BLF878 UHF power LDMOS transistor - NXP Semiconductors

NXP SemiconductorsBLF878UHF power LDMOS transistor8. Test informationTable 9. List of componentsFor test circuit, see Figure 14, Figure 15 and Figure 16.Component Description Value RemarksB1, B2 semi rigid coax 25 Ω; 43.5 mm EZ90-25-TPC1, C2 multilayer ceramic chip capacitor 8.2 pF[1]C3, C9 multilayer ceramic chip capacitor 3.9 pF[2]C4 multilayer ceramic chip capacitor 2.7 pF[2]C5, C7, C8 multilayer ceramic chip capacitor 6.8 pF[1]C6 multilayer ceramic chip capacitor 2.2 pF[2]C10 multilayer ceramic chip capacitor 47 pF[2]C11, C12 multilayer ceramic chip capacitor 100 pF[1]C13, C14 multilayer ceramic chip capacitor 100 pF[2]C15, C16 multilayer ceramic chip capacitor 10 µF TDK C570X7R1H106KT000N orcapacitor of same quality.C17, C18 electrolytic capacitor 470 µF; 63 VC20 multilayer ceramic chip capacitor 15 pF[3]C21 trimmer 0.6 pF to 4.5 pF TekelecC22 multilayer ceramic chip capacitor 11 pF[3]C23 multilayer ceramic chip capacitor 3.9 pF[3]C24 multilayer ceramic chip capacitor 4.7 pF[3]C25, C26, C27 multilayer ceramic chip capacitor 100 pF[3]C28, C29 multilayer ceramic chip capacitor 560 pF[2]C30, C31 electrolytic capacitor 10 µFL1 stripline -[4](W × L) 24 mm × 13 mmL2 stripline -[4](W × L) 15 mm × 24.5 mmL3 stripline -[4](W × L) 5 mm × 21 mmL4 stripline -[4](W × L) 2.4 mm × 6mmL5, L23 stripline -[4](W × L) 2 mm × 43.5 mmL6 stripline -[4](W × L) 2 mm × 4.5 mmL7 stripline -[4](W × L) 5.5 mm × 24 mmL20 stripline -[4] (W × L) 15 mm × 5mmL21 stripline -[4] (W × L) 3 mm × 39 mmL22 stripline -[4] (W × L) 2.4 mm × 5.7 mmR1, R2 resistor 5.6 Ω long wiresR3, R4 potentiometer 10 kΩR5, R6 resistor 10 kΩR7, R8 resistor 1 kΩ[1] American technical ceramics type 180R or capacitor of same quality.[2] American technical ceramics type 100B or capacitor of same quality.[3] American technical ceramics type 100A or capacitor of same quality.[4] Printed-Circuit Board (PCB): Rogers 5880; ε r = 2.2 F/m; height = 0.79 mm; Cu (top/bottom metallization);thickness copper plating = 35 µm.BLF878_2© NXP B.V. 2009. All rights reserved.Product data sheet Rev. 02 — 15 June 2009 12 of 18