Vapour Phase Soldering System WAM 3000 Operating Instructions
Vapour Phase Soldering System WAM 3000 Operating Instructions
Vapour Phase Soldering System WAM 3000 Operating Instructions
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Page 143.7 External sensor / temperature measurement on circuit boardsTo create a temperature profile, an appropriate measuring assembly is to be fitted with theexternal sensor. The connection for the external sensor (2) is in the process chamber. Thesensor must be correctly attached the assembly at a suitable point for it to work correctly.To obtain realistic measurements, SMD adhesive, thermally conductive silicone or Kaptonadhesive tape should be used for attaching the Ø 0.5mm sheathed thermocouple. Theindication of the temperature from the external sensor can be selected using the menubuttons and indicated on the display.3.8 PC interfaceThe system can be fully operated using separate software via the RS232 PC interface andthe sensor temperatures monitored and logged.3.9 De-soldering systemAn optional de-soldering system is available for the selective de-soldering of individualcomponents on the circuit board.The de-soldering system is heated in the system together with the assembly and thecomponents to be de-soldered. The de-soldering system comprises a lever system thatlifts the component to be de-soldered after the solder has melted.Cooper Tools GmbHCarl-Benz-Str. 2, 74354 Besigheim, GermanyTel: 07143/580-0; Fax 07143/580-108www.cooperhandtools.com/europe