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Datasheet for the PA6H - Adafruit

Datasheet for the PA6H - Adafruit

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GlobalTop TechnologyFGPMMO<strong>PA6H</strong> Data SheetDocument #Ver. V0A33Details Suggestions Notes1 Be<strong>for</strong>e proceeding with <strong>the</strong> reflowsolderingprocess, <strong>the</strong> GPS module mustbe pre-baked.2 Because PCBA (along with <strong>the</strong> patchantenna) is highly endo<strong>the</strong>rmic during<strong>the</strong> reflow-soldering process, extra caremust be paid to <strong>the</strong> GPS module's solderjoint to see if <strong>the</strong>re are any signs of coldweld(ing) or false welding.Pre-bake Time:6 Hours @ 60°±5°C or4 Hours @ 70°±5°CThe parameters of <strong>the</strong>reflow temperaturemust be set accordinglyto module’s reflowsolderingtemperatureprofile.The maximum toleratedtemperature <strong>for</strong> <strong>the</strong> tray is100°C.After <strong>the</strong> pre-bakingprocess, please make sure<strong>the</strong> temperature issufficiently cooled down to35°C or below in order toprevent any trayde<strong>for</strong>mation.Double check to see if <strong>the</strong>surrounding componentsaround <strong>the</strong> GPS module aredisplaying symptoms ofcold weld(ing) or falsewelding.3 Special attentions are needed <strong>for</strong> PCBAboard during reflow-soldering to see if<strong>the</strong>re are any symptoms of bending orde<strong>for</strong>mation to <strong>the</strong> PCBA board,possibility due to <strong>the</strong> weight of <strong>the</strong>module. If so, this will cause concerns at<strong>the</strong> latter half of <strong>the</strong> production process.A loading carrier fixturemust be used with PCBAif <strong>the</strong> reflow solderingprocess is using railconveyors <strong>for</strong> <strong>the</strong>production.If <strong>the</strong>re is any bending orde<strong>for</strong>mation to <strong>the</strong> PCBAboard, this might causes<strong>the</strong> PCBA to collide intoone ano<strong>the</strong>r during <strong>the</strong>unloading process.4 Be<strong>for</strong>e <strong>the</strong> PCBA is going through <strong>the</strong>reflow-soldering process, <strong>the</strong> productionoperators must check by eyesight to seeif <strong>the</strong>re are positional offset to <strong>the</strong>module, because it will be difficult toreadjust after <strong>the</strong> module has gonethrough reflow-soldering process.The operators mustcheck by eyesight andreadjust <strong>the</strong> positionbe<strong>for</strong>e reflow-solderingprocess.If <strong>the</strong> operator is planningto readjust <strong>the</strong> moduleposition, please do nottouch <strong>the</strong> patch antennawhile <strong>the</strong> module is hot inorder to prevent rotationaloffset between <strong>the</strong> patchantenna and moduleNote: References to patch antenna is referred to GPS modules with integrated Patch-on-topantennas (PA/Gms Module Series), and may not be applicable to all GPS modules.This document is <strong>the</strong> exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any o<strong>the</strong>r <strong>for</strong>mat withoutprior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved.

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