Understanding Smart Sensors - Nomads.usp

Index 377definitions, 119–20introduction to, 119multidrop, 120, 122point-to-point, 120, 122wireless, 179–82See also ProtocolsComplementary metal oxide semiconductor(CMOS), 8, 72advantages, 77–78aluminum interconnects, 40amplifiers, 76BiCMOS, 72, 73, 176circuitry, 13foundries, 38high-density (HCMOS), 8modular process, 39–40process, 39SAW-stabilized receivers, 196for signal conditioning sensors, 77surface micromachining compatibility, 18Complex instruction set computing(CISC), 165combined with RISC and DSP, 167–68MCUs, 166RISC vs., 165–66transistor allocation, 166Contention, 120Controladaptive, 161–63closed-loop system, 150, 151, 152derivative, 152DSP, 104–7fuzzy logic, 155–57integral, 151introduction to, 149–54neural networks, 157–60open-loop system, 150, 151, 152particulate, 30PID, 149, 150–54PWM, 108–9summary, 169techniques, 149–69vehicle systems, 151Controllers, 6–7ADC as element of, 71DLC, 120generic system illustration, 7PLC, 149, 150Cooling channels, 211–12defined, 211–12microheat pipe, 212patent, 212Current sensing, 256, 257Customer-specified integrated circuits(CSICs), 103–4ASICs vs., 103nonrecurring engineering costs and, 104Data link controller (DLC), 120Demodulators, phase-sensitive, 72Diagnostics, 256–61fault, 258, 259–60MCU, 111OBDII, 259remote, 302–3Diamond, 40as alternative sensor material, 41film flow sensor illustration, 41Diaphragmsarea, increased, 67–68die percentage, 84thin, 67Differential phase shift keying (DPSK), 179Differential quadrature shift keying(DQSK), 179Diffused MOS (DMOS), 251Digital output sensors, 62–65defined, 62–63digital techniques, 64–65EOB sensors, 65incremental optical encoders, 63–64SAD converters, 65SAW delay line oscillators, 64Digital signal processors (DSPs), 116-bit, 10524-bit, 105, 107algorithms, 106–7combined with CISC and RISC, 167–68control, 104–7design kit, 106features, 105hardware arithmetic capability, 104for increasing sensor IQ, 93–116instruction execution, 104MCU architecture vs., 106technology, 105