Micron

8MbSMART 3 BOOT BLOCK FLASH MEMORYCAPACITANCE(T A = 25ºC; f = 1 MHz)PARAMETER/CONDITION SYMBOL MAX UNITS NOTESInput Capacitance CI 9 pFOutput Capacitance CO 12 pFREAD AND STANDBY CURRENT DRAIN 1Commercial Temperature (0ºC ≤ T A ≤ +70ºC) and Extended Temperature (-40ºC ≤ T A ≤ +85ºC)PARAMETER/CONDITION SYMBOL MAX UNITS NOTESREAD CURRENT: WORD-WIDE(CE# ≤ 0.2V; OE# VCC - 0.2V; f = 5 MHz; ICC1 15 mA 2, 3Other inputs ≤ 0.2V or VCC - 0.2V; RP# VCC - 0.2V)READ CURRENT: BYTE-WIDE(CE# ≤ 0.2V; OE# VCC - 0.2V; f = 5 MHz; ICC2 15 mA 2, 3Other inputs ≤ 0.2V or VCC - 0.2V; RP# = VCC - 0.2V)STANDBY CURRENT: TTL INPUT LEVELSVCC power supply standby current ICC3 2 mA(CE# = RP# = VIH; Other inputs = VIL or VIH)STANDBY CURRENT: CMOS INPUT LEVELSVCC power supply standby current ICC4 100 µA(CE# = RP# = VCC - 0.2V)DEEP POWER-DOWN CURRENT: VCC SUPPLY ICC6 8 µA(RP# = VSS ±0.2V)STANDBY OR READ CURRENT: VPP SUPPLY IPP1 ±15 µA(VPP ≤ 5.5V)DEEP POWER-DOWN CURRENT: VPP SUPPLY IPP2 5 µA(RP# = VSS ±0.2V)NOTE:1. VCC = MAX VCC during ICC tests.2. ICC is dependent on cycle rates.3. ICC is dependent on output loading. Specified values are obtained with the outputs open.8Mb Smart 3 Boot Block Flash MemoryQ10_3.p65 – Rev. 3, Pub. 10/0119Micron Technology, Inc., reserves the right to change products or specifications without notice.©2001, Micron Technology, Inc.