<strong>NXP</strong> <strong>Semiconductors</strong><strong>BLF878</strong><strong>UHF</strong> <strong>power</strong> <strong>LDMOS</strong> <strong>transistor</strong>10. AbbreviationsTable 10.AcronymCWCCDFDVBDVB-TESDIMD3<strong>LDMOS</strong><strong>LDMOS</strong>TOFDMPALPARPEPRFTTF<strong>UHF</strong>VSWRAbbreviationsDescriptionContinuous WaveComplementary Cumulative Distribution FunctionDigital Video BroadcastDigital Video Broadcast - TerrestrialElectroStatic DischargeThird order InterModulation DistortionLaterally Diffused Metal-Oxide SemiconductorLaterally Diffused Metal-Oxide Semiconductor TransistorOrthogonal Frequency Division MultiplexingPhase Alternating LinePeak-to-Average <strong>power</strong> RatioPeak Envelope PowerRadio FrequencyTime To FailureUltra High FrequencyVoltage Standing-Wave Ratio11. Revision historyTable 11. Revision historyDocument ID Release date Data sheet status Change notice Supersedes<strong>BLF878</strong>_2 20090615 Product data sheet - <strong>BLF878</strong>_1Modifications: • Table 4 on page 3: changed maximum value of V GS .• Table 6 on page 3: changed several values.• Table 7 on page 4: removed PAR specification.<strong>BLF878</strong>_1 20081215 Preliminary data sheet - -<strong>BLF878</strong>_2© <strong>NXP</strong> B.V. 2009. All rights reserved.Product data sheet Rev. 02 — 15 June 2009 16 of 18
<strong>NXP</strong> <strong>Semiconductors</strong><strong>BLF878</strong><strong>UHF</strong> <strong>power</strong> <strong>LDMOS</strong> <strong>transistor</strong>12. Legal information12.1 Data sheet statusDocument status [1][2] Product status [3] DefinitionObjective [short] data sheet Development This document contains data from the objective specification for product development.Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.Product [short] data sheet Production This document contains the product specification.[1] Please consult the most recently issued document before initiating or completing a design.[2] The term ‘short data sheet’ is explained in section “Definitions”.[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product statusinformation is available on the Internet at URL http://www.nxp.com.12.2 DefinitionsDraft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. <strong>NXP</strong> <strong>Semiconductors</strong> does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequences ofuse of such information.Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet is intendedfor quick reference only and should not be relied upon to contain detailed andfull information. For detailed and full information see the relevant full datasheet, which is available on request via the local <strong>NXP</strong> <strong>Semiconductors</strong> salesoffice. In case of any inconsistency or conflict with the short data sheet, thefull data sheet shall prevail.12.3 DisclaimersGeneral — Information in this document is believed to be accurate andreliable. However, <strong>NXP</strong> <strong>Semiconductors</strong> does not give any representations orwarranties, expressed or implied, as to the accuracy or completeness of suchinformation and shall have no liability for the consequences of use of suchinformation.Right to make changes — <strong>NXP</strong> <strong>Semiconductors</strong> reserves the right to makechanges to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.Suitability for use — <strong>NXP</strong> <strong>Semiconductors</strong> products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure ormalfunction of an <strong>NXP</strong> <strong>Semiconductors</strong> product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. <strong>NXP</strong> <strong>Semiconductors</strong> accepts no liability for inclusion and/or use of<strong>NXP</strong> <strong>Semiconductors</strong> products in such equipment or applications andtherefore such inclusion and/or use is at the customer’s own risk.Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. <strong>NXP</strong> <strong>Semiconductors</strong> makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) may cause permanentdamage to the device. Limiting values are stress ratings only and operation ofthe device at these or any other conditions above those given in theCharacteristics sections of this document is not implied. Exposure to limitingvalues for extended periods may affect device reliability.Terms and conditions of sale — <strong>NXP</strong> <strong>Semiconductors</strong> products are soldsubject to the general terms and conditions of commercial sale, as publishedat http://www.nxp.com/profile/terms, including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unlessexplicitly otherwise agreed to in writing by <strong>NXP</strong> <strong>Semiconductors</strong>. In case ofany inconsistency or conflict between information in this document and suchterms and conditions, the latter will prevail.No offer to sell or license — Nothing in this document may be interpretedor construed as an offer to sell products that is open for acceptance or thegrant, conveyance or implication of any license under any copyrights, patentsor other industrial or intellectual property rights.Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from national authorities.12.4 TrademarksNotice: All referenced brands, product names, service names and trademarksare the property of their respective owners.13. Contact informationFor more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: salesaddresses@nxp.com<strong>BLF878</strong>_2© <strong>NXP</strong> B.V. 2009. All rights reserved.Product data sheet Rev. 02 — 15 June 2009 17 of 18
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