(B-axis) fly-cut adapter main spindle (C-axis)
(B-axis) fly-cut adapter main spindle (C-axis) (B-axis) fly-cut adapter main spindle (C-axis)
SPFC surfaces are composed of tiny “scallops”: W f W c LFM Universität Bremen Prof. Brinksmeier feed direction rc : radius of fly-cutter rd : radius of diamond depth in cutting direction: w 2 c / (8rc ) depth in feed direction: w 2 f / (8rd ) Topography of SPFC-surfaces cutting direction OR 885 (JS 0318e)
LFM Universität Bremen Prof. Brinksmeier Chip geometry and surface topography for Single-point Fly-cutting (SPFC) OR 884 (JS 0279)
- Page 1 and 2: LFM Universität Bremen Prof. Brink
- Page 3 and 4: Diamond machining Precision grindin
- Page 5 and 6: form deviation [mm] 1 0,1 0,01 0,00
- Page 7 and 8: Nanotech Nanotech 500 500 FG FG lin
- Page 9 and 10: straight straight knife: knife: b >
- Page 11 and 12: cutting edge clearance face 1 µm 1
- Page 13 and 14: electroless nickel OFHC copper LFM
- Page 15 and 16: 1 Mikrozerspanung 2 Rotationssymmet
- Page 17 and 18: LFM Universität Bremen Prof. Brink
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- Page 29 and 30: Quelle: MEOS LFM Universität Breme
- Page 31 and 32: Aspherical Mirror Quelle: Siemens V
- Page 33 and 34: 1 Mikrozerspanung 2 Rotationssymmet
- Page 35 and 36: LFM Universität Bremen Prof. Brink
- Page 37 and 38: Hybrid lens with total internal ref
- Page 39 and 40: LFM Universität Bremen Prof. Brink
- Page 41 and 42: front view n n a p LFM Universität
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SPFC surfaces are<br />
composed of tiny “scallops”:<br />
W f<br />
W c<br />
LFM<br />
Universität Bremen<br />
Prof. Brinksmeier<br />
feed direction<br />
rc : radius of <strong>fly</strong>-<strong>cut</strong>ter<br />
rd : radius of diamond<br />
depth in <strong>cut</strong>ting direction: w 2<br />
c / (8rc )<br />
depth in feed direction: w 2<br />
f / (8rd )<br />
Topography of SPFC-surfaces<br />
<strong>cut</strong>ting direction<br />
OR 885<br />
(JS 0318e)
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