Datasheet for the PA6H - Adafruit

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GlobalTop TechnologyFGPMMOPA6H Data SheetDocument #Ver. V0A326. Reflow Soldering Temperature ProfileThe following reflow temperature profile was evaluated by GlobalTop and has been proven to bereliable qualitatively. Please contact us beforehand if you plan to solder this component using adeviated temperature profile as it may cause significant damage to our module and your device.All the information in this sheet can only be used only for Pb-free manufacturing process.6.1 SMT Reflow Soldering Temperature Profile(Reference Only)Average ramp-up rate (25 ~ 150°C): 3°C/sec. max.Average ramp-up rate (270°C to peak): 3°C/sec. max.Preheat: 175 ± 25°C, 60 ~ 120 secondsTemperature maintained above 217°C: 60~150 secondsPeak temperature: 250 +0/-5°C, 20~40 secondsRamp-down rate: 6°C/sec. max.Time 25°C to peak temperature: 8 minutes max.°CSlop:3°C /sec. max.Peak:250+0/-5°C(217°C to peak)Slop:6°C /sec. max.217°CPreheat: 175±5°C20 ~ 40 sec.60 ~120 sec. 60 ~150 sec.25°CSlop:3°C /sec. max.Time (sec)This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format withoutprior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved.
GlobalTop TechnologyFGPMMOPA6H Data SheetDocument #Ver. V0A33Details Suggestions Notes1 Before proceeding with the reflowsolderingprocess, the GPS module mustbe pre-baked.2 Because PCBA (along with the patchantenna) is highly endothermic duringthe reflow-soldering process, extra caremust be paid to the GPS module's solderjoint to see if there are any signs of coldweld(ing) or false welding.Pre-bake Time:6 Hours @ 60°±5°C or4 Hours @ 70°±5°CThe parameters of thereflow temperaturemust be set accordinglyto module’s reflowsolderingtemperatureprofile.The maximum toleratedtemperature for the tray is100°C.After the pre-bakingprocess, please make surethe temperature issufficiently cooled down to35°C or below in order toprevent any traydeformation.Double check to see if thesurrounding componentsaround the GPS module aredisplaying symptoms ofcold weld(ing) or falsewelding.3 Special attentions are needed for PCBAboard during reflow-soldering to see ifthere are any symptoms of bending ordeformation to the PCBA board,possibility due to the weight of themodule. If so, this will cause concerns atthe latter half of the production process.A loading carrier fixturemust be used with PCBAif the reflow solderingprocess is using railconveyors for theproduction.If there is any bending ordeformation to the PCBAboard, this might causesthe PCBA to collide intoone another during theunloading process.4 Before the PCBA is going through thereflow-soldering process, the productionoperators must check by eyesight to seeif there are positional offset to themodule, because it will be difficult toreadjust after the module has gonethrough reflow-soldering process.The operators mustcheck by eyesight andreadjust the positionbefore reflow-solderingprocess.If the operator is planningto readjust the moduleposition, please do nottouch the patch antennawhile the module is hot inorder to prevent rotationaloffset between the patchantenna and moduleNote: References to patch antenna is referred to GPS modules with integrated Patch-on-topantennas (PA/Gms Module Series), and may not be applicable to all GPS modules.This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format withoutprior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved.
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Datasheet for the PA6H - Adafruit

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