High Power Impulse Magnetron Sputtering (HiPIMS)
High Power Impulse Magnetron Sputtering (HiPIMS)
High Power Impulse Magnetron Sputtering (HiPIMS)
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<strong>High</strong> <strong>Power</strong> <strong>Impulse</strong> <strong>Magnetron</strong> <strong>Sputtering</strong> (<strong>HiPIMS</strong>)<strong>HiPIMS</strong> - Deposition rateSeveral groups report on a significantly lowerdeposition rate for <strong>HiPIMS</strong> as compared todcMSa factor of 2 lower deposition rate for Cu andTi thin films(Bugaev et al., 1996) XVIIth Symp. Disc. Elec. Ins. Vac., p. 1074a factor of 3 – 7 lower deposition rate forreactive sputtering of TiO 2 from a Ti targetand AlO x from an Al targetDavis et al. (2004) 47th SVC, p. 215, Sproul et al. (2004) 47th SVC, p. 96the reduction in deposition rate decreaseswith decreased magnetic confinement(weaker magnetic field) Bugaev et al. (1996)a detailed study of various target materialsconfirms a consistently lower deposition rateSamuelsson et al. (2010) SCT 202 591From Samuelsson et al. (2010)
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