Understanding Smart Sensors - Nomads.usp

More documents

Recommendations

Info

96 Understanding Smart SensorsPowerGroundV ddV ssAddressProgrammemoryDatamemoryData busDigital inputsBusI/O andperipheralsDigitaloutputResetCentral processing unit(CPU)CrystalOscillatorandclockingFigure 5.2 Basic MCU block diagram.5.3 MCUs for Sensor InterfaceIn addition to the basic features of an MCU, a number of custom modules areintegrated on the same chip to increase the utilization of the process, reduceprinted circuit board space, and increase the functionality for a specific application.This section discusses MCU features that have a significant effect on sensorsystem performance. These include analog input capabilities, A/Dconversion techniques, processing bandwidth, electronically programmabletrim, onboard memory, power conservation, and improved electromagneticcompatibility (EMC) and control of radio frequency interference (RFI). Forpurposes of discussion here, the MC68HC05 family of 8-bit MCUs is used toexplain the various MCU features. The same features, possibly with differentspecifications, perform similarly on other families of MCUs and higher performance16-bit and 32-bit products as well.5.3.1 PeripheralsExisting MCU technology contains a variety of peripherals, or hardwareoptions, that enhance the capability of the MCU. Peripherals enable the MCU
Using MCUs/DSPs to Increase Sensor IQ 97to obtain information from sensors and control output devices. Some ofthe most common peripherals are general-purpose I/O ports, timers, and serialports.Timers usually measure time relative to the internal clock on the chip oran externally provided clock signal. An on-chip oscillator that operates up to4.0 MHz at 5V or 1 MHz at 3V controls the clock on the chip. A more complextimer can generate one or more PWM signals, measure the pulse width,and generate additional output pulse trains.Two basic serial ports are the serial communications interface (SCI) andthe serial peripheral interface (SPI). The SCI is a simple two-pin interface thatoperates asynchronously. Data is transmitted from one pin and received on theother. Start and stop bits synchronize communications between two devices.The SCI port is a universal asynchronous receiver transmitter (UART) that canbe used with an RS-232 level translator to communicate with personal or othertypes of computers over fairly long distances.The SPI port requires a third pin to provide the synchronizing signalbetween the control chip and an external peripheral. This type of communicationis usually on the same board. Standard SPI peripherals are available frommany manufacturers and include ADCs, display drivers, EEPROM, and shiftregisters.5.3.2 MemoryVarious types of memory can be integrated on a chip, including RAM, readonly memory (ROM), EPROM, EEPROM, and flash memory. Semiconductormemory is based on a single transistor or cell that is on or off to generate abit that is eithera1ora0.Memory is classified as either volatile or nonvolatile.Volatile memory is not stored when the power is disconnected to the MCU.Nonvolatile (NV) memory is stored when power is disconnected. The amountof memory in a chip is usually rated in kilobytes (1 KB = 1,024 bits). Increasingthe amount of memory increases the chip size and the chip cost. Some types ofmemory, such as EEPROM, can significantly increase the process complexityand also add to the cost.RAM can be read or written (changed) by the CPU and is volatile [3].The write/read (W/R) endurance is a key parameter for RAM. Dynamic RAMrequires a frequent refresh signal or the data will be lost. Static RAM does notrequire a refresh signal. ROM, which can be read but not changed, is nonvolatilememory and is included in the design (masked layout) of the chip. Reprogramminga chip once it has been designed is a common practice to correcterrors in the original software, to upgrade to improve system performance, or toadjust for variation that could have occurred since the system was initially
Page 2 and 3:
Understanding Smart SensorsSecond E
Page 5:
Library of Congress Cataloging-in-P
Page 8 and 9:
ContentsPrefacexix1 Smart Sensor Ba
Page 10 and 11:
Contentsix3.3.3 Hall Effect 603.3.4
Page 12 and 13:
Contentsxi5.8 Summary 116References
Page 14 and 15:
Contentsxiii8.3.1 Surface Acoustica
Page 16 and 17:
Contentsxv11.1.1 Integration and Me
Page 18 and 19:
Contentsxvii14.4.4 Electrostatic Me
Page 20 and 21:
PrefaceThe number one challenge fac
Page 22 and 23:
Prefacexxifor well over 6 years. A
Page 24 and 25:
2 Understanding Smart Sensorsobserv
Page 26 and 27:
4 Understanding Smart Sensorssmart
Page 28 and 29:
6 Understanding Smart Sensorsto pro
Page 30 and 31:
8 Understanding Smart Sensorsinclud
Page 32 and 33:
10 Understanding Smart SensorsLevel
Page 34 and 35:
12 Understanding Smart Sensorsuser
Page 36 and 37:
14 Understanding Smart Sensorstechn
Page 38 and 39:
16 Understanding Smart Sensorschang
Page 40 and 41:
18 Understanding Smart Sensorstechn
Page 42 and 43:
20 Understanding Smart Sensors Surf
Page 44 and 45:
22 Understanding Smart Sensorssecon
Page 46 and 47:
24 Understanding Smart SensorsSilic
Page 48 and 49:
26 Understanding Smart SensorsSilic
Page 50 and 51:
28 Understanding Smart SensorsSacri
Page 52 and 53:
30 Understanding Smart Sensors2.4.3
Page 54 and 55:
32 Understanding Smart Sensorsmeasu
Page 56 and 57:
34 Understanding Smart SensorsIon+S
Page 58 and 59:
36 Understanding Smart Sensorssidew
Page 60 and 61:
38 Understanding Smart SensorsTable
Page 62 and 63:
40 Understanding Smart Sensorsoptim
Page 64 and 65:
42 Understanding Smart SensorsAlumi
Page 66 and 67:
44 Understanding Smart SensorsThe f
Page 68 and 69: 46 Understanding Smart Sensors[21]
Page 70: This Page Intentionally Left Blank
Page 73 and 74: The Nature of Semiconductor Sensor
Page 93 and 94: 4Getting Sensor Information Into th
Page 95 and 96: Getting Sensor Information Into the
Page 115 and 116: 5Using MCUs/DSPs to Increase Sensor
Page 117: Using MCUs/DSPs to Increase Sensor
Page 121 and 122: Using MCUs/DSPs to Increase Sensor
Page 141 and 142: 6Communications for Smart SensorsBe
Page 143 and 144: Communications for Smart Sensors 12
Page 169 and 170:
Communications for Smart Sensors 14
Page 171 and 172:
7Control TechniquesA machine is int
Page 173 and 174:
Control Techniques 151Table 7.1Type
Page 175 and 176:
Control Techniques 153otherwise tak
Page 177 and 178:
Control Techniques 155consisting of
Page 179 and 180:
Control Techniques 157Supplied byap
Page 181 and 182:
Control Techniques 159InputX1Synaps
Page 183 and 184:
Control Techniques 1617.6 Adaptive
Page 185 and 186:
Control Techniques 163ObserverHB−
Page 187 and 188:
Control Techniques 165linear-vector
Page 189 and 190:
Control Techniques 1677.7.2 Combine
Page 191 and 192:
Control Techniques 169Domain-type s
Page 193 and 194:
Control Techniques 171[19] De Silva
Page 195 and 196:
8Transceivers, Transponders, andTel
Page 197 and 198:
Transceivers, Transponders, and Tel
Page 199 and 200:
Page 201 and 202:
Page 203 and 204:
Page 205 and 206:
Page 207 and 208:
Page 209 and 210:
Page 211 and 212:
Page 213 and 214:
Page 215 and 216:
Page 217 and 218:
Page 219 and 220:
Page 221 and 222:
Page 223 and 224:
9MEMS Beyond Sensors“And these ot
Page 225 and 226:
MEMS Beyond Sensors 203would not ex
Page 227 and 228:
MEMS Beyond Sensors 205PyrexSilicon
Page 229 and 230:
MEMS Beyond Sensors 207(a)IFluxIIMa
Page 231 and 232:
MEMS Beyond Sensors 209InletThermop
Page 233 and 234:
MEMS Beyond Sensors 211Figure 9.8 A
Page 235 and 236:
MEMS Beyond Sensors 2139.3.2 Microo
Page 237 and 238:
MEMS Beyond Sensors 215Over-range p
Page 239 and 240:
MEMS Beyond Sensors 217+ 10°− 10
Page 241 and 242:
MEMS Beyond Sensors 219achieved wit
Page 243 and 244:
MEMS Beyond Sensors 221Methods for
Page 245 and 246:
MEMS Beyond Sensors 223Figure 9.19
Page 247 and 248:
MEMS Beyond Sensors 225[21] Tortone
Page 249 and 250:
10Packaging, Testing, and Reliabili
Page 251 and 252:
Packaging, Testing, and Reliability
Page 253 and 254:
Page 255 and 256:
Page 257 and 258:
Page 259 and 260:
Page 261 and 262:
Page 263 and 264:
Page 265 and 266:
Page 267 and 268:
Page 269 and 270:
Page 271 and 272:
11Mechatronics and Sensing SystemsP
Page 273 and 274:
Mechatronics and Sensing Systems 25
Page 275 and 276:
Page 277 and 278:
Page 279 and 280:
Page 281 and 282:
Page 283 and 284:
Page 285 and 286:
Page 287 and 288:
Page 289 and 290:
Page 291 and 292:
Page 293 and 294:
Page 295 and 296:
12Standards for Smart SensingThe la
Page 297 and 298:
Standards for Smart Sensing 275Netw
Page 299 and 300:
Standards for Smart Sensing 277NCAP
Page 301 and 302:
Standards for Smart Sensing 279Proc
Page 303 and 304:
Standards for Smart Sensing 281PID
Page 305 and 306:
Standards for Smart Sensing 283•
Page 307 and 308:
Standards for Smart Sensing 285•
Page 309 and 310:
Standards for Smart Sensing 287Tabl
Page 311 and 312:
Standards for Smart Sensing 289perf
Page 313 and 314:
Standards for Smart Sensing 2911 0
Page 315 and 316:
Standards for Smart Sensing 293obje
Page 317 and 318:
Standards for Smart Sensing 295Mult
Page 319 and 320:
13The Implications of Smart SensorS
Page 321 and 322:
The Implications of Smart Sensor St
Page 323 and 324:
Page 325 and 326:
Page 327 and 328:
Page 329 and 330:
Page 331 and 332:
Page 333 and 334:
14The Next Phase of Sensing Systems
Page 335 and 336:
The Next Phase of Sensing Systems 3
Page 337 and 338:
Page 339 and 340:
Page 341 and 342:
Page 343 and 344:
Page 345 and 346:
Page 347 and 348:
Page 349 and 350:
Page 351 and 352:
Page 353 and 354:
Page 355 and 356:
List of Acronyms and Abbreviations3
Page 357 and 358:
List of Acronyms and Abbreviations
Page 359 and 360:
Page 361 and 362:
Page 363 and 364:
Page 365 and 366:
Page 367 and 368:
Page 369 and 370:
Page 371 and 372:
Page 373 and 374:
Glossaryablationvaporization of mat
Page 375 and 376:
Glossary 353buscalibrationconnectio
Page 377 and 378:
Glossary 355end point straight line
Page 379 and 380:
Glossary 357data transmission and p
Page 381 and 382:
Glossary 359multiplexer device that
Page 383 and 384:
Glossary 361repeatability the maxim
Page 385 and 386:
Glossary 363spread spectrum techniq
Page 387 and 388:
Glossary 365transducer a device con
Page 389 and 390:
Selected BibliographyBooks and Jour
Page 391 and 392:
Selected Bibliography 369Northeaste
Page 393 and 394:
Selected Bibliography 371Miscellane
Page 395 and 396:
About the AuthorRandy Frank is a te
Page 397 and 398:
Index4-to 20-mA signal transmitter,
Page 399 and 400:
Index 377definitions, 119-20introdu
Page 401 and 402:
Index 379HVAC, 318-19MCU with integ
Page 403 and 404:
Index 381Linearization, 108Linear p
Page 405 and 406:
Index 383in chemical measurements,
Page 407 and 408:
Index 385Ratiometricity, 56Reactive
Page 409 and 410:
Index 387IC fabrication, 19micromec
Page 411:
Index 389Transducer-independent int
show all

Understanding Smart Sensors - Nomads.usp

Create successful ePaper yourself

Delete template?

Save as template?