High Power Impulse Magnetron Sputtering (HiPIMS)
High Power Impulse Magnetron Sputtering (HiPIMS) High Power Impulse Magnetron Sputtering (HiPIMS)
High Power Impulse Magnetron Sputtering (HiPIMS)HiPIMS - Ionization fractionThere have been conflicting reports onthe fraction of ionized metal flux70 % for Cu Kouznetsov et al. (1999) SCT 122 29056 % for Cu Vlček et al. (2007a) JVSTA 25 4299 % for Ti Kudláček et al. (2008) PSST 17 02501040 % for Ti 0.5 Al 0.5 Macák et al. (2000) JVSTA 18 15339.5 % for Al DeKoven et al. (2003) 46th SVC p. 1584.5 % for C DeKoven et al. (2003) 46th SVC p. 158The degree of ionization90 % for Ti Bohlmark et al. (2005) JVSTA 23 18The fraction of ionized metal fluxdepends on applied power, pulsefrequency and pulse length, and distancefrom the targetFrom Bohlmark et al. (2005)
High Power Impulse Magnetron Sputtering (HiPIMS)HiPIMS - Ionization fractionThe ion flux versus timemeasured by a massspectrometer (20 µswindows)The gas pressure was 3mTorr, pulse energy 8 Jand the target made of TiHighly metallic ion fluxduring the active phase ofthe dischargeFrom Bohlmark et al. (2006) TSF 515 1522
- Page 1 and 2: High Power Impulse Magnetron Sputte
- Page 3 and 4: High Power Impulse Magnetron Sputte
- Page 5 and 6: High Power Impulse Magnetron Sputte
- Page 7 and 8: High Power Impulse Magnetron Sputte
- Page 9 and 10: High Power Impulse Magnetron Sputte
- Page 11 and 12: High Power Impulse Magnetron Sputte
- Page 13 and 14: High Power Impulse Magnetron Sputte
- Page 15 and 16: High Power Impulse Magnetron Sputte
- Page 17 and 18: High Power Impulse Magnetron Sputte
- Page 19 and 20: High Power Impulse Magnetron Sputte
- Page 21 and 22: High Power Impulse Magnetron Sputte
- Page 23 and 24: High Power Impulse Magnetron Sputte
- Page 25 and 26: High Power Impulse Magnetron Sputte
- Page 27 and 28: High Power Impulse Magnetron Sputte
- Page 29 and 30: High Power Impulse Magnetron Sputte
- Page 31 and 32: High Power Impulse Magnetron Sputte
- Page 33 and 34: High Power Impulse Magnetron Sputte
- Page 35 and 36: High Power Impulse Magnetron Sputte
- Page 37: High Power Impulse Magnetron Sputte
- Page 41 and 42: High Power Impulse Magnetron Sputte
- Page 43 and 44: High Power Impulse Magnetron Sputte
- Page 45 and 46: High Power Impulse Magnetron Sputte
- Page 47 and 48: High Power Impulse Magnetron Sputte
- Page 49 and 50: High Power Impulse Magnetron Sputte
- Page 51 and 52: High Power Impulse Magnetron Sputte
- Page 53 and 54: High Power Impulse Magnetron Sputte
- Page 55 and 56: High Power Impulse Magnetron Sputte
- Page 57 and 58: High Power Impulse Magnetron Sputte
- Page 59 and 60: High Power Impulse Magnetron Sputte
- Page 61 and 62: High Power Impulse Magnetron Sputte
- Page 63 and 64: High Power Impulse Magnetron Sputte
<strong>High</strong> <strong>Power</strong> <strong>Impulse</strong> <strong>Magnetron</strong> <strong>Sputtering</strong> (<strong>HiPIMS</strong>)<strong>HiPIMS</strong> - Ionization fractionThere have been conflicting reports onthe fraction of ionized metal flux70 % for Cu Kouznetsov et al. (1999) SCT 122 29056 % for Cu Vlček et al. (2007a) JVSTA 25 4299 % for Ti Kudláček et al. (2008) PSST 17 02501040 % for Ti 0.5 Al 0.5 Macák et al. (2000) JVSTA 18 15339.5 % for Al DeKoven et al. (2003) 46th SVC p. 1584.5 % for C DeKoven et al. (2003) 46th SVC p. 158The degree of ionization90 % for Ti Bohlmark et al. (2005) JVSTA 23 18The fraction of ionized metal fluxdepends on applied power, pulsefrequency and pulse length, and distancefrom the targetFrom Bohlmark et al. (2005)
Change language