea SouthSandacci, Serghei, Sensor Technology Ltd., UKSapozhnikova, Ksenia, D.I.Mendeleyev Institute <strong>for</strong> Metrology, Russia


Increasing of Excursion Range of Absolute Optical Sensors Intended <strong>for</strong> PositionersIgor Friedland, Ioseph Gurwich, Amit Brandes................................................................................... 125Field-Effect-Transistor Behavior of a Multiwall Carbon Nano Fiber Directly Grown on NickelElectrodesL. W. Chang, P. S. Wu, J. T. Lue and Z. P. Chen.............................................................................. 137Classification of Fiber-Optic Pressure Sensors with Amplitude Modulation of Optical SignalVladyslav Kondratov, Vitalii Redko..................................................................................................... 146New e-BookLaboratories of Instrumentation <strong>for</strong> MeasurementMaria Teresa Restivo, Fernando Gomes de Almeida, Maria de Fátima Chouzal, Joaquim GabrielMendes, António Mendes Lopes........................................................................................................ 161Authors are encouraged to submit article in MS Word (doc) and Acrobat (pdf) <strong>for</strong>mats by e-mail: editor@sensorsportal.comPlease visit journal’s webpage with preparation instructions: http://www.sensorsportal.com/HTML/DIGEST/Submition.htmInternational Frequency Sensor Association (IFSA).


Sensors & Transducers Journal, Vol. 100, Issue 1, January 2009, pp. 1-10Sensors & TransducersISSN 1726-5479© 2009 by IFSAhttp://www.sensorsportal.comA <strong>Log</strong> <strong>Amplifier</strong> <strong>Based</strong> <strong>Linearization</strong> <strong>Scheme</strong><strong>for</strong> <strong>Thermocouples</strong>1 Nikhil MONDAL, 2 A. ABUDHAHIR, 3 Sourav Kanti JANA,1 Sugata MUNSHI and 3 D. P. BHATTACHARYA1 Electrical Engineering Department, Jadavpur University, Kolkata-700032, India2 National Engineering College, Kovilpatti-628503, India3 Physics Department, Jadavpur University, Kolkata-700032, IndiaFax: +913324146184E-mail: sugatamunshi@yahoo.comReceived: 22 October 2008 /Accepted: 19 January 2009 /Published: 26 January 2009Abstract: This paper presents a new analog linearization circuit <strong>for</strong> thermocouple temperature sensors.The proposed circuit employs the linearizing action inherent in logarithmic operation, as well as theratiometric property of op-amp based logarithmic amplifier compensated against variation in ambienttemperature. Numerical and PSPICE simulation studies have been carried out using the standard data<strong>for</strong> T, J and G type thermocouples. Encouraging results have been obtained. Copyright © 2009 IFSA.Keywords: Thermocouple, Temperature-sensor, <strong>Linearization</strong>, <strong>Log</strong>-<strong>Amplifier</strong>1. Introduction<strong>Thermocouples</strong> are long being used as temperature sensors in different fields of Science andTechnology. In view of the advantages of thermocouples over other temperature sensors [1-3], it isobvious that there should be considerable ef<strong>for</strong>t in developing more and more improved techniques <strong>for</strong>processing thermoelectric signals. Two important issues in the conditioning of thermocouple signalsare cold junction compensation (CJC) and <strong>Linearization</strong> of the transfer relation. While CJC is aproblem unique to this class of transducers, the problem of linearization is universal. The problem ofcold junction compensation has been given due importance by the investigators over years and avariety of techniques have been developed [4-7].1


Sensors & Transducers Journal, Vol. 100, Issue 1, January 2009, pp. 1-10The generalized software based linearization techniques <strong>for</strong> transducers [8-10] can also be used <strong>for</strong>thermocouples, but in the literatures, the results of such applications have seldom been reported. Thereare however few exceptions [11, 12]. So far as hardware based schemes are concerned, although it istrue that there are commercially available hardware modules, e.g. SCM7B47 modules fromDATAFORTH, which per<strong>for</strong>m both CJC and linearization <strong>for</strong> thermocouples, in the researchpublications one rarely comes across issues in the development of linearizing circuits <strong>for</strong>thermocouples. Principles of hardware based linearizing schemes developed <strong>for</strong> other sensors can ofcourse be utilized <strong>for</strong> thermocouples. It is however worth mentioning that the issue of linearization asapplied to thermocouples in general, is further complicated due to the fact that that the refractory metalthermocouples meant <strong>for</strong> measurement of very high temperatures have transfer characteristics that arenot only extremely nonlinear, but are also non monotonic.Rapid development of digital computer and microprocessor based systems, combined with theirdwindling prices, have resulted in wide spread use of computer based measurement systems where theproblem of transducer nonlinearity is tackled by software packages. Although it is generally true thatcomputational algorithms <strong>for</strong> linearization have better per<strong>for</strong>mance compared to hardware methods,there are also exceptions [13]. Moreover, even with slashed prices of computer based systems,hardware based linearizers are by and large still cheaper. Hardware linearization methods can also beused to supplement the software techniques. As an example, linearization of a transducer signal by ahardware method followed by a simple <strong>for</strong>m of software linearization, e.g. by means of a ROM lookuptable combined with linear interpolation, may yield better results than those obtained solely bysome other complex algorithm.This work presents a newly devised log-amplifier based circuit <strong>for</strong> linearizing thermocouple signals. Ithas originated from the knowledge that linearization is inherent in logarithmic operation, and this iswhy varieties of log- circuits are already in use <strong>for</strong> linearization of different transducer characteristics[13]. In the present work the task of linearization has been further facilitated by utilizing theratiometric property of op-amp based temperature-compensated logarithmic amplifier. Computationaland PSPICE based studies have been carried out using the manufacturer’s data <strong>for</strong> T and J typethermocouples that have decent linearity, and also <strong>for</strong> G type thermocouple that has an extremely nonlineartransfer characteristic, to assess the per<strong>for</strong>mance of the proposed linearizing scheme.2. Theory <strong>for</strong> Proposed Linearizing CircuitThe output of the temperature compensated log amplifier [14] shown in Fig. 1, isV1Vo = Aoln , (1)Vwhere Aο = AKTa /q , q = 1.6 x 10 –19 C is the magnitude of the charge of electron,k= 1.38×10 −23 J / K is the Boltzmann’s constant and T a is the ambient temperature in Kelvin. It isconvenient at this point to assume the ‘standard’ ambient temperature of 25 °C (298 K), which iswidely used in specifying semiconductor properties.To linearize analog transducer signals, equation (1) can be modified as2VINVo= Aoln , (2)VRe f2


Sensors & Transducers Journal, Vol. 100, Issue 1, January 2009, pp. 1-10whereV IN = V 1 = E (T) + E (3)andVRe fE K=2. (4)1+K 1+Kr( T ) V = + E( T )Here, T is the temperature being measured, E(T) is the analog output voltage signal from thethermocouple (after cold junction compensation) and E is the constant dc voltage used to ensure thatV o (0) = 0. E r is a dc voltage and K is a constant. By selecting the appropriate values <strong>for</strong> linearizingconstants ‘K’ and E r , the linearity of the signal E(T) can be improved.Fig. 1. Practical Form of <strong>Log</strong>arithmic <strong>Amplifier</strong>.Then, equation (2) can be written as∴( 1+K ){ E( T ) + E}⎛⎞⎜E ⎟rVo( T ) = AoIn⎜⎟(5)⎜ 1+KE( T ) ⎟⎝Er⎠In order to satisfy the condition V o (0)=0, assuming that E(0)=0, the value of E should be so selected tofulfill the conditionErE = (6)1+K3. Determination of Optimum Values of K and E rThe normalized deviation of V o (T) Vs. T characteristic from linearity is defined as3


Sensors & Transducers Journal, Vol. 100, Issue 1, January 2009, pp. 1-10( E , K,T )where T f denotes the full-scale value of T.DrVVo( E , K,T )o= − , (7)r( E , K,T )The optimal values of E r and K can be reached by numerically minimizing the sum-squared deviation‘S’, given in equation (8), with respect to E r and K.S =N∑n=1D2r( E K,)rT nfTTf, , (8)where N denotes the number of values (T 1 ,T 2 ,etc.) of T, considered <strong>for</strong> computation.The optimum values of linearizing coefficient K and dc voltage E r and the values of scaling constant A<strong>for</strong> the different thermocouples and <strong>for</strong> different temperature ranges have been determined andtabulated in Table 1. A has been calculated, considering that numerical value of V o (T f ) in mV shouldbe equal to T f. It can be seen that the value of K required is negative.Table 1. Optimum values of ‘k’ and reference voltage ‘e r ’ and values of 'a' <strong>for</strong> different thermocouples.Thermo-CoupleTypeTemp.RangeKE rmVEmVV o (T f )mVE(T f )mVACopper –Constantan0 o C – 300 o C - 0.209 11.1 14.032 300 14.86 10.972(T – Type) 0 o C – 400 o C - 0.198 12.8 15.96 400 20.87 12.548Iron Constantan 0 o C – 300 o C - 0.352 18.1 27.932 300 16.32 13.704(J – Type) 0 o C – 760 o C - 0.01 258.1 260.707 760 42.92 189.255Tungsten –Tungsten 26%Rhenium400 o C –2300 o C- 0.084 3.804 4.15 2300 38.325 21.069(G – Type) 1000 o C –2300 o C- 0.132 6.515 7.50 2300 38.325 26.7444. Circuit DiagramA circuit is proposed that may be used <strong>for</strong> linearization when the value of K required is negative, andis shown in Fig. 2.4


Sensors & Transducers Journal, Vol. 100, Issue 1, January 2009, pp. 1-10The salient features of the findings of the study undertaken, are summarized below:1. From Table 3, it can be observed that <strong>for</strong> T-type, the maximum % error and RMS % error aresubstantially reduced to about 1/50 of their original values in the two different temperature ranges0 o C to 300 o C and 0 o C to 400 o C. In the case of J-type, <strong>for</strong> the temperature range 0 o C to 300 o C, thesequantities are reduced to same extent as in T-type. However in the range 0°C to 760 o C, thereduction in the interested quantities are small (1/4 of the original values) due to the wide range oftemperature considered <strong>for</strong> computation. For G-type, it can be seen that the maximum and RMS%deviation can be reduced approximately to 1/5 of their original values <strong>for</strong> 400ºC to 2300 o C. Overthe range 1000 o C to 2300 o C, the reduction is approximately to 1/10 of the original values.2. The per<strong>for</strong>mance of the log-amplifier based linearizing circuit is excellent when used <strong>for</strong> T-typethermocouple. The non-linearity with the present scheme is within. ± 0.01% over 0°C to 300°C and± 0.1% over 0°C to 400°C. The per<strong>for</strong>mance is substantially better than that of a software methodintroduced by Bolk [11] which yields a nonlinearity of ± 0.36% over 0°C to 300°C. It is noteworthythat Bolk had proved that his method gives better results than the interpolation techniques.3. The per<strong>for</strong>mance of the log-amplifier based linearizing circuit is excellent when used <strong>for</strong> T-typethermocouple. The non-linearity with the present scheme is within. ± 0.01% over 0°C to 300°C and± 0.1% over 0°C to 400°C. The per<strong>for</strong>mance is substantially better than that of a software methodintroduced by Bolk [11] which yields a nonlinearity of ± 0.36% over 0°C to 300°C. It is noteworthythat Bolk had proved that his method gives better results than the interpolation techniques.4. When used <strong>for</strong> type-J thermocouple, the per<strong>for</strong>mance of the proposed linearizer is also brilliant. Thenon-linearity is within ±0.04% and ±0.55% over 0 o C to 300 o C and 0 o C to 760 o C respectively. Theerror value achieved with Bolk's method lies within ±0.29% over 0 o C to 300 o C.5. When applied to type-G thermocouple, the logarithmic circuit, as expected, yields inferior results.The results with the proposed log-amplifier based contender are not satisfactory compared to thesoftware methods indicated below. From 1000 o C to 2300 o C, the non-linearity with the presentscheme lies within ±0.53% of full-scale, which is ±12.2 o C. The RMS deviation is 0.365%, whichcorresponds to 8.28 o C. It is worth mentioning that the RMS deviations obtained by Attari et al. [12]using linear interpolation, quadratic interpolation, polynomial interpolation and by an ANN method,are 2.11 o C, 1.27 o C, 10.54 o C and 1.06 o C respectively even over a wider temperature range of250ºC to 2150ºC.6. ConclusionA low-cost log-amplifier based linearizing circuit has been proposed <strong>for</strong> thermocouple temperaturesensors. It has been shown that its per<strong>for</strong>mance when employed <strong>for</strong> thermocouples with monotonicthermo-emf vs. temperature characteristics is better than some of the common software linearizersused <strong>for</strong> these thermocouples.For the G-type thermocouple, the per<strong>for</strong>mance of the proposed linearizer is not satisfactory comparedto that of software methods. There<strong>for</strong>e, <strong>for</strong> temperature measurement using G-type thermocouple, thelog circuit can be used only <strong>for</strong> high temperature applications, provided that linearity of transfercharacteristic can be sacrificed to a certain extent, in exchange of the low cost of the linearizer. Forcomputer based measurement systems employing G-type thermocouple sensor, the log circuit may alsobe used as a first stage linearizer, and the final linearization may be carried out by some simple9

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