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Quarterly Reliability Report - Peregrine Semiconductor

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March 2013<strong>Quarterly</strong> <strong>Reliability</strong> <strong>Report</strong>Document Number DOC-51325, Revision 1


Table of Contents<strong>Peregrine</strong> <strong>Semiconductor</strong> <strong>Reliability</strong> System 3Failure Rate Calculation 4<strong>Reliability</strong> Results 5Process Technology ClassificationSTeP2 UltraCMOS ® Process (U500E) 6STeP3.5 UltraCMOS ® Process (U350E) 7STeP5 UltraCMOS ® Process (U350B) 8STeP6 UltraCMOS ® Process (U250E) 9Product Family ClassificationAntenna Switches (ASW) 10Digitally Tunable Capacitors (DTC) 11High Performance Switches (HPSW) 12Digital Step Attenuators (DSA) 13DC-DC Buck Regulators/Converters (DCDC) 14Mixers (MXR) 15Phase Locked-Loop Synthesizers (PLL) 16Prescalers (PSR) 17Temperature Cycling (TC) <strong>Reliability</strong> Data 18, 19Highly Accelerated Stress Test (HAST) <strong>Reliability</strong> Data 20, 21Document No. DOC-51325-01 Page 2 of 20


Failure Rate CalculationAcceleration FactorAn acceleration factor is a constant, which expresses the enhanced effect of temperature on a device’sfailure rate used in reliability prediction formulas. The typical purpose is to show the acceleration effectbetween the failure rates at two different temperatures. The semiconductor industry uses the thermalacceleration factor formula based on Arrhenius equation noted below:where:e base of the natural logarithmEa Activation energyk Boltzmann’s constantT1 test temperature in KelvinT2 use temperature in KelvinT1 55 o C 273.15 328.15 o KT2125 125 o C 273.1 398.15 o KAF125 exp 0.7 / 8.617 x 10 –5 x 1/328.15 – 1/398.15 77.6 @125°CT2150 150 o C 273.1 423.15 o KAF150 exp 0.7 / 8.617 x 10 –5 x 1/328.15 – 1/423.15 259.2 @150°CFailure Rate CalculationMean time to failure (M.T.T.F.) is defined as the average time it takes for a failure to occur. Failure inTime (F.I.T.) is the number of units predicted to fail in a billion (1e 9 ) device hours at a specifiedtemperature. After the life test is completed and accelerated device hour data is calculated, the failurerate is estimated using the Chi-Square approximation (χ 2 ) as follows:Sample CalculationGiven: Units Tested Sample Size 231 devicesTest temperature 150°CTest duration 500 hoursFailures 0where:χ 2 chi square functionr number of failuresEDH equivalent device hours units tested x test hours x AFEDH 231 x 500 x 259.2 2.99E7 equivalent device hoursχ 2 @ 60% conidence level and 0 failures 1.83FIT 60% conidence level 1.83 / 2 x 2.99E7 x 1.0E9 30.6 FITDocument No. DOC-51325-01 Page 4 of 20


<strong>Reliability</strong> ResultsPage 5 of 20Document No. DOC-51325-01


STeP2 UltraCMOS ® Process TechnologyGeneration:500 nm CMOS Silicon Epi Process (U500E)Units Tested:16,064Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)1.01E+08 9.1 1.10E+081.50E+09 0.6 1.67E+09100.00Constant Failure Rate as a Function of Operating Temperature10.00FIT1.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 6 of 20


STeP3.5 UltraCMOS ® Process TechnologyGeneration:350 nm CMOS Silicon Epi Process (U350E)Units Tested:3,243Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)3.77E+07 24.3 4.12E+073.95E+08 2.3 4.31E+081000.00Constant Failure Rate as a Function of Operating Temperature100.00FIT10.001.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 7 of 20


STeP5 UltraCMOS ® Process TechnologyGeneration:350 nm CMOS Bonded Silicon Process (U350B)Units Tested:2,629Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)3.04E+07 30.1 3.32E+073.17E+08 2.9 3.46E+081000.00Constant Failure Rate as a Function of Operating Temperature100.00FIT10.001.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 8 of 20


STeP6 UltraCMOS® Process TechnologyGeneration:250 nm CMOS Silicon Epi Process (U250E)Units Tested:401Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)4.19E+06 218.9 4.57E+064.36E+07 21.0 4.76E+0710000.00Constant Failure Rate as a Function of Operating Temperature1000.00FIT100.0010.001.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 9 of 20


Antenna Switches (ASW) Product FamilyDescriptionProducts in FamilyProcess TechnologyUnits Tested::Multi-pole & multi-throw high power handling antenna switchproducts for Mobile Wireless RF and Test Equipment /ATEapplications.PE4211x, PE421230, PE4255x, PE426x, PE4261x, PE42614x,PE42615x, PE42616x, PE42617x, PE4263x, PE42641, PE4266x,PE4267x, PE4268x, PE42682x, PE42684x, PE42685x, PE4269x,PE42695x, PE42688x, PE421510, PE421550: STeP2, STeP3.5, STeP5, STeP6:4,920Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)5.45E+07 16.8 5.95E+075.78E+08 1.6 6.33E+08100.00Constant Failure Rate as a Function of Operating Temperature10.00FIT1.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 10 of 20


Digitally Tunable Capacitors (DTC) Product FamilyDescriptionProducts in FamilyProcess TechnologyUnits Tested: Supports a wide range of tuning applications, from tuning the centerfrequency of mobile-TV and antennas, to tunable impedancematching and filters.: PE6230x, PE621010, PE621020, PE623060, PE623090, PE6490x,PE6410x: STeP3.5, STeP5:1,452Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)1.68E+07 54.4 1.84E+071.75E+08 5.2 1.92E+081000.00Constant Failure Rate as a Function of Operating Temperature100.00FIT10.001.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 11 of 20


High Performance Switches (HPSW) Product FamilyDescriptionProducts in FamilyProcess TechnologyUnits Tested::High performance switch products for wireless RF, broadband andhigh reliability space switch applications.PE4210, PE4220, PE423x, PE424x, PE4242x, PE425x, PE42540,PE427x, PE42742, PE42750, PE428x, PE84140, PE84244, PE94257,PE9354, PE9542x, PE42420, PE42359, PE42850: STeP2, STeP3.5, STeP5:5,895Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)5.23E+07 17.5 5.71E+077.60E+08 1.2 8.33E+08100.00Constant Failure Rate as a Function of Operating Temperature10.00FIT1.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 12 of 20


Digital Step Attenuators (DSA) Product FamilyDescriptionProducts in FamilyProcess TechnologyUnits Tested: 50Ω and 75Ω Digital Step Attenuators for wireless infrastructure,microwave, test equipment and high reliability space applications.: PE430x, PE43204, PE43404, PE4350x, PE4360x, PE4370x,: STeP2:1,467Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)1.05E+07 87.4 1.14E+071.20E+08 7.6 1.31E+081000.00Constant Failure Rate as a Function of Operating Temperature100.00FIT10.001.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 13 of 20


DC-DC Buck Regulators/Converters (DCDC) Product FamilyDescriptionProducts in FamilyProcess TechnologyUnits Tested:These devices are radiation-hardened point-of-load (POL) buckregulators with integrated switches suited for DC-DC converterapplications. This monolithic technology replaces multi-chip modulesby offering superior performance, smaller size and reduced weight insensitive space applications.: PE9915x: STeP2:465Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)1.94E+06 472.4 2.12E+061.39E+07 65.9 1.52E+0710000.00Constant Failure Rate as a Function of Operating Temperature1000.00FIT100.0010.001.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 14 of 20


Mixers (MXR) Product FamilyDescriptionProducts in FamilyProcess TechnologyUnits Tested: UltraCMOS MOSFET quad array broadband and tuned mixers.: PE412x, PE413x, PE414x, PE4150: STeP2:783Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)4.92E+06 186.1 5.37E+061.30E+08 7.1 1.42E+081000.00Constant Failure Rate as a Function of Operating Temperature100.00FIT10.001.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 15 of 20


Phase Locked-Loop Synthesizers (PLL) Product FamilyDescriptionProducts in FamilyProcess TechnologyUnits Tested: Integer-N, Fractional-N and Delta Sigma Modulated frequencysynthesizers for base station, mobile wireless and high reliabilityspace applications.: PE323x, PE3240, PE329x, PE333x, PE334x, PE960x, PE970x,PE972x, PE9763, PE8333x, PE8334x: STeP2:5,240Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)2.41E+07 38.1 2.63E+073.44E+08 2.7 3.76E+081000.00Constant Failure Rate as a Function of Operating Temperature100.00FIT10.001.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 16 of 20


Prescalers (PSR) Product FamilyDescriptionProducts in FamilyProcess TechnologyUnits Tested: UltraCMOS RF Prescalers.: PE350x, PE351x, PE8350x, PE8351x, PE930x, PE931x: STeP2, STeP3.5: 2,115Early LifeConstant (Random)Standard Failure Rate Calculations at 55°C and 60% UCLEquivalent Device Hours (EDH) FITs MTTF (hours)8.52E+06 107.5 9.30E+061.37E+08 6.7 1.50E+081000.00Constant Failure Rate as a Function of Operating Temperature100.00FIT10.001.0060% UCL90% UCL0.1025 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100Operating Temperature (°C)Document No. DOC-51325-01 Page 17 of 20


PackageTemperature Cycling (TC)ProductSampleSizeStress ConditionsDuration(cycles)Failures8L MSOP PE4231 50 -65°C/150°C 1000 08L MSOP PE4251 135 -65°C/150°C 500 0Subtotal 185 08L 1.5x1.5 UDFN PE42430 286 -65°C/150°C 500 06L SC70 PE42359 240 -50°C/150°C 500 06L SC70 PE4259 49 -65°C/150°C 1000 06L SC70 PE4259 135 -65°C/150°C 500 06L SC70 PE4259 135 -65°C/150°C 100 06L SC70 PE4259 135 -65°C/150°C 500 06L SC70 PE42421 297 -65°C/150°C 500 0Subtotal 991 06L 3x3 DFN PE4237 130 -65°C/150°C 500 048L 7x7 MLP PE3336 45 -65°C/150°C 500 032L 5x5 QFN FCOLAM PE42540 292 -65°C/150°C 500 032L 5x5 QFN PE42650 231 -65°C/150°C 500 032L 5x5 QFN PE42650 231 -65°C/150°C 500 032L 5x5 QFN PE43703 135 -65°C/150°C 500 032L 5x5 QFN PE43703 180 -65°C/150°C 500 0Subtotal 777 024L TSSOP PE3341 130 -65°C/150°C 500 024L 4x4 QFN PE4309 90 -65°C/150°C 500 020L 4x4 QFN PE42691 135 -65°C/150°C 500 020L 4x4 QFN PE42742 135 -65°C/150°C 500 020L 4x4 QFN PE42742 135 -65°C/150°C 500 020L 4x4 QFN PE4302 50 -65°C/150°C 1000 020L 4x4 QFN PE3341 50 -65°C/150°C 1000 020L 4x4 QFN PE4256 55 -65°C/150°C 1000 0Subtotal 560 0Document No. DOC-51325-01 Page 18 of 20


PackageTemperature Cycling (TC)ProductSampleSizeStress ConditionsDuration(cycles)Failures16L 3x3 QFN PE42641 45 -65°C/150°C 500 016L 3x3 QFN PE42641 135 -65°C/150°C 1000 0Subtotal 180 012L 3x3 QFN PE42750 135 -65°C/150°C 500 012L 3x3 QFN PE42750 290 -65°C/150°C 500 0Subtotal 425 010L 2x2 QFN PE623060 148 -65°C/150°C 500 012L 2x2 QFN PE64102 299 -65°C/150°C 500 012L 2x2 QFN PE42422 299 -65°C/150°C 500 0Subtotal 598 010L MSOP PE4151 135 -65°C/150°C 500 010L 2x2 FCETSLP PE62305 135 -65°C/150°C 500 010L 2x2 FCETSLP PE62304 282 -55°C/25°C 1000 0Subtotal 417 024L 4x4 QFN FCOLAM PE42420 255 -65°C/150°C 500 024L 4x4 QFN FCOLAM PE42420 237 -55°C/125°C 1000 0Subtotal 492 032L CQFP PE99155 15 -65°C/150°C 500 0Total 5,896 0Document No. DOC-51325-01 Page 19 of 20


Highly Accelerated Stress Test (HAST)PackageProductSampleSizeStressTempDuration(hours) Failures8L MSOP PE4231 45 130°C/85%RH 168 08L MSOP PE4251 135 130°C/85%RH 96 0Subtotal 180 08L 1.5x1.5 UDFN PE42430 135 110°C/85%RH 264 06L SC70 PE42359 238 130°C/85%RH 96 06L SC70 PE4259 50 130°C/85%RH 168 06L SC70 PE4259 135 130°C/85%RH 96 06L SC70 PE4259 135 130°C/85%RH 96 06L SC70 PE4259 135 130°C/85%RH 96 06L SC70 PE42421 134 130°C/85%RH 96 0Subtotal 827 06L 3x3 DFN PE4237 130 130°C/85%RH 96 048L 7x7 MLP PE3336 45 130°C/85%RH 96 032L 5x5 QFN FCOLAM PE42540 135 110°C/85%RH 264 032L 5x5 QFN PE42650 231 130°C/85%RH 96 032L 5x5 QFN PE42650 231 130°C/85%RH 96 032L 5x5 QFN PE43703 135 130°C/85%RH 96 032L 5x5 QFN PE43703 90 130°C/85%RH 96 0Subtotal 687 024L TSSOP PE3341 70 130°C/85%RH 96 024L 4x4 QFN PE4309 90 130°C/85%RH 96 020L 4x4 QFN PE42742 135 130°C/85%RH 96 020L 4x4 QFN PE42742 90 130°C/85%RH 96 020L 4x4 QFN PE4302 48 130°C/85%RH 168 020L 4x4 QFN PE3341 50 130°C/85%RH 168 0Subtotal 323 0Page 20 of 20Document No. DOC-51325-01


Highly Accelerated Stress Test (HAST)Sample Stress DurationPackageProduct SizeTemp(hours) Failures10L 2x2 QFN PE623060 149 130°C/85%RH 96 016L 3x3 QFN PE42641 45 130°C/85%RH 96 016L 3x3 QFN PE42641 135 130°C/85%RH 96 0Subtotal 180 012L 3x3 QFN PE42750 135 130°C/85%RH 96 012L 3x3 QFN PE42750 291 130°C/85%RH 96 0Subtotal 426 012L 2x2 QFN PE64102 135 130°C/85%RH 96 012L 2x2 QFN PE42422 135 130°C/85%RH 96 0Subtotal 270 010L 2x2 FCETSLP PE62305 135 110°C/85%RH 264 010L 2x2 FCETSLP PE62304 135 110°C/85%RH 264 0Subtotal 270 024L 4x4 QFN FCOLAM PE42420 150 110°C/85%RH 264 0Total 4,067 0Page 21 of 20Document No. DOC-51325-01

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