High Power Impulse Magnetron Sputtering (HiPIMS)
High Power Impulse Magnetron Sputtering (HiPIMS)
High Power Impulse Magnetron Sputtering (HiPIMS)
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<strong>High</strong> <strong>Power</strong> <strong>Impulse</strong> <strong>Magnetron</strong> <strong>Sputtering</strong> (<strong>HiPIMS</strong>)Planar <strong>Magnetron</strong> <strong>Sputtering</strong> DischargeMagnetsGroundedshieldSNS−I dcV dc+s R CathodeSubstrateAnodeLFor a typical dc planar magnetron dischargepressure of 1 – 10 mTorra magnetic field strength of 0.01 – 0.05 Tcathode potentials 300 – 700 Vaverage power 200 – 600 Welectron density in the substrate vicinity is 10 15 − 10 17 m −3low fraction of the sputtered material is ionized ∼ 1 %the majority of ions are the ions of the inert gasthe sputtered vapor is mainly neutral
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