DATA SHEET - Glyn High-Tech Distribution

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HX8346-A(T)240RGB x 320 dot, 262K color, TFT Mobile Single Chip DriverDATA SHEET V01SignalsI/OPinNumberConnectedwithTest pin and othersDescriptionPADA0,Test pin for display glass break detection.I 2 MPUPADB0If not used, please open these pins.PADA1~PADA4,Test pin for chip attachment detection.I 8 MPUPADB1~If not used, please open these pins.PADB4TEST3-1 I 3 GND Test pin input (Internal pull low).TS8~0 O 9 Open A test pin. Disconnect it.SO_TEST1~3 O 3 Open A test pin.VMONI O 1 Open A test pin. Disconnect it.VTEST O 1 Open Gamma voltage of Panel test pin output. Must be left open.TVCOMHI O 1 Open A test pin output. Must be left open.TVMAG O 1 Open A test pin output. Must be left open.DUMMYR1-10 - 10 -Dummy pads. Available for measuring the COG contact resistance.DUMMYR1 and DUMMYR10 are short-circuited within the chip.DUMMYR2 and DUMMYR9 are short-circuited within the chip.DUMMYR3 and DUMMYR4 are short-circuited within the chip.DUMMYR5 and DUMMYR6 are short-circuited within the chip.DUMMYR7 and DUMMYR8 are short-circuited within the chip.DUMMY - 16 Open Dummy pads.Himax ConfidentialThis information contained herein is the exclusive property of Himax and shall not be distributed, reproduced, or disclosedin whole or in part without prior written permission of Himax.-P.19-July, 2007
NO.1NO.302PADA1PADB1DUMMYR1DUMMYR2PADA0BGR_PANELREVPANELTBRLSHUTTEST1D23D22D21D20D19D18SM_PANELDUMMYOSCCMSS_ PANELGS_ PANELP68EXTCBS0BS1BS2IFSEL0IFSEL1DUMMYTEST2NRESETVSYNCHXYNCDOTCLKENABLED17D16D15D14D13D12D11D10D9D8TEST3DUMMYHSSP_END7D6D5D4D3D2D1D0SDOSDINRD_ENWR_ RNWDNC_SELNCSNISDDUMMYBURNTETS8TS7TS6TS5TS4TS3TS2TS1TS0REGVDDFLMDUMMYDUMMYDUMMYHS_DA_PHS_DA_PHS_DA_PHS_DA_PDUMMYDUMMYDUMMYDUMMYDUMMYR3DUMMYR4VSSDVSSDVSSDHS_DA_NHS_DA_NHS_DA_NHS_DA_NIOVCCIOVCCIOVCCIOVCCIOVCCIOVCCIOVCCHS_CLK_NHS_CLK_NHS_CLK_NHS_CLK_NHS_ CLK_PHS_CLK_PHS_CLK_PHS_ CLK_PVCIVCIVCIVCIVCIVCIVCIVCIVCIVCCVCCVCCVCCDUMMYDUMMYDUMMYVCI2VCI2VCI2DUMMYVBGPVSSAVSSAVSSAVSSAVSSAVSSAVSSAVSSAVSSAVSSAVSSAVGSVGSVSSDVSSDVSSDVSSDVSSDVSSDVSSDVSSDVSSDVSSDVSSDVMONIVTESTSO_ TEST1SO_ TEST2SO_ TEST3LED_FBLED_FBLED_FBLED_FBLED_FBVCOMVCOMVCOMVCOMVCOMVCOMVCOMHVCOMHVCOMHVCOMHVCOMHVCOMHVCOMLVCOMLVCOMLVCOMLVCOMLVCOMLVREG1VREG1VREG1VREG1VSSDTVCOMHIVCOMRTVMAGVCLVCLVCLPWM_OUTPWM_OUTPWM_OUTVLCDVLCDVLCDVLCDVLCDVLCDVLCDVREG3VREG3VREG3LED_SWLED_SWLED_SWLED_SWLED_SWVDDDVDDDVDDDVDDDVDDDVDDDVDDDVDDDVDDDCX11BCX11BCX11BCX11BCX11BCX11ACX11ACX11ACX11ACX11AC11BC11BC11BC11BC11BC11AC11AC11AC11AC11AVSSAVGLVGLVGLVGLVGLVGLVGLVGLVGLVGLVGLVGLVSSAVSSAVSSAVGHVGHVGHVGHVGHVGHDUMMYC12BC12BC12BC12BC12AC12AC12AC12AC21BC21BC21BC21AC21AC21AC22BC22BC22BC22AC22AC22AC23BC23BC23BC23AC23AC23APADB0PADB0DUMMYR5DUMMYR6PADA 2PADB 2(A3)(A4)(A1)(A2)PADB4PADA4DUMMYR10DUMMYR9DUMMY58G319G317G1DUMMY57DUMMY56DUMMY55S1S2S3S718DUMMY54DUMMY53DUMMY52G2G4G6G318G320DUMMY51DUMMYR8DUMMYR7PADB3PADA3NO.1358NO. 1353NO.1194NO.1190NO.471NO.467NO.308NO.303HX8346-A(T)240RGB x 320 dot, 262K color, TFT Mobile Single Chip Driver4.2 Pin assignmentDATA SHEET V01. Chip Size : 23020 x 1267 umInclude seal ring : 20 x 2umInclude scribe line : 40 x 2um. Chip thickness :300um. Pad Location : PAD Center. Coordinate Origin : Chip Center. Au Bump Size :1 . 28 um x 120umInput :No. 1 to No.2 No. 301 to No.3022 . 50 um x 120umInput :No. 3 to No.3003 . 20 um x 96umStaggered LCD output side :No. 303 to No. 1358. The chip size includes the core size ,seal ring size, and scribe line size..Au bump pitch: Refer to Pad Coordinate ..Au bump height : 15um.Numbers in the figure corresponds topad coordinate numbers .Face Up( Bump View)HX8346- A PinAssignmentXYG5G3S719S720G314G316Himax ConfidentialThis information contained herein is the exclusive property of Himax and shall not be distributed, reproduced, or disclosedin whole or in part without prior written permission of Himax.-P.20-July, 2007
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