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26 Understanding Smart SensorsSilicon fusion bonding processSilicon sensing waferStep 1Anisotropically etched cavityHydratedsurfaceSilicon constraint waferEtched-back surfaceFusedinterfaceStep 2Step 3Ground and polished surfacefor final wafer thickness(a)Conventional absolute-pressure sensorASilicon-fusion-bondedtop waferAEquivalent silicon-fusion-bonded sensorFigure 2.5 (a) Silicon fusion bonding process and (b) its effect on die size. (After: [12].)(b)
Table 2.3Comparison of Typical Wafer Bonding Process Conditions [8]ProcessTemperature(°C)Pressure(Bar)Voltage(V)SurfaceRoughness (nm) Precise Gaps Hermetic SealSilicon-silicon 400–500 1 N/A N/A No Yes 10(glass frit)Anodic 300–500 N/A 100–1,000 20 Yes Yes 10 –5Silicon fusion 1,000 N/A N/A 0.5 Yes Yes 10 –3Vacuum LevelDuring Bonding(Torr)Micromachining 27
Page 2 and 3: Understanding Smart SensorsSecond E
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Page 8 and 9: ContentsPrefacexix1 Smart Sensor Ba
Page 10 and 11: Contentsix3.3.3 Hall Effect 603.3.4
Page 12 and 13: Contentsxi5.8 Summary 116References
Page 14 and 15: Contentsxiii8.3.1 Surface Acoustica
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Page 20 and 21: PrefaceThe number one challenge fac
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Page 73 and 74: The Nature of Semiconductor Sensor
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Getting Sensor Information Into the
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5Using MCUs/DSPs to Increase Sensor
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Using MCUs/DSPs to Increase Sensor
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6Communications for Smart SensorsBe
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7Control TechniquesA machine is int
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Control Techniques 151Table 7.1Type
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Control Techniques 153otherwise tak
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Control Techniques 155consisting of
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Control Techniques 157Supplied byap
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Control Techniques 159InputX1Synaps
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Control Techniques 1617.6 Adaptive
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Control Techniques 163ObserverHB−
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Control Techniques 165linear-vector
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Control Techniques 1677.7.2 Combine
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Control Techniques 169Domain-type s
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Control Techniques 171[19] De Silva
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8Transceivers, Transponders, andTel
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Transceivers, Transponders, and Tel
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9MEMS Beyond Sensors“And these ot
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MEMS Beyond Sensors 203would not ex
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MEMS Beyond Sensors 205PyrexSilicon
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MEMS Beyond Sensors 207(a)IFluxIIMa
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MEMS Beyond Sensors 209InletThermop
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MEMS Beyond Sensors 211Figure 9.8 A
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MEMS Beyond Sensors 2139.3.2 Microo
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MEMS Beyond Sensors 215Over-range p
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MEMS Beyond Sensors 217+ 10°− 10
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MEMS Beyond Sensors 219achieved wit
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MEMS Beyond Sensors 221Methods for
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MEMS Beyond Sensors 223Figure 9.19
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MEMS Beyond Sensors 225[21] Tortone
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10Packaging, Testing, and Reliabili
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Packaging, Testing, and Reliability
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11Mechatronics and Sensing SystemsP
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12Standards for Smart SensingThe la
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Standards for Smart Sensing 275Netw
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Standards for Smart Sensing 277NCAP
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Standards for Smart Sensing 279Proc
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Standards for Smart Sensing 281PID
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Standards for Smart Sensing 283•
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Standards for Smart Sensing 287Tabl
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Standards for Smart Sensing 289perf
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Standards for Smart Sensing 2911 0
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Standards for Smart Sensing 293obje
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Standards for Smart Sensing 295Mult
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13The Implications of Smart SensorS
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The Implications of Smart Sensor St
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14The Next Phase of Sensing Systems
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The Next Phase of Sensing Systems 3
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List of Acronyms and Abbreviations3
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List of Acronyms and Abbreviations
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Glossaryablationvaporization of mat
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Glossary 353buscalibrationconnectio
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Glossary 355end point straight line
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Glossary 357data transmission and p
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Glossary 359multiplexer device that
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Glossary 361repeatability the maxim
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Glossary 363spread spectrum techniq
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Glossary 365transducer a device con
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Selected BibliographyBooks and Jour
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Selected Bibliography 369Northeaste
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Selected Bibliography 371Miscellane
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About the AuthorRandy Frank is a te
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Index4-to 20-mA signal transmitter,
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Index 377definitions, 119-20introdu
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Index 379HVAC, 318-19MCU with integ
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Index 381Linearization, 108Linear p
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Index 383in chemical measurements,
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Index 385Ratiometricity, 56Reactive
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Index 387IC fabrication, 19micromec
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Index 389Transducer-independent int
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