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WHISKER TEST REPORT - Maxim

WHISKER TEST REPORT - Maxim

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Whisker Test Report # : 20060623Rev.004. Package / Material Description<strong>WHISKER</strong> <strong>TEST</strong> <strong>REPORT</strong>(FINAL <strong>REPORT</strong>)4.1. PackageTypeBody sizeLead CountLead PitchLead to Lead Gap4.2. MaterialBase metal alloyTemper (1/2 hard, etc.)Stamped/Etched L/FL/F thicknessBarrier layer typeBarrier layer thicknessSOIC391x155 mils8L50 milsN/ALead frameC194Full HardEtched8 milsPure Tin Over CopperN/A4.3. Process DatesLot #1 Lot #2 Lot #3Plating date/time 05/10/06 / 1115H 05/17/06 / 1425H 05/24/06 / 1630HPost bake date/time 05/10/06 / 1135H 05/17/06 / 1440H 05/24/06 / 1655HSimulated reflow date 06/14/06 06/14/06 06/14/06Board assembly date N/A N/A N/A30°C/60%RH start date 06/14/06 06/14/06 06/14/0655°C/85%RH start date 06/14/06 06/14/06 06/14/06-55°C/85°C start date 06/14/06 06/14/06 06/14/065. Attachments5.1. Process Summary5.2. Workmanship Summary5.3. Whisker Test Summary and Photos5.4. Appendix4 of 21

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