High Power Impulse Magnetron Sputtering (HiPIMS)
High Power Impulse Magnetron Sputtering (HiPIMS)
High Power Impulse Magnetron Sputtering (HiPIMS)
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<strong>High</strong> <strong>Power</strong> <strong>Impulse</strong> <strong>Magnetron</strong> <strong>Sputtering</strong> (<strong>HiPIMS</strong>)Ionized Physical Vapor Deposition (IPVD)Another important parameter is the fraction of ionizedmetal fluxΓ iΓ i + Γ nThe ion flux to the substrate isΓ i ≈ 0.61n m+ u B ∼ √ T eThe flux of thermalized neutrals isΓ n = 1 4 n mv Th ∼√T gSince T e ≫ T g the fraction of ionized metal flux is largerthan the fraction of ionized metal in the plasmaIt is not necessary to completely ionize the sputtered metalto create a highly ionized flux to the substrate
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