Intel® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family ...

More documents

Recommendations

Info

Functional Description 260
11 Electrical Characteristics Electrical Characteristics This chapter contains the (G)MCH absolute maximum electrical ratings, power dissipation values, and DC characteristics. Note: References to SDVO apply to the 82945G/82945GC/82945GZ GMCH only. Note: References to 1066 MHz FSB apply to the 82945G/82945P only. Note: References to DDR2-667 apply to the 82945G/82945GC/82945P only. Note: References to the PCI Express Interface applies to the 82945G/82945GC/82945P/82945PL only. 11.1 Absolute Minimum and Maximum Ratings Table 11-1 specifies the (G)MCH’s absolute maximum and minimum ratings. Within functional operation limits, functionality and long-term reliability can be expected. At conditions outside functional operation condition limits, but within absolute maximum and minimum ratings, neither functionality nor long-term reliability can be expected. If a device is returned to conditions within functional operation limits after having been subjected to conditions outside these limits, but within the absolute maximum and minimum ratings, the device may be functional, but with its lifetime degraded depending on exposure to conditions exceeding the functional operation condition limits. At conditions exceeding absolute maximum and minimum ratings, neither functionality nor longterm reliability can be expected. Moreover, if a device is subjected to these conditions for any length of time, then, when returned to conditions within the functional operating condition limits, it will either not function, or its reliability will be severely degraded. Although the (G)MCH contains protective circuitry to resist damage from static electric discharge, precautions should always be taken to avoid high static voltages or electric fields. 261
Page 1 and 2:
Intel ® 945G/945GZ/945GC/ 945P/945
Page 3 and 4:
Contents 1 Introduction ...........
Page 5 and 6:
4.2.11 C0DRC1—Channel A DRAM Cont
Page 7 and 8:
6.1.16 DMICESTS—DMI Correctable E
Page 9 and 10:
9.4.5 SMM Space Decode and Transact
Page 11 and 12:
11.3 DC Characteristics ...........
Page 13 and 14:
Revision History Rev Description Da
Page 15 and 16:
Intel ® 82945G/82945GZ/82945GC/829
Page 17 and 18:
1 Introduction Introduction The Int
Page 19 and 20:
Figure 1-2. Intel ® 945GZ/82945GC
Page 21 and 22:
1.1 Terminology Term Description Ac
Page 23 and 24:
Term Description TOLM Top Of Low Me
Page 25 and 26:
Introduction � Supports four bank
Page 27 and 28:
Introduction 1.4 Graphics (Intel ®
Page 29 and 30:
1.5 Analog and SDVO Displays (Intel
Page 31 and 32:
2 Signal Description Signal Descrip
Page 33 and 34:
2.1 Host Interface Signals Signal D
Page 35 and 36:
Signal Name Type Description HREQ[4
Page 37 and 38:
2.3 DDR2 DRAM Channel B Interface S
Page 39 and 40:
Signal Description 2.6 Analog Displ
Page 41 and 42:
2.8 Direct Media Interface (DMI) Si
Page 43 and 44:
2.10 Power and Ground Name Voltage
Page 45 and 46:
Interface Signal Name I/O System Me
Page 47 and 48:
Interface Signal Name I/O State Dur
Page 49 and 50:
3 Register Description Register Des
Page 51 and 52:
Register Description Note: A physic
Page 53 and 54:
3.3 Configuration Mechanisms Regist
Page 55 and 56:
3.4 Routing Configuration Accesses
Page 57 and 58:
3.4.2.2 DMI Configuration Accesses
Page 59 and 60:
Bit Access & Default 10:8 R/W 000b
Page 61 and 62:
Host Bridge/DRAM Controller Registe
Page 63 and 64:
4.1 Device 0 Configuration Register
Page 65 and 66:
4.1.4 PCISTS—PCI Status (D0:F0) P
Page 67 and 68:
4.1.7 MLT—Master Latency Timer (D
Page 69 and 70:
4.1.12 EPBAR—Egress Port Base Add
Page 71 and 72:
Page 73 and 74:
Page 75 and 76:
Page 77 and 78:
4.1.19 PAM1—Programmable Attribut
Page 79 and 80:
Page 81 and 82:
Page 83 and 84:
4.1.25 LAC—Legacy Access Control
Page 85 and 86:
Page 87 and 88:
4.1.29 ERRSTS—Error Status (D0:F0
Page 89 and 90:
4.1.31 SKPD—Scratchpad Data (D0:F
Page 91 and 92:
Page 93 and 94:
Page 95 and 96:
4.2.7 C0DCLKDIS—Channel A DRAM Cl
Page 97 and 98:
4.2.9 C0DRT1—Channel A DRAM Timin
Page 99 and 100:
Bit Access & Default 6:4 R/W 000b 3
Page 101 and 102:
Page 103 and 104:
4.2.24 PMSTS—Power Management Sta
Page 105 and 106:
4.3.1 EPESD—EP Element Self Descr
Page 107 and 108:
4.3.3 EPLE1A—EP Link Entry 1 Addr
Page 109 and 110:
Host-PCI Express* Bridge Registers
Page 111 and 112:
Address Offset Host-PCI Express* Br
Page 113 and 114:
5.1.3 PCICMD1—PCI Command (D1:F0)
Page 115 and 116:
5.1.4 PCISTS1—PCI Status (D1:F0)
Page 117 and 118:
5.1.7 CL1—Cache Line Size (D1:F0)
Page 119 and 120:
5.1.12 IOBASE1—I/O Base Address (
Page 121 and 122:
5.1.15 MBASE1—Memory Base Address
Page 123 and 124:
Page 125 and 126:
5.1.20 INTRLINE1—Interrupt Line (
Page 127 and 128:
Bit Access & Default 2 R/W 0b 1 R/W
Page 129 and 130:
Page 131 and 132:
Page 133 and 134:
5.1.29 MA—Message Address (D1:F0)
Page 135 and 136:
5.1.33 DCAP—Device Capabilities (
Page 137 and 138:
5.1.35 DSTS—Device Status (D1:F0)
Page 139 and 140:
5.1.37 LCTL—Link Control (D1:F0)
Page 141 and 142:
5.1.39 SLOTCAP—Slot Capabilities
Page 143 and 144:
5.1.41 SLOTSTS—Slot Status (D1:F0
Page 145 and 146:
5.1.43 RSTS—Root Status (D1:F0) P
Page 147 and 148:
Page 149 and 150:
Page 151 and 152:
Page 153 and 154:
5.1.56 ESD—Element Self Descripti
Page 155 and 156:
Page 157 and 158:
5.1.61 CESTS—Correctable Error St
Page 159 and 160:
Page 161 and 162:
Direct Media Interface (DMI) RCRB 6
Page 163 and 164:
6.1.3 DMIPVCCAP2—DMI Port VC Capa
Page 165 and 166:
6.1.6 DMIVC0RCTL—DMI VC0 Resource
Page 167 and 168:
6.1.9 DMIVC1RCTL—DMI VC1 Resource
Page 169 and 170:
6.1.13 DMILSTS—DMI Link Status MM
Page 171 and 172:
6.1.15 DMIUEMSK—DMI Uncorrectable
Page 173 and 174:
Integrated Graphics Device (D2:F0)
Page 175 and 176:
Page 177 and 178:
7.1.4 PCISTS2—PCI Status (D2:F0)
Page 179 and 180:
7.1.7 CLS—Cache Line Size (D2:F0)
Page 181 and 182:
7.1.11 IOBAR—I/O Base Address (D2
Page 183 and 184:
Page 185 and 186:
7.1.20 MINGNT—Minimum Grant (D2:F
Page 187 and 188:
Page 189 and 190:
Page 191 and 192:
Page 193 and 194:
8.1.3 PCICMD2—PCI Command (D2:F1)
Page 195 and 196:
8.1.5 RID2—Revision Identificatio
Page 197 and 198:
Page 199 and 200:
Page 201 and 202:
Page 203 and 204:
8.2 Device 2 - PCI I/O Registers In
Page 205 and 206:
9 System Address Map System Address
Page 207 and 208:
Figure 9-1. System Address Ranges 4
Page 209 and 210: Compatible SMRAM Address Range (A_0
Page 211 and 212: 9.2 Main Memory Address Range (1 MB
Page 213 and 214: 9.3 PCI Memory Address Range (TOLUD
Page 215 and 216: 9.3.6 PCI Express* Graphics Attach
Page 217 and 218: 9.4.1 SMM Space Definition System A
Page 219 and 220: 9.4.5 SMM Space Decode and Transact
Page 221 and 222: 9.4.12 Legacy VGA and I/O Range Dec
Page 223 and 224: 10 Functional Description This chap
Page 225 and 226: Interleaved Mode Functional Descrip
Page 227 and 228: 667 MHz (PC 5300) (82945G/82945GC/8
Page 229 and 230: 10.2.2.2 System Memory Supported Co
Page 231 and 232: Functional Description Table 10-5.
Page 233 and 234: 10.3 PCI Express* (Intel ® 82945G/
Page 235 and 236: Figure 10-2. SDVO Conceptual Block
Page 237 and 238: Figure 10-3. Concurrent SDVO / PCI
Page 239 and 240: 10.5 Integrated Graphics Device (In
Page 241 and 242: 10.5.3 4X Faster Setup Engine Funct
Page 243 and 244: 10.5.4 Texture Engine Functional De
Page 245 and 246: 10.5.4.8 Pixel Shader Functional De
Page 247 and 248: Functional Description to determine
Page 249 and 250: 10.5.6 2D Engine Functional Descrip
Page 251 and 252: 10.5.8.1 Cursor Plane Functional De
Page 253 and 254: Functional Description device is in
Page 255 and 256: 10.6.2 Digital Display Interface Fu
Page 257 and 258: 10.6.2.1.5 Control Bus Functional D
Page 259: Figure 10-7 illustrates the various
Page 263 and 264: 11.1.1 Power Characteristics Table
Page 265 and 266: Signal Group Electrical Characteris
Page 267 and 268: 11.3 DC Characteristics Table 11-5.
Page 269 and 270: Symbol Signal Group Electrical Char
Page 271 and 272: Ballout and Package Information 12
Page 273 and 274: Ballout and Package Information Fig
Page 275 and 276: 12.2 Ballout Table Ballout and Pack
Page 277 and 278: Ballout and Package Information EXP
Page 279 and 280: Ballout and Package Information HA2
Page 281 and 282: Ballout and Package Information HD6
Page 283 and 284: Ballout and Package Information RSV
Page 285 and 286: Ballout and Package Information SDM
Page 287 and 288: Ballout and Package Information SDQ
Page 289 and 290: Ballout and Package Information SDQ
Page 291 and 292: Ballout and Package Information VCC
Page 297 and 298: Ballout and Package Information VSS
Page 305 and 306: 12.3 Package § Ballout and Package
Page 307 and 308: Ballout and Package Information Int
Page 309 and 310: 13.2 XOR Test Mode Initialization T
Page 311 and 312:
13.4 XOR Chains Testability Table 1
Page 313 and 314:
Table 13-5. XOR Chain 2 Pin Count B
Page 315 and 316:
Table 13-8. XOR Chain 5 Pin Count B
Page 317 and 318:
Table 13-11. XOR Chain 8 Pin Count
show all

Intel® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family ...

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?