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Understanding Smart Sensors - Nomads.usp

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246 <strong>Understanding</strong> <strong>Smart</strong> <strong>Sensors</strong>techniques that are unique to smart sensors most likely will be developed tomeet future requirements.References[1] Vaganov, V., H. Joseph, and S. Terry, “Matching Customer Application RequirementsWith Cost Effective Sensor Packaging and Testing,” Proc. <strong>Sensors</strong> Expo, Boston, May13–15, 1997, pp. 181–189.[2] Van Zant, P. Microchip Fabrication, New York: McGraw-Hill, 1990.[3] Benson, A. F., “Count on Conformal Coatings,” Assembly Engineering, June 1990, pp.20–23.[4] Frank, R., and J. Staller, “The Merging of Micromachining and Microelectronics,” Proc.Third Internat’l Forum on ASIC and Transducer Technology, Banff, Alberta, Canada, May20–23, 1990, pp. 53–60.[5] Ristic, L. J., Sensor Technology and Devices, Norwood, MA: Artech House, 1994.[6] Blood, W. R., and J. S. Carey, “Practical Manufacturing of MCMs,” Surface Mount Technology,Nov. 1992, pp. 16–22.[7] Czarnocki, W. S., and J. P. Schuster, “Robust, Modular, Integrated Pressure Sensor,” Sensor95 Internat’l Conference on <strong>Sensors</strong>, Transducers, and Systems, Nuremburg, Germany,May 1995.[8] Chin, S., “Ball Grid Array Package Challenges Quad Flatpack,” Electronic Products, Apr.1993, pp. 19–20.[9] Oncore Ad, Automotive Industries, Oct. 1994, p. 71.[10] Babyak, R. J., “Electronics,” Appliance Manufacturer, May 1994, pp. 95–99.[11] Markus, K. W., V. Dhuler, and A. Cowen, “<strong>Smart</strong> MEMS: Flip Chip Integration ofMEMS and Electronics,” Proc. <strong>Sensors</strong> Expo, Cleveland, Sept. 20–22, 1994, pp. 559–564.[12] Linear/Interface ICs Device Data Book, Vol. II, DL128/D Rev. 4, Motorola SemiconductorProducts Sector, Phoenix, 1994.[13] Hill, G., J. Clementi, and J. Palomaki, “Epoxy Encapsulation Improves Flip Chip Bonding,”Electronic Packaging and Production, Aug. 1993, pp. 46–49.[14] Maudie, T., and B. Tucker, “Reliability Issues for Silicon Pressure <strong>Sensors</strong>,” Proc. <strong>Sensors</strong>Expo ’91, Chicago, Oct. 1–3, 1991, pp. 101-1 to 101-8.[15] Frank, R., and T. Maudie, “Surviving the Automotive Environment,” Electronic EngineeringTimes 1995 Systems Design Guide, Special Issue, 1995.[16] Maudie, T., D. J. Monk, and R. Frank, “Packaging Considerations for Predictable Lifetime<strong>Sensors</strong>,” Proc. <strong>Sensors</strong> Expo, Boston, May 13–15, 1997, pp. 167–172.

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