Dynamic Shift Registers - Bitsavers - Trailing-Edge

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Custom MOS/LSIo...ct/)o3s:o(J)........r(J)Custom MOS/LSI Product FlowI nterface betweenCustomer andDesign/ProductionEngineersTime Sharing ComputerSimulatesStatic and <strong>Dynamic</strong>Performance andWorst Case ParametersMacrodata FEDISLSI Design SystemProduct DefinitionPartitioningSimulationDraftingDigitizingDavid MannReticle Generator10X Reticle GenerationDavid Mann Camera6-Barrel Step & RepeatMask Making (In-House)Wafer FabricationVolume Wafer ProductionSanta Clara FacilityAssemblyVolume Assembly,WorldwideMacrodata J259, J277100,230-2 LSI Tester100% Wafer Probe Test100% Finished ProductTestQuality AssuranceInternal Spec to MIL-STD 883ReliabilityHigh Rei ProcessingAvailable on all ProductsShipping225
INTRODUCTIONWhile custom and standard MOS have advantagesover each other for specific appl ications, there is ahigh demand for both in today's electronics industry.In most cases, the true test of whether a systemcan most economically be implemented withstandard, custom, or both, can only be determinedafter partitioning. If the quantities in question donot exceed a few hundred units per year, the standardproduct approach is probably the best solution.However, if the total number of units isseveral thousand per year, then customizing isusually the best approach.Custom MOS circu its are designed to do a specificjob. You are not buying capability that is notneeded. The entire chip is devoted to performingyour specific function. Advantages are:1) Fewer Packages2) Lower Power Dissipation3) Smaller P.C. Boards4) Proprietary DesignThese advantages result in lower system costs andprotection of your system design.RESOURCESNational has brought together a group of experiencedcircuit and system designers, separate fromthe standard product group, to offer a customMOS/LSI design service to the industry. This groupis prepared to aid in the logic design of a system,partition the system into feasible LSI circuits ifthe design requires more than one chip, developthe chips, assist the customer in prototype systemcheckout, and put the design into production.National has one of the most advanced IC manufacturingfacilities in the industry. Your customdesign will go through the same production facilitieswhere National's standard MOS products aremanufactured, and thus benefit from our longexperience in MOS processing.As with its bipolar circuits, the key to National'sMOS program is volume production. We are aleading producer of shift registers, read-only memories,and random access memories. I n the lattercategory, National is supplying many second sourceand proprietary static and dynamic RAMs as wellas several advanced large-capacity RAMs. Nationalis also exploring other MOS device applications,such as MAPS (Microprogram mabie ArithmeticProcessor System). This unit contains five LSIchi'ps which, with very few added parts, can comprisea high sophisticated electronic calculator, an"intelligent" computer terminal, or even a lowcostmicroprocessor.National was the first company to offer MOS circuitsthat operate at voltage levels directly compatiblewith TTL. (Previously, level-shifters wereneeded if high-voltage MOS and low-voltage TTLwere to work together). To achieve this so-calledlow-level MOS operation, National pioneered inthe fabrication of circuits made from silicon cutalong the (1-0-0) axis of the crystal. Subsequently,other companies developed bipolar compatibleMOS circuits also. Today, National is investigatinga variety of MOS technologies to determine thebest process to use a specific function. During thepast year, National introduced the silicon gateprocess to the MOS product line; other technologiessuch as ion-implantation, N-channel andCMOS are also being investigated. The companywill use any available technology as a tool toachieve necessary performance for a given function.1-0-0 P-channel metal gate and 1-1-1 silicon selfalignedgate enhancement mode MOS technologiesare presently utilized by National in our standardMOS products. These processes have become industrystandards. All of the P-channel MOS processdevices offer bipolar compatibility.Metal gate devices operate to 3.3 MHz. This technologyis wel.l-suited to random logic and ROMapplications. Higher logic densities and operatingfrequencies approaching 10 MHz can be achievedby using silicon gate technology. This process lendsitself to RAMs, registers, and random logic applications.Static and dynamic logic is available in both metaland silicon gate devices (including ion-implants).In general, less power is dissipated if dynamic logicis employed, which also offers the advantage ofsynchronous operation and eliminates hazards dueto race conditions. In any event, power dissipationof typical LSI functions (up to 1000 gate func·tions) approach 500 mW in devices fabricated witheither metal gate or silicon gate technology.Complementary MOS (CMOS) technology is presentlybeing used on many standard products andwill soon be available for custom products. Structuredlogic, ROMs, RAMs, and registers, designedwith CMOS cannot achieve the density of Pchannel MOS. However, quiescent power and dissipationsare less than one microwatt per gate.Operation to 10 MHz can be achieved. One of theadvantages of CMOS is that power dissipation is afunction of frequency, with the DC (quiescent)state consuming the least power.The N-channel process is also undergoing developmentat National. This process allows higher densityand high frequency operation than P-channel.This process is slated for production capabilitybefore June 1972.Ion implantation is a technique that can be appliedto any of the previously mentioned processes. Itallows threshold voltages to be adjusted to a desiredlevel by implanting ions in the gate region. Depletionload devices and large value ohmic resistors arealso being made with ion implantation, whichgreatly improves packing density on LSI chips.DESIGNYour custom design will benefit from National'slongtime experience in the MOS business. Extensiveuse of computer-aided design (CAD) andcomputer simulation programs assure proper operationof your circuit before it goes into production.226
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National Semiconductor CorporationM
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IntroductionHere is National's newe
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RAMsMM1101 256-Bit Fully Decoded St
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MOS Selection GuidePRODUCT TYPE NO.
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The five basic elements are interco
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absolute maximum ratingsVoltage at
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timing diagramsSequence of Command
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programming of MM5704 (can't)o coun
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......tnG)G)(I)0010:E:E......00..:E
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Dynamic Shift Registers~~ MM1402A/M
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performance characteristics! 100,.J
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«o ....oLC'):E:E.......«.... oo-.
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Dynamic Shift Registers.....enoLn:?
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performance characteristicsN~ '"> u
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logic table (Notes 3,4)MOOEREGISTER
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Dynamic Shift RegistersMM4015A/MM50
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performance characteristics~~>...zw
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.... co0LC):E:E........CO....0~:E:E
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Dynamic Shift RegistersMM4017/MM501
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perform ance ch a racteristicslOOkN
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performance characteristics!ji,:Ii'
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absolute maximum ratingsGate Voltag
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performance c ha racte risticsac te
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absolute maximum ratingsDrain Volta
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Static Shift RegistersMM4040/MM5040
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guaranteed performance characterist
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Static Shift RegistersMM4052/MM5052
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guaranteed performance characterist
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MM4203/MM5203 electrically programm
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operating characteristics (con'tl f
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ROMsMM4210/MM5210 1024-bit read onl
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performance characteristicsGuarante
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ROMsMM42111MM52111024-bit read only
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performance characteristicsPower Su
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MM4220/ MM5220 1024-bit read only m
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ROMsMM42211MM52211024-bit read only
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performance characteristicsPower Su
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illSROMsMM4230/MM5230 2048-bit read
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~12V-----_""' _____________ROMsMM42
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ROMsMM4232/MM5232 4096 -bit static
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ROMsMM4240/MM5240 2560-bit static c
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performance characteristics1200Guar
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ROMsMM42411MM5241 3072-bit static r
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performance characteristicsTypical
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RAMsMM1101/MM11011/MM1101A/MM1101A1
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performance curves (MM1101A/MM1101A
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RAMsMM1103 1024-bit fully decodeddy
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ac operating characteristics (con't
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absolute maximum ratingsAll I nput
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MH0007/MH0007C dc coupled MOS clock
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Clock DriversMH0009/MH0009C dc coup
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MH0012/MH0012C high speed MOS clock
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MH0013/MH0013C two phase MOS clock
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typical performance (cont.)FIGURE 4
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MH0025/MH0025C two phase MOS clock
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applications informationCircuit Ope
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absolute maximum ratings (Notes 1 &
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typical applicationsIfOP~T"IfOPUT"D
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application information (con't)The
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application information (con't)For
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absolute maximum ratingsContinuous
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ininin::?i::?iabsolute maximum rati
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typical input capacitancesMM450, MM
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"litIt)It):?!:?!......."litIt)"lit:
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enQ)...Q)fJ)oCD-o:I:«oIJ')-o:I:«o
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...(I)Q)electrical characteristicse
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enCD''::CDtJ)o...CDoJ:c:(o~in...oJ:
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TtilQ)'a::Q)enoCD....o:I:«oIt)....
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absolute maximum ratingsVplus Suppl
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No....~
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Uanor-.M~
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schematic diagramanalog switch data
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(.)0')....ooJ:Z........0')....ooJ:Z
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(.)0')-ooJ:Z........0')-ooJ:Z(.)"d'
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absolute maximum ratingsSupply Volt
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MM482/MM582Voltage Transfer Charact
Page 182 and 183: ROM Character GeneratorsMM4220N P/M
Page 184 and 185: ROM Character GeneratorsMM4240ABU/M
Page 186 and 187: ROM Character GeneratorsMM4240ABZ/M
Page 188 and 189: ROM Code Convertersrn"owSK0003 sine
Page 190 and 191: ROM Code Converte rsMM4220AE/MM5220
Page 192 and 193: ROM Code ConvertersMM4220AP/MM5220A
Page 194 and 195: ROM Code ConvertersMM4220BL/MM5220B
Page 196 and 197: ROM Code ConvertersMM4220BM/MM5220B
Page 198 and 199: ROM Code ConvertersMM4220BN/MM5220B
Page 200 and 201: MM4220DF/MM5220DF"quick brown fox"
Page 202 and 203: ROM Code ConvertersMM4220EK/MM5220E
Page 204 and 205: MM4220LR/MM5220LR BCOIC to ASCII-7/
Page 206 and 207: ROM Code ConvertersMM4221RO/MM5221R
Page 208 and 209: ROM Code ConvertersMM4221RR/MM5221R
Page 210 and 211: 11151 ROM Code ConvertersM M 42 30
Page 212 and 213: code conversion table-selectric-to-
Page 214 and 215: ROM Code ConvertersMM4230JT /MM5230
Page 216 and 217: ROM Code ConvertersMM4230KP/MM5230K
Page 218: ~BlillSROM Code ConvertersMM42300W/
Page 221 and 222: ROM Code ConvertersMM4230QY/MM5230Q
Page 223 and 224: ROM Code ConvertersMM4230RS/MM5230R
Page 225 and 226: A.a:-MNit)~~.......A.a:ROM Code Con
Page 227 and 228: «coco~r-..:?!c........«coco~Ln:?!
Page 229 and 230: «0000~.....~c.......«0000~Ln~Ctru
Page 231 and 232: ROM Code ConvertersDM7598AA/DM8598A
Page 236: All designs are verified with a cir
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Page 282 and 283: BriefsJANUARY 1970...aTRIG FUNCTION
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MASK PROGRAMMING SPECIALIZESMOS SHI
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ORDERING INFORMATIONWhen ordering,
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Clock Repetition Rate: The range of
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National Semiconductor Corporation2
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