MOST Productive PACKAGING SOLUTION

wOrLDwIDE SaLES & SErVICE CONTaCTS
ANy QUESTIONS? WE ARE HERE TO HELP
LIECHTENSTEIN
Headquarters
OC Oerlikon Balzers Ltd.
GErmaNy
EmEa Hub
Oerlikon Deutschland
Vertriebs GmbH
amErICaS
Central Hub
Oerlikon USa Inc
TaIwaN (rOC)
Central Hub
DKSH Taiwan Ltd.
CHINa
DKSH China Ltd.
JapaN
Hakuto Co., Ltd.
maLaySIa *
ZmC Technologies
(malaysia) Sdn Bhd
SINGapOrE *
ZmC Technologies
(Singapore) pte Ltd
SOUTH KOrEa
woowon Technology Co., Ltd
Iramali 18
P.O. Box 1000
9496 Balzers
Liechtenstein
www.oerlikon.com/systems
Karl-Hammerschmidt-Strasse 34
85609 Aschheim-Dornach
Germany
10050 16th Street North
St. Petersburg FL 33716
United States
13F-1, No.100, Sec. 1,
Jiafong 11th Rd.
Jhubei City, Hsinchu County 302
Taiwan (R.O.C.)
1801 Hongmei Road
Innov Tower / Block A Unit 2208
Shanghai
China
1-13. Shinjuku 1-Chome
Shinjuku-ku
Tokyo 160-8910
Japan
No. 1-3-23 Krystal Point 2
Lebuh Bukit Kecil 6
Penang 11900
Malaysia
10 Ubi Crescent #05-92/93/94/95
Lobby E, Ubi Techpark
Singapore 408564
Singapore
1903 Parkview Office Tower
6 Jeongja-dong, Bundang-gu
Seongnam-si, Kyeonggi-do
463-863 South Korea
T: +423 388 4770
info.systems@oerlikon.com
S: sales.systems@oerlikon.com
CS: service.systems@oerlikon.com
T: +49 89 75 505 100
S: sales.systems.mn@oerlikon.com
CS: service.systems.mn@oerlikon.com
T: +1 727 828 0850
S: sales.systems.sp@oerlikon.com
CS: service.systems.sp@oerlikon.com
T: +886 3 657 8788
S: jason.chen@dksh.com
CS: ben.lin@dksh.com
T: +86 21 5383 8811
S: kai.liao@dksh.com
S: +81-3-3225-8992
CS: +81-3-3225-8992
S: HKT-oerlikon@hakuto.co.jp
T: +60 4 646 4586
S: yf_lau@zmc.net
CS: pf_lau@zmc.net
STL: julie_khoo@zmc.net
T: +65 6285 1161
S: steven_ho@zmc.net
CS: jiang_ez@zmc.net
STL: carmen_leong@zmc.net
T: +82 31 783 4770
S: jskim@wwtech.co.kr
CS: igseo@wwtech.co.kr
KEy: T: Telephone, S: Sales, CS: Customer service, STL: Support, training & logistics. *Including Indonesia / Thailand / Philippines
HEX/6P/EN/08_2011
MOST PRODUCTIvE
PACKAGING SOLUTION
OUTPERFORMING TECHNOLOGy REQUIREMENTS

HEXaGON
ADvANCED PACKAGING SOLUTION
FOR HIGH vOLUME PRODUCTION
Innovation Has A Name – Cost of Ownership does too
At Oerlikon, we understand the pressure you have to lower your cost per wafer. That’s why our
newest tool for advanced packaging more than doubles wafer throughput, has a 50% smaller
footprint than its competitors, and runs up to 5000 wafers before requiring maintenance.
prODUCTIVITy
Cost per wafer
J J Highest Throughput
JJ Smallest Footprint
JJ Lowest Energy Consumption
reliability
J J Proven Process Components
J J Proven Material Handling Systems
J J Proven Control Backbone
availability
J J Designed for Organic Passivation Layers
J J Highest Wafer Count per Maintenance Interval
J J Temperature Controlled Shields and Targets
maintainability
J J Drop-in Shield Kits
JJ Powered Source Handling
J J Automated Maintenance Services
FEaTUrES
300mm or 200/300mm Bridge Capability
process Capabilities
JJ DC/DCp Sputtering
JJ ICP Etching
JJ Thermal Pre-Treatment
JJ Ultra Low Temperature Cleaning
Chucks
JJ Temperature Controlled
JJ Full Face, Clamped, ESC, Floating
JJ RF or DC Biased
Chambers
JJ Full Metal Sealed Stainless Steel Process Chambers
JJ Full Process Isolation
JJ UHv Pumping and vacuum Capacity
Transfer System
JJ Up to four FOUP Atmospheric Front End
JJ High Throughput Synchronous Motion Indexer
JJ Wafer Position Monitoring
JJ Mechanically Confined Wafer Transfers
J Cryogenic Gates and Toroidal Chamber Design for
Open Source Isolation
Operability
J Fully Pre-Integrated Systems for Fast Installation
J 90% Spare Part Overlap with Previous Generation
J 90% Process Matching with Previous Generation
J 100% Control and Operation Compatibility with
Previous Generation
UNDER BUMP & RE-DISTRIBUTION METALLIzATION
JJ System integration and packaging are responsible for the functionality, quality and
economy of microelectronic products.
JJ UBM and RDL films are commonly used in todays advanced packaging industry.
The main requirements include Oxide free IC final metal pads, no damage etch step,
good adhesion to the chip surface and even more importand to the chip passivation,
hermetic seal to the chip passivation, good diffusion barrier between solder bump
metals and IC final metal,sufficient wetability of the UBM and low stress metal stack.
JJ UBM for Flip Chip, WLP and SIP production solutions eg. Ti-Cu, WTi-Cu etc.
JJ Oerlikon the market leader in packaging
ENHANCED WAFER LEvEL PACKAGING
JJ The eWLB technology allows the realization of chips with a high
number of interconnects. The package is not realized on a silicon
wafer as for classical Wafer Level Package, but on an artificial wafer.
Therefore a front-end-processed wafer is diced and the singulated
chips are placed on a carrier.
JJ HEXAGON the ideal system to do eWLB production
3D &THROUGH SILICON PACKAGING
JJ Traditional scaling of semiconductor chips also improves signal
propagation speed. 3-D integrated circuits address the scaling challenge
by stacking 2-D dies an connecting them in the 3rd dimension. This
promises to speed up communication between layered chips. 3D
ICs promise many significant benefits including: Footprint, Cost,
Heterogeneous integration, Shorter interconnect, Power, Design, Circuit
security
J J Another application for the HEXAGON
THIN WAFER & BACKSIDE METALLIzATION
JJ Backside metallization on thin wafers are required to either build a
solder contact for improved heat drain or create an ohmic contact
layer, typically used in power device (IGBT), processors, graphic chips
etc.
JJ Handling reliability is one of the key advantages of the HEXAGON
HEXaGON
TECHNICAL INFORMATION
THrOUGHpUT
JJ 100 Wafers-per-hour (Wph) Handling Limit
JJ Conventional UBM Processing: 56 Wph
JJ Enhanced UBM Processing: 68 Wph
JJ High Output UBM Processing: 80Wph
FOOT prINT & LayOUT
JJ 12m2 Equipment Mainframe
JJ 5m2 Support and Control Systems
JJ 17m2 Total Installation Area
Less than half of any other
commercially available System
prODUCTIVITy
JJ Over 90% typical availability
JJ Over 4000 wafers maintenance intervals
JJ Less than 6 hours Total Equipment Maintenance Time
JJ Breakage rate Less than 1:20k
JJ Mean Time Between Failure over 500 hours
Above: The revolving carousel on HEXAGON Below: At just 12m 2 the HEXAGON mainframe