Intel® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family ...

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Integrated Graphics Device (D2:F0) (Intel® 82945G/82945GC/ 82945GZ GMCH Only) 7.1.29 PMCS—Power Management Control/Status (D2:F0) PCI Device: 2 Address Offset: D4h Default Value: 0000h Access: RO, R/W Size: 16 bits Bit Access & Default 15 RO 0b 14:9 Reserved 8 RO 0b 7:2 Reserved 1:0 R/W 00b Description PME_Status: This bit is 0 to indicate that the IGD does not support PME# generation from D3 (cold). PME_En: This bit is 0 to indicate that PME# assertion from D3 (cold) is disabled. Power State: This field indicates the current power state of the IGD and can be used to set the IGD into a new power state. If software attempts to write an unsupported state to this field, the write operation must complete normally on the bus, but the data is discarded and no state change occurs. On a transition from D3 to D0 the graphics controller is optionally reset to initial values. Behavior of the graphics controller in supported states is detailed in the power management section. 00 = D0 (Default) 01 = D1 (Not Supported) 10 = D2 (Not Supported) 11 = D3 7.1.30 SWSMI—Software SMI (D2:F0) PCI Device: 2 Address Offset: E0h Default Value: 0000h Access: R/W Size: 16 bits As long as there is the potential that DVO port legacy drivers exist that expect this register at this address, D2, F0, address E0h–E1h must be reserved for this register. Bit Access & Default 15:8 R/W 00h 7:1 R/W 00h 0 R/W 0b SW scratch bits Description Software Flag: This field indicates the caller and SMI function desired, as well as return result. GMCH Software SMI Event: Software must write a 0 to clear this bit. 0 = SMI Not triggered. 1 = When set, this bit will trigger an SMI. 188 Intel ® 82945G/82945GZ/82945GC GMCH and 82945P/82945PL MCH Datasheet
Integrated Graphics Device (D2:F0) (Intel® 82945G/82945GC/ 82945GZ GMCH Only) 7.1.31 ASLE—System Display Event Register (D2:F0) PCI Device: 2 Address Offset: E4h Default Value: 00000000h Access: R/W Size: 32 bits Byte, Word, or Double Word PCI configuration cycles can access this register. Bit Access & Default 31:24 R/W 00h 23:16 R/W 00h 15:8 R/W 00h 7:0 R/W 00h 7.1.32 ASLS—ASL Storage (D2:F0) PCI Device: 2 Address Offset: FCh Default Value: 00000000h Access: R/W Size: 32 bits Description ASLE Scratch Trigger 3: When written, this scratch byte triggers an interrupt when IER bit 0 is enabled and IMR bit 0 is unmasked. If written as part of a 16bit or 32-bit write, only one interrupt is generated in common. ASLE Scratch Trigger 2: When written, this scratch byte triggers an interrupt when IER bit 0 is enabled and IMR bit 0 is unmasked. If written as part of a 16bit or 32-bit write, only one interrupt is generated in common. ASLE Scratch Trigger 1: When written, this scratch byte triggers an interrupt when IER bit 0 is enabled and IMR bit 0 is unmasked. If written as part of a 16bit or 32-bit write, only one interrupt is generated in common. ASLE Scratch Trigger 0: When written, this scratch byte triggers an interrupt when IER bit 0 is enabled and IMR bit 0 is unmasked. If written as part of a 16bit or 32-bit write, only one interrupt is generated in common. This software scratch register is read/write accessible. The exact bit register usage must be worked out in common between system BIOS and driver software, but storage for switching/indicating up to 6 devices is possible with this amount. For each device, the ASL control method requires two bits for _DOD (BIOS detectable yes or no, VGA/Non VGA), one bit for _DGS (enable/disable requested), and two bits for _DCS (enabled now/disabled now, connected or not). Bit Access & Default 31:0 R/W 00000000h Description RW according to a software controlled usage to support device switching. Intel ® 82945G/82945G/82945GC GMCH and 82945P/82945PL MCH Datasheet 189 §
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Intel ® 945G/945GZ/945GC/ 945P/945
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Contents 1 Introduction ...........
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4.2.11 C0DRC1—Channel A DRAM Cont
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6.1.16 DMICESTS—DMI Correctable E
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9.4.5 SMM Space Decode and Transact
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11.3 DC Characteristics ...........
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Revision History Rev Description Da
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Intel ® 82945G/82945GZ/82945GC/829
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1 Introduction Introduction The Int
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Figure 1-2. Intel ® 945GZ/82945GC
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1.1 Terminology Term Description Ac
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Term Description TOLM Top Of Low Me
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Introduction � Supports four bank
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Introduction 1.4 Graphics (Intel ®
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1.5 Analog and SDVO Displays (Intel
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2 Signal Description Signal Descrip
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2.1 Host Interface Signals Signal D
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Signal Name Type Description HREQ[4
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2.3 DDR2 DRAM Channel B Interface S
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Signal Description 2.6 Analog Displ
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2.8 Direct Media Interface (DMI) Si
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2.10 Power and Ground Name Voltage
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Interface Signal Name I/O System Me
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Interface Signal Name I/O State Dur
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3 Register Description Register Des
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Register Description Note: A physic
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3.3 Configuration Mechanisms Regist
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3.4 Routing Configuration Accesses
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3.4.2.2 DMI Configuration Accesses
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Bit Access & Default 10:8 R/W 000b
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Host Bridge/DRAM Controller Registe
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4.1 Device 0 Configuration Register
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4.1.4 PCISTS—PCI Status (D0:F0) P
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4.1.7 MLT—Master Latency Timer (D
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4.1.12 EPBAR—Egress Port Base Add
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4.1.19 PAM1—Programmable Attribut
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4.1.25 LAC—Legacy Access Control
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4.1.29 ERRSTS—Error Status (D0:F0
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4.1.31 SKPD—Scratchpad Data (D0:F
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4.2.7 C0DCLKDIS—Channel A DRAM Cl
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4.2.9 C0DRT1—Channel A DRAM Timin
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Bit Access & Default 6:4 R/W 000b 3
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4.2.24 PMSTS—Power Management Sta
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4.3.1 EPESD—EP Element Self Descr
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4.3.3 EPLE1A—EP Link Entry 1 Addr
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Host-PCI Express* Bridge Registers
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Address Offset Host-PCI Express* Br
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5.1.3 PCICMD1—PCI Command (D1:F0)
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5.1.4 PCISTS1—PCI Status (D1:F0)
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5.1.7 CL1—Cache Line Size (D1:F0)
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5.1.12 IOBASE1—I/O Base Address (
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5.1.15 MBASE1—Memory Base Address
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5.1.20 INTRLINE1—Interrupt Line (
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Bit Access & Default 2 R/W 0b 1 R/W
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5.1.29 MA—Message Address (D1:F0)
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5.1.33 DCAP—Device Capabilities (
Page 137 and 138: 5.1.35 DSTS—Device Status (D1:F0)
Page 139 and 140: 5.1.37 LCTL—Link Control (D1:F0)
Page 141 and 142: 5.1.39 SLOTCAP—Slot Capabilities
Page 143 and 144: 5.1.41 SLOTSTS—Slot Status (D1:F0
Page 145 and 146: 5.1.43 RSTS—Root Status (D1:F0) P
Page 147 and 148: Host-PCI Express* Bridge Registers
Page 153 and 154: 5.1.56 ESD—Element Self Descripti
Page 157 and 158: 5.1.61 CESTS—Correctable Error St
Page 161 and 162: Direct Media Interface (DMI) RCRB 6
Page 163 and 164: 6.1.3 DMIPVCCAP2—DMI Port VC Capa
Page 165 and 166: 6.1.6 DMIVC0RCTL—DMI VC0 Resource
Page 167 and 168: 6.1.9 DMIVC1RCTL—DMI VC1 Resource
Page 169 and 170: 6.1.13 DMILSTS—DMI Link Status MM
Page 171 and 172: 6.1.15 DMIUEMSK—DMI Uncorrectable
Page 173 and 174: Integrated Graphics Device (D2:F0)
Page 177 and 178: 7.1.4 PCISTS2—PCI Status (D2:F0)
Page 179 and 180: 7.1.7 CLS—Cache Line Size (D2:F0)
Page 181 and 182: 7.1.11 IOBAR—I/O Base Address (D2
Page 185 and 186: 7.1.20 MINGNT—Minimum Grant (D2:F
Page 187: Integrated Graphics Device (D2:F0)
Page 193 and 194: 8.1.3 PCICMD2—PCI Command (D2:F1)
Page 195 and 196: 8.1.5 RID2—Revision Identificatio
Page 203 and 204: 8.2 Device 2 - PCI I/O Registers In
Page 205 and 206: 9 System Address Map System Address
Page 207 and 208: Figure 9-1. System Address Ranges 4
Page 209 and 210: Compatible SMRAM Address Range (A_0
Page 211 and 212: 9.2 Main Memory Address Range (1 MB
Page 213 and 214: 9.3 PCI Memory Address Range (TOLUD
Page 215 and 216: 9.3.6 PCI Express* Graphics Attach
Page 217 and 218: 9.4.1 SMM Space Definition System A
Page 219 and 220: 9.4.5 SMM Space Decode and Transact
Page 221 and 222: 9.4.12 Legacy VGA and I/O Range Dec
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Page 225 and 226: Interleaved Mode Functional Descrip
Page 227 and 228: 667 MHz (PC 5300) (82945G/82945GC/8
Page 229 and 230: 10.2.2.2 System Memory Supported Co
Page 231 and 232: Functional Description Table 10-5.
Page 233 and 234: 10.3 PCI Express* (Intel ® 82945G/
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Page 237 and 238: Figure 10-3. Concurrent SDVO / PCI
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10.5 Integrated Graphics Device (In
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10.5.3 4X Faster Setup Engine Funct
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10.5.4 Texture Engine Functional De
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10.5.4.8 Pixel Shader Functional De
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Functional Description to determine
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10.5.6 2D Engine Functional Descrip
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10.5.8.1 Cursor Plane Functional De
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Functional Description device is in
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10.6.2 Digital Display Interface Fu
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10.6.2.1.5 Control Bus Functional D
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Figure 10-7 illustrates the various
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11 Electrical Characteristics Elect
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11.1.1 Power Characteristics Table
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Signal Group Electrical Characteris
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11.3 DC Characteristics Table 11-5.
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Symbol Signal Group Electrical Char
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Ballout and Package Information 12
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Ballout and Package Information Fig
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12.2 Ballout Table Ballout and Pack
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Ballout and Package Information EXP
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Ballout and Package Information HA2
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Ballout and Package Information HD6
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Ballout and Package Information RSV
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Ballout and Package Information SDM
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Ballout and Package Information SDQ
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Ballout and Package Information SDQ
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Ballout and Package Information VCC
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Ballout and Package Information VSS
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12.3 Package § Ballout and Package
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Ballout and Package Information Int
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13.2 XOR Test Mode Initialization T
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13.4 XOR Chains Testability Table 1
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Table 13-5. XOR Chain 2 Pin Count B
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Table 13-8. XOR Chain 5 Pin Count B
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Table 13-11. XOR Chain 8 Pin Count
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Intel® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family ...

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