(B-axis) fly-cut adapter main spindle (C-axis)

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X y workpiece: • Ø 50 mm, AlMg3 • roughness calculated Rt,kin = 10 nm (fc ) Rt,kin = 5.6 nm (fr ) • roughness measured (WLI, 1300µm x 980 µm) Ra = 4.8 nm • inclination in xy-plane: ϕ = 10° LFM Universität Bremen Prof. Brinksmeier z diamond tool: •r ε = 5 mm (half arc) process (spiral ball-end-milling): •ap = 20 µm •fc = 20 µm fr = 15 µm • n = 5000 rpm x Y � Spiral ball-end-milling of a free-form reflector z f r f c OR 1010
1 Mikrozerspanung 2 Rotationssymmetrische Flächen 3 Freiformflächen 4 Strukturierte Oberflächen LFM Universität Bremen Prof. Brinksmeier
Page 1 and 2: LFM Universität Bremen Prof. Brink
Page 3 and 4: Diamond machining Precision grindin
Page 5 and 6: form deviation [mm] 1 0,1 0,01 0,00
Page 7 and 8: Nanotech Nanotech 500 500 FG FG lin
Page 9 and 10: straight straight knife: knife: b >
Page 11 and 12: cutting edge clearance face 1 µm 1
Page 13 and 14: electroless nickel OFHC copper LFM
Page 15 and 16: 1 Mikrozerspanung 2 Rotationssymmet
Page 29 and 30: Quelle: MEOS LFM Universität Breme
Page 31: Aspherical Mirror Quelle: Siemens V
Page 37 and 38: Hybrid lens with total internal ref
Page 41 and 42: front view n n a p LFM Universität

(B-axis) fly-cut adapter main spindle (C-axis)

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