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260 B. Zalba et al. / Applied Thermal Engineering 23 (2003) 251–283Table 4Organic substances with potential use as PCMCompoundMelting temperature(°C)Heat of fusion(kJ/kg)Thermal conductivity(W/m K)Density(kg/m 3 )Paraffin C 14 4.5 [1] 165 [1] n.a. n.a.Paraffin C 15 –C 16 8 [1] 153 [1] n.a. n.a.Polyglycol E400 8 [4,11] 99.6 [4,11] 0.187 (liquid, 38.6 °C) [4,11] 1125 (liquid, 25 °C) [4,11]0.185 (liquid, 69.9 °C) [11] 1228 (solid, 3 °C) [4,11]Dimethyl-sulfoxide 16.5 [28] 85.7 [28] n.a. 1009 (solid and liquid) [28](DMS)Paraffin C 16 –C 18 20–22 [29] 152 [29] n.a. n.a.Polyglycol E600 22 [4,11] 127.2 [4,11] 0.189 (liquid, 38.6 °C) [4,11] 1126 (liquid, 25 °C) [4,11]0.187 (liquid, 67.0 °C) [11] 1232 (solid, 4 °C) [4,11]Paraffin C 13 –C 24 22–24 [1] 189 [1] 0.21 (solid) [1] 0.760 (liquid, 70 °C) [1]0.900 (solid, 20 °C) [1]1-Dodecanol 26 [9] 200 [9] n.a. n.a.Paraffin C 18 28 [1] 244 [1] 0.148 (liquid, 40 °C) [30] 0.774 (liquid, 70 °C) [1]27.5 [30] 243.5 [30] 0.15 (solid) [1] 0.814 (solid, 20 °C) [1]0.358 (solid, 25 °C) [30]1-Tetradecanol 38 [9] 205 [9]Paraffin C 16 –C 28 42–44 [1] 189 [1] 0.21 (solid) [1] 0.765 (liquid, 70 °C) [1]0.910 (solid, 20 °C) [1]Paraffin C 20 –C 33 48–50 [1] 189 [1] 0.21 (solid) [1] 0.769 (liquid, 70 °C) [1]0.912 (solid, 20 °C) [1]Paraffin C 22 –C 45 58–60 [1] 189 [1] 0.21 (solid) [1] 0.795 (liquid, 70 °C) [1]0.920 (solid, 20 °C) [1]Parffin wax 64 [4,11] 173.6 [4,11] 0.167 (liquid, 63.5 °C) [4,11] 790 (liquid, 65 °C) [4,11]266 [6] 0.346 (solid, 33.6 °C) [4,11] 916 (solid, 24 °C) [4,11]0.339 (solid, 45.7 °C) [11]Polyglycol E6000 66 [4,11] 190.0 [4,11] n.a. 1085 (liquid, 70 °C) [4,11]1212 (solid, 25 °C) [4,11]Paraffin C 21 –C 50 66–68 [1] 189 [1] 0.21 (solid) [1] 0.830 (liquid, 70 °C) [1]0.930 (solid, 20 °C) [1]Biphenyl 71 [4,11] 119.2 [4,11] n.a. 991 (liquid, 73 °C) [4,11]1166 (solid, 24 °C) [11]Propionamide 79 [11] 168.2 [11] n.a. n.a.Naphthalene 80 [4,11] 147.7 [4,11] 0.132 (liquid, 83.8 °C) [4,11] 976 (liquid, 84 °C) [4,11]0.341 (solid, 49.9 °C) [4,11] 1145 (solid, 20 °C) [4,11]0.310 (solid, 66.6 °C) [11]Erythritol 118.0 [31] 339.8 [31] 0.326 (liquid, 140 °C) [31] 1300 (liquid, 140 °C) [31]0.733 (solid, 20 °C) [31] 1480 (solid, 20 °C) [31]HDPE 100–150 [32] 200 [32] n.a. n.a.Trans-1,4-polybutadiene145 [33] 144 [33] n.a. n.a.(TPB)n.a.: not available.2.3.2. Corrosion of the materialsMost references on corrosion tests using salt hydrates were performed with diluted salt hydrates,as typically used in the chemical industry, and only a few presented results, usually based
Table 5Organic eutectics with potential use as PCMCompoundMelting temperature(°C)B. Zalba et al. / Applied Thermal Engineering 23 (2003) 251–283 261Heat of fusion(kJ/kg)Thermal conductivity(W/m K)37.5% Urea þ 63:5% acetamide 53 [1] n.a. n.a. n.a.67.1% Naphthalene þ67 [11] 123.4 [11] 0.136 (liquid, 78.5 °C) [11] n.a.32:9% benzoic acid0.130 (liquid, 100 °C) [11]0.282 (solid, 38 °C) [11]0.257 (solid, 52 °C) [11]% in weight; n.a.: not available.Density(kg/m 3 )on observation over experimental set-ups [78,79]. Porisini [80] tested the corrosion of four commerciallyavailable salt hydrates used as PCMs in 1988. Recently, Cabeza et al. [81–84] studiedcorrosion resistance of five common metals (aluminium, brass, copper, steel and stainless steel) incontact with molten salt hydrates (zinc nitrate hexahydrate, sodium hydrogen phosphate dodecahydrate,calcium chloride hexahydrate, sodium carbonate, potassium hydrogen carbonate,potassium chloride, water, sodium acetate trihydrate, and sodium thiosulphate pentahydrate) inan immersion corrosion test.Some investigations have been concerned with corrosion of molten salts at high temperature.Already in 1980, Heine et al. [21] studied the corrosion performance of six molten salts meltingbetween 235 and 857 °C vs. four metals used at these temperatures.2.3.3. Encapsulation of the materialsThe encapsulation of the PCM has developed interest in several researchers. Advantages anddisadvantages of different geometries of PCM encapsulation with different materials and theircompatibility was discussed by Lane [3]. The freezing and melting processes of water contained inspherical elements was studied experimentally by Eames et al. [85], proposing semi empiricalequations that allow the mass of ice within a sphere to be predicted at any time during the freezingor melting processes. Earlier, Bedecarrats et al. [86,87] and Alloncle [88], studied the crystallizationprocess of an organic eutectic in a spherical encapsulation.For the use of PCM in buildings applications, an encapsulation of PCM (50–80%) withunsaturated polyester matrix (45–10%), and water (5–10%) was studied by Morikama et al.[89]. Polymerisation of PCMs has been also studied for other applications, like insulationmaterials for use in clothing or bedding articles [90]. In the same area, Inaba [91] and Lee andChoi [92] propose using the storage substance integrated with the building materials withoutencapsulation (‘‘Shape-stabilised paraffin’’: 74% paraffin þ 26% high-density polyethylene(HDPE)). Structural stability is achieved using HDPE which retains the paraffin when in liquidphase.Revankar et al. studied the presence of concentrated voids in encapsulated PCM use for spacebasedheat exchangers [93].For many applications, PCMs are microencapsulated, and this has been studied by severalresearchers [94] and developed by companies like BASF[95]. Nevertheless, the potential use ofmicroencapsulated PCMs in various thermal control applications is limited to some extent by
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