Understanding Smart Sensors - Nomads.usp

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10 Understanding Smart SensorsLevel IDiscretedevicesLevel IIBasicintegrationLevel IIIMixingtechnologiesLevel IVSelectiveintegrationLevel VFullintegrationBipolarsensorDiscretesensorinterfaceBipolarsensorIntegratedsensor interfaceMultichipsensorcontrollerMOS compatiblesensorHCMOSMCUHCMOSMCU“Smart”sensorFullyintegratedsensorsystemMOSdriverMOSdriverMCU+ LDMOS+ interfaceSMARTMOS driversMCU +high currenthigh voltagedriversFigure 1.7 Sensor technology migration path.Table 1.3Terms Used to Identify New Smart-Sensor ApplicationsMeasureMonitorCorrectDetectSafe operating areaCommunicatePrevent failureWarningRegulateObserveDetermineUnderstandDiagnoseControlPresence/absenceExceed levelIdentifyMaintainInstrumentGaugeKnowSee/hear/touch/smell/tasteHow/what/where/when/whyWhen sensors are combined with an MCU, a DSP, or an ASIC, the capabilityto obtain additional performance improvements is limited only by the
Smart Sensor Basics 11capability of the computing element and the imagination of the designer.Chapters 5, 6, and 7 explain and develop some of those possibilities. In additionto signal transmission in distributed control systems through a variety ofprotocols described in Chapter 6, the possibilities of portable, wireless, andremote sensing are explored in Chapter 8. A broad variety of micromechanicalelements and additional system components are investigated in Chapter 9.Among the challenges and limiting factors to higher levels of integration arepackaging, testing, and reliability. Chapter 10 reveals the progress being madein these areas for production sensors. However, packaging, testing, and reliabilityare some of the formidable challenges that must be addressed for smart sensors.The combination of the previously discussed aspects is already beingresearched, as discussed in Chapter 11, with the addition of the system outputand sensing systems.Chapter 12 presents what could be the milestone in the future for theturning point in the evolution of smart sensors. The availability and acceptanceof standards can accelerate the development and use of smart sensors.Chapter 13 provides some examples and explores the implications of standardsthat affect sensing. Finally, based on the system-level complexity already possibleand continuously evolving, a look into the not-too-distant future of smartsensing is shared in Chapter 14.1.4 Integration of Micromachining and MicroelectronicsIncreasing the performance and reliability and reducing the cost of electroniccircuits through increased integration are standard expectations for semiconductortechnology. In the area of semiconductor sensors, however, that integrationhas been limited to Hall-effect and optoelectronic devices. The recentcombination of micromechanical structures, sensing elements, and signal conditioningis the beginning of a new chapter in sensor technology. The combinationof microelectronics with micromechanical structures promises to changefuture control systems and enable entirely new applications that previouslywere too costly for commercial purposes. The term microelectromechanical systems,or sometimes simply microsystems, is used to describe the structures andfunctions provided by micromachining and the addition of microelectronics tothose structures.A sensor with its own dedicated interface circuitry has several advantages.The sensor designer can trade off unnecessary performance characteristics forthose that will provide desirable performance advantages to the sensor-interfacecombination. Normally, interface ICs are designed for a broad range of applicationsand such tradeoffs are not possible. The combination allows the sensor
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The Nature of Semiconductor Sensor
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4Getting Sensor Information Into th
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5Using MCUs/DSPs to Increase Sensor
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6Communications for Smart SensorsBe
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7Control TechniquesA machine is int
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Control Techniques 151Table 7.1Type
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Control Techniques 153otherwise tak
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Control Techniques 155consisting of
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Control Techniques 157Supplied byap
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Control Techniques 159InputX1Synaps
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Control Techniques 1617.6 Adaptive
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Control Techniques 163ObserverHB−
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Control Techniques 165linear-vector
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Control Techniques 1677.7.2 Combine
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Control Techniques 169Domain-type s
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Control Techniques 171[19] De Silva
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8Transceivers, Transponders, andTel
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Transceivers, Transponders, and Tel
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9MEMS Beyond Sensors“And these ot
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MEMS Beyond Sensors 203would not ex
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MEMS Beyond Sensors 205PyrexSilicon
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MEMS Beyond Sensors 207(a)IFluxIIMa
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MEMS Beyond Sensors 209InletThermop
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MEMS Beyond Sensors 211Figure 9.8 A
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MEMS Beyond Sensors 2139.3.2 Microo
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MEMS Beyond Sensors 215Over-range p
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MEMS Beyond Sensors 217+ 10°− 10
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MEMS Beyond Sensors 219achieved wit
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MEMS Beyond Sensors 221Methods for
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MEMS Beyond Sensors 223Figure 9.19
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MEMS Beyond Sensors 225[21] Tortone
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10Packaging, Testing, and Reliabili
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Packaging, Testing, and Reliability
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11Mechatronics and Sensing SystemsP
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12Standards for Smart SensingThe la
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Standards for Smart Sensing 275Netw
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Standards for Smart Sensing 2911 0
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Standards for Smart Sensing 293obje
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Standards for Smart Sensing 295Mult
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13The Implications of Smart SensorS
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14The Next Phase of Sensing Systems
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The Next Phase of Sensing Systems 3
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List of Acronyms and Abbreviations3
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List of Acronyms and Abbreviations
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Glossaryablationvaporization of mat
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Glossary 353buscalibrationconnectio
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Glossary 355end point straight line
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Glossary 357data transmission and p
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Glossary 359multiplexer device that
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Glossary 361repeatability the maxim
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Glossary 363spread spectrum techniq
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Glossary 365transducer a device con
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Selected BibliographyBooks and Jour
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Selected Bibliography 369Northeaste
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Selected Bibliography 371Miscellane
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About the AuthorRandy Frank is a te
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Index4-to 20-mA signal transmitter,
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Index 377definitions, 119-20introdu
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Index 379HVAC, 318-19MCU with integ
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Index 381Linearization, 108Linear p
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Index 383in chemical measurements,
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Index 385Ratiometricity, 56Reactive
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Index 387IC fabrication, 19micromec
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Index 389Transducer-independent int
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