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Understanding Smart Sensors - Nomads.usp

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xiv<strong>Understanding</strong> <strong>Smart</strong> <strong>Sensors</strong>9.3.8 Field Emission Displays 2199.3.9 Unfoldable Microelements 2199.3.10 Micronozzles 2219.3.11 Interconnects for Stacked Wafers 2229.3.12 Nanoguitar 2229.4 Summary 223References 22310 Packaging, Testing, and ReliabilityImplications of <strong>Smart</strong>er <strong>Sensors</strong> 22710.1 Introduction 22710.2 Semiconductor Packaging Applied to <strong>Sensors</strong> 22810.2.1 Increased Pin Count 23110.3 Hybrid Packaging 23110.3.1 Ceramic Packaging and Ceramic Substrates 23210.3.2 Multichip Modules 23210.3.3 Dual-Chip Packaging 23310.3.4 Ball Grid Array Packaging 23410.4 Packaging for Monolithic <strong>Sensors</strong> 23510.4.1 Plastic Packaging 23610.4.2 Surface-Mount Packaging 23610.4.3 Flip-Chip 23710.4.4 Wafer-Level Packaging 23810.5 Reliability Implications 23910.5.1 The Physics of Failure 24210.5.2 Wafer-Level Sensor Reliability 24310.6 Testing <strong>Smart</strong>er <strong>Sensors</strong> 24410.7 Summary 245References 24611 Mechatronics and Sensing Systems 24911.1 Introduction 249

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