Intel® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family ...

More documents

Recommendations

Info

Electrical Characteristics 11.3.1 RGB/CRT DAC Display DC Characteristics (Intel ® 82945G/82945GC/82945GZ GMCH Only) Table 11-6. RGB/CRT DAC Display DC Characteristics: Functional Operating Range (VCCA_DAC = 2.5 V �5%) 270 Parameter Min Typica l Max Units Notes DAC Resolution 8 — — Bits 1 Max Luminance (full-scale) 0.665 0.700 0.770 V Min Luminance — 0.000 — V LSB Current — 73.2 — �A 4, 5 Integral Linearity (INL) -1.0 — +1.0 LSB 1, 6 Differential Linearity (DNL) -1.0 — +1.0 LSB 1, 6 Video channel-channel voltage amplitude mismatch Monotonicity Ensured — — 6 % 7 1, 2, 4 (white video level voltage) 1, 3, 4 (black video level voltage) NOTES: 1. Measured at each R, G, B termination according to the VESA Test Procedure – Evaluation of Analog Display Graphics Subsystems Proposal (Version 1, Draft 4, December 1, 2000). 2. Maximum steady-state amplitude 3. Minimum steady-state amplitude 4. Defined for a double 75-� termination. 5. Set by external reference resistor value. 6. INL and DNL measured and calculated according to VESA Video Signal Standards. 7. Max full-scale voltage difference among R, G, B outputs (percentage of steady-state full-scale voltage). §
Ballout and Package Information 12 Ballout and Package Information 12.1 Ballout This chapter provides the ballout and package information. Figure 12-1 through Figure 12-3 show the GMCH ballout for platforms using DDR2 system memory, as viewed from the top side of the package. Note: Balls that are listed as RSV are reserved. Board traces should Not be routed to these balls. Note: Some balls marked as reserved (RSV) are used in XOR testing. See Chapter 0 for details. Note: Some balls marked as reserved (RSV) can be used as test points. These are marked as RSV_TPx. Note: Balls that are listed as NC are No Connects. 271
Page 1 and 2:
Intel ® 945G/945GZ/945GC/ 945P/945
Page 3 and 4:
Contents 1 Introduction ...........
Page 5 and 6:
4.2.11 C0DRC1—Channel A DRAM Cont
Page 7 and 8:
6.1.16 DMICESTS—DMI Correctable E
Page 9 and 10:
9.4.5 SMM Space Decode and Transact
Page 11 and 12:
11.3 DC Characteristics ...........
Page 13 and 14:
Revision History Rev Description Da
Page 15 and 16:
Intel ® 82945G/82945GZ/82945GC/829
Page 17 and 18:
1 Introduction Introduction The Int
Page 19 and 20:
Figure 1-2. Intel ® 945GZ/82945GC
Page 21 and 22:
1.1 Terminology Term Description Ac
Page 23 and 24:
Term Description TOLM Top Of Low Me
Page 25 and 26:
Introduction � Supports four bank
Page 27 and 28:
Introduction 1.4 Graphics (Intel ®
Page 29 and 30:
1.5 Analog and SDVO Displays (Intel
Page 31 and 32:
2 Signal Description Signal Descrip
Page 33 and 34:
2.1 Host Interface Signals Signal D
Page 35 and 36:
Signal Name Type Description HREQ[4
Page 37 and 38:
2.3 DDR2 DRAM Channel B Interface S
Page 39 and 40:
Signal Description 2.6 Analog Displ
Page 41 and 42:
2.8 Direct Media Interface (DMI) Si
Page 43 and 44:
2.10 Power and Ground Name Voltage
Page 45 and 46:
Interface Signal Name I/O System Me
Page 47 and 48:
Interface Signal Name I/O State Dur
Page 49 and 50:
3 Register Description Register Des
Page 51 and 52:
Register Description Note: A physic
Page 53 and 54:
3.3 Configuration Mechanisms Regist
Page 55 and 56:
3.4 Routing Configuration Accesses
Page 57 and 58:
3.4.2.2 DMI Configuration Accesses
Page 59 and 60:
Bit Access & Default 10:8 R/W 000b
Page 61 and 62:
Host Bridge/DRAM Controller Registe
Page 63 and 64:
4.1 Device 0 Configuration Register
Page 65 and 66:
4.1.4 PCISTS—PCI Status (D0:F0) P
Page 67 and 68:
4.1.7 MLT—Master Latency Timer (D
Page 69 and 70:
4.1.12 EPBAR—Egress Port Base Add
Page 71 and 72:
Page 73 and 74:
Page 75 and 76:
Page 77 and 78:
4.1.19 PAM1—Programmable Attribut
Page 79 and 80:
Page 81 and 82:
Page 83 and 84:
4.1.25 LAC—Legacy Access Control
Page 85 and 86:
Page 87 and 88:
4.1.29 ERRSTS—Error Status (D0:F0
Page 89 and 90:
4.1.31 SKPD—Scratchpad Data (D0:F
Page 91 and 92:
Page 93 and 94:
Page 95 and 96:
4.2.7 C0DCLKDIS—Channel A DRAM Cl
Page 97 and 98:
4.2.9 C0DRT1—Channel A DRAM Timin
Page 99 and 100:
Bit Access & Default 6:4 R/W 000b 3
Page 101 and 102:
Page 103 and 104:
4.2.24 PMSTS—Power Management Sta
Page 105 and 106:
4.3.1 EPESD—EP Element Self Descr
Page 107 and 108:
4.3.3 EPLE1A—EP Link Entry 1 Addr
Page 109 and 110:
Host-PCI Express* Bridge Registers
Page 111 and 112:
Address Offset Host-PCI Express* Br
Page 113 and 114:
5.1.3 PCICMD1—PCI Command (D1:F0)
Page 115 and 116:
5.1.4 PCISTS1—PCI Status (D1:F0)
Page 117 and 118:
5.1.7 CL1—Cache Line Size (D1:F0)
Page 119 and 120:
5.1.12 IOBASE1—I/O Base Address (
Page 121 and 122:
5.1.15 MBASE1—Memory Base Address
Page 123 and 124:
Page 125 and 126:
5.1.20 INTRLINE1—Interrupt Line (
Page 127 and 128:
Bit Access & Default 2 R/W 0b 1 R/W
Page 129 and 130:
Page 131 and 132:
Page 133 and 134:
5.1.29 MA—Message Address (D1:F0)
Page 135 and 136:
5.1.33 DCAP—Device Capabilities (
Page 137 and 138:
5.1.35 DSTS—Device Status (D1:F0)
Page 139 and 140:
5.1.37 LCTL—Link Control (D1:F0)
Page 141 and 142:
5.1.39 SLOTCAP—Slot Capabilities
Page 143 and 144:
5.1.41 SLOTSTS—Slot Status (D1:F0
Page 145 and 146:
5.1.43 RSTS—Root Status (D1:F0) P
Page 147 and 148:
Page 149 and 150:
Page 151 and 152:
Page 153 and 154:
5.1.56 ESD—Element Self Descripti
Page 155 and 156:
Page 157 and 158:
5.1.61 CESTS—Correctable Error St
Page 159 and 160:
Page 161 and 162:
Direct Media Interface (DMI) RCRB 6
Page 163 and 164:
6.1.3 DMIPVCCAP2—DMI Port VC Capa
Page 165 and 166:
6.1.6 DMIVC0RCTL—DMI VC0 Resource
Page 167 and 168:
6.1.9 DMIVC1RCTL—DMI VC1 Resource
Page 169 and 170:
6.1.13 DMILSTS—DMI Link Status MM
Page 171 and 172:
6.1.15 DMIUEMSK—DMI Uncorrectable
Page 173 and 174:
Integrated Graphics Device (D2:F0)
Page 175 and 176:
Page 177 and 178:
7.1.4 PCISTS2—PCI Status (D2:F0)
Page 179 and 180:
7.1.7 CLS—Cache Line Size (D2:F0)
Page 181 and 182:
7.1.11 IOBAR—I/O Base Address (D2
Page 183 and 184:
Page 185 and 186:
7.1.20 MINGNT—Minimum Grant (D2:F
Page 187 and 188:
Page 189 and 190:
Page 191 and 192:
Page 193 and 194:
8.1.3 PCICMD2—PCI Command (D2:F1)
Page 195 and 196:
8.1.5 RID2—Revision Identificatio
Page 197 and 198:
Page 199 and 200:
Page 201 and 202:
Page 203 and 204:
8.2 Device 2 - PCI I/O Registers In
Page 205 and 206:
9 System Address Map System Address
Page 207 and 208:
Figure 9-1. System Address Ranges 4
Page 209 and 210:
Compatible SMRAM Address Range (A_0
Page 211 and 212:
9.2 Main Memory Address Range (1 MB
Page 213 and 214:
9.3 PCI Memory Address Range (TOLUD
Page 215 and 216:
9.3.6 PCI Express* Graphics Attach
Page 217 and 218:
9.4.1 SMM Space Definition System A
Page 219 and 220: 9.4.5 SMM Space Decode and Transact
Page 221 and 222: 9.4.12 Legacy VGA and I/O Range Dec
Page 223 and 224: 10 Functional Description This chap
Page 225 and 226: Interleaved Mode Functional Descrip
Page 227 and 228: 667 MHz (PC 5300) (82945G/82945GC/8
Page 229 and 230: 10.2.2.2 System Memory Supported Co
Page 231 and 232: Functional Description Table 10-5.
Page 233 and 234: 10.3 PCI Express* (Intel ® 82945G/
Page 235 and 236: Figure 10-2. SDVO Conceptual Block
Page 237 and 238: Figure 10-3. Concurrent SDVO / PCI
Page 239 and 240: 10.5 Integrated Graphics Device (In
Page 241 and 242: 10.5.3 4X Faster Setup Engine Funct
Page 243 and 244: 10.5.4 Texture Engine Functional De
Page 245 and 246: 10.5.4.8 Pixel Shader Functional De
Page 247 and 248: Functional Description to determine
Page 249 and 250: 10.5.6 2D Engine Functional Descrip
Page 251 and 252: 10.5.8.1 Cursor Plane Functional De
Page 253 and 254: Functional Description device is in
Page 255 and 256: 10.6.2 Digital Display Interface Fu
Page 257 and 258: 10.6.2.1.5 Control Bus Functional D
Page 259 and 260: Figure 10-7 illustrates the various
Page 261 and 262: 11 Electrical Characteristics Elect
Page 263 and 264: 11.1.1 Power Characteristics Table
Page 265 and 266: Signal Group Electrical Characteris
Page 267 and 268: 11.3 DC Characteristics Table 11-5.
Page 269: Symbol Signal Group Electrical Char
Page 273 and 274: Ballout and Package Information Fig
Page 275 and 276: 12.2 Ballout Table Ballout and Pack
Page 277 and 278: Ballout and Package Information EXP
Page 279 and 280: Ballout and Package Information HA2
Page 281 and 282: Ballout and Package Information HD6
Page 283 and 284: Ballout and Package Information RSV
Page 285 and 286: Ballout and Package Information SDM
Page 287 and 288: Ballout and Package Information SDQ
Page 289 and 290: Ballout and Package Information SDQ
Page 291 and 292: Ballout and Package Information VCC
Page 297 and 298: Ballout and Package Information VSS
Page 305 and 306: 12.3 Package § Ballout and Package
Page 307 and 308: Ballout and Package Information Int
Page 309 and 310: 13.2 XOR Test Mode Initialization T
Page 311 and 312: 13.4 XOR Chains Testability Table 1
Page 313 and 314: Table 13-5. XOR Chain 2 Pin Count B
Page 315 and 316: Table 13-8. XOR Chain 5 Pin Count B
Page 317 and 318: Table 13-11. XOR Chain 8 Pin Count
show all

Intel® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family ...

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?