PDF of August Issue - IEEE Photonics Society

Editor’sColumnHON TSANGThis month’s issue has a central theme, close to my own researchinterests, on energy efficiency in telecommunicationsand silicon photonics. Professor Rod Tucker highlightssome conclusions from work at the Center of Energy EfficientTelecommunications at Melbourne University. Usingan assumption of 15% per year continued improvement inthe energy efficiency of network equipment, the global internet’spower consumption, not including the power usedby wireless networks, is projected to double by 2020, anduse 2% of the electrical power generated in the world. Manygroups are working hard to improve the energy efficiencyof the internet. If such research bears fruit, it could reversethe historical trend of increasing relative power consumptionin network equipment, and then the energy efficiencyof computer servers may become more important. Accordingto Tucker’s article, computer servers today consume lesspower than access networks, but their relative power consumptionwill rise until they surpass access network equipmentin the two years’ time. This is one reason why siliconphotonics may become relevant in the power consumptionin the internet. Power consumption already constrain highperformance microprocessors to operate at lower clock frequencies(a few GHz) than that possible with state of theart CMOS transistors (tens of GHz). The power consumedby electrical interconnects accounts for a significant fractionof the power in today’s microprocessors. Reduction inthe power consumption of high speed interconnects can allowcomputers to operate at higher speeds or with lowerpower consumption at the same speed. Potential improvedenergy efficiency of on-chip photonic interconnects is oneof the motivations for research in silicon photonics (thereare others, including the prospect for low cost integrationof multiple photonic functions in telecommunications, andphotonic sensors). In this month’s issue Professor LukasChrostowski summarizes the support of silicon photonicsresearch via workshops and foundry-like services under thesilicon EPIC programme, which is supported until 2018by NSERC in Canada and which is typical of programmesalready established in Europe and Asia. Also in this issueare highlights of recent work on monolithic integration ofIII-V quantum dot lasers on silicon by the group at UniversityCollege London led by Professors Alwyn Seeds andHuiyun Liu. In the conference section, Professor MichaelHochberg reports on the Rump Session on “Silicon Photonics:Disruptive Technology or Research Curiosity” atthis year’s OFC. The large number of people who attendedthis session attest to the strong interest on silicon photonicsin the photonics community.I hope you enjoy this month’s articles. Please feel freepost comments on http://www.facebook.com/Photonics-Society or send your comments by email to us.Hon TsangIEEE Photonics SocietyPresidentHideo KuwaharaFujitsu Laboratories4-1-1, Kamikodanaka, NakaharaKawasaki, 211-8588, JapanTel: +81 44 754 2068Fax: +81 44 754 2580Email: kuwahara.hideo@jp.fujitsu.comPast PresidentJames ColemanDept of E & C EngineeringUniversity of Illinois208 N. Wright StreetUrbana, IL 81801-2355Tel: +217 333 2555Email: j.coleman@ieee.orgSecretary-TreasurerDalma NovakPharad, LLC797 Cromwell Park DriveSuite VGlen Burnie, MD 21061Tel: +410 590 3333Email: d.novak@ieee.orgBoard of GovernorsJ. S. Aitchison P. AndreksonS. Bigo M. DawsonP. Juodawlkis A. KirkF. Koyama J. McInerneyM. Nakazawa D. NovakP. Smowton M. WuVice PresidentsConferences - D. PlantFinance & Administration – C. JagadishMembership & RegionalActivities – J. KashPublications – B. TkachTechnical Affairs – K. ChoquetteNewsletter StaffExecutive EditorHon K. TsangDepartment of Electronic EngineeringThe Chinese University of Hong KongShatin, Hong KongTel: +852 - 39438254Fax: +852 - 26035558Email: hktsang@ee.cuhk.edu.hkIEEE prohibits discrimination, harassment, andbullying. For more information, visit http://www.ieee.org/web/aboutus/whatis/policies/p9-26.html.Associate Editor of Asia & PacificChristina LimDepartment of Electrical &Electronic EngineeringThe University of MelbourneVIC 3010 AustraliaTel: +61-3-8344-4486Email: chrislim@unimelb.edu.auAssociate Editor of CanadaLawrence R. ChenDepartment of Electrical &Computer EngineeringMcConnell Engineering Building,Rm 633McGill University3480 University St.Montreal, QuebecCanada H3A-2A7Tel: +514 398 1879Fax: 514 398 3127Email: lawrence.chen@mcgill.caAssociate Editor of Europe/Mid East/AfricaKevin A. WilliamsEindhoven University of TechnologyInter-University Research InstituteCOBRA on CommunicationTechnologyDepartment of ElectricalEngineeringPO Box 5135600 MB Eindhoven,The NetherlandsEmail: K.A.Williams@tue.nlStaff EditorLisa ManteriaIEEE Photonics Society445 Hoes LanePiscataway, NJ 08854Tel: 1 732 465 6662Fax: 1 732 981 1138Email: ipsnewsletter@ieee.orgSFI LOGOIEEE Photonics Society News (USPS 014-023) is published bimonthlyby the Photonics Society of the Institute of Electrical andElectronics Engineers, Inc., Corporate Office: 3 Park Avenue, 17thFloor, New York, NY 10017-2394. Printed in the USA. One dollar permember per year is included in the Society fee for each memberof the Photonics Society. Periodicals postage paid at New York,NY and at additional mailing offices. Postmaster: Send addresschanges to Photonics Society Newsletter, IEEE, 445 Hoes Lane,Piscataway, NJ 08854.Copyright © 2013 by IEEE: Permission to copy without fee all orpart of any material without a copyright notice is granted providedthat the copies are not made or distributed for direct commercialadvantage, and the title of the publication and its dateappear on each copy. To copy material with a copyright noticerequires specific permission. Please direct all inquiries or requeststo IEEE Copyrights Office.2 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

President’sColumnHIDEO KUWAHARAI am writing this column manuscript in San Jose, California,while attending CLEO2013. The conference is exciting, asalways, gathering 1198 oral, 320 poster and 189 invited papers,as well as 24 tutorials and 20 short courses, with in-depthpresentations by experts, all covering new trends in photonicstechnologies, such as novel materials and devices. I think oneof the highlights is the plenary session, and we had three splendidplenary talks: “Attosecond Photonics” by Paul Corkum,“Parametric Down Conversion Over Fifty Years: From Microwaveto X-Rays” by Stephen Harris, and “QCLs RevolutionizingMWIR and LWIR Applications” by Kumar Patel. Theirpresentations will be posted on the CLEO website.Another highlight of the plenary session was the report onthe National Photonics Initiative (NPI) by Prof. Alan Willnerof Southern California University, who is a former president ofIPS. He discussed the current status of the NPI, which is aninitiative designed to highlight the importance of photonicstechnologies. The NPI was started based partially on a recommendationfrom the U.S. National Academies’ Report on Opticsand Photonics and is a collaborative initiative sponsored byfive professional societies: APS, IEEE Photonics Society, OSA,SPIE, and LIA. The core concept of the NPI is that photonicsis an essential technology enabling today’s ICT-based society,on a par with semiconductor technology. For example, whenwe click on a Google search item, the information is transmittedthrough photonic networks and is processed in data centersin which millions of optical interconnects are used. Today’sproliferation of cloud-based technologies would be impossiblewithout photonic networks. The important role of photonicsin our daily life is not well understood, or even given a moment’snotice, by the general public. Although the NPI wasoriginally conceived as a way to appeal to decision-makers inthe U.S., photonics technology, itself, has no national borders.Therefore, given that the and the fact that IEEE is a globalorganization, it is not a stretch to think of the global publicas being a natural audience for the NPI’s message. When Iassumed the role of IPS president in the beginning of 2012, Ihad in my mind a similar notion that IPS should highlight theimportance of photonics technology to the general public, includingstudents and researchers at large as potential IPS members.I think we should communicate the essential message ofthe NPI globally, and we must think about what we can do toeducate the general public about photonics technology.At the plenary session of CLEO2013, we also had a recognitionceremony, and this time four new Fellows associated withIPS were recognized. The IPS Young Investigator Award waspresented to Alexandra Boltasseva of Purdue University. Congratulationsto our new Fellows and Alexandra!CLEO2013 highlighted progress in the area of nanophotonics,including plasmonics and metamaterials, seemingly anarea that is attracting even more attention than Si photonics.Similar to the message conveyed in discussions at the OpticalInterconnect Conference held in May in Santa Fe, New Mexico,there was an emphasis on lower power consumption andhigher spatial density as being the crucial needs from the systemside. Recent reports in nanophotonics on the interactionbetween photons and materials through plasmonics may representa breakthrough in overcoming the weakness of photonsas a boson in interacting with matter. IPS is also increasingour efforts in publications and conferences on these areas, withthe aim of transitioning nanophotonics from a lab curiosity toa practical technology.As for the issue of energy, I cannot help thinking about therecent string of violent weather-related incidents around theworld, including tornados and hurricanes in US and floodingin central Europe in May and June. Of course I hope this trendwill diminish. Unfortunately, however, the reality is that it willprobably increase, and I think the reason stems mainly fromglobal warming and the resulting elevated thermal equilibriumand dynamic range of climate change. Please refer to thearticle “Global CO2 Concentration Reaches 400 ppm” by BillSweet in the IEEE Spectrum Energywise Newsletter posted onMay 22, 2013. I have raised this issue several times in thiscolumn, but I still feel we need to start serious discussions onglobal warming. The Kyoto Protocol no longer appears to beeffective. In dry areas of the world, there are severe droughts,and desertification is expanding, which can lead to food shortagesand social instability. I realize this discussion exceeds thebounds of the Photonics Society, but I think there is a pressingneed in the world for a broad discussion on renewable energy,not just about photovoltaic energy. Of course, economic issuesare important, but the issue of global warming may be evenmore important.Photonics Society and IEEE MattersOn the occasion of CLEO2013, IPS had some internal committee/councilmeetings. Editor meetings of the Journal of QuantumElectronics and Photonics Journal were held, and manyopinions were discussed with the editors-in-chief and associateeditors to improve and strengthen our journals. A TechnicalAffairs Council meeting was also held to discuss new technologytrends for our future planning.The IEEE Photonics Society started to use social media andnow issues the IEEE Photonics Daily e-newsletter. Please jointo get quick micro-blogs on IEEE Photonics Society programs,photonics research and innovation news, publications andmembership information, and upcoming conference details.Among the activities of the IEEE, the peer review process tomaintain high-quality standards for published papers is one ofthe most important activities, and we must bear in mind againthe importance of the peer review process for submitted papers.The process is supported by the volunteer efforts of reviewers(continued on page 45)August 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 3

Research HighlightsResearch at the University of Melbourne’sCentre for Energy-Efficient TelecommunicationsRodney S. Tucker, Fellow, IEEEAbstract—This paper provides an overview of research activitiesin the University of Melbourne’s Centre for Energy- EfficientTelecommunications.Index Terms—Telecommunications, photonics, energyconsumption, energy efficiency.BackgroundIn 2002, the Australian Research Council awarded me afive-year research fellowship, titled “towards an all-opticalInternet”. I hoped that the research carried out under this fellowshipwould contribute to the dream that many researchershad been pursuing during the 1990’s and early 2000’s—anoptical communications network that would be freed from theconstraints and limitations of electronic devices. According tothe dream, this all-optical network would circumvent the needfor data to undergo endless optical to electronic and electronicto optical conversions as it passed through the network, andopen the way to huge increases in bandwidth.I was very enthusiastic about the concept of the all-opticalnetwork. Over a number of years, I worked with students andcolleagues on a variety of all-optical enabling technologies, includingall-optical wavelength converters, data format converters,serializers and deserializers, and optical packet switches.Like many other researchers working on all-optical technologies,most of my work had been limited to small-scale demonstrationsof devices, and lacked any careful considerations ofhow these devices could scale to be usefully incorporated intoa full-size network.My goal, for the five years of research under the fellowship,was to figure out how to build full-size networks using theFigure 1. CEET research team.available all-optical devices, and if this proved to be impossible,to develop an understanding of what new all-optical technologieswould be needed to make the dream of an all-opticalnetwork become a reality.After a year or two of efforts to work out how to build ascalable all-optical network, the penny finally dropped. Itslowly became clear to me that all-optical concepts do not scalewell to large continental or global-scale networks. One reasonis that because optical devices are analog rather than digital,crosstalk between separate signals becomes a limiting factorwhen it comes to scaling to large networks. But more importantthan crosstalk is the issue of energy consumption.Like many of my colleagues in other research labs, I hadpreviously paid little or no attention to the energy consumptionof the various all-optical devices I had been working on.But when I started taking the energy consumption of variousall-optical devices into account, I realized that the viability ofthe all-optical network might be fundamentally limited bythe fact that it could consume astronomically large amountsof energy.This insight into the importance of energy consumptionled me to focus my research on the issue of energy consumptionin telecommunications. Together with a group of colleagues,I re-focussed my research on the energy efficiencyall-optical devices and circuits in comparison with the energyefficiency of conventional optical and electronic devices andcircuits.The Australian Research Council decided not to renewmy fellowship—I suspect that this might have been becauseI had taken an about-face in my research direction. Nevertheless,together with Alcatel-Lucent andwith government support, the Centrefor Energy-Efficient Telecommunications(CEET) was established at the Universityof Melbourne in 2009, and a team of some20 researchers was assembled to tackle thequestion of how to quantify and improvethe energy efficiency of telecommunicationsnetworks. Fig. 1 shows the CEETresearch team among Melbourne University’scloisters.Why is Energy Important?Attempts to quantify the energy consumptionof networks and data centresbegan in the early 1990’s. Early work focusedon an inventory-counting approachthat counts all purchased equipment and4 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

estimates how much of that equipment is in the network, andadds up the power consumption of all the equipment. Ourgroup at the University of Melbourne decided to take a network-orientedapproach. In this approach, we design a networkcapable of providing a given bit rate to a given number of usersand then repeat this design for a range of user numbers and arange of bit rates to each user [1].Fig. 2 shows our estimates of the total power consumptionof the global Internet as a function of time (excluding the wirelessaccess network), from 2010 to 2020. In this estimate thenumber of users is taken to be 1.5 billion in 2010, and increasesat 10% per annum. Likewise, our calculations are based on a40% per annum increase in bit rates per user.The lines in Fig. 2 represent power consumption for anetwork in which the energy efficiency of all equipment inthe network (measured in terms of capacity in Gigabits persecond of throughput per Watt of power consumption) improvesat 15% per annum. This improvement rate is representativeof the improvements that are achieved in successivegenerations of network equipment, but is a fairly optimisticimprovement rate for the entire network because most equipmentin the network is replaced much less often than on anannual basis.The solid red line represents the total power consumptionof the network for a 15% per annum improvements in equipmentefficiency. The broken red line represents the total powerconsumption of a (pessimistic) scenario where none of theequipment in the network improves in efficiency over time andmaintains the same efficiency as 2010 technology. For comparison,the broken black line at the top of Fig. 2 shows the globalelectricity supply, which is growing at about 3% per annum.It can be seen from Fig. 2 that the total power consumptionof the network grows from about 1% of the global electricitysupply in 2010 to about 2% or 18% of the global electricitysupply in 2020, depending on the rate of improvement ofequipment energy efficiency.The purple line is the projected power consumption of theaccess network. Our calculations are based on a Passive OpticalNetwork (PON) network, which is the greenest of all fixed accessnetworks. Despite this conservatism, it is clear from Fig. 2that the access network currently dominates the total powerconsumption of the network, and will do so until about 2015.Given that not all users have access to PON technology, thedata in Fig. 2 is conservative.The green line in Fig. 2 represents the power consumed byall servers in the data centres connected to the network. Thispower consumption is increasing, due to the continuous rise inapplications that terminate on data centres. As shown in Fig. 2,the server power consumption will exceed the access poweraround 2015.The next most important contributors to network powerconsumption are the switches and routers in the core and metronetwork (blue line), followed by the switches and routers locatedin data centers. Finally, the green line represents the totalpower consumption of all optical transport equipment in thenetwork. The good news for optical transport engineers is thattheir part of the network contributes only a small amount tothe total power consumption.Power Consumption (W)10 12 Global Electricity Supply (3% p.a.)Total (2010 Technology)10 11Total10 10Access (PON)ServersCore and Metro10 915% p.a. ImprovementNetworking Within in All Technology10 8 Data Centers2010 2015 2020YearFigure 2. Projected power consumption of the global wiredinternet.Some Research in Energy-EfficientTelecommunicationsIn collaboration with GreenTouch, CEET researchers arepursuing a number of avenues that we believe will assist inthe understanding of where energy is consumed in the network,and how that energy consumption can be managed.Here are three examples of projects in CEET that aim to betterquantify, understand, and manage the energy consumptionof the network.Cloud Computing, Content Distributionand Information LogisticsCloud computing provides a range of on-demand applicationssuch as storage, software applications and social networking services,both to business and consumers. These services are hostedin data centres and accessed remotely through a network connectionby end users. Cloud services will see dramatic growth intothe future as more and more applications are delivered remotely.The energy consumption of a cloud service or application isbased on the consumption of all of its components – computingresources, storage and network transport. An increasingvolume of cloud services will be accessed from mobile devices,the least energy-efficient access network technology.Previous research into the energy-efficiency of cloud serviceshas compared the relationship between local and remoteprocessing. These analyses generally fail to include the energyinvolved in the transport of data between the user and thecloud. To address this issue CEET is working on a model ofcloud computing that takes into account the full energy costsassociates with data transport [2].To illustrate why transport energy costs may be importantto cloud-based services, we have measured the data requiredto serve simple operations on a cloud-based word-processingapplication. Fig. 3(a) shows the measurement technique, usingthe well-known packet sniffer Wireshark. Fig. 3(b) shows thedownstream, upstream, and total traffic as text is entered intothe user’s keyboard.The top curve in Fig. 3(b) shows that the total traffic(the sum of the upstream and downstream traffic) is aboutAugust 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 5

PONCentralOfficeOpticalFront-EndsAggregationSwitchOpticalSplitterPtPOptical NetworkTerminationPremisesInternet DataPower ConsumptionPer Subscriber

team is also developing new sleep-mode mechanisms for differentfiber access networks, to further improve the power efficiencyespecially during times when traffic is light.Where to From HereMany research groups around the world are working on energyin telecommunications networks. At the time of writing,GreenTouch has announced that it is well on the way toachieving its long-term objective of improving the energyefficiency of ICT networks by a factor of 1000 [8]. An excitingimplication of the GreenTouch announcement is that ifthe technologies and architectures developed by GreenTouchcan be incorporated into the network, the rise in power consumptionof the network projected in Fig. 2 could not onlybe stopped, but could even be turned into a decrease in overallpower consumption over time. Good progress is beingmade, but there remains plenty of scope for further improvementsin energy efficiency.References[1] J. Baliga, R. Ayre, K. Hinton, W. Sorin, and R.S. Tucker,“Energy consumption in optical IP Networks,” J. LightwaveTechnol., vol. 27, 2009, pp. 2391–2403.[2] J. Baliga, R. Ayre, K. Hinton and R.S. Tucker, “GreenCloud Computing: Balancing Energy in Processing,Storage and Transport”, Proc. IEEE, vol. 99, Jan. 2011,pp. 149–167.[3] A. Vishwanath, F. Jalali, R. Ayre, T. Alpcan, K. Hintonand R. S. Tucker, “Energy Consumption of InteractiveCloud-Based Document Processing Applications,” Proc.IEEE International Conference on Communications (ICC),Hungary, Jun 2013.[4] C. A. Chan, A. F. Gygax, E. Wong, C. A. Leckie, A. Nirmalathas,and D. C. Kilper, “Methodologies for Assessingthe Use-Phase Power Consumption and GreenhouseGas Emissions of Telecommunications Network Services,”Environ. Sci. Technol., vol. 47, Jan. 2013, pp. 485–492.[5] C. A. Chan, E. Wong, A. Nirmalathas, A. F. Gygax,C. A. Leckie, and D. C. Kilper, “Towards An Energy RatingSystem for Telecommunications,” TelecommunicationsJournal of Australia, vol. 62, Nov. 2012, pp. 77.1–77.10.[6] H. Chow, D. Suvakovic, D. Van Veen, A. Dupas, R.Boislaigue, R. Farah, M.F. Lau, J. Galaro, G. Qua, N. P.Anthapadmanabhan, G. Torfs, C. Van Praet, X. Yin, andP. Vetter, “Demonstration of Low-Power Bit-InterleavingTDM PON,” Proc. 38th European Conference andExhibition on Optical Communication (ECOC), paperMo.2.B.1, Sep. 2012.[7] K-L. Lee, B. Sedighi, R.S. Tucker, H. Chow, and P. Vetter,“Energy Efficiency of Optical Transceivers in Fiber AccessNetworks,” J. Opt. Commun. Netw., vol. 4, no. 9,pp. A59-A68, Sep. 2012.[8] http://www.greentouch.org/index.php?page=green-meter-research“Nick” Cartoon Series by Christopher Doerr8 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

Research HighlightsTraining in Silicon Photonics Research in CanadaBy Lukas Chrostowski, Associate Professor, Electrical and Computer Engineering,University of British Columbia; NSERC SiEPIC Program DirectorThe Silicon Electronic-Photonic Integrated Circuits (Si-EPIC)NSERC CREATE research training program [1], funded until2018, has been developed in response to the rapidly emergingfield of silicon photonics. Globally, we are on the cusp ofrevolutionary changes in communication and microsystemstechnology through the marriage of photonics (manipulationof information using light, or photons) and electronics (informationprocessing using electrical current) on a single platform(silicon). How is this relevant to society? The miniaturizationof optical components onto silicon chips will enable tremendousdevelopments and will play a ubiquitous role globally,impacting such areas as high-speed communications for mobiledevices, optical communications within computers andwithin data centres, sensor systems, and medical applications.Our training program emphasizes student design of “commercializable”single-chip systems for far-reaching industryrelevantapplications.The Si-EPIC CREATE program builds on the success ofour pioneering nation-wide training workshops in silicon photonics,offered in partnership with CMC Microsystems, whichbegan as a pilot course at the University of British Columbiain 2008 [2]. Since then, over 100 participants have takenour workshops from over 18 universities and from industry.The emphasis is to train students to be innovative designersusing world-leading industrial CMOS foundry processes andto engage in innovation and commercialization with industrypartners. Si-EPIC uses a successful collaborative-teachingmodel [2], which consists of week-long workshops taught byup to 20 instructors and presenters, which are followed by design–fabricate–testcycles. Workshops provide students withleading-edge interdisciplinary exposure to both electronics andphotonics, and to both devices and systems. Our program offersthe following annual workshops, which are open to bothacademics and industry:1) Passive Silicon Photonics – topics including fibre gratingcouplers, resonators (rings, disks, Bragg gratings,photonic crystals), splitters (Y-branches, directionalcouplers), and various optical filters.2) Active Silicon Photonics – with an emphasis on highspeedmodulators and detectors. Next offered July10-16, 2013, at McGill University.3) CMOS Electronics for Silicon Photonics – with anemphasis on analog circuit design for optical transmitterand receivers, and tuning circuits. It will be offeredfor the first time during August 26–30, 2013, at theUniversity of British Columbia.4) Systems, Integration, Packaging – including CMOSand photonic integration strategies, and system-leveldesign and modelling. It will be offered in late 2013or 2014.The Si-EPIC program offers students from across Canada theunique, coordinated design and test support by CMC Microsystems,with access to leading-edge industrial design softwareand fabrication processes. As is the case in the microelectronicsSiEPIC Passive Silicon Photonics workshop and tour of the C2MI MiQro Innovation Collaborative Centre in Bromont, Quebec.August 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 9

Automated chip-scale optical probe stations facilitate the measurementof thousands of optical devices.SiEPIC scholar Ms. Samantha Grist is testing silicon nanophotonicbiosensors.Designed by scholar Mr. Xu Wang, waveguide Bragg gratingdevices function as filters for on-chip signal processing applications,and as sensors for biomedical applications.world, working together on a common foundry platform hasthe following advantages:1) Resource Efficiency – working in a “fabless” modelreduces the need for in-house cleanrooms and costlyprocess development.2) Design Re-Use – the electronics industry benefits byreusing building blocks termed Intellectual Property(IP) cores rather than designing systems (such asprocessors) from the transistor up for each new design(over 1 billion transistors). Similarly, we are buildinga shared library of Silicon Photonics IP cores. Thisfacilitates collaborative systems-level research anddevelopment.3) Transferability for commercialization – allowsindustry to our library in a plug-and-play fashion todesign new products that will be fabricated by a commonfoundry.4) Encourages collaborative design – facilitated bycommon goals, language, workshops, and a library.Our team conducts research in modelling tools and methods,design, fabrication, test and measurement, and packagingof both devices and systems. The research objectives areto a) collaboratively develop new technologies, b) incorporatethese into the Si-EPIC library, and c) use the library to drivefurther innovation, both academic and industrial. Some of thesystems-level research topics include communication systemsfor data centers, fibre-to-the-home, and on-chip networks;quantum-based, ultra-secure information networks usingnon-classical light; and wireless communications. Devicelevel research includes optical detectors, high-speed modulators,lasers and their integration with silicon, a variety of passiveoptical components such as on-chip spectrometers, andelectronics.More information about the program and the workshopscan be found at our web page, http://www.siepic.ubc.ca.References[1] http://www.siepic.ubc.ca[2] L. Chrostowski, N. Rouger, D. Deptuck, N. A. F. Jaeger,“Silicon Nanophotonics Fabrication: an InnovativeGraduate Course,” (invited) 17th Int. Conf. on Telecommunications,Qatar, 04/2010.10 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

Research HighlightsMonolithic Integration of III-V Quantum-DotLasers on Silicon for Silicon PhotonicsJiang Wu, Qi Jiang, Andrew Lee, Mingchu Tang, Alwyn Seeds, Huiyun LiuAbstract—Silicon, the most popular material for electronic integratedcircuits, has been widely investigated as a platform forphotonic integration since the 1980s. Silicon photonics holdsgreat promise to provide better systems in terms of speed, bandwidth,and energy efficiency while still remaining cost-effectivecompared to current microelectronics. Although silicon is ableto fulfill the criteria of many photonic devices, the electricallypumped laser based on silicon remains the ‘holy grail’ for Siphotonics. Could III-V semiconductors provide an answer forefficient light sources on silicon platform? III-V semiconductorsdo afford excellent optical properties, but monolithic integrationof III-V on silicon substrates is challenging. This articlepresents a review of monolithic growth of III-V quantum dotlaser diodes on a silicon platform at University College London.These results provide a feasible means for monolithically integratingIII-V materials on Si platform for photonic circuitry.I. IntroductionOver the last few decades, silicon-based integrated circuits(ICs) have become faster, more compact, and more functional.The boom in ICs has a high bandwidth requirement to keeppace with computer chip performance. On the other hand,it becomes increasingly challenging for copper interconnectsto meet the current data communication requirements. Thedevelopment of current information technology requires integrationof photonic devices for the reasons of high bandwidthdemand and energy-efficient operation [1]. The maturity ofelectronic IC technology makes silicon the most desired platformfor advanced optoelectronic integrated circuits. Despitegreat advances in silicon photonics over recent years, efficientlight sources on silicon platform remain one of the greatestchallenges facing silicon photonics because of the indirectbandgap of silicon. In general, III-V materials are used for highefficiency optical devices due to their superior optical properties.Direct growth of III-V materials on silicon substratescould potentially revolutionize the development of siliconphotonics [2]. However, structural differences between siliconand III-V semiconductors make the integration of III-V opticaldevices on silicon platform non-trivial [3]. This article reviewsthe recent progress and results of the Photonics Group at UniversityCollege London (UCL) in fabrication of III-V quantumdot lasers on silicon substrates.II. Advantages of III-V Quantum Dot Laserson Direct Epitaxy of III-V on Si SubstratesThe direct growth of III-V semiconductors on Si substrateswould be an ideal approach for III-V on silicon (III-V/Si) integrationso that the production cost can be reduced and expensivesubstrates can be avoided. However, there are great challengesfor III-V/Si by direct epitaxial growth [4], [5], namely the formationof three types of defects: anti-phase boundaries (APBs),threading dislocations (TDs) and micro-cracks.(1) Anti-phase boundaries: III-V compound materials arecomposed of two different atomic sublattices. Sublattice shiftsmay nucleate during epitaxial growth of III-V on Si and Ge.Sheets of wrong nearest neighbor bonds, i.e., APB or inversiondomain boundaries (IDBs) can occur. IDBs are planar defects,which deteriorate device performance by acting as nonradiativerecombination centers. To solve the issue of APB, off-axis-cutsubstrates can be used. A single domain surface can be formedby choosing carefully the off-cut angle to obtain bi-atomicsteps. Such single domain surface have Si-Si dimers oriented inthe same direction and thus, GaAs growth on Si can be initializedwith formation of arsenic/gallium dimmers with identicalorientation after with As/Ga prelayer deposition.(2) Micro-cracks: A mismatch in thermal expansion betweenthe III-V epilayers and a Si substrate will result in tensile stressin the III-V layer, and could lead to crack formation duringthe cooling from growth temperature (>500 o C) to room temperature.Thin compressive materials, such as InAlGaAs layerswith In

InGaAs QWGaAsThreading Dislocationstructures, such as QWs. The QDs behave as artificial atomswith properties, which can be engineered by crystal growthtechniques, such as Molecular Beam Epitaxy (MBE). Theseunique QD properties lead to revolutionary characteristics forQD lasers. These include temperature-independent operation,reduced drive current, and higher operating speeds [6], [7],which are significantly superior to conventional semiconductorQW lasers. This unique attribute of QD technology leads us todevelop III-V QD lasers on the Si platform. Furthermore, QDstructures offer other special advantages over QWs, not directlyrelated to their unique density of states, for the productionof better III-V/Si photonic devices [8]–[10]. These include:(1) Lower sensitivity to defects: Some of the TDs and APBsgenerated at the III-V epilayers grown on Si substrates willpropagate through the III-V layers. Every TD propagatingthrough QWs will become a nonradiative recombination center,leading to dramatically degraded performance of III-VQW devices. However, in the case of QD devices, one TD inthe active region can only “kill” one or a few dots. It will notaffect the majority of dots, as shown in Figure 1. Furthermore,the electrons and holes within the active region are spatiallylocalized in dots. This carrier localization could result in carriersnot “seeing” the TDs. QD devices thus exhibit dramaticallyreduced sensitivity to defects.(2) High resistance to degradation: The strain field of QDsgives greater mechanical strength to prevent the movementof dislocations, even in the presence of high-density nonradiativerecombination centers [10]. Consequently, in the case ofIII-V/Si devices with a relatively high density of TD, QD lasersshould exhibit much longer lifetimes and higher operationtemperature than QW devices.These advantageous properties of QDs led to the recentdemonstrations of III-V QD lasers monolithically grown on Sisubstrates [11]–[15].III. Quantum Dot Lasers on Si SubstratesA conventional GaAs-based InAs/InGaAs dot-on-a-well(DWELL) structure was first fabricated on silicon substratesby a solid-source MBE. To reduce the density of threadingdislocations nucleated at the interface between the GaAs bufferand silicon substrate, the GaAs buffer growth temperatureis critical. To optimize the growth temperature of the GaAsbuffer layer on Si, transmission electron microscopy (TEM)measurements were carried out to compare the quality of III-Vmaterial grown on Si substrates at different temperatures.[Figure 2(a)–(c)]. For all buffer growth temperatures, defectsInAs QDsFigure 1. Cross-sectional schematic of threading dislocation propagating throughInGaAs/GaAs quantum well layer and InAs/GaAs quantum dots layer, respectively.are formed at the GaAs/Si interface asa result of the lattice mismatch. Thegrowth temperature of the GaAs bufferlayer plays a critical role in suppressingthe formation of the dislocationsand we have seen the lowest density ofdefects which are mainly confined in theinterface region at a growth temperatureof 400 °C [2].In order to keep the defects frompropagating into the III-V device activeregion, InGaAs/GaAs superlattices aregrown as dislocation filter layers (DFLs). These strainedsuperlattices can work as dislocation stop layers by bending thedislocations and confining them in the DFL region. Figure 2(d)shows a TEM image of a few InGaAs/GaAs superlattice DFLsgrown on a Si substrate. Initially, a large number of threadingdislocations are generated at the interface between the GaAslayer and Si substrate. With four repeats of DFLs, the densityof threading dislocations is significantly reduced. After thisone set of DFLs, there is no dislocation observed in a numberof similar images, as shown in Figure 2(d). The misfit strainof the strained superlattices blocks the threading dislocationsfrom propagating in the growth direction [16].By using the aforementioned growth techniques, abroad-area stripe laser was fabricated at London Centre forNanotechnology. Electrically pumped laser at 1.302 nm wasdemonstrated with a low room temperature threshold currentdensity (J thS ), 725 A/cm 2 [see Figure 2(e)], and operation temperatureup to 42 °C [11].IV. Quantum Dot Lasers on Ge SubstratesThe direct epitaxy of III-V materials on Si substrates faces difficultyin suppressing the formation of defects due to the largelattice mismatch between III-V materials and Si. Comparedwith Si substrates, Ge has a much smaller lattice mismatchand thermal mismatch to GaAs. In addition, Ge has not onlyhigher carrier mobilities but also a higher absorption coefficientat an optical communication wavelength region. Despitethese advantages, the APBs caused by polar/non-polar heteroepitaxyare still problematic. The same solution to eliminateAPBs for III-V/Si heteroepitaxy does not work satisfactorilyas a self-terminating one-monolayer As cannot always be sustainedon a Ge surface. As a result, III-V devices integratedon Ge substrates have not been well established. A solution toremove APBs at the III-V/Ge interface and grow high qualityIII-V buffer layers is critical for integration of III-V devices onGe substrates.At UCL, we have employed a Ga prelayer technique forGaAs growth on miscut Ge (100) substrates. By using thistechnique, we have demonstrated the first InAs/GaAs QDlasers grown on Ge substrates [13], [14]. In our investigation,the As prelayer used for GaAs growth on Ge surfaceresults in quasi 3D structures because of APBs generatedat the GaAs/Ge interface [6]. On the other hand, with aninitial deposition of about one atomic layer of Ga over Gesurface, the GaAs epitaxial layer over Ge surface exhibitsa much smoother surface. TEM measurements reveal only12 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013GaAs

NewsIEEE Photonics Society Gets Social to Connectwith the Photonics Community OnlinePiscataway, NJ (July 2013)—The IEEE Photonics Society(IPS) is now active on social media and ready to connectwith members, academia and industry professionals onFacebook, Twitter, LinkedIn, and through their new onlinenewspaper, the IEEE Photonics Daily. IPS is using thesesocial media channels to provide the photonics and opticscommunity with innovative ways to engage in conversationand share useful resources. Raising awareness is IPS’sgoal; providing education and outreach about the role ofphotonics in technology, manufacturing, telecommunications,research, healthcare, energy development, security,aerospace, and more.“The IEEE Photonics Society is the professionalhome for a global network of scientists and engineerswho represent the laser, optoelectronics and photonicscommunity,” said Lauren Mecum, IPS MembershipDevelopment Specialist. “We are continually searchingfor new ways to provide our members with professionalgrowth opportunities and we plan to use social media asyet another avenue of doing so. We hope to offer photonicscommunity supporters a place to network with peers,keep up with evolving tech news and have a voice in theindustry.”Followers of IPS on social media will have immediateaccess to quick updates and micro-blogs on IPSprograms, educational opportunities, photonics researchand innovation, publications, membership news andupcoming conference information. In addition, IPS followerson Twitter have the opportunity for their tweetsto be featured in IEEE Photonics Daily, which servesto inform the readership of new products and technologies.Interested parties who are not active on Facebookor Twitter can also subscribe to receive the daily onlinenewspaper, the IEEE Photonics Daily, via email, explainedMecum.Follow IPS on Twitter: @IEEEPhotonicsLike IPS on Facebook: Facebook.com/PhotonicsSocietyJoin the IPS LinkedIn Group: http://linkd.in/10MW07oSubscribe to IEEE Photonics Daily: http://bit.ly/IPSDailyAbout the IEEE Photonics SocietyThe IEEE Photonics Society is one of the world’s leadingtechnical communities in the field of optoelectronics andphotonic materials, devices, and systems, with membersand activities engaged in research, development, design,manufacture, and applications, as well as with the variousother activities necessary for the useful expansion of thefield. As part of this dynamic worldwide community, morethan 100,000 photonics professionals actively organize,contribute to, and participate in Society technical conferences,journals and other activities covering all aspects ofthe field. The IEEE Photonics Society has 80+ chaptersworldwide and is part of IEEE, the world’s largest technicalprofessional association. The IEEE Photonics Society (IPS)is the current name for the former IEEE Lasers and Electro-Optics Society (LEOS). Learn more at http://www.photonicssociety.organd http://www.photonicsconferences.org/.About IEEEIEEE, the world’s largest technical professional association,is dedicated to advancing technology for the benefit of humanity.Through its highly cited publications, conferences,technology standards, and professional and educational activities,IEEE is the trusted voice on a wide variety of areasranging from aerospace systems, computers and telecommunicationsto biomedical engineering, electric power andconsumer electronics. Learn more at http://www.ieee.org.18 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

News (cont’d)IEEE PHOTONICS SOCIETY—CALL FOR NOMINATIONS2014 JOHN TYNDALL AWARD2014 YOUNG INVESTIGATOR AWARDNominaons are now being accepted for the 2014 John Tyndall Award.This award, which is jointly sponsored by the IEEE Photonics Society and theOpcal Society, is presented to a single individual who has made outstandingcontribuons in any area of lightwave technology, including opcal bers andcables, the opcal components employed in ber systems, as well as thetransmission systems employing bers. With the expansion of this technology,many individuals have become worthy of consideraon. Nominaondeadline is 10 August, 2013.Nominaons are now being solicited for the 2014 Young Invesgator Award.The Young Invesgator Award was established to honor an individual who hasmade outstanding technical contribuons to photonics (broadly dened) priorto his or her 35 th birthday. Nominees must be under 35 years of age onSept. 30th of the year in which the nominaon is made. Nominaon deadlineis 30 September, 2013.The nominaon form(s), awards informaon and a list of previous recipients are availableon the Photonics Society web site:hp://www.photonicssociety.org/award‐infohp://www.photonicssociety.org/award‐winners20 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

News (cont’d)Iga Received Franklin Medal and AwardProfessor Kenichi Iga, IEEE Life Fellow and Professor Emeritus of Tokyo Institute ofTechnology received 2013 Bower Award and Prize for Achievement in Science fromFranklin Institute. Prof Iga is also a receipent of the IPS William Streifer award (in1992). Prof Iga’s citation for the Franklin Medal and award is for “the conception anddevelopment of the vertical cavity surface emitting laser and its multiple applicationsto optoelectronics”http://www.fi.edu/franklinawards/13/bowersci.htmlProfessor Kenichi IgaIEEE Fellow Prof. Russel Dean DupuisReceives Humboldt Research AwardProf. Dr. Russel Dean DupuisA faculty member of the Georgia Institute of Technology, School of Electrical andComputer Engineering, Atlanta, USA—Prof. Dr. Russel Dean Dupuis (IEEE Fellow)—hasbeen elected the recipient of a Humboldt Research Award after havingbeen nominated for this award by Prof. Dr. Michael Kneissl, Technische UniversitaetBerlin, Germany.This award is conferred in recognition of lifetime achievements in research. In addition,the awardee is invited to carry out research projects of his own choice in cooperationwith specialist colleagues in Germany. We hope that thereby the internationalscientific cooperation will be further promoted.The award is granted in recognition of a researcher’s entire achievements to dateto academics whose fundamental discoveries, new theories, or insights have had a significantimpact on their own discipline and who are expected to continue producingcutting-edge achievements in the future.August 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 21

Careers and AwardsOFC Rump Session on SiliconPhotonics—Standing Room Only!Michael Hochberg, U. Delaware and NUS, Dan Kuchta, IBM ResearchAt OFC this year, we chaired a Rump Session,entitled “Silicon Photonics: DisruptiveTechnology or Research Curiosity?” The OFCrump session was formatted as a spontaneousdiscussion among the audience members; assession chairs, we tried to ask provocative questionsand occasionally prompt specific audiencemembers for their reactions. A few brief presentationswere given to kick things off, then thefun started with questions and discussions fromthe audience.Seating was set for 200 and more than 300people showed up! People were literally sittingin the aisles and stacked up outside the roomuntil almost 10 PM, more than two hours intothe session. The room was packed with students and researchersin academia, professionals from industry and WallStreet, venture capitalists and industry analysts. It was clearfrom the discussion that there is broad, cross-cutting interestin silicon photonics, both domestically and internationally,and that the interest ranges from system integrators to devicedevelopers, and includes end-users in the datacenter andtelecommunications spaces.Chris Cole, of Finisar, commented: “To hold that manypeople’s interest for 2 ½ hours, ending at 10 PM, after along day, was a testimony to…the audience’s interest insilicon photonics.” As session chairs, we’re pleased that thiswas such a success, and that the topic captured the audience’simagination and interest.Several key topics emerged as points of discussion:Has the Hype has Outpaced the Technology?The “Hype-cycle” about silicon photonics was discussed andmany mentioned it was a technology that has begun to matureat the same time when the optical industry is starting toneed the benefits of photonic integration. This triggered anintense series of debates about whether the silicon photonicswas in fact mature enough and ready for production, or stillmainly in research and development.• Several people commented that InP is a serious challengerto silicon photonics at 100 G in the datacenter. Thereare already InP products at 1310 and InP can emit light,which means that any silicon photonic solution willnecessarily integrate an InP source in the near term.• Photonic integration has been a topic of discussion andpresentations since OFC1999 but very few companies haveHalf of the standing room only crowd at OFC 2013 Rump Session onSi Photonics.developed products containing more than a few devices.• Kotura and Luxtera were mentioned, since they wereshowing 4 #28 G transceivers and/or AOCs at OFC.• Skorpios and Aurrion had accepted papers in the Postdeadline session, but no public demos or productannouncements.• Cisco’s purchase of LightWire and the new CPAK productswere also mentioned as an indicator of support forsilicon photonics.• Kotura, Luxtera, IBM, Intel and Cisco were cited asexamples that both big companies and startups wereable to build silicon photonics transceivers.Will Silicon Photonics be the Magic Solution to theTransceiver Industry Financial Woes?From the discussion, it was clear that silicon photonics isnot a magic solution to all the optical industry and transceiverbusiness’s profitability problems. Silicon photonics isnot new, with the early work occurring over 15 years ago.The field has recently matured to the point where systemlevel products can now be manufactured with moderate investmentand risk. Previous to ~2010, most research was inoptimizing individual device performance—now it is aboutlinking devices and building integrated systems.The ecosystem for this has been under development for along time, but is just now maturing enough that truly fablessprojects are possible and relatively inexpensive.What are Silicon Photonic’s Strengths and Weaknesses?Silicon photonics has a specific set of strengths and weaknesses.It leverages the low cost CMOS semiconductor22 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

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Careers and Awards (cont’d)semiconductors to enable building very low cost, highcomplexitysystems on chip. Ramping yield and complexityin silicon is going to be very quick.”Center: Moderator Michael Hochberg.infrastructure. It enables high levels of device integrationand devices have been shown that are capable of high-speedline rates such as 25 G and 56 G, though not yet full linksat 56 G.The III-V community members mentioned that unlikeGaAs and InP, silicon lacks the band gap to generate enoughusable light, hence lasers have to be attached which can be asignificant cost addition. Some members in the audience mentionedthat recent advancement in laser attach using flip-chiptechnology with a tuned external silicon cavity were beingused by Kotura and Cisco. Another approach was pioneeredby Luxtera with a MEMS micropackage. Lasers attached tofibers and edge/butt coupled lasers were also mentioned asmanufacturable options.Speaking as a moderator, Hochberg summarized someof the comments as follows: “Silicon photonics’ strongfeatures are integration of many devices and high-speedmodulation. Silicon photonics is not the best solution ateverything and should be considered another tool in thetool-box for photonics systems design.” He also commentedthat silicon photonics brings a special combination ofleveraging the tremendous capital investment in CMOSWhere exactly is the need for Silicon photonics?As the data rates escalate (eg 25 G, 56 G), the reach ofmulti-mode fiber with VCSELs is dramatically shrinking.At the same time, large datacenters and cloud datacenter arebecoming increasingly large requiring longer reaches than100 m the VCSEL technology enables. This is spawninga lot of interest in using silicon photonics for inexpensive,high-speed modulation and to build transceivers that canreach up to 2 km for the ever-expanding datacenter market.This area is where the optics industry hopes it will see bothhigh unit numbers and decent prices. This application space,which is driven by reach and uses SMF, is likely to be a majorentry point for silicon photonics.Why not use InP for the 100 m–2 Km reach – a technologyavailable now instead of building a new infrastructurefor silicon photonics?Members from the Indium Phosphide community askedwhy the current LR and LR4 implementations could notbe scaled down to address the 100 m–2 km reach andavoid large capital investments in silicon photonics. Theconsensus among the audience seemed to be that for10 G, 40 G and even 100 G, InP is certainly viable using4 channels but that at 400 G, there will be significantyield challenges in InP.What are the roadblocks to low-cost Implementations?Test and packaging was discussed as a key issue needing alot more research and effort. This was identified as a keyarea needing more investment and research to drive downcosts. John Bowers (CEO Aurrion) provided a perspectiveon hybrid integration strategies, commenting that thetemperature and lifetime performance of Aurrion’s chipswas turning out to be extremely impressive.Several companies openly asked if there wereany test and packaging engineers in the audiencelooking for a job.Members of the VCSEL community spokeout that long wavelength VCSELs at 1060 or1090 nm with new fibers could address the100 m–500 m reach issue in datacenters.Will it be reliable?The topic of Reliability of Si Photonicswas brought up as there is little to no datain the literature to support the reliabilityclaims. The InP proponents were quick toStanding left: Moderator Dan Kuchta (continued on page 32)24 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

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Membership Section (cont’d)Does Your Chapter havean Interesting Story to Share?Over the years the IEEE Photonics Society (IPS) hascome across many wonderful stories about our chapters’ experiencesall around the world. Moving forward, we’d liketo feature these stories in the print & electronic IEEE PhotonicsNewsletter and IEEE Institute.The members and chapters of IPS help advance ourmission of representing the laser, optoelectronics andphotonics community. You are the advocates and drivingforce of our society around the world. We want tohear from you!• Did your chapter hold a recent, innovative event youare proud to share?• Is your chapter actively involved in the community,promoting the photonics profession or breakthroughsin the field?• How does your chapter educate students and fosterprofessional growth?We want to hear your voice! Stories about your chapter’sactivities can help spark new ideas for other chapters!How to submit an article to the IPS Newsletter:IPS will feature 1–2 stories in the bi-monthly newsletterand share chapters’ best practices via e-blast monthly.If you have a story to tell, submit an article with pictures,video, etc. to:ipsnewsletter@ieee.orgAttention: Lisa ManteriaPlease note: That by submitting a story you agree to haveit featured in IPS material, such as membership and recruitmentpublications. For more information, please review thenewsletter Submission Guidelines at PhotonicsSociety.org34 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

your personal gateway to IEEE MembershipGet the most from your IEEE membership with myIEEE—your one-stop Web portal to the member benefits you use most.IEEE Knowledge Desktopconnects you to valuableIEEE information. Manageyour subscriptions, browseIEEE publications, and learnabout the latest technologyon IEEE.tv.IEEE Community Desktoplets you keep in touch withIEEE colleagues aroundthe world. View upcomingconferences and IEEEsection activities, or see whatother members are up to.IEEE Profession Desktopis all about developingyour career. Grow yourprofessional contacts, sign upfor one-on-one mentoring, orview job opportunities andcareer information.Stay connected to IEEE.Use your Web Account to log in today at www.myieee.orgAugust 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 3512-MEMB-0023a_myIEEE Ad_Update_7x10_float_Final.indd 11/30/12 6:22 PM

IEEE First Year New Member ExperienceIEEE has an outreach program, First Year New Member Experience, for newly inductedmembers. It was designed to help each understand and navigate IEEE during their firstyear experience. Whether a member joined to build a professional network, save money onconferences or keep current with technology, this program can help.It includes a website portal, a monthlyonline orientation to help the new memberget connected to IEEE and basic serviceson how to participate in various memberactivities.Please inform new members and chapterparticipants of this program when they firstjoin the society.To get started visit: www.IEEE.org/StartGet Connected &Stay Informed @:@IEEEPhotonicswww.PhotonicsSociety.org / www.IEEE.org/MembershipFacebook.com/PhotonicsSociety36 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

Delivered via the IEEE Learning Management SystemIEEE eLearning LibraryThe premier online collection of shortcourses and conference workshopsThe IEEE eLearning Library presents a betterway to learn for technology professionals,students and any organization who wants itsteam to strive, excel and stay competitive.■Advanced technology courses, writtenand peer-reviewed by experts■ Earn CEU and PDH continuingeducation credits■ Relaxed, self-paced, onlineIEEE is a certifi ed continuing education providerFind out what IEEE eLearning Librarycan do for your organization:www.ieee.org/go/elearningAugust 10-PIM-0300a-eLearning-Ad-Updates-Final.indd 2013 1IEEE PHOTONICS SOCIETY NEWSLETTER 9/9/10 2:26 PM 37

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Conference SectionThe 10th International Conference on Group IVPhotonics Will Feature the Latest Advancementsin Silicon Photonics, Advanced Materials &Nano-PhotonicsOfficially known as the Seoul Special City, the capital and largestmetropolis of South Korea will host GFP 2013…SEOUL, KOREA—The 10th International Conferenceon Group IV Photonics (GFP 2013) will featurepresentations spanning a broad range of topics focusedon silicon photonics and other Group IV element-basedphotonic materials and devices. Professionals from industry,academia, and government around the worldwill gather from 28–30 August 2013 for the GFP 2013conference, held for the first time in Seoul, Korea at theGrand Hilton Seoul.Planned as a single-track conference, GFP 2013 willfeature both oral and poster sessions of contributed andinvited papers focused on silicon photonics and otherGroup IV element-based photonic materials, applications,and manufacturing technology. In addition, apost-deadline session will feature the most up-to-dateresults involving Group IV element photonic materialsand devices, including integration and fabricationtechnologies.Some of the major topic areas will include:• Electro-Photonic Convergence on Silicon: mainstreamingindustrial Si photonics; optical interconnecttechnology, including light sources, modulators, anddetectors; technology platforms, design tools/rules, andindustrial fabrication concerns.• Novel Materials and Structure: novel materials andmaterial combinations, and/or structures generatingscientific interest; graphene, complex oxides,photonic crystals, gratings, as well as plasmonics andits hybrids.• Photonic Devices and Nanophotonics: devices andsystems that are at the stage of focusing on real applicationsbut do not necessarily need/require integrationwith electronics; couplers, (bio) sensors, Si photonicsfor telecom applications.“As one of the leading international conferences focusedon silicon photonics materials, devices and processes, the10th International Conference on Group IV Photonics representsa unique venue for the exchange of ideas betweenresearchers, engineers and business leaders on the latestdevelopments in Group IV photonics devices,” said GFP2013 General Chair, Jung Hoon Shin of Korea AdvancedInstitute of Science and Technology. “Our program willblend an impressive array of invited speakers, as well ascomprehensive technical presentations, in a format that encouragesinteraction between participants and presenters.”Invited Speakers• Mehdi Asghari, Kotura Inc., USA• Jean-Marc Fedeli, Atomic Energy and AlternativesEnergies Commission (CEA), France• Beomsuk Lee, Samsung Electronics, Korea• Subal Sahni, Luxtera, Inc., USA• Qiaoliang Bao, Monash University, Australia• Hideo Issihki, The University of Electro-Communication(UEC), Japan• Robert Halir, University of Malaga ETSI, Spain• Volker Sorger, George Washington University, USA• Hiroshi Fukuda, Nippon Telegraph and TelephoneCorporation, Japan• Cary Gunn, Genalyte, USA• Jie Sun, Massachusetts Institute of Technology, USA• Dave Thomson, University of Southampton, UK• Xuezhe Zheng, Oracle, USAGFP 2013 Program-at-a-Glance Available for Download:http://www.gfp-ieee.org/documents/GFP-2013-Program-at-a-Glance-6-4.pdf(continued on page 43)August 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 39

Conference Section (cont’d)wddJOIN US!10th International ConferenceonGroup IV Photonics 201328-30 August 2013Grand Hilton SeoulSeoul, Koreawww.gfp-ieee.orgWWW.PHOTONICSCONFERENCES.ORG40 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

Conference Section (cont’d)IEEE Photonics Society’s 2013 Avionics,Fiber-Optics & Photonics Conference toHighlight the Latest Developments in FiberOptic Architectures, Networking & MobilePlatform Development in Avionics, NavalVessels & Ground VehiclesSAN DIEGO, CA—The IEEE Photonics Society’s 2013 Avionics,Fiber-Optics & Photonics Conference (AVFOP 2013)taking place 1–3 October 2013, is an application-orientedconference designed to cover all aspects of severe environmentfiber optic component systems and technology for avionics,vetronics (vehicle electronics) and naval vessels. Each year,the AVFOP provides an international forum for engineers,researchers and manufacturers to meet and exchange ideas onthe latest developments in reliability, maintainability, producibility,supportability, as well as the future direction of thesecritical systems for military and commercial applications.Photonics professionals from industry, government andacademia will gather from for the tenth annual AVFOP2013 Conference at the Wyndham San Diego Bayside Hotelin the Embarcadero harbor district of San Diego, California(USA). A program of more than 60 presentations willcover a comprehensive range of topics, including:• Integrated & WDM optical components for harshenvironments• Fiber optic transceivers for digital avionics & vetronicssystems• Avionics/vetronics fiber optics & photonics technologysynergies• Fly-by-light & power-by-light components & systems• Optical components for analog/RF signal transmission& distribution• Avionics architecture/networking & standardization foraerospace systems• Modeling & simulation of aerospace fiber optic components,links & systems• Avionics/aerospace fiber optic component & systemreliability• and a host of other topics presented by experts in avionics,fiber optics and photonics technology.In addition to the paper sessions, there will be a paneldiscussion on “Fiber Optics & Photonics Technology InsertionForum,” to be held on 2 October. The discussion willprovide unique insight into the processes used by defenseagencies, aircraft, rotorcraft & spacecraft manufacturers,subsystem suppliers & system integrators to create and acceptnew fiber optics and photonics technologies.“The past ten years has seen significant growth in thedeployment of fiber optic and photonics technology in theaerospace industry for both commercial and military platforms,”said AVFOP 2013 General Chair, Richard DeSalvoof Harris Corporation, USA. “And these avionics fiber opticsystem architectures, networking schemes and componentshave grown more sophisticated. The AVFOP conference hasproven to be an indispensable international forum for theacademic, industry and government R&D professionals tofurther these technology developments.”Program OverviewThe preliminary conference program and listing of eventsare online at: http://www.avfop-ieee.org/program.Supplier Exhibits & Sponsorship OpportunitiesA supplier exhibition and a wide range of sponsorship opportunitiesare available for participating companies to promoteawareness, discuss the latest new products, interactwith customers and develop new sales contacts. Individualizedsponsorship opportunities can be tailored to meet anybudget by contacting conference planner Megan Figueroaat +1 732 562 3895 or via email at m.figueroa@ieee.org.For registration and other information about AVFOP2013, visit http://www.avfop-ieee.org/ or contact:Megan FigueroaConference Planner | IEEE Photonics Society(formerly LEOS)445 Hoes Lane | Piscataway, NJ 08854Tel: +1 732 562 3895 | m.figueroa@ieee.orgAugust 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 41

Conference Section (cont’d)JOIN US!Pre-Registration Deadline30 August 2013WWW.AVFOP-IEEE.ORG1-3 October 2013Wyndham San Diego BaysideSan Diego California, USA10th Avionics, Fiber-Optics&Photonics Conference 2013WWW.PHOTONICSCONFERENCES.ORG42 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

Conference Section (cont’d)IEEE Photonics Conference to SpotlightBreakthroughs in Many Lightwave-Related TechnologiesSEATTLE, WA (June 27, 2013)—The unveiling of breakthroughsin photonics—the use of light waves in electronicsystems as opposed to electrical currents and voltages—willtop the agenda when the world’s leading technologists inthe field convene in the Seattle area this September for theannual IEEE Photonics Conference (IPC-2013), formerlycalled the IEEE LEOS Annual Meeting.Some 600 scientists, engineers and technical managerswill gather from September 8–12 at the Hyatt RegencyBellevue Hotel for an IPC-2013 program of invited talks,paper presentations, panel sessions, special symposia, networkingopportunities, and a product showcase.Since 1988, the IEEE Photonics Conference and its predecessorthe IEEE LEOS Annual Meeting have been thepremier autumn gatherings for the presentation and discussionof research in photonics technologies and applications,including: lasers, biophotonics, displays, photodetectors,sensors, imaging systems, integrated optics, photovoltaics,optoelectronics, interconnects, microwave and nanophotonicdevices and systems, non-linear and ultrafast optics,optical fiber communications, planar waveguide technologyand optoelectronic materials.This year’s conference comes in the wake of the launchthis spring of the National Photonics Initiative, a collaborativealliance among industry, academia and governmentexperts seeking to raise awareness of the impact of photonicson our everyday lives, and of the field’s compellingbusiness opportunities, as well as the potential barriers togrowth. “While more than a thousand companies havesprung up in recent years to produce the photonics devicesand systems we all depend on, there’s a need to overcomefinancial and other barriers to growth in order to enablecontinuing progress, and that’s what this initiative is allabout” said Richard Linke, executive director of the IEEEPhotonics Society, sponsor of IPC-2013 and co-sponsor ofthe National Photonics Initiative along with four otherleading industry groups.“The IEEE Photonics Conference represents a fusion ofcutting-edge scientific research and leading industrial innovationsfor photonics engineers, technologists and suppliersfrom around the world,” said Dr. Martin Dawson,IPC-2013 Program Chair and Professor and Director ofPhotonics Research at the University of Strathclyde in Scotland.“Thought-provoking technical talks, numerous specialevents and a product exhibition will provide attendeeswith the insights and ideas they need to advance the use oflight to address many of today’s most important technologicalchallenges.”Highlights of the IPC-2013 program include:Plenary Sessions• Lab-on-Chip and Point-of-Care Applications of Silicon Photonicsby Roel G. Baets, Ghent University/IMEC• Microwave Quantum Optics in Superconducting Circuits byYasunobu Nakamura, University of Tokyo• The Flexibility of Coherent Optical Transceivers by KimRoberts, Ciena• Digital Cameras in Bio-Inspired Designs: From Humans toFlies by John Rogers, University of IllinoisTutorial SpeakersTutorial talks, which provide a broad view of a photonicsfield starting from the basics, have been scheduled at varioustimes throughout the conference on these topics:• Semiconductor Optical Amplifiers by Ivan Andonovic,University of Strathclyde• VCSELs for Green High Performance Computers and ComputerInterconnects by Dieter Bimberg, TU Berlin• Photonic Microwave-to-Digital Conversion by ThomasClark, Johns Hopkins University• Optical Sensors in Life Science and Medicine by BrianT. Cunningham, UIUC• Tutorial on Optical Micromanipulation by KishanDholakia, University of St Andrews• Nonlinear Propagation Effects in Multimode Transmissionby Antonio Mecozzi, University d’AquilaPanel Sessions and Special Symposia• There will be two panel discussions on Sunday, September8: Silicon Photonics and Photonics in the Pacific Northwest• There will be three Special Symposia at various timesduring the conference on the following topics: OpticalData Storage, Optogenetics and The Internet of ThingsPost-Deadline PapersA limited number of exceptional and timely papers reportingthe latest breakthroughs may be submitted as postdeadlinepapers. They must be submitted to the SpeakerCheck-In Desk onsite by 9 a.m. on September 9. The purposeof post-deadline papers is to enable participants to hearnew and significant material in rapidly advancing areas. Seehttp://www.ipc-ieee.org/call-for-papers.44 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

Conference Section (cont’d)Supplier Exhibits and SponsorshipsSupplier exhibits are included as an integral part ofIPC-2013, and the conference also offers a variety offinancial sponsorship opportunities to those who wishto highlight their offerings to this highly targetedaudience of industry professionals. These sponsorshipscan be either pre-defined or individualized. Forsponsorship information, registration questions andother event information, visit http://www.ipc-ieee.org/ or contact:Tracy HolleIEEE Photonics Society (formerly LEOS)445 Hoes LanePiscataway, NJ 08854+1 732.562.3863t.holle@ieee.orgPresident’s Column(continued from page 3)and editors (the associate editors and editor-in-chief). I deeplyrespect their efforts and the time they spend. Researchers submittingpapers should be conscious of this volunteer processand the value it brings to their papers published in IEEE publications.Researchers should, in turn, participate in the reviewprocess to contribute to the publications of other researchers.In addition to contributing to the field in this way, the experienceof reviewing the papers of others will help improve thequality of one’s own papers.On the subject of our journals I’d like to mention that the journalImpact Factors for 2012 were just released and I’m pleased tosay that our Journal on Special Topics on Quantum Electronics posted avalue of 4.08 which is the highest of any IPS journal in more than10 years. Congratulations to Editor-in-Chief John Cartledge andthe JSTQE Editorial Board and Staff!Finally, please remember that the IEEE annual election isapproaching. Please do not miss your chance to vote.With warm wishes,Hideo KuwaharaFellowFujitsu Laboratories Ltd.August 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 45

Conference Section (cont’d)26th IEEEPHOTONICS JOIN US!CONFERENCE 20138-12 SEPTEMBER 2013Hyatt Regency Bellevue, Bellevue Washington USAGeneral ChairDavid Plant , McGill University, CanadaMember-At- LargeSusumu Noda, Kyoto University, JapanProgram ChairMartin Dawson, University of Strathclyde, ScotlandFEATURED TOPICSBiophotonicsDisplays & LightingHigh Power/Intensity SourcesMicrowave PhotonicsNanophotonicsOptical CommunicationsOptical Fiber TechnologyOptical InterconnectsOptical Networks & SystemsPhotodetectors, Sensors, Systems and ImagingPhotonic Integration and PackagingPhotonic Materials and MetamaterialsSemiconductor LasersOptical Micro/Nano Resonators & DevicesNon-Linear and Ultrafast OpticsFor more information visitwww.PhotonicsConferences.org46 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

Conference Section (cont’d)2013 IEEE Photonics SocietyCo-Sponsored EventsNUSOD August 19—22, 201313th International Conference on Numerical Simulation of Optoelectronic DevicesUniversity of British ColumbiaVancouver, Canadahttp://www.nusod.org/2013/CAOL September 9—13, 20136th International Conference on Advanced Optoelectronics and LasersSanatroy ComplexSudak, Crimea, Ukrainehttp://caol.kture.kharkov.ua/NLP September 10—11, 20132nd International Workshop on Nonlinear PhotonicsSanatroy ComplexSudak, Crimea, Ukrainehttp://lfnm.kture.kharkov.ua/page-nlp.htmlLFNM September 11—13, 201312th International Conference on Laser and Fiber-Optical Networks ModelingSanatroy ComplexSudak, Crimea, Ukrainehttp://lfnm.kture.kharkov.ua/MOC October 27—30, 201318th Microoptics ConferenceTokyo Institute of TechnologyTokyo, Japanhttp://www.moc2013.comMWP October 28—31, 20132013 IEEE International Topical Meeting on Microwave PhotonicsHotel MonacoAlexandria, VA, USAhttp://www.mwp2013.orgICP October 28—30, 20134th International Conference on PhotonicsMeleka, Malaysiahttp://www.icp2013.netAugust 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 47

Conference Section (cont’d)Forthcoming Meetings with ICO ParticipationICO, THE PLACE WHERE THE WORLD OF OPTICS MEETResponsibility for the correctness of the information on this page rests with ICO, the InternationalCommission for Optics; http://www.ico-optics.org/.President: Prof. Duncan T. Moore, Biomedical Engineering and Business Administration, Universityof Rochester, USA; moore@optics.rochester.edu.Associate Secretary: Prof. Gert von Bally, Centrum für Biomedizinische Optik und Photonik, UniversitätsklinikumMünster, Robert-Koch-Straße 45, 48149 Münster, Germany; Ce.BOP@uni-muenster.de16–19 September 2013Information Photonics 2013Warsaw, PolandContact: Marian Marciniak,phone: +48 22 5128715,fax: +48 22 5128715,marian.marciniak@ieee.org18–21 September 2013The Eleventh InternationalConference on Correlation Optics“Correlation Optics’13”Chernivtsi, UkraineContact: Oleg V. Angelsky,phone: (380-3722)44730,fax: (380-3722)44730,angelsky@itf.cv.ua,www.itf.cv.ua/corropt13/27–30 October 2013ICO Topical Meeting: 18thMicrooptics Conference (MOC’13)Tokyo, JapanContact: Tomoyuki Miyamoto;phone: +81-45-924-5059;fax: +81-45-924-5059;tmiyamot@pi.titech.ac.jphttp://www.comemoc.com/moc13/48 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

Publication SectionCall for PapersAnnouncing an Issue of the IEEEJOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS onSilicon PhotonicsSubmission Deadline: October 1, 2013The IEEE Journal of Selected Topics in Quantum Electronics (JSTQE) invites manuscript submissions in the area of SiliconPhotonics. Silicon photonics has been the subject of intense research activity in both industry and academia as a compellingtechnology paving the way for next generation energy-efficient high-speed computing, information processing and communicationssystems. The trend is to use optics in intimate proximity to electronic circuits, which implies a high level of optoelectronicintegration. This evolution towards silicon-based technologies is largely based on the vision that silicon provides a matureintegration platform supported by the enormous existing CMOS manufacturing infrastructure which can be used to cost-effectivelyproduce integrated optoelectronic circuits for a wide range of applications. The solicited areas include (but are not limited to):• Silicon photonic physics, theory, modeling and simulations• Active and passive devices (waveguide structures, modulators, switches, photodetectors, resonators, sensors, subwavelengthstructures, wavelength multiplexers, spectrometers, photonic crystals, nanoplasmonics, amplifiers, light sources, etc.)• Integrated optical circuits for datacom, WDM networks and coherent communications• Strategies for optoelectronic integration (e.g., III-V lasers, organic-Si devices, isolators, etc.)• Cost efficient packaging and testing solutions• Applications in aerospace, bioimaging, biophotonics, photovoltaics, quantum communications, sensing, andtelecommunicationsThe Primary Guest Editor for this issue is Laurent Vivien, CNRS - University of Paris Sud, France. The Guest Editors are PavelCheben National Research Council, Canada; Patrick Lo Guo-Qiang, Institute of Microelectronics/A*Star, Singapore; LorenzoPavesi, University of Trento, Italy; and Zhiping (James) Zhou, Peking University, China.The deadline for submission of manuscripts is October 1, 2013. Unedited preprints of accepted manuscripts are normally postedonline on IEEE Xplore within 1 week of the final files being uploaded by the author(s) on the ScholarOne Manuscripts submissionsystem. Posted preprints have digital object identifiers (DOIs) assigned to them and are fully citable. Once available, final copyeditedand XML-tagged versions of manuscripts replace the preprints on IEEE Xplore. This usually occurs well before the hardcopypublication date. These final versions have article numbers assigned to them to accelerate the online publication; the same articlenumbers are used for the print versions of JSTQE. Hardcopy publication of the issue is scheduled for July/August 2014.For inquiries regarding this Special Issue, please contact:JSTQE Editorial Office - Chin Tan Lutz (Phone: 732-465-5813, Email: c.tanlutz@ieee.org)IEEE/Photonics SocietyThe following documents are required during the mandatory online submission at: http://mc.manuscriptcentral.com/jstqe-pho.1) PDF or MS Word manuscript (double column format, up to 12 pages for an invited paper, up to 8 pages for a contributed paper).Manuscripts over the standard page limit will have an overlength charge of $220.00 per page imposed. Biographies of all authors aremandatory, photographs are optional. See the Tools for Authors link: www.ieee.org/web/publications/authors/transjnl/index.html.2) MS Word document with full contact information for all authors as indicated below:Last name (Family name), First name, Suffix (Dr./Prof./Ms./Mr.), Affiliation, Department, Address, Telephone, Facsimile, Email.JSTQE uses the iThenticate software to detect instances of overlapping and similar text in submitted manuscripts and previouslypublished papers. Authors should ensure that relevant previously published papers are cited and that instances of similarity arejustified by clearly stating the distinction between a submitted paper and previous publications.50 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

Publication Section (cont’d)Call for PapersAnnouncing an Issue of the IEEEJOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS onFiber LasersSubmission Deadline: December 1, 2013The IEEE Journal of Selected Topics in Quantum Electronics (JSTQE) invites manuscript submissions in the area of FiberLasers. The purpose of this issue of JSTQE is to document leading-edge work in this field through a collection of original andinvited papers ranging from fundamental physics to applications. This special issue will be solely devoted to the most recentachievements in fiber laser technology and serve as universal resource for future development. The scope of the issue covers allaspects of theoretical and experimental laser research including:• Fiber design and fabrication• Fiber-processing techniques• Laser architectures and pumping methods• Fiber frequency comb sources• Fiber supercontinuum sources• Photonic crystal fibers and lasers• Ultra high power fiber lasers• Wavelength tunable fiber sources• Ultra narrow-linewidth fiber laser• Picoseconds and femtosecond fiber sources• Beam combination of fiber lasers.The Primary Guest Editor for this issue is Sulaiman Wadi Harun, University of Malaya, Malaysia. The Guest Editors are Shaif-ulAlam, University of Southampton, UK; Andrey S. Kurkov, Russian Academy of Science, Russia; Mukul Chandra Paul, CentralGlass and Ceramic Research Institute, India; and Zhipei Sun, Aalto University, Finland.The deadline for submission of manuscripts is December 1, 2013. Unedited preprints of accepted manuscripts are normally postedonline on IEEE Xplore within 1 week of the final files being uploaded by the author(s) on the ScholarOne Manuscripts submissionsystem. Posted preprints have digital object identifiers (DOIs) assigned to them and are fully citable. Once available, final copyeditedand XML-tagged versions of manuscripts replace the preprints on IEEE Xplore. This usually occurs well before the hardcopypublication date. These final versions have article numbers assigned to them to accelerate the online publication; the same articlenumbers are used for the print versions of JSTQE. Hardcopy publication of the issue is scheduled for September/October 2014.All submissions will be reviewed in accordance with the normal procedures of the Journal.For inquiries regarding this Special Issue, please contact:JSTQE Editorial Office - Chin Tan Lutz (Phone: 732-465-5813, Email: c.tanlutz@ieee.org)IEEE/Photonics SocietyThe following documents are required during the mandatory online submission at: http://mc.manuscriptcentral.com/jstqe-pho.1) PDF or MS Word manuscript (double column format, up to 12 pages for an invited paper, up to 8 pages for a contributed paper).Manuscripts over the standard page limit will have an overlength charge of $220.00 per page imposed. Biographies of all authors aremandatory, photographs are optional. See the Tools for Authors link: www.ieee.org/web/publications/authors/transjnl/index.html.2) MS Word document with full contact information for all authors as indicated below:Last name (Family name), First name, Suffix (Dr./Prof./Ms./Mr.), Affiliation, Department, Address, Telephone, Facsimile, Email.JSTQE uses the iThenticate software to detect instances of overlapping and similar text in submitted manuscripts and previouslypublished papers. Authors should ensure that relevant previously published papers are cited and that instances of similarity arejustified by clearly stating the distinction between a submitted paper and previous publications.August 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 51

Publication Section (cont’d)Call for PapersAnnouncing an Issue of the IEEEJOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS onOptical Detectors – Technology and ApplicationsSubmission Deadline: February 1, 2014The IEEE Journal of Selected Topics in Quantum Electronics (JSTQE) invites manuscript submissions in the area of OpticalDetectors – Technologies and Applications. Pure electronics cannot satisfy all application fields. Photonics and optoelectronicscomplement electronics for many of them. Photonics and optoelectronics demonstrate a large progress and may promise a larger,longer lasting growth than electronics alone. Within optoelectronics, stand alone and integrated optical detectors are a wide field ofresearch. Since about two decades optical detectors have been integrated together with electronics in optoelectronic integratedcircuits or photodiode ICs. This evolution towards silicon-based technologies is based on the existing mature (Bi)CMOSmanufacturing infrastructure which can be used to cost-effectively produce photodiode integrated circuits for a wide range ofapplications. The solicited areas include (but are not limited to):• High-speed and ultrahigh-speed photodetectors• Infrared, visible, UV detectors• Single-photon detectors, silicon photomultipliers• Monolithic, heterogenous or hybride integration of detectors in III/V semiconductor and silicon technologies• Cost efficient packaging and testing solutions• Applications in optical receivers, optical storage systems, 3D-sensors, infrared cameras, thermography, quantumcommunications, sensing, spectroscopy, medical diagnostics and tele-communications.The Primary Guest Editor for this issue is Horst Zimmermann, Vienna University of Technology, Austria. The Guest Editors areEdoardo Charbon, Technical University of Delft, The Netherlands; Y. C. Chung, Korea Advanced Institute of Science andTechnology, Korea; and Hooman Mohseni, Northwestern University, USA.The deadline for submission of manuscripts is February 1, 2014. Unedited preprints of accepted manuscripts are normally postedonline on IEEE Xplore within 1 week of the final files being uploaded by the author(s) on the ScholarOne Manuscripts submissionsystem. Posted preprints have digital object identifiers (DOIs) assigned to them and are fully citable. Once available, final copyeditedand XML-tagged versions of manuscripts replace the preprints on IEEE Xplore. This usually occurs well before the hardcopypublication date. These final versions have article numbers assigned to them to accelerate the online publication; the same articlenumbers are used for the print versions of JSTQE. Hardcopy publication of the issue is scheduled for November/December 2014.For inquiries regarding this Special Issue, please contact:JSTQE Editorial Office - Chin Tan Lutz (Phone: 732-465-5813, Email: c.tanlutz@ieee.org)IEEE/Photonics SocietyThe following documents are required during the mandatory online submission at: http://mc.manuscriptcentral.com/jstqe-pho.1) PDF or MS Word manuscript (double column format, up to 12 pages for an invited paper, up to 8 pages for a contributed paper).Manuscripts over the standard page limit will have an overlength charge of $220.00 per page imposed. Biographies of all authors aremandatory, photographs are optional. See the Tools for Authors link: www.ieee.org/web/publications/authors/transjnl/index.html.2) MS Word document with full contact information for all authors as indicated below:Last name (Family name), First name, Suffix (Dr./Prof./Ms./Mr.), Affiliation, Department, Address, Telephone, Facsimile, Email.JSTQE uses the iThenticate software to detect instances of overlapping and similar text in submitted manuscripts and previouslypublished papers. Authors should ensure that relevant previously published papers are cited and that instances of similarity arejustified by clearly stating the distinction between a submitted paper and previous publications.52 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

Publication Section (cont’d)Call for PapersAnnouncing an Issue of the IEEEJOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS onSolid-State LasersSubmission Deadline: April 1, 2014The IEEE Journal of Selected Topics in Quantum Electronics (JSTQE) invites manuscript submissions in the area of Solid-StateLasers. Advances in solid-state lasers and nonlinear frequency conversion provide powerful tools for an increasingly broad range ofapplications including spectroscopy, metrology, remote sensing, security, material processing, astronomy, medicine, biology,display, and ignitions. Especially, the high-brightness as achievable with giant pulses from Q-switching and amplified mode-lockingenable fruitful nonlinear interactions for materials. The purpose of this issue of JSTQE is to highlight the recent progress and trendsin the development of leading-edge Solid-State Lasers. The solicited areas include (but are not limited to):• Solid-state laser physics, spectroscopy, theory, and modeling for materials and cavities• Tunable and new wavelength solid-state lasers, including nonlinear frequency conversions• High-power lasers and power scaling strategies (oscillator, amplifier, injection seeding/locking, and beam combining)• Short-pulse lasers (mode-locking, Q-switching, and their pulse gap)• Laser and nonlinear materials (single crystal, glass, semiconductor, and ceramics)• Laser structures (slab, disk, fiber, waveguide, microchip, and other micro-structures)• Pump sources for lasers such as high-power and wavelength-stabilized diode arrays• Narrow-linewidth, frequency-stable, and low-noise lasers• Applications in science, medicine, remote sensing, industry, display and ignitionsThe Primary Guest Editor for this issue is Takunori Taira, Laser Research Center, Institute for Molecular Science, Japan. TheGuest Editors are Tso Yee Fan, MIT Lincoln Laboratory, USA; and Guenter Huber, University of Hamburg, Germany.The deadline for submission of manuscripts is April 1, 2014. Unedited preprints of accepted manuscripts are normally posted onlineon IEEE Xplore within 1 week of the final files being uploaded by the author(s) on the ScholarOne Manuscripts submissionsystem. Posted preprints have digital object identifiers (DOIs) assigned to them and are fully citable. Once available, final copyeditedand XML-tagged versions of manuscripts replace the preprints on IEEE Xplore. This usually occurs well before the hardcopypublication date. These final versions have article numbers assigned to them to accelerate the online publication; the same articlenumbers are used for the print versions of JSTQE. Hardcopy publication of the issue is scheduled for January/February 2015.For inquiries regarding this Special Issue, please contact:JSTQE Editorial Office - Chin Tan Lutz (Phone: 732-465-5813, Email: c.tanlutz@ieee.org)IEEE/Photonics SocietyThe following documents are required during the mandatory online submission at: http://mc.manuscriptcentral.com/jstqe-pho.1) PDF or MS Word manuscript (double column format, up to 12 pages for an invited paper, up to 8 pages for a contributed paper).Manuscripts over the standard page limit will have an overlength charge of $220.00 per page imposed. Biographies of all authors aremandatory, photographs are optional. See the Tools for Authors link: www.ieee.org/web/publications/authors/transjnl/index.html.2) MS Word document with full contact information for all authors as indicated below:Last name (Family name), First name, Suffix (Dr./Prof./Ms./Mr.), Affiliation, Department, Address, Telephone, Facsimile, Email.JSTQE uses the iThenticate software to detect instances of overlapping and similar text in submitted manuscripts and previouslypublished papers. Authors should ensure that relevant previously published papers are cited and that instances of similarity arejustified by clearly stating the distinction between a submitted paper and previous publications.August 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 53

Publication Section (cont’d)Announcement of an Issue of the IEEE/OSAJournal of Lightwave Technology on:MICROWAVE PHOTONICS** Submission Deadline: January 1 st , 2014**The IEEE/OSA Journal of Lightwave Technology invites manuscript submissions in the area ofMicrowave Photonics. This special issue of the Journal of Lightwave Technology covers all topics in thefield of microwave photonics, including radio-over-fiber systems, microwave photonic technologies forbiomedical applications, broadband photonic devices, and photonic techniques for the generation,distribution, and processing of microwave signals. A portion of this issue will feature expanded versions ofaccepted papers presented at the 2013 International Topical Meeting on Microwave Photonics (MWP 2013)in Alexandria, Virginia, USA on October 28–31, 2013. It is therefore likely that the topic of the in-depthworkshop held on the first day of MWP 2013, which was integrated photonic devices and subsystems, willbe discussed in some of the papers assembled in this issue.The Guest Editors for this issue are: Edward Ackerman, Photonic Systems Inc., USA; Tadao Nagatsuma,Osaka University, Japan; Stavros Iezekiel, University of Cyprus, CyprusThe deadline for submission of manuscripts is January 1 st 2014. Please submit your paper to:http://mc.manuscriptcentral.com/jlt-ieee and under Manuscript Type select “Microwave Photonics2014”. Unedited preprints of accepted manuscripts are normally posted online on IEEE Xplore within 1week of authors uploading their final files in the ScholarOne Manuscripts submission system. The finalcopy-edited and XML-tagged version of a manuscript is posted on IEEE Xplore as soon as proofs are sent inby authors. This version replaces the preprint and is usually posted well before the hardcopy of the issue ispublished. Hardcopy Publication is scheduled for September/October 2014.All submissions will be reviewed in accordance with the normal procedures of the Journal.All questions should be sent to:IEEE Photonics SocietyDoug Hargis445 Hoes LanePiscataway, NJ 08854 USAd.hargis@ieee.orgThe following documents are required using online submission at: http://mc.manuscriptcentral.com/jlt-ieee1. PDF or MS Word manuscript (double column format, up to 12 pages for an invited paper, up to 7pages for a contributed paper). Manuscripts over the page limits will have an overlength charge of$260.00 USD per page imposed. Biographies of all authors are optional, author photographs areprohibited. See Tools for Authors athttp://www.ieee.org/web/publications/authors/transjnl/index.html2. MS Word document with full contact information for all authors.54 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013

2013 IEEE International Topical Meeting onMicrowave Photonics (MWP)October 28 - 31, 2013Alexandria, Virginia, USACall For ParticipationMicrowave Photonics (MWP) is an inter-disciplinary field of studythat concerns the interactions between microwave and opticalwaves for the generation, processing, control and distribution ofmicrowave, millimeter-wave and THz-frequency signals. Microwavephotonics serves as an enabling technology in a wide variety ofapplications such as signal generation and distribution, high-speedwireless communication networks, radar systems, sensors, andmodern instrumentation. The 2013 International Topical Meeting onMicrowave Photonics (MWP 2013) will provide a forum for thepresentation of new advances in this multi-disciplinary researcharea, ranging from novel devices to system field trials. MWP 2013is now soliciting papers for the conference.Conference Scope:• Radio-over-fiber systems• Photonic techniques for microwave backhaul• Photonic systems for antennas and beamforming• Optical technologies for high-frequency wireless systems andUWB systems• Microwave photonic technologies for biomedical applications• High-speed and/or broadband photonic devices• Integration technologies for microwave photonic devices• Optical analog-to-digital converters• Optical probing and sensing of microwave properties• Optical generation of RF, microwave, millimeter-wave and THzwaves and optoelectronic oscillators• Optical processing and control of analog and digital signals• Optical distribution of subcarrier multiplexed voice, data, and video• Innovative applications of microwave photonicsGeneral ChairEdward AckermanPhotonic Systems, Inc.TPC ChairPaul MatthewsNorthrop Grumman Corp.FinanceRobert AlongiIEEE Boston SectionPublicityYifei LiUMass DartmouthSponsorshipAdil KarimJohns Hopkins UniversityExhibit CoordinatorVincent UrickNaval Research LaboratoryStudent Paper ContestTom ClarkJohns Hopkins UniversityWebsiteKathleen BallosBallos AssociatesLocal Arrangements:Dalma NovakRod WaterhousePharad USAConference VenueHotel Monaco - Alexandria480 King StreetAlexandria, VA 22314 USAAugust 2013 IEEE PHOTONICS SOCIETY NEWSLETTER 55

ADVERTISER’S INDEXThe Advertiser’s Index contained in this issue iscompiled as a service to our readers and advertisers.The publisher is not liable for errors or omissionsalthough every effort is made to ensure itsaccuracy. Be sure to let our advertisers know youfound them through the IEEE Photonics SocietyNewsletter.Advertiser . . . . . . . . . . . . . Page #General Photonics . . . . . . . . . . . . . .CVR 2Woodhead Publishing LTD . . . . . . . . . . 17IEEE Marketing Department . . . . . . . . 23NANOLN . . . . . . . . . . . . . . . . . . . .CVR 3Optiwave Systems Inc . . . . . . . . . . .CVR 4Photonics SocietyMission StatementPhotonics Society shall advance the interestsof its members and the laser, optoelectronics,and photonics professional community by:• providing opportunities for informationexchange, continuing education, andprofessional growth;• publishing journals, sponsoring conferences,and supporting local chapter andstudent activities;• formally recognizing the professionalcontributions of members;• representing the laser, optoelectronics,and photonics community and serving asits advocate within the IEEE, the broaderscientific and technical community, andsociety at large.Photonics SocietyField of InterestThe Field of Interest of the Society shall be lasers,optical devices, optical fibers, and associatedlightwave technology and their applicationsin systems and subsystems in which quantumelectronic devices are key elements. The Societyis concerned with the research, development,design, manufacture, and applications of materials,devices and systems, and with the variousscientific and technological activities whichcontribute to the useful expansion of the field ofquantum electronics and applications.The Society shall aid in promoting close cooperationwith other IEEE groups and societiesin the form of joint publications, sponsorshipof meetings, and other forms of informationexchange. Appropriate cooperative efforts willalso be undertaken with non-IEEE societies.IEEE PhotonicsSociety NewsletterAdvertising Sales Offices445 Hoes Lane, Piscataway NJ 08854www.ieee.org/ieeemediaImpact this hard-to-reach audience in their own Societypublication. For further information on product andrecruitment advertising, call your local sales office.MANAGEMENTJames A. VickSr. Director, AdvertisingPhone: 212-419-7767Fax: 212-419-7589jv.ieeemedia@ieee.orgSusan E. SchneidermanBusiness DevelopmentManagerPhone: 732-562-3946Fax: 732-981-1855ss.ieeemedia@ieee.orgMarion DelaneyAdvertising Sales DirectorPhone: 415-863-4717Fax: 415-863-4717md.ieeemedia@ieee.orgPRODUCTADVERTISINGMidatlanticLisa RinaldoPhone: 732-772-0160Fax: 732-772-0161lr.ieeemedia@ieee.orgNY, NJ, PA, DE, MD, DC,KY, WVNew England/South Central/Eastern CanadaJody EstabrookPhone: 774-283-4528Fax: 774-283-4527je.ieeemedia@ieee.orgME, VT, NH, MA, RI, CT,AR, LA, OK, TXCanada: Quebec, Nova Scotia,Newfoundland, Prince EdwardIsland, New BrunswickSoutheastThomas FlynnPhone: 770-645-2944Fax: 770-993-4423tf.ieeemedia@ieee.orgVA, NC, SC, GA, FL, AL,MS, TNMidwest/Central CanadaDave JonesPhone: 708-442-5633Fax: 708-442-7620dj.ieeemedia@ieee.orgIL, IA, KS, MN, MO, NE,ND, SD, WI, OHCanada: Manitoba,Saskatchewan, AlbertaMidwest/Ontario, CanadaWill HamiltonPhone: 269-381-2156Fax: 269-381-2556wh.ieeemedia@ieee.orgIN, MI. Canada: OntarioWest Coast/Northwest/Western CanadaMarshall RubinPhone: +1 818 888 2407;Fax: +1 818 888 4907mr.ieeemedia@ieee.orgAZ, CO, HI, NM, NV,UT, AK, ID, MT, WY,OR, WA, CA. Canada:British ColumbiaEurope/Africa/Middle EastHeleen VodegelPhone: +44-1875-825-700Fax: +44-1875-825-701hv.ieeemedia@ieee.orgEurope, Africa, Middle EastAsia/Far East/Pacific RimLouise SmithPhone: +44-1875-825-700Fax: +44-1875-825-701les.ieeemedia@ieee.orgAsia, Far East, Pacific Rim,Australia, New ZealandRECRUITMENTADVERTISINGMidatlanticLisa RinaldoPhone: 732-772-0160Fax: 732-772-0161lr.ieeemedia@ieee.orgNY, NJ, CT, PA, DE, MD,DC, KY, WVNew England/Eastern CanadaLiza ReichPhone: +1 212 419 7578Fax: 212-419-7589e.reich@ieee.orgME, VT, NH, MA, RICanada: Quebec,Nova Scotia,Prince Edward Island,Newfoundland,New BrunswickSoutheastCathy FlynnPhone: 770-645-2944Fax: 770-993-4423cf.ieeemedia@ieee.orgVA, NC, SC, GA, FL, AL,MS, TNMidwest/Texas/CentralCanadaDarcy GiovingoPhone: 847-498-4520Fax: 847-729-4269dg.ieeemedia@ieee.org;AR, IL, IN, IA, KS, LA,MI, MN, MO, NE, ND,SD, OH, OK, TX, WI.Canada: Ontario,Manitoba, Saskatchewan,AlbertaWest Coast/Southwest/Mountain States/AsiaTim MattesonPhone: 310-836-4064Fax: 310-836-4067tm.ieeemedia@ieee.orgAZ, CO, HI, NV, NM,UT, CA, AK, ID, MT,WY, OR, WA.Canada: British ColumbiaEurope/Africa/Middle EastHeleen VodegelPhone: +44-1875-825-700Fax: +44-1875-825-701hv.ieeemedia@ieee.orgEurope, Africa,Middle East56 IEEE PHOTONICS SOCIETY NEWSLETTER August 2013