PDF of August Issue - IEEE Photonics Society
PDF of August Issue - IEEE Photonics Society
PDF of August Issue - IEEE Photonics Society
- No tags were found...
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
Editor’sColumnHON TSANGThis month’s issue has a central theme, close to my own researchinterests, on energy efficiency in telecommunicationsand silicon photonics. Pr<strong>of</strong>essor Rod Tucker highlightssome conclusions from work at the Center <strong>of</strong> Energy EfficientTelecommunications at Melbourne University. Usingan assumption <strong>of</strong> 15% per year continued improvement inthe energy efficiency <strong>of</strong> network equipment, the global internet’spower consumption, not including the power usedby wireless networks, is projected to double by 2020, anduse 2% <strong>of</strong> the electrical power generated in the world. Manygroups are working hard to improve the energy efficiency<strong>of</strong> the internet. If such research bears fruit, it could reversethe historical trend <strong>of</strong> increasing relative power consumptionin network equipment, and then the energy efficiency<strong>of</strong> computer servers may become more important. Accordingto Tucker’s article, computer servers today consume lesspower than access networks, but their relative power consumptionwill rise until they surpass access network equipmentin the two years’ time. This is one reason why siliconphotonics may become relevant in the power consumptionin the internet. Power consumption already constrain highperformance microprocessors to operate at lower clock frequencies(a few GHz) than that possible with state <strong>of</strong> theart CMOS transistors (tens <strong>of</strong> GHz). The power consumedby electrical interconnects accounts for a significant fraction<strong>of</strong> the power in today’s microprocessors. Reduction inthe power consumption <strong>of</strong> high speed interconnects can allowcomputers to operate at higher speeds or with lowerpower consumption at the same speed. Potential improvedenergy efficiency <strong>of</strong> on-chip photonic interconnects is one<strong>of</strong> the motivations for research in silicon photonics (thereare others, including the prospect for low cost integration<strong>of</strong> multiple photonic functions in telecommunications, andphotonic sensors). In this month’s issue Pr<strong>of</strong>essor LukasChrostowski summarizes the support <strong>of</strong> silicon photonicsresearch via workshops and foundry-like services under thesilicon EPIC programme, which is supported until 2018by NSERC in Canada and which is typical <strong>of</strong> programmesalready established in Europe and Asia. Also in this issueare highlights <strong>of</strong> recent work on monolithic integration <strong>of</strong>III-V quantum dot lasers on silicon by the group at UniversityCollege London led by Pr<strong>of</strong>essors Alwyn Seeds andHuiyun Liu. In the conference section, Pr<strong>of</strong>essor MichaelHochberg reports on the Rump Session on “Silicon <strong>Photonics</strong>:Disruptive Technology or Research Curiosity” atthis year’s OFC. The large number <strong>of</strong> people who attendedthis session attest to the strong interest on silicon photonicsin the photonics community.I hope you enjoy this month’s articles. Please feel freepost comments on http://www.facebook.com/<strong>Photonics</strong>-<strong>Society</strong> or send your comments by email to us.Hon Tsang<strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>PresidentHideo KuwaharaFujitsu Laboratories4-1-1, Kamikodanaka, NakaharaKawasaki, 211-8588, JapanTel: +81 44 754 2068Fax: +81 44 754 2580Email: kuwahara.hideo@jp.fujitsu.comPast PresidentJames ColemanDept <strong>of</strong> E & C EngineeringUniversity <strong>of</strong> Illinois208 N. Wright StreetUrbana, IL 81801-2355Tel: +217 333 2555Email: j.coleman@ieee.orgSecretary-TreasurerDalma NovakPharad, LLC797 Cromwell Park DriveSuite VGlen Burnie, MD 21061Tel: +410 590 3333Email: d.novak@ieee.orgBoard <strong>of</strong> GovernorsJ. S. Aitchison P. AndreksonS. Bigo M. DawsonP. Juodawlkis A. KirkF. Koyama J. McInerneyM. Nakazawa D. NovakP. Smowton M. WuVice PresidentsConferences - D. PlantFinance & Administration – C. JagadishMembership & RegionalActivities – J. KashPublications – B. TkachTechnical Affairs – K. ChoquetteNewsletter StaffExecutive EditorHon K. TsangDepartment <strong>of</strong> Electronic EngineeringThe Chinese University <strong>of</strong> Hong KongShatin, Hong KongTel: +852 - 39438254Fax: +852 - 26035558Email: hktsang@ee.cuhk.edu.hk<strong>IEEE</strong> prohibits discrimination, harassment, andbullying. For more information, visit http://www.ieee.org/web/aboutus/whatis/policies/p9-26.html.Associate Editor <strong>of</strong> Asia & PacificChristina LimDepartment <strong>of</strong> Electrical &Electronic EngineeringThe University <strong>of</strong> MelbourneVIC 3010 AustraliaTel: +61-3-8344-4486Email: chrislim@unimelb.edu.auAssociate Editor <strong>of</strong> CanadaLawrence R. ChenDepartment <strong>of</strong> Electrical &Computer EngineeringMcConnell Engineering Building,Rm 633McGill University3480 University St.Montreal, QuebecCanada H3A-2A7Tel: +514 398 1879Fax: 514 398 3127Email: lawrence.chen@mcgill.caAssociate Editor <strong>of</strong> Europe/Mid East/AfricaKevin A. WilliamsEindhoven University <strong>of</strong> TechnologyInter-University Research InstituteCOBRA on CommunicationTechnologyDepartment <strong>of</strong> ElectricalEngineeringPO Box 5135600 MB Eindhoven,The NetherlandsEmail: K.A.Williams@tue.nlStaff EditorLisa Manteria<strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>445 Hoes LanePiscataway, NJ 08854Tel: 1 732 465 6662Fax: 1 732 981 1138Email: ipsnewsletter@ieee.orgSFI LOGO<strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> News (USPS 014-023) is published bimonthlyby the <strong>Photonics</strong> <strong>Society</strong> <strong>of</strong> the Institute <strong>of</strong> Electrical andElectronics Engineers, Inc., Corporate Office: 3 Park Avenue, 17thFloor, New York, NY 10017-2394. Printed in the USA. One dollar permember per year is included in the <strong>Society</strong> fee for each member<strong>of</strong> the <strong>Photonics</strong> <strong>Society</strong>. Periodicals postage paid at New York,NY and at additional mailing <strong>of</strong>fices. Postmaster: Send addresschanges to <strong>Photonics</strong> <strong>Society</strong> Newsletter, <strong>IEEE</strong>, 445 Hoes Lane,Piscataway, NJ 08854.Copyright © 2013 by <strong>IEEE</strong>: Permission to copy without fee all orpart <strong>of</strong> any material without a copyright notice is granted providedthat the copies are not made or distributed for direct commercialadvantage, and the title <strong>of</strong> the publication and its dateappear on each copy. To copy material with a copyright noticerequires specific permission. Please direct all inquiries or requeststo <strong>IEEE</strong> Copyrights Office.2 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
President’sColumnHIDEO KUWAHARAI am writing this column manuscript in San Jose, California,while attending CLEO2013. The conference is exciting, asalways, gathering 1198 oral, 320 poster and 189 invited papers,as well as 24 tutorials and 20 short courses, with in-depthpresentations by experts, all covering new trends in photonicstechnologies, such as novel materials and devices. I think one<strong>of</strong> the highlights is the plenary session, and we had three splendidplenary talks: “Attosecond <strong>Photonics</strong>” by Paul Corkum,“Parametric Down Conversion Over Fifty Years: From Microwaveto X-Rays” by Stephen Harris, and “QCLs RevolutionizingMWIR and LWIR Applications” by Kumar Patel. Theirpresentations will be posted on the CLEO website.Another highlight <strong>of</strong> the plenary session was the report onthe National <strong>Photonics</strong> Initiative (NPI) by Pr<strong>of</strong>. Alan Willner<strong>of</strong> Southern California University, who is a former president <strong>of</strong>IPS. He discussed the current status <strong>of</strong> the NPI, which is aninitiative designed to highlight the importance <strong>of</strong> photonicstechnologies. The NPI was started based partially on a recommendationfrom the U.S. National Academies’ Report on Opticsand <strong>Photonics</strong> and is a collaborative initiative sponsored byfive pr<strong>of</strong>essional societies: APS, <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>, OSA,SPIE, and LIA. The core concept <strong>of</strong> the NPI is that photonicsis an essential technology enabling today’s ICT-based society,on a par with semiconductor technology. For example, whenwe click on a Google search item, the information is transmittedthrough photonic networks and is processed in data centersin which millions <strong>of</strong> optical interconnects are used. Today’sproliferation <strong>of</strong> cloud-based technologies would be impossiblewithout photonic networks. The important role <strong>of</strong> photonicsin our daily life is not well understood, or even given a moment’snotice, by the general public. Although the NPI wasoriginally conceived as a way to appeal to decision-makers inthe U.S., photonics technology, itself, has no national borders.Therefore, given that the and the fact that <strong>IEEE</strong> is a globalorganization, it is not a stretch to think <strong>of</strong> the global publicas being a natural audience for the NPI’s message. When Iassumed the role <strong>of</strong> IPS president in the beginning <strong>of</strong> 2012, Ihad in my mind a similar notion that IPS should highlight theimportance <strong>of</strong> photonics technology to the general public, includingstudents and researchers at large as potential IPS members.I think we should communicate the essential message <strong>of</strong>the NPI globally, and we must think about what we can do toeducate the general public about photonics technology.At the plenary session <strong>of</strong> CLEO2013, we also had a recognitionceremony, and this time four new Fellows associated withIPS were recognized. The IPS Young Investigator Award waspresented to Alexandra Boltasseva <strong>of</strong> Purdue University. Congratulationsto our new Fellows and Alexandra!CLEO2013 highlighted progress in the area <strong>of</strong> nanophotonics,including plasmonics and metamaterials, seemingly anarea that is attracting even more attention than Si photonics.Similar to the message conveyed in discussions at the OpticalInterconnect Conference held in May in Santa Fe, New Mexico,there was an emphasis on lower power consumption andhigher spatial density as being the crucial needs from the systemside. Recent reports in nanophotonics on the interactionbetween photons and materials through plasmonics may representa breakthrough in overcoming the weakness <strong>of</strong> photonsas a boson in interacting with matter. IPS is also increasingour efforts in publications and conferences on these areas, withthe aim <strong>of</strong> transitioning nanophotonics from a lab curiosity toa practical technology.As for the issue <strong>of</strong> energy, I cannot help thinking about therecent string <strong>of</strong> violent weather-related incidents around theworld, including tornados and hurricanes in US and floodingin central Europe in May and June. Of course I hope this trendwill diminish. Unfortunately, however, the reality is that it willprobably increase, and I think the reason stems mainly fromglobal warming and the resulting elevated thermal equilibriumand dynamic range <strong>of</strong> climate change. Please refer to thearticle “Global CO2 Concentration Reaches 400 ppm” by BillSweet in the <strong>IEEE</strong> Spectrum Energywise Newsletter posted onMay 22, 2013. I have raised this issue several times in thiscolumn, but I still feel we need to start serious discussions onglobal warming. The Kyoto Protocol no longer appears to beeffective. In dry areas <strong>of</strong> the world, there are severe droughts,and desertification is expanding, which can lead to food shortagesand social instability. I realize this discussion exceeds thebounds <strong>of</strong> the <strong>Photonics</strong> <strong>Society</strong>, but I think there is a pressingneed in the world for a broad discussion on renewable energy,not just about photovoltaic energy. Of course, economic issuesare important, but the issue <strong>of</strong> global warming may be evenmore important.<strong>Photonics</strong> <strong>Society</strong> and <strong>IEEE</strong> MattersOn the occasion <strong>of</strong> CLEO2013, IPS had some internal committee/councilmeetings. Editor meetings <strong>of</strong> the Journal <strong>of</strong> QuantumElectronics and <strong>Photonics</strong> Journal were held, and manyopinions were discussed with the editors-in-chief and associateeditors to improve and strengthen our journals. A TechnicalAffairs Council meeting was also held to discuss new technologytrends for our future planning.The <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> started to use social media andnow issues the <strong>IEEE</strong> <strong>Photonics</strong> Daily e-newsletter. Please jointo get quick micro-blogs on <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> programs,photonics research and innovation news, publications andmembership information, and upcoming conference details.Among the activities <strong>of</strong> the <strong>IEEE</strong>, the peer review process tomaintain high-quality standards for published papers is one <strong>of</strong>the most important activities, and we must bear in mind againthe importance <strong>of</strong> the peer review process for submitted papers.The process is supported by the volunteer efforts <strong>of</strong> reviewers(continued on page 45)<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 3
Research HighlightsResearch at the University <strong>of</strong> Melbourne’sCentre for Energy-Efficient TelecommunicationsRodney S. Tucker, Fellow, <strong>IEEE</strong>Abstract—This paper provides an overview <strong>of</strong> research activitiesin the University <strong>of</strong> Melbourne’s Centre for Energy- EfficientTelecommunications.Index Terms—Telecommunications, photonics, energyconsumption, energy efficiency.BackgroundIn 2002, the Australian Research Council awarded me afive-year research fellowship, titled “towards an all-opticalInternet”. I hoped that the research carried out under this fellowshipwould contribute to the dream that many researchershad been pursuing during the 1990’s and early 2000’s—anoptical communications network that would be freed from theconstraints and limitations <strong>of</strong> electronic devices. According tothe dream, this all-optical network would circumvent the needfor data to undergo endless optical to electronic and electronicto optical conversions as it passed through the network, andopen the way to huge increases in bandwidth.I was very enthusiastic about the concept <strong>of</strong> the all-opticalnetwork. Over a number <strong>of</strong> years, I worked with students andcolleagues on a variety <strong>of</strong> all-optical enabling technologies, includingall-optical wavelength converters, data format converters,serializers and deserializers, and optical packet switches.Like many other researchers working on all-optical technologies,most <strong>of</strong> my work had been limited to small-scale demonstrations<strong>of</strong> devices, and lacked any careful considerations <strong>of</strong>how these devices could scale to be usefully incorporated intoa full-size network.My goal, for the five years <strong>of</strong> research under the fellowship,was to figure out how to build full-size networks using theFigure 1. CEET research team.available all-optical devices, and if this proved to be impossible,to develop an understanding <strong>of</strong> what new all-optical technologieswould be needed to make the dream <strong>of</strong> an all-opticalnetwork become a reality.After a year or two <strong>of</strong> efforts to work out how to build ascalable all-optical network, the penny finally dropped. Itslowly became clear to me that all-optical concepts do not scalewell to large continental or global-scale networks. One reasonis that because optical devices are analog rather than digital,crosstalk between separate signals becomes a limiting factorwhen it comes to scaling to large networks. But more importantthan crosstalk is the issue <strong>of</strong> energy consumption.Like many <strong>of</strong> my colleagues in other research labs, I hadpreviously paid little or no attention to the energy consumption<strong>of</strong> the various all-optical devices I had been working on.But when I started taking the energy consumption <strong>of</strong> variousall-optical devices into account, I realized that the viability <strong>of</strong>the all-optical network might be fundamentally limited bythe fact that it could consume astronomically large amounts<strong>of</strong> energy.This insight into the importance <strong>of</strong> energy consumptionled me to focus my research on the issue <strong>of</strong> energy consumptionin telecommunications. Together with a group <strong>of</strong> colleagues,I re-focussed my research on the energy efficiencyall-optical devices and circuits in comparison with the energyefficiency <strong>of</strong> conventional optical and electronic devices andcircuits.The Australian Research Council decided not to renewmy fellowship—I suspect that this might have been becauseI had taken an about-face in my research direction. Nevertheless,together with Alcatel-Lucent andwith government support, the Centrefor Energy-Efficient Telecommunications(CEET) was established at the University<strong>of</strong> Melbourne in 2009, and a team <strong>of</strong> some20 researchers was assembled to tackle thequestion <strong>of</strong> how to quantify and improvethe energy efficiency <strong>of</strong> telecommunicationsnetworks. Fig. 1 shows the CEETresearch team among Melbourne University’scloisters.Why is Energy Important?Attempts to quantify the energy consumption<strong>of</strong> networks and data centresbegan in the early 1990’s. Early work focusedon an inventory-counting approachthat counts all purchased equipment and4 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
estimates how much <strong>of</strong> that equipment is in the network, andadds up the power consumption <strong>of</strong> all the equipment. Ourgroup at the University <strong>of</strong> Melbourne decided to take a network-orientedapproach. In this approach, we design a networkcapable <strong>of</strong> providing a given bit rate to a given number <strong>of</strong> usersand then repeat this design for a range <strong>of</strong> user numbers and arange <strong>of</strong> bit rates to each user [1].Fig. 2 shows our estimates <strong>of</strong> the total power consumption<strong>of</strong> the global Internet as a function <strong>of</strong> time (excluding the wirelessaccess network), from 2010 to 2020. In this estimate thenumber <strong>of</strong> users is taken to be 1.5 billion in 2010, and increasesat 10% per annum. Likewise, our calculations are based on a40% per annum increase in bit rates per user.The lines in Fig. 2 represent power consumption for anetwork in which the energy efficiency <strong>of</strong> all equipment inthe network (measured in terms <strong>of</strong> capacity in Gigabits persecond <strong>of</strong> throughput per Watt <strong>of</strong> power consumption) improvesat 15% per annum. This improvement rate is representative<strong>of</strong> the improvements that are achieved in successivegenerations <strong>of</strong> network equipment, but is a fairly optimisticimprovement rate for the entire network because most equipmentin the network is replaced much less <strong>of</strong>ten than on anannual basis.The solid red line represents the total power consumption<strong>of</strong> the network for a 15% per annum improvements in equipmentefficiency. The broken red line represents the total powerconsumption <strong>of</strong> a (pessimistic) scenario where none <strong>of</strong> theequipment in the network improves in efficiency over time andmaintains the same efficiency as 2010 technology. For comparison,the broken black line at the top <strong>of</strong> Fig. 2 shows the globalelectricity supply, which is growing at about 3% per annum.It can be seen from Fig. 2 that the total power consumption<strong>of</strong> the network grows from about 1% <strong>of</strong> the global electricitysupply in 2010 to about 2% or 18% <strong>of</strong> the global electricitysupply in 2020, depending on the rate <strong>of</strong> improvement <strong>of</strong>equipment energy efficiency.The purple line is the projected power consumption <strong>of</strong> theaccess network. Our calculations are based on a Passive OpticalNetwork (PON) network, which is the greenest <strong>of</strong> all fixed accessnetworks. Despite this conservatism, it is clear from Fig. 2that the access network currently dominates the total powerconsumption <strong>of</strong> the network, and will do so until about 2015.Given that not all users have access to PON technology, thedata in Fig. 2 is conservative.The green line in Fig. 2 represents the power consumed byall servers in the data centres connected to the network. Thispower consumption is increasing, due to the continuous rise inapplications that terminate on data centres. As shown in Fig. 2,the server power consumption will exceed the access poweraround 2015.The next most important contributors to network powerconsumption are the switches and routers in the core and metronetwork (blue line), followed by the switches and routers locatedin data centers. Finally, the green line represents the totalpower consumption <strong>of</strong> all optical transport equipment in thenetwork. The good news for optical transport engineers is thattheir part <strong>of</strong> the network contributes only a small amount tothe total power consumption.Power Consumption (W)10 12 Global Electricity Supply (3% p.a.)Total (2010 Technology)10 11Total10 10Access (PON)ServersCore and Metro10 915% p.a. ImprovementNetworking Within in All Technology10 8 Data Centers2010 2015 2020YearFigure 2. Projected power consumption <strong>of</strong> the global wiredinternet.Some Research in Energy-EfficientTelecommunicationsIn collaboration with GreenTouch, CEET researchers arepursuing a number <strong>of</strong> avenues that we believe will assist inthe understanding <strong>of</strong> where energy is consumed in the network,and how that energy consumption can be managed.Here are three examples <strong>of</strong> projects in CEET that aim to betterquantify, understand, and manage the energy consumption<strong>of</strong> the network.Cloud Computing, Content Distributionand Information LogisticsCloud computing provides a range <strong>of</strong> on-demand applicationssuch as storage, s<strong>of</strong>tware applications and social networking services,both to business and consumers. These services are hostedin data centres and accessed remotely through a network connectionby end users. Cloud services will see dramatic growth intothe future as more and more applications are delivered remotely.The energy consumption <strong>of</strong> a cloud service or application isbased on the consumption <strong>of</strong> all <strong>of</strong> its components – computingresources, storage and network transport. An increasingvolume <strong>of</strong> cloud services will be accessed from mobile devices,the least energy-efficient access network technology.Previous research into the energy-efficiency <strong>of</strong> cloud serviceshas compared the relationship between local and remoteprocessing. These analyses generally fail to include the energyinvolved in the transport <strong>of</strong> data between the user and thecloud. To address this issue CEET is working on a model <strong>of</strong>cloud computing that takes into account the full energy costsassociates with data transport [2].To illustrate why transport energy costs may be importantto cloud-based services, we have measured the data requiredto serve simple operations on a cloud-based word-processingapplication. Fig. 3(a) shows the measurement technique, usingthe well-known packet sniffer Wireshark. Fig. 3(b) shows thedownstream, upstream, and total traffic as text is entered intothe user’s keyboard.The top curve in Fig. 3(b) shows that the total traffic(the sum <strong>of</strong> the upstream and downstream traffic) is about<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 5
PONCentralOfficeOpticalFront-EndsAggregationSwitchOpticalSplitterPtPOptical NetworkTerminationPremisesInternet DataPower ConsumptionPer Subscriber
team is also developing new sleep-mode mechanisms for differentfiber access networks, to further improve the power efficiencyespecially during times when traffic is light.Where to From HereMany research groups around the world are working on energyin telecommunications networks. At the time <strong>of</strong> writing,GreenTouch has announced that it is well on the way toachieving its long-term objective <strong>of</strong> improving the energyefficiency <strong>of</strong> ICT networks by a factor <strong>of</strong> 1000 [8]. An excitingimplication <strong>of</strong> the GreenTouch announcement is that ifthe technologies and architectures developed by GreenTouchcan be incorporated into the network, the rise in power consumption<strong>of</strong> the network projected in Fig. 2 could not onlybe stopped, but could even be turned into a decrease in overallpower consumption over time. Good progress is beingmade, but there remains plenty <strong>of</strong> scope for further improvementsin energy efficiency.References[1] J. Baliga, R. Ayre, K. Hinton, W. Sorin, and R.S. Tucker,“Energy consumption in optical IP Networks,” J. LightwaveTechnol., vol. 27, 2009, pp. 2391–2403.[2] J. Baliga, R. Ayre, K. Hinton and R.S. Tucker, “GreenCloud Computing: Balancing Energy in Processing,Storage and Transport”, Proc. <strong>IEEE</strong>, vol. 99, Jan. 2011,pp. 149–167.[3] A. Vishwanath, F. Jalali, R. Ayre, T. Alpcan, K. Hintonand R. S. Tucker, “Energy Consumption <strong>of</strong> InteractiveCloud-Based Document Processing Applications,” Proc.<strong>IEEE</strong> International Conference on Communications (ICC),Hungary, Jun 2013.[4] C. A. Chan, A. F. Gygax, E. Wong, C. A. Leckie, A. Nirmalathas,and D. C. Kilper, “Methodologies for Assessingthe Use-Phase Power Consumption and GreenhouseGas Emissions <strong>of</strong> Telecommunications Network Services,”Environ. Sci. Technol., vol. 47, Jan. 2013, pp. 485–492.[5] C. A. Chan, E. Wong, A. Nirmalathas, A. F. Gygax,C. A. Leckie, and D. C. Kilper, “Towards An Energy RatingSystem for Telecommunications,” TelecommunicationsJournal <strong>of</strong> Australia, vol. 62, Nov. 2012, pp. 77.1–77.10.[6] H. Chow, D. Suvakovic, D. Van Veen, A. Dupas, R.Boislaigue, R. Farah, M.F. Lau, J. Galaro, G. Qua, N. P.Anthapadmanabhan, G. Torfs, C. Van Praet, X. Yin, andP. Vetter, “Demonstration <strong>of</strong> Low-Power Bit-InterleavingTDM PON,” Proc. 38th European Conference andExhibition on Optical Communication (ECOC), paperMo.2.B.1, Sep. 2012.[7] K-L. Lee, B. Sedighi, R.S. Tucker, H. Chow, and P. Vetter,“Energy Efficiency <strong>of</strong> Optical Transceivers in Fiber AccessNetworks,” J. Opt. Commun. Netw., vol. 4, no. 9,pp. A59-A68, Sep. 2012.[8] http://www.greentouch.org/index.php?page=green-meter-research“Nick” Cartoon Series by Christopher Doerr8 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Research HighlightsTraining in Silicon <strong>Photonics</strong> Research in CanadaBy Lukas Chrostowski, Associate Pr<strong>of</strong>essor, Electrical and Computer Engineering,University <strong>of</strong> British Columbia; NSERC SiEPIC Program DirectorThe Silicon Electronic-Photonic Integrated Circuits (Si-EPIC)NSERC CREATE research training program [1], funded until2018, has been developed in response to the rapidly emergingfield <strong>of</strong> silicon photonics. Globally, we are on the cusp <strong>of</strong>revolutionary changes in communication and microsystemstechnology through the marriage <strong>of</strong> photonics (manipulation<strong>of</strong> information using light, or photons) and electronics (informationprocessing using electrical current) on a single platform(silicon). How is this relevant to society? The miniaturization<strong>of</strong> optical components onto silicon chips will enable tremendousdevelopments and will play a ubiquitous role globally,impacting such areas as high-speed communications for mobiledevices, optical communications within computers andwithin data centres, sensor systems, and medical applications.Our training program emphasizes student design <strong>of</strong> “commercializable”single-chip systems for far-reaching industryrelevantapplications.The Si-EPIC CREATE program builds on the success <strong>of</strong>our pioneering nation-wide training workshops in silicon photonics,<strong>of</strong>fered in partnership with CMC Microsystems, whichbegan as a pilot course at the University <strong>of</strong> British Columbiain 2008 [2]. Since then, over 100 participants have takenour workshops from over 18 universities and from industry.The emphasis is to train students to be innovative designersusing world-leading industrial CMOS foundry processes andto engage in innovation and commercialization with industrypartners. Si-EPIC uses a successful collaborative-teachingmodel [2], which consists <strong>of</strong> week-long workshops taught byup to 20 instructors and presenters, which are followed by design–fabricate–testcycles. Workshops provide students withleading-edge interdisciplinary exposure to both electronics andphotonics, and to both devices and systems. Our program <strong>of</strong>fersthe following annual workshops, which are open to bothacademics and industry:1) Passive Silicon <strong>Photonics</strong> – topics including fibre gratingcouplers, resonators (rings, disks, Bragg gratings,photonic crystals), splitters (Y-branches, directionalcouplers), and various optical filters.2) Active Silicon <strong>Photonics</strong> – with an emphasis on highspeedmodulators and detectors. Next <strong>of</strong>fered July10-16, 2013, at McGill University.3) CMOS Electronics for Silicon <strong>Photonics</strong> – with anemphasis on analog circuit design for optical transmitterand receivers, and tuning circuits. It will be <strong>of</strong>feredfor the first time during <strong>August</strong> 26–30, 2013, at theUniversity <strong>of</strong> British Columbia.4) Systems, Integration, Packaging – including CMOSand photonic integration strategies, and system-leveldesign and modelling. It will be <strong>of</strong>fered in late 2013or 2014.The Si-EPIC program <strong>of</strong>fers students from across Canada theunique, coordinated design and test support by CMC Microsystems,with access to leading-edge industrial design s<strong>of</strong>twareand fabrication processes. As is the case in the microelectronicsSiEPIC Passive Silicon <strong>Photonics</strong> workshop and tour <strong>of</strong> the C2MI MiQro Innovation Collaborative Centre in Bromont, Quebec.<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 9
Automated chip-scale optical probe stations facilitate the measurement<strong>of</strong> thousands <strong>of</strong> optical devices.SiEPIC scholar Ms. Samantha Grist is testing silicon nanophotonicbiosensors.Designed by scholar Mr. Xu Wang, waveguide Bragg gratingdevices function as filters for on-chip signal processing applications,and as sensors for biomedical applications.world, working together on a common foundry platform hasthe following advantages:1) Resource Efficiency – working in a “fabless” modelreduces the need for in-house cleanrooms and costlyprocess development.2) Design Re-Use – the electronics industry benefits byreusing building blocks termed Intellectual Property(IP) cores rather than designing systems (such asprocessors) from the transistor up for each new design(over 1 billion transistors). Similarly, we are buildinga shared library <strong>of</strong> Silicon <strong>Photonics</strong> IP cores. Thisfacilitates collaborative systems-level research anddevelopment.3) Transferability for commercialization – allowsindustry to our library in a plug-and-play fashion todesign new products that will be fabricated by a commonfoundry.4) Encourages collaborative design – facilitated bycommon goals, language, workshops, and a library.Our team conducts research in modelling tools and methods,design, fabrication, test and measurement, and packaging<strong>of</strong> both devices and systems. The research objectives areto a) collaboratively develop new technologies, b) incorporatethese into the Si-EPIC library, and c) use the library to drivefurther innovation, both academic and industrial. Some <strong>of</strong> thesystems-level research topics include communication systemsfor data centers, fibre-to-the-home, and on-chip networks;quantum-based, ultra-secure information networks usingnon-classical light; and wireless communications. Devicelevel research includes optical detectors, high-speed modulators,lasers and their integration with silicon, a variety <strong>of</strong> passiveoptical components such as on-chip spectrometers, andelectronics.More information about the program and the workshopscan be found at our web page, http://www.siepic.ubc.ca.References[1] http://www.siepic.ubc.ca[2] L. Chrostowski, N. Rouger, D. Deptuck, N. A. F. Jaeger,“Silicon Nanophotonics Fabrication: an InnovativeGraduate Course,” (invited) 17th Int. Conf. on Telecommunications,Qatar, 04/2010.10 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Research HighlightsMonolithic Integration <strong>of</strong> III-V Quantum-DotLasers on Silicon for Silicon <strong>Photonics</strong>Jiang Wu, Qi Jiang, Andrew Lee, Mingchu Tang, Alwyn Seeds, Huiyun LiuAbstract—Silicon, the most popular material for electronic integratedcircuits, has been widely investigated as a platform forphotonic integration since the 1980s. Silicon photonics holdsgreat promise to provide better systems in terms <strong>of</strong> speed, bandwidth,and energy efficiency while still remaining cost-effectivecompared to current microelectronics. Although silicon is ableto fulfill the criteria <strong>of</strong> many photonic devices, the electricallypumped laser based on silicon remains the ‘holy grail’ for Siphotonics. Could III-V semiconductors provide an answer forefficient light sources on silicon platform? III-V semiconductorsdo afford excellent optical properties, but monolithic integration<strong>of</strong> III-V on silicon substrates is challenging. This articlepresents a review <strong>of</strong> monolithic growth <strong>of</strong> III-V quantum dotlaser diodes on a silicon platform at University College London.These results provide a feasible means for monolithically integratingIII-V materials on Si platform for photonic circuitry.I. IntroductionOver the last few decades, silicon-based integrated circuits(ICs) have become faster, more compact, and more functional.The boom in ICs has a high bandwidth requirement to keeppace with computer chip performance. On the other hand,it becomes increasingly challenging for copper interconnectsto meet the current data communication requirements. Thedevelopment <strong>of</strong> current information technology requires integration<strong>of</strong> photonic devices for the reasons <strong>of</strong> high bandwidthdemand and energy-efficient operation [1]. The maturity <strong>of</strong>electronic IC technology makes silicon the most desired platformfor advanced optoelectronic integrated circuits. Despitegreat advances in silicon photonics over recent years, efficientlight sources on silicon platform remain one <strong>of</strong> the greatestchallenges facing silicon photonics because <strong>of</strong> the indirectbandgap <strong>of</strong> silicon. In general, III-V materials are used for highefficiency optical devices due to their superior optical properties.Direct growth <strong>of</strong> III-V materials on silicon substratescould potentially revolutionize the development <strong>of</strong> siliconphotonics [2]. However, structural differences between siliconand III-V semiconductors make the integration <strong>of</strong> III-V opticaldevices on silicon platform non-trivial [3]. This article reviewsthe recent progress and results <strong>of</strong> the <strong>Photonics</strong> Group at UniversityCollege London (UCL) in fabrication <strong>of</strong> III-V quantumdot lasers on silicon substrates.II. Advantages <strong>of</strong> III-V Quantum Dot Laserson Direct Epitaxy <strong>of</strong> III-V on Si SubstratesThe direct growth <strong>of</strong> III-V semiconductors on Si substrateswould be an ideal approach for III-V on silicon (III-V/Si) integrationso that the production cost can be reduced and expensivesubstrates can be avoided. However, there are great challengesfor III-V/Si by direct epitaxial growth [4], [5], namely the formation<strong>of</strong> three types <strong>of</strong> defects: anti-phase boundaries (APBs),threading dislocations (TDs) and micro-cracks.(1) Anti-phase boundaries: III-V compound materials arecomposed <strong>of</strong> two different atomic sublattices. Sublattice shiftsmay nucleate during epitaxial growth <strong>of</strong> III-V on Si and Ge.Sheets <strong>of</strong> wrong nearest neighbor bonds, i.e., APB or inversiondomain boundaries (IDBs) can occur. IDBs are planar defects,which deteriorate device performance by acting as nonradiativerecombination centers. To solve the issue <strong>of</strong> APB, <strong>of</strong>f-axis-cutsubstrates can be used. A single domain surface can be formedby choosing carefully the <strong>of</strong>f-cut angle to obtain bi-atomicsteps. Such single domain surface have Si-Si dimers oriented inthe same direction and thus, GaAs growth on Si can be initializedwith formation <strong>of</strong> arsenic/gallium dimmers with identicalorientation after with As/Ga prelayer deposition.(2) Micro-cracks: A mismatch in thermal expansion betweenthe III-V epilayers and a Si substrate will result in tensile stressin the III-V layer, and could lead to crack formation duringthe cooling from growth temperature (>500 o C) to room temperature.Thin compressive materials, such as InAlGaAs layerswith In
InGaAs QWGaAsThreading Dislocationstructures, such as QWs. The QDs behave as artificial atomswith properties, which can be engineered by crystal growthtechniques, such as Molecular Beam Epitaxy (MBE). Theseunique QD properties lead to revolutionary characteristics forQD lasers. These include temperature-independent operation,reduced drive current, and higher operating speeds [6], [7],which are significantly superior to conventional semiconductorQW lasers. This unique attribute <strong>of</strong> QD technology leads us todevelop III-V QD lasers on the Si platform. Furthermore, QDstructures <strong>of</strong>fer other special advantages over QWs, not directlyrelated to their unique density <strong>of</strong> states, for the production<strong>of</strong> better III-V/Si photonic devices [8]–[10]. These include:(1) Lower sensitivity to defects: Some <strong>of</strong> the TDs and APBsgenerated at the III-V epilayers grown on Si substrates willpropagate through the III-V layers. Every TD propagatingthrough QWs will become a nonradiative recombination center,leading to dramatically degraded performance <strong>of</strong> III-VQW devices. However, in the case <strong>of</strong> QD devices, one TD inthe active region can only “kill” one or a few dots. It will notaffect the majority <strong>of</strong> dots, as shown in Figure 1. Furthermore,the electrons and holes within the active region are spatiallylocalized in dots. This carrier localization could result in carriersnot “seeing” the TDs. QD devices thus exhibit dramaticallyreduced sensitivity to defects.(2) High resistance to degradation: The strain field <strong>of</strong> QDsgives greater mechanical strength to prevent the movement<strong>of</strong> dislocations, even in the presence <strong>of</strong> high-density nonradiativerecombination centers [10]. Consequently, in the case <strong>of</strong>III-V/Si devices with a relatively high density <strong>of</strong> TD, QD lasersshould exhibit much longer lifetimes and higher operationtemperature than QW devices.These advantageous properties <strong>of</strong> QDs led to the recentdemonstrations <strong>of</strong> III-V QD lasers monolithically grown on Sisubstrates [11]–[15].III. Quantum Dot Lasers on Si SubstratesA conventional GaAs-based InAs/InGaAs dot-on-a-well(DWELL) structure was first fabricated on silicon substratesby a solid-source MBE. To reduce the density <strong>of</strong> threadingdislocations nucleated at the interface between the GaAs bufferand silicon substrate, the GaAs buffer growth temperatureis critical. To optimize the growth temperature <strong>of</strong> the GaAsbuffer layer on Si, transmission electron microscopy (TEM)measurements were carried out to compare the quality <strong>of</strong> III-Vmaterial grown on Si substrates at different temperatures.[Figure 2(a)–(c)]. For all buffer growth temperatures, defectsInAs QDsFigure 1. Cross-sectional schematic <strong>of</strong> threading dislocation propagating throughInGaAs/GaAs quantum well layer and InAs/GaAs quantum dots layer, respectively.are formed at the GaAs/Si interface asa result <strong>of</strong> the lattice mismatch. Thegrowth temperature <strong>of</strong> the GaAs bufferlayer plays a critical role in suppressingthe formation <strong>of</strong> the dislocationsand we have seen the lowest density <strong>of</strong>defects which are mainly confined in theinterface region at a growth temperature<strong>of</strong> 400 °C [2].In order to keep the defects frompropagating into the III-V device activeregion, InGaAs/GaAs superlattices aregrown as dislocation filter layers (DFLs). These strainedsuperlattices can work as dislocation stop layers by bending thedislocations and confining them in the DFL region. Figure 2(d)shows a TEM image <strong>of</strong> a few InGaAs/GaAs superlattice DFLsgrown on a Si substrate. Initially, a large number <strong>of</strong> threadingdislocations are generated at the interface between the GaAslayer and Si substrate. With four repeats <strong>of</strong> DFLs, the density<strong>of</strong> threading dislocations is significantly reduced. After thisone set <strong>of</strong> DFLs, there is no dislocation observed in a number<strong>of</strong> similar images, as shown in Figure 2(d). The misfit strain<strong>of</strong> the strained superlattices blocks the threading dislocationsfrom propagating in the growth direction [16].By using the aforementioned growth techniques, abroad-area stripe laser was fabricated at London Centre forNanotechnology. Electrically pumped laser at 1.302 nm wasdemonstrated with a low room temperature threshold currentdensity (J thS ), 725 A/cm 2 [see Figure 2(e)], and operation temperatureup to 42 °C [11].IV. Quantum Dot Lasers on Ge SubstratesThe direct epitaxy <strong>of</strong> III-V materials on Si substrates faces difficultyin suppressing the formation <strong>of</strong> defects due to the largelattice mismatch between III-V materials and Si. Comparedwith Si substrates, Ge has a much smaller lattice mismatchand thermal mismatch to GaAs. In addition, Ge has not onlyhigher carrier mobilities but also a higher absorption coefficientat an optical communication wavelength region. Despitethese advantages, the APBs caused by polar/non-polar heteroepitaxyare still problematic. The same solution to eliminateAPBs for III-V/Si heteroepitaxy does not work satisfactorilyas a self-terminating one-monolayer As cannot always be sustainedon a Ge surface. As a result, III-V devices integratedon Ge substrates have not been well established. A solution toremove APBs at the III-V/Ge interface and grow high qualityIII-V buffer layers is critical for integration <strong>of</strong> III-V devices onGe substrates.At UCL, we have employed a Ga prelayer technique forGaAs growth on miscut Ge (100) substrates. By using thistechnique, we have demonstrated the first InAs/GaAs QDlasers grown on Ge substrates [13], [14]. In our investigation,the As prelayer used for GaAs growth on Ge surfaceresults in quasi 3D structures because <strong>of</strong> APBs generatedat the GaAs/Ge interface [6]. On the other hand, with aninitial deposition <strong>of</strong> about one atomic layer <strong>of</strong> Ga over Gesurface, the GaAs epitaxial layer over Ge surface exhibitsa much smoother surface. TEM measurements reveal only12 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013GaAs
News<strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> Gets Social to Connectwith the <strong>Photonics</strong> Community OnlinePiscataway, NJ (July 2013)—The <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>(IPS) is now active on social media and ready to connectwith members, academia and industry pr<strong>of</strong>essionals onFacebook, Twitter, LinkedIn, and through their new onlinenewspaper, the <strong>IEEE</strong> <strong>Photonics</strong> Daily. IPS is using thesesocial media channels to provide the photonics and opticscommunity with innovative ways to engage in conversationand share useful resources. Raising awareness is IPS’sgoal; providing education and outreach about the role <strong>of</strong>photonics in technology, manufacturing, telecommunications,research, healthcare, energy development, security,aerospace, and more.“The <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> is the pr<strong>of</strong>essionalhome for a global network <strong>of</strong> scientists and engineerswho represent the laser, optoelectronics and photonicscommunity,” said Lauren Mecum, IPS MembershipDevelopment Specialist. “We are continually searchingfor new ways to provide our members with pr<strong>of</strong>essionalgrowth opportunities and we plan to use social media asyet another avenue <strong>of</strong> doing so. We hope to <strong>of</strong>fer photonicscommunity supporters a place to network with peers,keep up with evolving tech news and have a voice in theindustry.”Followers <strong>of</strong> IPS on social media will have immediateaccess to quick updates and micro-blogs on IPSprograms, educational opportunities, photonics researchand innovation, publications, membership news andupcoming conference information. In addition, IPS followerson Twitter have the opportunity for their tweetsto be featured in <strong>IEEE</strong> <strong>Photonics</strong> Daily, which servesto inform the readership <strong>of</strong> new products and technologies.Interested parties who are not active on Facebookor Twitter can also subscribe to receive the daily onlinenewspaper, the <strong>IEEE</strong> <strong>Photonics</strong> Daily, via email, explainedMecum.Follow IPS on Twitter: @<strong>IEEE</strong><strong>Photonics</strong>Like IPS on Facebook: Facebook.com/<strong>Photonics</strong><strong>Society</strong>Join the IPS LinkedIn Group: http://linkd.in/10MW07oSubscribe to <strong>IEEE</strong> <strong>Photonics</strong> Daily: http://bit.ly/IPSDailyAbout the <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>The <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> is one <strong>of</strong> the world’s leadingtechnical communities in the field <strong>of</strong> optoelectronics andphotonic materials, devices, and systems, with membersand activities engaged in research, development, design,manufacture, and applications, as well as with the variousother activities necessary for the useful expansion <strong>of</strong> thefield. As part <strong>of</strong> this dynamic worldwide community, morethan 100,000 photonics pr<strong>of</strong>essionals actively organize,contribute to, and participate in <strong>Society</strong> technical conferences,journals and other activities covering all aspects <strong>of</strong>the field. The <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> has 80+ chaptersworldwide and is part <strong>of</strong> <strong>IEEE</strong>, the world’s largest technicalpr<strong>of</strong>essional association. The <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> (IPS)is the current name for the former <strong>IEEE</strong> Lasers and Electro-Optics <strong>Society</strong> (LEOS). Learn more at http://www.photonicssociety.organd http://www.photonicsconferences.org/.About <strong>IEEE</strong><strong>IEEE</strong>, the world’s largest technical pr<strong>of</strong>essional association,is dedicated to advancing technology for the benefit <strong>of</strong> humanity.Through its highly cited publications, conferences,technology standards, and pr<strong>of</strong>essional and educational activities,<strong>IEEE</strong> is the trusted voice on a wide variety <strong>of</strong> areasranging from aerospace systems, computers and telecommunicationsto biomedical engineering, electric power andconsumer electronics. Learn more at http://www.ieee.org.18 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
News (cont’d)<strong>IEEE</strong> PHOTONICS SOCIETY—CALL FOR NOMINATIONS2014 JOHN TYNDALL AWARD2014 YOUNG INVESTIGATOR AWARDNominaons are now being accepted for the 2014 John Tyndall Award.This award, which is jointly sponsored by the <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> and theOpcal <strong>Society</strong>, is presented to a single individual who has made outstandingcontribuons in any area <strong>of</strong> lightwave technology, including opcal bers andcables, the opcal components employed in ber systems, as well as thetransmission systems employing bers. With the expansion <strong>of</strong> this technology,many individuals have become worthy <strong>of</strong> consideraon. Nominaondeadline is 10 <strong>August</strong>, 2013.Nominaons are now being solicited for the 2014 Young Invesgator Award.The Young Invesgator Award was established to honor an individual who hasmade outstanding technical contribuons to photonics (broadly dened) priorto his or her 35 th birthday. Nominees must be under 35 years <strong>of</strong> age onSept. 30th <strong>of</strong> the year in which the nominaon is made. Nominaon deadlineis 30 September, 2013.The nominaon form(s), awards informaon and a list <strong>of</strong> previous recipients are availableon the <strong>Photonics</strong> <strong>Society</strong> web site:hp://www.photonicssociety.org/award‐infohp://www.photonicssociety.org/award‐winners20 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
News (cont’d)Iga Received Franklin Medal and AwardPr<strong>of</strong>essor Kenichi Iga, <strong>IEEE</strong> Life Fellow and Pr<strong>of</strong>essor Emeritus <strong>of</strong> Tokyo Institute <strong>of</strong>Technology received 2013 Bower Award and Prize for Achievement in Science fromFranklin Institute. Pr<strong>of</strong> Iga is also a receipent <strong>of</strong> the IPS William Streifer award (in1992). Pr<strong>of</strong> Iga’s citation for the Franklin Medal and award is for “the conception anddevelopment <strong>of</strong> the vertical cavity surface emitting laser and its multiple applicationsto optoelectronics”http://www.fi.edu/franklinawards/13/bowersci.htmlPr<strong>of</strong>essor Kenichi Iga<strong>IEEE</strong> Fellow Pr<strong>of</strong>. Russel Dean DupuisReceives Humboldt Research AwardPr<strong>of</strong>. Dr. Russel Dean DupuisA faculty member <strong>of</strong> the Georgia Institute <strong>of</strong> Technology, School <strong>of</strong> Electrical andComputer Engineering, Atlanta, USA—Pr<strong>of</strong>. Dr. Russel Dean Dupuis (<strong>IEEE</strong> Fellow)—hasbeen elected the recipient <strong>of</strong> a Humboldt Research Award after havingbeen nominated for this award by Pr<strong>of</strong>. Dr. Michael Kneissl, Technische UniversitaetBerlin, Germany.This award is conferred in recognition <strong>of</strong> lifetime achievements in research. In addition,the awardee is invited to carry out research projects <strong>of</strong> his own choice in cooperationwith specialist colleagues in Germany. We hope that thereby the internationalscientific cooperation will be further promoted.The award is granted in recognition <strong>of</strong> a researcher’s entire achievements to dateto academics whose fundamental discoveries, new theories, or insights have had a significantimpact on their own discipline and who are expected to continue producingcutting-edge achievements in the future.<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 21
Careers and AwardsOFC Rump Session on Silicon<strong>Photonics</strong>—Standing Room Only!Michael Hochberg, U. Delaware and NUS, Dan Kuchta, IBM ResearchAt OFC this year, we chaired a Rump Session,entitled “Silicon <strong>Photonics</strong>: DisruptiveTechnology or Research Curiosity?” The OFCrump session was formatted as a spontaneousdiscussion among the audience members; assession chairs, we tried to ask provocative questionsand occasionally prompt specific audiencemembers for their reactions. A few brief presentationswere given to kick things <strong>of</strong>f, then thefun started with questions and discussions fromthe audience.Seating was set for 200 and more than 300people showed up! People were literally sittingin the aisles and stacked up outside the roomuntil almost 10 PM, more than two hours intothe session. The room was packed with students and researchersin academia, pr<strong>of</strong>essionals from industry and WallStreet, venture capitalists and industry analysts. It was clearfrom the discussion that there is broad, cross-cutting interestin silicon photonics, both domestically and internationally,and that the interest ranges from system integrators to devicedevelopers, and includes end-users in the datacenter andtelecommunications spaces.Chris Cole, <strong>of</strong> Finisar, commented: “To hold that manypeople’s interest for 2 ½ hours, ending at 10 PM, after along day, was a testimony to…the audience’s interest insilicon photonics.” As session chairs, we’re pleased that thiswas such a success, and that the topic captured the audience’simagination and interest.Several key topics emerged as points <strong>of</strong> discussion:Has the Hype has Outpaced the Technology?The “Hype-cycle” about silicon photonics was discussed andmany mentioned it was a technology that has begun to matureat the same time when the optical industry is starting toneed the benefits <strong>of</strong> photonic integration. This triggered anintense series <strong>of</strong> debates about whether the silicon photonicswas in fact mature enough and ready for production, or stillmainly in research and development.• Several people commented that InP is a serious challengerto silicon photonics at 100 G in the datacenter. Thereare already InP products at 1310 and InP can emit light,which means that any silicon photonic solution willnecessarily integrate an InP source in the near term.• Photonic integration has been a topic <strong>of</strong> discussion andpresentations since OFC1999 but very few companies haveHalf <strong>of</strong> the standing room only crowd at OFC 2013 Rump Session onSi <strong>Photonics</strong>.developed products containing more than a few devices.• Kotura and Luxtera were mentioned, since they wereshowing 4 #28 G transceivers and/or AOCs at OFC.• Skorpios and Aurrion had accepted papers in the Postdeadline session, but no public demos or productannouncements.• Cisco’s purchase <strong>of</strong> LightWire and the new CPAK productswere also mentioned as an indicator <strong>of</strong> support forsilicon photonics.• Kotura, Luxtera, IBM, Intel and Cisco were cited asexamples that both big companies and startups wereable to build silicon photonics transceivers.Will Silicon <strong>Photonics</strong> be the Magic Solution to theTransceiver Industry Financial Woes?From the discussion, it was clear that silicon photonics isnot a magic solution to all the optical industry and transceiverbusiness’s pr<strong>of</strong>itability problems. Silicon photonics isnot new, with the early work occurring over 15 years ago.The field has recently matured to the point where systemlevel products can now be manufactured with moderate investmentand risk. Previous to ~2010, most research was inoptimizing individual device performance—now it is aboutlinking devices and building integrated systems.The ecosystem for this has been under development for along time, but is just now maturing enough that truly fablessprojects are possible and relatively inexpensive.What are Silicon Photonic’s Strengths and Weaknesses?Silicon photonics has a specific set <strong>of</strong> strengths and weaknesses.It leverages the low cost CMOS semiconductor22 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Instant Access to <strong>IEEE</strong> PublicationsEnhance your <strong>IEEE</strong> print subscription withonline access to the <strong>IEEE</strong> Xplore ® digital library.■Download papers the day they are published■Discover related content in <strong>IEEE</strong> Xplore■ Signifi cant savings over print with an onlineinstitutional subscription“<strong>IEEE</strong> is the umbrella thatallows us all to stay currentwith technology trends.”Dr. Mathukumalli VidyasagarHead, Bioengineering Dept.University <strong>of</strong> Texas, DallasStart today to maximizeyour research potential.Contact: onlinesupport@ieee.orgwww.ieee.org/digitalsubscriptions
Careers and Awards (cont’d)semiconductors to enable building very low cost, highcomplexitysystems on chip. Ramping yield and complexityin silicon is going to be very quick.”Center: Moderator Michael Hochberg.infrastructure. It enables high levels <strong>of</strong> device integrationand devices have been shown that are capable <strong>of</strong> high-speedline rates such as 25 G and 56 G, though not yet full linksat 56 G.The III-V community members mentioned that unlikeGaAs and InP, silicon lacks the band gap to generate enoughusable light, hence lasers have to be attached which can be asignificant cost addition. Some members in the audience mentionedthat recent advancement in laser attach using flip-chiptechnology with a tuned external silicon cavity were beingused by Kotura and Cisco. Another approach was pioneeredby Luxtera with a MEMS micropackage. Lasers attached t<strong>of</strong>ibers and edge/butt coupled lasers were also mentioned asmanufacturable options.Speaking as a moderator, Hochberg summarized some<strong>of</strong> the comments as follows: “Silicon photonics’ strongfeatures are integration <strong>of</strong> many devices and high-speedmodulation. Silicon photonics is not the best solution ateverything and should be considered another tool in thetool-box for photonics systems design.” He also commentedthat silicon photonics brings a special combination <strong>of</strong>leveraging the tremendous capital investment in CMOSWhere exactly is the need for Silicon photonics?As the data rates escalate (eg 25 G, 56 G), the reach <strong>of</strong>multi-mode fiber with VCSELs is dramatically shrinking.At the same time, large datacenters and cloud datacenter arebecoming increasingly large requiring longer reaches than100 m the VCSEL technology enables. This is spawninga lot <strong>of</strong> interest in using silicon photonics for inexpensive,high-speed modulation and to build transceivers that canreach up to 2 km for the ever-expanding datacenter market.This area is where the optics industry hopes it will see bothhigh unit numbers and decent prices. This application space,which is driven by reach and uses SMF, is likely to be a majorentry point for silicon photonics.Why not use InP for the 100 m–2 Km reach – a technologyavailable now instead <strong>of</strong> building a new infrastructurefor silicon photonics?Members from the Indium Phosphide community askedwhy the current LR and LR4 implementations could notbe scaled down to address the 100 m–2 km reach andavoid large capital investments in silicon photonics. Theconsensus among the audience seemed to be that for10 G, 40 G and even 100 G, InP is certainly viable using4 channels but that at 400 G, there will be significantyield challenges in InP.What are the roadblocks to low-cost Implementations?Test and packaging was discussed as a key issue needing alot more research and effort. This was identified as a keyarea needing more investment and research to drive downcosts. John Bowers (CEO Aurrion) provided a perspectiveon hybrid integration strategies, commenting that thetemperature and lifetime performance <strong>of</strong> Aurrion’s chipswas turning out to be extremely impressive.Several companies openly asked if there wereany test and packaging engineers in the audiencelooking for a job.Members <strong>of</strong> the VCSEL community spokeout that long wavelength VCSELs at 1060 or1090 nm with new fibers could address the100 m–500 m reach issue in datacenters.Will it be reliable?The topic <strong>of</strong> Reliability <strong>of</strong> Si <strong>Photonics</strong>was brought up as there is little to no datain the literature to support the reliabilityclaims. The InP proponents were quick toStanding left: Moderator Dan Kuchta (continued on page 32)24 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Careers and Awards (cont’d)<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 25
Careers and Awards (cont’d)26 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Careers and Awards (cont’d)<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 27
Careers and Awards (cont’d)28 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Careers and Awards (cont’d)<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 29
Membership Section (cont’d)Does Your Chapter havean Interesting Story to Share?Over the years the <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> (IPS) hascome across many wonderful stories about our chapters’ experiencesall around the world. Moving forward, we’d liketo feature these stories in the print & electronic <strong>IEEE</strong> <strong>Photonics</strong>Newsletter and <strong>IEEE</strong> Institute.The members and chapters <strong>of</strong> IPS help advance ourmission <strong>of</strong> representing the laser, optoelectronics andphotonics community. You are the advocates and drivingforce <strong>of</strong> our society around the world. We want tohear from you!• Did your chapter hold a recent, innovative event youare proud to share?• Is your chapter actively involved in the community,promoting the photonics pr<strong>of</strong>ession or breakthroughsin the field?• How does your chapter educate students and fosterpr<strong>of</strong>essional growth?We want to hear your voice! Stories about your chapter’sactivities can help spark new ideas for other chapters!How to submit an article to the IPS Newsletter:IPS will feature 1–2 stories in the bi-monthly newsletterand share chapters’ best practices via e-blast monthly.If you have a story to tell, submit an article with pictures,video, etc. to:ipsnewsletter@ieee.orgAttention: Lisa ManteriaPlease note: That by submitting a story you agree to haveit featured in IPS material, such as membership and recruitmentpublications. For more information, please review thenewsletter Submission Guidelines at <strong>Photonics</strong><strong>Society</strong>.org34 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
your personal gateway to <strong>IEEE</strong> MembershipGet the most from your <strong>IEEE</strong> membership with my<strong>IEEE</strong>—your one-stop Web portal to the member benefits you use most.<strong>IEEE</strong> Knowledge Desktopconnects you to valuable<strong>IEEE</strong> information. Manageyour subscriptions, browse<strong>IEEE</strong> publications, and learnabout the latest technologyon <strong>IEEE</strong>.tv.<strong>IEEE</strong> Community Desktoplets you keep in touch with<strong>IEEE</strong> colleagues aroundthe world. View upcomingconferences and <strong>IEEE</strong>section activities, or see whatother members are up to.<strong>IEEE</strong> Pr<strong>of</strong>ession Desktopis all about developingyour career. Grow yourpr<strong>of</strong>essional contacts, sign upfor one-on-one mentoring, orview job opportunities andcareer information.Stay connected to <strong>IEEE</strong>.Use your Web Account to log in today at www.myieee.org<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 3512-MEMB-0023a_my<strong>IEEE</strong> Ad_Update_7x10_float_Final.indd 11/30/12 6:22 PM
<strong>IEEE</strong> First Year New Member Experience<strong>IEEE</strong> has an outreach program, First Year New Member Experience, for newly inductedmembers. It was designed to help each understand and navigate <strong>IEEE</strong> during their firstyear experience. Whether a member joined to build a pr<strong>of</strong>essional network, save money onconferences or keep current with technology, this program can help.It includes a website portal, a monthlyonline orientation to help the new memberget connected to <strong>IEEE</strong> and basic serviceson how to participate in various memberactivities.Please inform new members and chapterparticipants <strong>of</strong> this program when they firstjoin the society.To get started visit: www.<strong>IEEE</strong>.org/StartGet Connected &Stay Informed @:@<strong>IEEE</strong><strong>Photonics</strong>www.<strong>Photonics</strong><strong>Society</strong>.org / www.<strong>IEEE</strong>.org/MembershipFacebook.com/<strong>Photonics</strong><strong>Society</strong>36 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Delivered via the <strong>IEEE</strong> Learning Management System<strong>IEEE</strong> eLearning LibraryThe premier online collection <strong>of</strong> shortcourses and conference workshopsThe <strong>IEEE</strong> eLearning Library presents a betterway to learn for technology pr<strong>of</strong>essionals,students and any organization who wants itsteam to strive, excel and stay competitive.■Advanced technology courses, writtenand peer-reviewed by experts■ Earn CEU and PDH continuingeducation credits■ Relaxed, self-paced, online<strong>IEEE</strong> is a certifi ed continuing education providerFind out what <strong>IEEE</strong> eLearning Librarycan do for your organization:www.ieee.org/go/elearning<strong>August</strong> 10-PIM-0300a-eLearning-Ad-Updates-Final.indd 2013 1<strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 9/9/10 2:26 PM 37
Who develops green technologies, video games, rescue robots and more?Explore the amazing world <strong>of</strong> engineers—all in one web site…TryEngineering.org■ See the exciting work that engineers do■ Learn how engineers make a difference■ Start now to prepare to be an engineer■ Play online games and challengesTryEngineering■ Download free engineering lesson plans■ Explore the fascinating FAQ■ Search for accredited engineering programs■ Find competitions and summer campsVisit www.tryengineering.org today!Brought to you by:38 10-EA-0198-Tryengineering-7x10-Print-ad-Final.indd <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 1<strong>August</strong> 7/7/10 10:35 2013 AM
Conference SectionThe 10th International Conference on Group IV<strong>Photonics</strong> Will Feature the Latest Advancementsin Silicon <strong>Photonics</strong>, Advanced Materials &Nano-<strong>Photonics</strong>Officially known as the Seoul Special City, the capital and largestmetropolis <strong>of</strong> South Korea will host GFP 2013…SEOUL, KOREA—The 10th International Conferenceon Group IV <strong>Photonics</strong> (GFP 2013) will featurepresentations spanning a broad range <strong>of</strong> topics focusedon silicon photonics and other Group IV element-basedphotonic materials and devices. Pr<strong>of</strong>essionals from industry,academia, and government around the worldwill gather from 28–30 <strong>August</strong> 2013 for the GFP 2013conference, held for the first time in Seoul, Korea at theGrand Hilton Seoul.Planned as a single-track conference, GFP 2013 willfeature both oral and poster sessions <strong>of</strong> contributed andinvited papers focused on silicon photonics and otherGroup IV element-based photonic materials, applications,and manufacturing technology. In addition, apost-deadline session will feature the most up-to-dateresults involving Group IV element photonic materialsand devices, including integration and fabricationtechnologies.Some <strong>of</strong> the major topic areas will include:• Electro-Photonic Convergence on Silicon: mainstreamingindustrial Si photonics; optical interconnecttechnology, including light sources, modulators, anddetectors; technology platforms, design tools/rules, andindustrial fabrication concerns.• Novel Materials and Structure: novel materials andmaterial combinations, and/or structures generatingscientific interest; graphene, complex oxides,photonic crystals, gratings, as well as plasmonics andits hybrids.• Photonic Devices and Nanophotonics: devices andsystems that are at the stage <strong>of</strong> focusing on real applicationsbut do not necessarily need/require integrationwith electronics; couplers, (bio) sensors, Si photonicsfor telecom applications.“As one <strong>of</strong> the leading international conferences focusedon silicon photonics materials, devices and processes, the10th International Conference on Group IV <strong>Photonics</strong> representsa unique venue for the exchange <strong>of</strong> ideas betweenresearchers, engineers and business leaders on the latestdevelopments in Group IV photonics devices,” said GFP2013 General Chair, Jung Hoon Shin <strong>of</strong> Korea AdvancedInstitute <strong>of</strong> Science and Technology. “Our program willblend an impressive array <strong>of</strong> invited speakers, as well ascomprehensive technical presentations, in a format that encouragesinteraction between participants and presenters.”Invited Speakers• Mehdi Asghari, Kotura Inc., USA• Jean-Marc Fedeli, Atomic Energy and AlternativesEnergies Commission (CEA), France• Beomsuk Lee, Samsung Electronics, Korea• Subal Sahni, Luxtera, Inc., USA• Qiaoliang Bao, Monash University, Australia• Hideo Issihki, The University <strong>of</strong> Electro-Communication(UEC), Japan• Robert Halir, University <strong>of</strong> Malaga ETSI, Spain• Volker Sorger, George Washington University, USA• Hiroshi Fukuda, Nippon Telegraph and TelephoneCorporation, Japan• Cary Gunn, Genalyte, USA• Jie Sun, Massachusetts Institute <strong>of</strong> Technology, USA• Dave Thomson, University <strong>of</strong> Southampton, UK• Xuezhe Zheng, Oracle, USAGFP 2013 Program-at-a-Glance Available for Download:http://www.gfp-ieee.org/documents/GFP-2013-Program-at-a-Glance-6-4.pdf(continued on page 43)<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 39
Conference Section (cont’d)wddJOIN US!10th International ConferenceonGroup IV <strong>Photonics</strong> 201328-30 <strong>August</strong> 2013Grand Hilton SeoulSeoul, Koreawww.gfp-ieee.orgWWW.PHOTONICSCONFERENCES.ORG40 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Conference Section (cont’d)<strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>’s 2013 Avionics,Fiber-Optics & <strong>Photonics</strong> Conference toHighlight the Latest Developments in FiberOptic Architectures, Networking & MobilePlatform Development in Avionics, NavalVessels & Ground VehiclesSAN DIEGO, CA—The <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>’s 2013 Avionics,Fiber-Optics & <strong>Photonics</strong> Conference (AVFOP 2013)taking place 1–3 October 2013, is an application-orientedconference designed to cover all aspects <strong>of</strong> severe environmentfiber optic component systems and technology for avionics,vetronics (vehicle electronics) and naval vessels. Each year,the AVFOP provides an international forum for engineers,researchers and manufacturers to meet and exchange ideas onthe latest developments in reliability, maintainability, producibility,supportability, as well as the future direction <strong>of</strong> thesecritical systems for military and commercial applications.<strong>Photonics</strong> pr<strong>of</strong>essionals from industry, government andacademia will gather from for the tenth annual AVFOP2013 Conference at the Wyndham San Diego Bayside Hotelin the Embarcadero harbor district <strong>of</strong> San Diego, California(USA). A program <strong>of</strong> more than 60 presentations willcover a comprehensive range <strong>of</strong> topics, including:• Integrated & WDM optical components for harshenvironments• Fiber optic transceivers for digital avionics & vetronicssystems• Avionics/vetronics fiber optics & photonics technologysynergies• Fly-by-light & power-by-light components & systems• Optical components for analog/RF signal transmission& distribution• Avionics architecture/networking & standardization foraerospace systems• Modeling & simulation <strong>of</strong> aerospace fiber optic components,links & systems• Avionics/aerospace fiber optic component & systemreliability• and a host <strong>of</strong> other topics presented by experts in avionics,fiber optics and photonics technology.In addition to the paper sessions, there will be a paneldiscussion on “Fiber Optics & <strong>Photonics</strong> Technology InsertionForum,” to be held on 2 October. The discussion willprovide unique insight into the processes used by defenseagencies, aircraft, rotorcraft & spacecraft manufacturers,subsystem suppliers & system integrators to create and acceptnew fiber optics and photonics technologies.“The past ten years has seen significant growth in thedeployment <strong>of</strong> fiber optic and photonics technology in theaerospace industry for both commercial and military platforms,”said AVFOP 2013 General Chair, Richard DeSalvo<strong>of</strong> Harris Corporation, USA. “And these avionics fiber opticsystem architectures, networking schemes and componentshave grown more sophisticated. The AVFOP conference hasproven to be an indispensable international forum for theacademic, industry and government R&D pr<strong>of</strong>essionals t<strong>of</strong>urther these technology developments.”Program OverviewThe preliminary conference program and listing <strong>of</strong> eventsare online at: http://www.avfop-ieee.org/program.Supplier Exhibits & Sponsorship OpportunitiesA supplier exhibition and a wide range <strong>of</strong> sponsorship opportunitiesare available for participating companies to promoteawareness, discuss the latest new products, interactwith customers and develop new sales contacts. Individualizedsponsorship opportunities can be tailored to meet anybudget by contacting conference planner Megan Figueroaat +1 732 562 3895 or via email at m.figueroa@ieee.org.For registration and other information about AVFOP2013, visit http://www.avfop-ieee.org/ or contact:Megan FigueroaConference Planner | <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>(formerly LEOS)445 Hoes Lane | Piscataway, NJ 08854Tel: +1 732 562 3895 | m.figueroa@ieee.org<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 41
Conference Section (cont’d)JOIN US!Pre-Registration Deadline30 <strong>August</strong> 2013WWW.AVFOP-<strong>IEEE</strong>.ORG1-3 October 2013Wyndham San Diego BaysideSan Diego California, USA10th Avionics, Fiber-Optics&<strong>Photonics</strong> Conference 2013WWW.PHOTONICSCONFERENCES.ORG42 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Conference Section (cont’d)<strong>IEEE</strong> <strong>Photonics</strong> Conference to SpotlightBreakthroughs in Many Lightwave-Related TechnologiesSEATTLE, WA (June 27, 2013)—The unveiling <strong>of</strong> breakthroughsin photonics—the use <strong>of</strong> light waves in electronicsystems as opposed to electrical currents and voltages—willtop the agenda when the world’s leading technologists inthe field convene in the Seattle area this September for theannual <strong>IEEE</strong> <strong>Photonics</strong> Conference (IPC-2013), formerlycalled the <strong>IEEE</strong> LEOS Annual Meeting.Some 600 scientists, engineers and technical managerswill gather from September 8–12 at the Hyatt RegencyBellevue Hotel for an IPC-2013 program <strong>of</strong> invited talks,paper presentations, panel sessions, special symposia, networkingopportunities, and a product showcase.Since 1988, the <strong>IEEE</strong> <strong>Photonics</strong> Conference and its predecessorthe <strong>IEEE</strong> LEOS Annual Meeting have been thepremier autumn gatherings for the presentation and discussion<strong>of</strong> research in photonics technologies and applications,including: lasers, biophotonics, displays, photodetectors,sensors, imaging systems, integrated optics, photovoltaics,optoelectronics, interconnects, microwave and nanophotonicdevices and systems, non-linear and ultrafast optics,optical fiber communications, planar waveguide technologyand optoelectronic materials.This year’s conference comes in the wake <strong>of</strong> the launchthis spring <strong>of</strong> the National <strong>Photonics</strong> Initiative, a collaborativealliance among industry, academia and governmentexperts seeking to raise awareness <strong>of</strong> the impact <strong>of</strong> photonicson our everyday lives, and <strong>of</strong> the field’s compellingbusiness opportunities, as well as the potential barriers togrowth. “While more than a thousand companies havesprung up in recent years to produce the photonics devicesand systems we all depend on, there’s a need to overcomefinancial and other barriers to growth in order to enablecontinuing progress, and that’s what this initiative is allabout” said Richard Linke, executive director <strong>of</strong> the <strong>IEEE</strong><strong>Photonics</strong> <strong>Society</strong>, sponsor <strong>of</strong> IPC-2013 and co-sponsor <strong>of</strong>the National <strong>Photonics</strong> Initiative along with four otherleading industry groups.“The <strong>IEEE</strong> <strong>Photonics</strong> Conference represents a fusion <strong>of</strong>cutting-edge scientific research and leading industrial innovationsfor photonics engineers, technologists and suppliersfrom around the world,” said Dr. Martin Dawson,IPC-2013 Program Chair and Pr<strong>of</strong>essor and Director <strong>of</strong><strong>Photonics</strong> Research at the University <strong>of</strong> Strathclyde in Scotland.“Thought-provoking technical talks, numerous specialevents and a product exhibition will provide attendeeswith the insights and ideas they need to advance the use <strong>of</strong>light to address many <strong>of</strong> today’s most important technologicalchallenges.”Highlights <strong>of</strong> the IPC-2013 program include:Plenary Sessions• Lab-on-Chip and Point-<strong>of</strong>-Care Applications <strong>of</strong> Silicon <strong>Photonics</strong>by Roel G. Baets, Ghent University/IMEC• Microwave Quantum Optics in Superconducting Circuits byYasunobu Nakamura, University <strong>of</strong> Tokyo• The Flexibility <strong>of</strong> Coherent Optical Transceivers by KimRoberts, Ciena• Digital Cameras in Bio-Inspired Designs: From Humans toFlies by John Rogers, University <strong>of</strong> IllinoisTutorial SpeakersTutorial talks, which provide a broad view <strong>of</strong> a photonicsfield starting from the basics, have been scheduled at varioustimes throughout the conference on these topics:• Semiconductor Optical Amplifiers by Ivan Andonovic,University <strong>of</strong> Strathclyde• VCSELs for Green High Performance Computers and ComputerInterconnects by Dieter Bimberg, TU Berlin• Photonic Microwave-to-Digital Conversion by ThomasClark, Johns Hopkins University• Optical Sensors in Life Science and Medicine by BrianT. Cunningham, UIUC• Tutorial on Optical Micromanipulation by KishanDholakia, University <strong>of</strong> St Andrews• Nonlinear Propagation Effects in Multimode Transmissionby Antonio Mecozzi, University d’AquilaPanel Sessions and Special Symposia• There will be two panel discussions on Sunday, September8: Silicon <strong>Photonics</strong> and <strong>Photonics</strong> in the Pacific Northwest• There will be three Special Symposia at various timesduring the conference on the following topics: OpticalData Storage, Optogenetics and The Internet <strong>of</strong> ThingsPost-Deadline PapersA limited number <strong>of</strong> exceptional and timely papers reportingthe latest breakthroughs may be submitted as postdeadlinepapers. They must be submitted to the SpeakerCheck-In Desk onsite by 9 a.m. on September 9. The purpose<strong>of</strong> post-deadline papers is to enable participants to hearnew and significant material in rapidly advancing areas. Seehttp://www.ipc-ieee.org/call-for-papers.44 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Conference Section (cont’d)Supplier Exhibits and SponsorshipsSupplier exhibits are included as an integral part <strong>of</strong>IPC-2013, and the conference also <strong>of</strong>fers a variety <strong>of</strong>financial sponsorship opportunities to those who wishto highlight their <strong>of</strong>ferings to this highly targetedaudience <strong>of</strong> industry pr<strong>of</strong>essionals. These sponsorshipscan be either pre-defined or individualized. Forsponsorship information, registration questions andother event information, visit http://www.ipc-ieee.org/ or contact:Tracy Holle<strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong> (formerly LEOS)445 Hoes LanePiscataway, NJ 08854+1 732.562.3863t.holle@ieee.orgPresident’s Column(continued from page 3)and editors (the associate editors and editor-in-chief). I deeplyrespect their efforts and the time they spend. Researchers submittingpapers should be conscious <strong>of</strong> this volunteer processand the value it brings to their papers published in <strong>IEEE</strong> publications.Researchers should, in turn, participate in the reviewprocess to contribute to the publications <strong>of</strong> other researchers.In addition to contributing to the field in this way, the experience<strong>of</strong> reviewing the papers <strong>of</strong> others will help improve thequality <strong>of</strong> one’s own papers.On the subject <strong>of</strong> our journals I’d like to mention that the journalImpact Factors for 2012 were just released and I’m pleased tosay that our Journal on Special Topics on Quantum Electronics posted avalue <strong>of</strong> 4.08 which is the highest <strong>of</strong> any IPS journal in more than10 years. Congratulations to Editor-in-Chief John Cartledge andthe JSTQE Editorial Board and Staff!Finally, please remember that the <strong>IEEE</strong> annual election isapproaching. Please do not miss your chance to vote.With warm wishes,Hideo KuwaharaFellowFujitsu Laboratories Ltd.<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 45
Conference Section (cont’d)26th <strong>IEEE</strong>PHOTONICS JOIN US!CONFERENCE 20138-12 SEPTEMBER 2013Hyatt Regency Bellevue, Bellevue Washington USAGeneral ChairDavid Plant , McGill University, CanadaMember-At- LargeSusumu Noda, Kyoto University, JapanProgram ChairMartin Dawson, University <strong>of</strong> Strathclyde, ScotlandFEATURED TOPICSBiophotonicsDisplays & LightingHigh Power/Intensity SourcesMicrowave <strong>Photonics</strong>NanophotonicsOptical CommunicationsOptical Fiber TechnologyOptical InterconnectsOptical Networks & SystemsPhotodetectors, Sensors, Systems and ImagingPhotonic Integration and PackagingPhotonic Materials and MetamaterialsSemiconductor LasersOptical Micro/Nano Resonators & DevicesNon-Linear and Ultrafast OpticsFor more information visitwww.<strong>Photonics</strong>Conferences.org46 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Conference Section (cont’d)2013 <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>Co-Sponsored EventsNUSOD <strong>August</strong> 19—22, 201313th International Conference on Numerical Simulation <strong>of</strong> Optoelectronic DevicesUniversity <strong>of</strong> British ColumbiaVancouver, Canadahttp://www.nusod.org/2013/CAOL September 9—13, 20136th International Conference on Advanced Optoelectronics and LasersSanatroy ComplexSudak, Crimea, Ukrainehttp://caol.kture.kharkov.ua/NLP September 10—11, 20132nd International Workshop on Nonlinear <strong>Photonics</strong>Sanatroy ComplexSudak, Crimea, Ukrainehttp://lfnm.kture.kharkov.ua/page-nlp.htmlLFNM September 11—13, 201312th International Conference on Laser and Fiber-Optical Networks ModelingSanatroy ComplexSudak, Crimea, Ukrainehttp://lfnm.kture.kharkov.ua/MOC October 27—30, 201318th Microoptics ConferenceTokyo Institute <strong>of</strong> TechnologyTokyo, Japanhttp://www.moc2013.comMWP October 28—31, 20132013 <strong>IEEE</strong> International Topical Meeting on Microwave <strong>Photonics</strong>Hotel MonacoAlexandria, VA, USAhttp://www.mwp2013.orgICP October 28—30, 20134th International Conference on <strong>Photonics</strong>Meleka, Malaysiahttp://www.icp2013.net<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 47
Conference Section (cont’d)Forthcoming Meetings with ICO ParticipationICO, THE PLACE WHERE THE WORLD OF OPTICS MEETResponsibility for the correctness <strong>of</strong> the information on this page rests with ICO, the InternationalCommission for Optics; http://www.ico-optics.org/.President: Pr<strong>of</strong>. Duncan T. Moore, Biomedical Engineering and Business Administration, University<strong>of</strong> Rochester, USA; moore@optics.rochester.edu.Associate Secretary: Pr<strong>of</strong>. Gert von Bally, Centrum für Biomedizinische Optik und Photonik, UniversitätsklinikumMünster, Robert-Koch-Straße 45, 48149 Münster, Germany; Ce.BOP@uni-muenster.de16–19 September 2013Information <strong>Photonics</strong> 2013Warsaw, PolandContact: Marian Marciniak,phone: +48 22 5128715,fax: +48 22 5128715,marian.marciniak@ieee.org18–21 September 2013The Eleventh InternationalConference on Correlation Optics“Correlation Optics’13”Chernivtsi, UkraineContact: Oleg V. Angelsky,phone: (380-3722)44730,fax: (380-3722)44730,angelsky@itf.cv.ua,www.itf.cv.ua/corropt13/27–30 October 2013ICO Topical Meeting: 18thMicrooptics Conference (MOC’13)Tokyo, JapanContact: Tomoyuki Miyamoto;phone: +81-45-924-5059;fax: +81-45-924-5059;tmiyamot@pi.titech.ac.jphttp://www.comemoc.com/moc13/48 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Publication SectionCall for PapersAnnouncing an <strong>Issue</strong> <strong>of</strong> the <strong>IEEE</strong>JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS onSilicon <strong>Photonics</strong>Submission Deadline: October 1, 2013The <strong>IEEE</strong> Journal <strong>of</strong> Selected Topics in Quantum Electronics (JSTQE) invites manuscript submissions in the area <strong>of</strong> Silicon<strong>Photonics</strong>. Silicon photonics has been the subject <strong>of</strong> intense research activity in both industry and academia as a compellingtechnology paving the way for next generation energy-efficient high-speed computing, information processing and communicationssystems. The trend is to use optics in intimate proximity to electronic circuits, which implies a high level <strong>of</strong> optoelectronicintegration. This evolution towards silicon-based technologies is largely based on the vision that silicon provides a matureintegration platform supported by the enormous existing CMOS manufacturing infrastructure which can be used to cost-effectivelyproduce integrated optoelectronic circuits for a wide range <strong>of</strong> applications. The solicited areas include (but are not limited to):• Silicon photonic physics, theory, modeling and simulations• Active and passive devices (waveguide structures, modulators, switches, photodetectors, resonators, sensors, subwavelengthstructures, wavelength multiplexers, spectrometers, photonic crystals, nanoplasmonics, amplifiers, light sources, etc.)• Integrated optical circuits for datacom, WDM networks and coherent communications• Strategies for optoelectronic integration (e.g., III-V lasers, organic-Si devices, isolators, etc.)• Cost efficient packaging and testing solutions• Applications in aerospace, bioimaging, biophotonics, photovoltaics, quantum communications, sensing, andtelecommunicationsThe Primary Guest Editor for this issue is Laurent Vivien, CNRS - University <strong>of</strong> Paris Sud, France. The Guest Editors are PavelCheben National Research Council, Canada; Patrick Lo Guo-Qiang, Institute <strong>of</strong> Microelectronics/A*Star, Singapore; LorenzoPavesi, University <strong>of</strong> Trento, Italy; and Zhiping (James) Zhou, Peking University, China.The deadline for submission <strong>of</strong> manuscripts is October 1, 2013. Unedited preprints <strong>of</strong> accepted manuscripts are normally postedonline on <strong>IEEE</strong> Xplore within 1 week <strong>of</strong> the final files being uploaded by the author(s) on the ScholarOne Manuscripts submissionsystem. Posted preprints have digital object identifiers (DOIs) assigned to them and are fully citable. Once available, final copyeditedand XML-tagged versions <strong>of</strong> manuscripts replace the preprints on <strong>IEEE</strong> Xplore. This usually occurs well before the hardcopypublication date. These final versions have article numbers assigned to them to accelerate the online publication; the same articlenumbers are used for the print versions <strong>of</strong> JSTQE. Hardcopy publication <strong>of</strong> the issue is scheduled for July/<strong>August</strong> 2014.For inquiries regarding this Special <strong>Issue</strong>, please contact:JSTQE Editorial Office - Chin Tan Lutz (Phone: 732-465-5813, Email: c.tanlutz@ieee.org)<strong>IEEE</strong>/<strong>Photonics</strong> <strong>Society</strong>The following documents are required during the mandatory online submission at: http://mc.manuscriptcentral.com/jstqe-pho.1) <strong>PDF</strong> or MS Word manuscript (double column format, up to 12 pages for an invited paper, up to 8 pages for a contributed paper).Manuscripts over the standard page limit will have an overlength charge <strong>of</strong> $220.00 per page imposed. Biographies <strong>of</strong> all authors aremandatory, photographs are optional. See the Tools for Authors link: www.ieee.org/web/publications/authors/transjnl/index.html.2) MS Word document with full contact information for all authors as indicated below:Last name (Family name), First name, Suffix (Dr./Pr<strong>of</strong>./Ms./Mr.), Affiliation, Department, Address, Telephone, Facsimile, Email.JSTQE uses the iThenticate s<strong>of</strong>tware to detect instances <strong>of</strong> overlapping and similar text in submitted manuscripts and previouslypublished papers. Authors should ensure that relevant previously published papers are cited and that instances <strong>of</strong> similarity arejustified by clearly stating the distinction between a submitted paper and previous publications.50 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Publication Section (cont’d)Call for PapersAnnouncing an <strong>Issue</strong> <strong>of</strong> the <strong>IEEE</strong>JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS onFiber LasersSubmission Deadline: December 1, 2013The <strong>IEEE</strong> Journal <strong>of</strong> Selected Topics in Quantum Electronics (JSTQE) invites manuscript submissions in the area <strong>of</strong> FiberLasers. The purpose <strong>of</strong> this issue <strong>of</strong> JSTQE is to document leading-edge work in this field through a collection <strong>of</strong> original andinvited papers ranging from fundamental physics to applications. This special issue will be solely devoted to the most recentachievements in fiber laser technology and serve as universal resource for future development. The scope <strong>of</strong> the issue covers allaspects <strong>of</strong> theoretical and experimental laser research including:• Fiber design and fabrication• Fiber-processing techniques• Laser architectures and pumping methods• Fiber frequency comb sources• Fiber supercontinuum sources• Photonic crystal fibers and lasers• Ultra high power fiber lasers• Wavelength tunable fiber sources• Ultra narrow-linewidth fiber laser• Picoseconds and femtosecond fiber sources• Beam combination <strong>of</strong> fiber lasers.The Primary Guest Editor for this issue is Sulaiman Wadi Harun, University <strong>of</strong> Malaya, Malaysia. The Guest Editors are Shaif-ulAlam, University <strong>of</strong> Southampton, UK; Andrey S. Kurkov, Russian Academy <strong>of</strong> Science, Russia; Mukul Chandra Paul, CentralGlass and Ceramic Research Institute, India; and Zhipei Sun, Aalto University, Finland.The deadline for submission <strong>of</strong> manuscripts is December 1, 2013. Unedited preprints <strong>of</strong> accepted manuscripts are normally postedonline on <strong>IEEE</strong> Xplore within 1 week <strong>of</strong> the final files being uploaded by the author(s) on the ScholarOne Manuscripts submissionsystem. Posted preprints have digital object identifiers (DOIs) assigned to them and are fully citable. Once available, final copyeditedand XML-tagged versions <strong>of</strong> manuscripts replace the preprints on <strong>IEEE</strong> Xplore. This usually occurs well before the hardcopypublication date. These final versions have article numbers assigned to them to accelerate the online publication; the same articlenumbers are used for the print versions <strong>of</strong> JSTQE. Hardcopy publication <strong>of</strong> the issue is scheduled for September/October 2014.All submissions will be reviewed in accordance with the normal procedures <strong>of</strong> the Journal.For inquiries regarding this Special <strong>Issue</strong>, please contact:JSTQE Editorial Office - Chin Tan Lutz (Phone: 732-465-5813, Email: c.tanlutz@ieee.org)<strong>IEEE</strong>/<strong>Photonics</strong> <strong>Society</strong>The following documents are required during the mandatory online submission at: http://mc.manuscriptcentral.com/jstqe-pho.1) <strong>PDF</strong> or MS Word manuscript (double column format, up to 12 pages for an invited paper, up to 8 pages for a contributed paper).Manuscripts over the standard page limit will have an overlength charge <strong>of</strong> $220.00 per page imposed. Biographies <strong>of</strong> all authors aremandatory, photographs are optional. See the Tools for Authors link: www.ieee.org/web/publications/authors/transjnl/index.html.2) MS Word document with full contact information for all authors as indicated below:Last name (Family name), First name, Suffix (Dr./Pr<strong>of</strong>./Ms./Mr.), Affiliation, Department, Address, Telephone, Facsimile, Email.JSTQE uses the iThenticate s<strong>of</strong>tware to detect instances <strong>of</strong> overlapping and similar text in submitted manuscripts and previouslypublished papers. Authors should ensure that relevant previously published papers are cited and that instances <strong>of</strong> similarity arejustified by clearly stating the distinction between a submitted paper and previous publications.<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 51
Publication Section (cont’d)Call for PapersAnnouncing an <strong>Issue</strong> <strong>of</strong> the <strong>IEEE</strong>JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS onOptical Detectors – Technology and ApplicationsSubmission Deadline: February 1, 2014The <strong>IEEE</strong> Journal <strong>of</strong> Selected Topics in Quantum Electronics (JSTQE) invites manuscript submissions in the area <strong>of</strong> OpticalDetectors – Technologies and Applications. Pure electronics cannot satisfy all application fields. <strong>Photonics</strong> and optoelectronicscomplement electronics for many <strong>of</strong> them. <strong>Photonics</strong> and optoelectronics demonstrate a large progress and may promise a larger,longer lasting growth than electronics alone. Within optoelectronics, stand alone and integrated optical detectors are a wide field <strong>of</strong>research. Since about two decades optical detectors have been integrated together with electronics in optoelectronic integratedcircuits or photodiode ICs. This evolution towards silicon-based technologies is based on the existing mature (Bi)CMOSmanufacturing infrastructure which can be used to cost-effectively produce photodiode integrated circuits for a wide range <strong>of</strong>applications. The solicited areas include (but are not limited to):• High-speed and ultrahigh-speed photodetectors• Infrared, visible, UV detectors• Single-photon detectors, silicon photomultipliers• Monolithic, heterogenous or hybride integration <strong>of</strong> detectors in III/V semiconductor and silicon technologies• Cost efficient packaging and testing solutions• Applications in optical receivers, optical storage systems, 3D-sensors, infrared cameras, thermography, quantumcommunications, sensing, spectroscopy, medical diagnostics and tele-communications.The Primary Guest Editor for this issue is Horst Zimmermann, Vienna University <strong>of</strong> Technology, Austria. The Guest Editors areEdoardo Charbon, Technical University <strong>of</strong> Delft, The Netherlands; Y. C. Chung, Korea Advanced Institute <strong>of</strong> Science andTechnology, Korea; and Hooman Mohseni, Northwestern University, USA.The deadline for submission <strong>of</strong> manuscripts is February 1, 2014. Unedited preprints <strong>of</strong> accepted manuscripts are normally postedonline on <strong>IEEE</strong> Xplore within 1 week <strong>of</strong> the final files being uploaded by the author(s) on the ScholarOne Manuscripts submissionsystem. Posted preprints have digital object identifiers (DOIs) assigned to them and are fully citable. Once available, final copyeditedand XML-tagged versions <strong>of</strong> manuscripts replace the preprints on <strong>IEEE</strong> Xplore. This usually occurs well before the hardcopypublication date. These final versions have article numbers assigned to them to accelerate the online publication; the same articlenumbers are used for the print versions <strong>of</strong> JSTQE. Hardcopy publication <strong>of</strong> the issue is scheduled for November/December 2014.For inquiries regarding this Special <strong>Issue</strong>, please contact:JSTQE Editorial Office - Chin Tan Lutz (Phone: 732-465-5813, Email: c.tanlutz@ieee.org)<strong>IEEE</strong>/<strong>Photonics</strong> <strong>Society</strong>The following documents are required during the mandatory online submission at: http://mc.manuscriptcentral.com/jstqe-pho.1) <strong>PDF</strong> or MS Word manuscript (double column format, up to 12 pages for an invited paper, up to 8 pages for a contributed paper).Manuscripts over the standard page limit will have an overlength charge <strong>of</strong> $220.00 per page imposed. Biographies <strong>of</strong> all authors aremandatory, photographs are optional. See the Tools for Authors link: www.ieee.org/web/publications/authors/transjnl/index.html.2) MS Word document with full contact information for all authors as indicated below:Last name (Family name), First name, Suffix (Dr./Pr<strong>of</strong>./Ms./Mr.), Affiliation, Department, Address, Telephone, Facsimile, Email.JSTQE uses the iThenticate s<strong>of</strong>tware to detect instances <strong>of</strong> overlapping and similar text in submitted manuscripts and previouslypublished papers. Authors should ensure that relevant previously published papers are cited and that instances <strong>of</strong> similarity arejustified by clearly stating the distinction between a submitted paper and previous publications.52 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
Publication Section (cont’d)Call for PapersAnnouncing an <strong>Issue</strong> <strong>of</strong> the <strong>IEEE</strong>JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS onSolid-State LasersSubmission Deadline: April 1, 2014The <strong>IEEE</strong> Journal <strong>of</strong> Selected Topics in Quantum Electronics (JSTQE) invites manuscript submissions in the area <strong>of</strong> Solid-StateLasers. Advances in solid-state lasers and nonlinear frequency conversion provide powerful tools for an increasingly broad range <strong>of</strong>applications including spectroscopy, metrology, remote sensing, security, material processing, astronomy, medicine, biology,display, and ignitions. Especially, the high-brightness as achievable with giant pulses from Q-switching and amplified mode-lockingenable fruitful nonlinear interactions for materials. The purpose <strong>of</strong> this issue <strong>of</strong> JSTQE is to highlight the recent progress and trendsin the development <strong>of</strong> leading-edge Solid-State Lasers. The solicited areas include (but are not limited to):• Solid-state laser physics, spectroscopy, theory, and modeling for materials and cavities• Tunable and new wavelength solid-state lasers, including nonlinear frequency conversions• High-power lasers and power scaling strategies (oscillator, amplifier, injection seeding/locking, and beam combining)• Short-pulse lasers (mode-locking, Q-switching, and their pulse gap)• Laser and nonlinear materials (single crystal, glass, semiconductor, and ceramics)• Laser structures (slab, disk, fiber, waveguide, microchip, and other micro-structures)• Pump sources for lasers such as high-power and wavelength-stabilized diode arrays• Narrow-linewidth, frequency-stable, and low-noise lasers• Applications in science, medicine, remote sensing, industry, display and ignitionsThe Primary Guest Editor for this issue is Takunori Taira, Laser Research Center, Institute for Molecular Science, Japan. TheGuest Editors are Tso Yee Fan, MIT Lincoln Laboratory, USA; and Guenter Huber, University <strong>of</strong> Hamburg, Germany.The deadline for submission <strong>of</strong> manuscripts is April 1, 2014. Unedited preprints <strong>of</strong> accepted manuscripts are normally posted onlineon <strong>IEEE</strong> Xplore within 1 week <strong>of</strong> the final files being uploaded by the author(s) on the ScholarOne Manuscripts submissionsystem. Posted preprints have digital object identifiers (DOIs) assigned to them and are fully citable. Once available, final copyeditedand XML-tagged versions <strong>of</strong> manuscripts replace the preprints on <strong>IEEE</strong> Xplore. This usually occurs well before the hardcopypublication date. These final versions have article numbers assigned to them to accelerate the online publication; the same articlenumbers are used for the print versions <strong>of</strong> JSTQE. Hardcopy publication <strong>of</strong> the issue is scheduled for January/February 2015.For inquiries regarding this Special <strong>Issue</strong>, please contact:JSTQE Editorial Office - Chin Tan Lutz (Phone: 732-465-5813, Email: c.tanlutz@ieee.org)<strong>IEEE</strong>/<strong>Photonics</strong> <strong>Society</strong>The following documents are required during the mandatory online submission at: http://mc.manuscriptcentral.com/jstqe-pho.1) <strong>PDF</strong> or MS Word manuscript (double column format, up to 12 pages for an invited paper, up to 8 pages for a contributed paper).Manuscripts over the standard page limit will have an overlength charge <strong>of</strong> $220.00 per page imposed. Biographies <strong>of</strong> all authors aremandatory, photographs are optional. See the Tools for Authors link: www.ieee.org/web/publications/authors/transjnl/index.html.2) MS Word document with full contact information for all authors as indicated below:Last name (Family name), First name, Suffix (Dr./Pr<strong>of</strong>./Ms./Mr.), Affiliation, Department, Address, Telephone, Facsimile, Email.JSTQE uses the iThenticate s<strong>of</strong>tware to detect instances <strong>of</strong> overlapping and similar text in submitted manuscripts and previouslypublished papers. Authors should ensure that relevant previously published papers are cited and that instances <strong>of</strong> similarity arejustified by clearly stating the distinction between a submitted paper and previous publications.<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 53
Publication Section (cont’d)Announcement <strong>of</strong> an <strong>Issue</strong> <strong>of</strong> the <strong>IEEE</strong>/OSAJournal <strong>of</strong> Lightwave Technology on:MICROWAVE PHOTONICS** Submission Deadline: January 1 st , 2014**The <strong>IEEE</strong>/OSA Journal <strong>of</strong> Lightwave Technology invites manuscript submissions in the area <strong>of</strong>Microwave <strong>Photonics</strong>. This special issue <strong>of</strong> the Journal <strong>of</strong> Lightwave Technology covers all topics in thefield <strong>of</strong> microwave photonics, including radio-over-fiber systems, microwave photonic technologies forbiomedical applications, broadband photonic devices, and photonic techniques for the generation,distribution, and processing <strong>of</strong> microwave signals. A portion <strong>of</strong> this issue will feature expanded versions <strong>of</strong>accepted papers presented at the 2013 International Topical Meeting on Microwave <strong>Photonics</strong> (MWP 2013)in Alexandria, Virginia, USA on October 28–31, 2013. It is therefore likely that the topic <strong>of</strong> the in-depthworkshop held on the first day <strong>of</strong> MWP 2013, which was integrated photonic devices and subsystems, willbe discussed in some <strong>of</strong> the papers assembled in this issue.The Guest Editors for this issue are: Edward Ackerman, Photonic Systems Inc., USA; Tadao Nagatsuma,Osaka University, Japan; Stavros Iezekiel, University <strong>of</strong> Cyprus, CyprusThe deadline for submission <strong>of</strong> manuscripts is January 1 st 2014. Please submit your paper to:http://mc.manuscriptcentral.com/jlt-ieee and under Manuscript Type select “Microwave <strong>Photonics</strong>2014”. Unedited preprints <strong>of</strong> accepted manuscripts are normally posted online on <strong>IEEE</strong> Xplore within 1week <strong>of</strong> authors uploading their final files in the ScholarOne Manuscripts submission system. The finalcopy-edited and XML-tagged version <strong>of</strong> a manuscript is posted on <strong>IEEE</strong> Xplore as soon as pro<strong>of</strong>s are sent inby authors. This version replaces the preprint and is usually posted well before the hardcopy <strong>of</strong> the issue ispublished. Hardcopy Publication is scheduled for September/October 2014.All submissions will be reviewed in accordance with the normal procedures <strong>of</strong> the Journal.All questions should be sent to:<strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>Doug Hargis445 Hoes LanePiscataway, NJ 08854 USAd.hargis@ieee.orgThe following documents are required using online submission at: http://mc.manuscriptcentral.com/jlt-ieee1. <strong>PDF</strong> or MS Word manuscript (double column format, up to 12 pages for an invited paper, up to 7pages for a contributed paper). Manuscripts over the page limits will have an overlength charge <strong>of</strong>$260.00 USD per page imposed. Biographies <strong>of</strong> all authors are optional, author photographs areprohibited. See Tools for Authors athttp://www.ieee.org/web/publications/authors/transjnl/index.html2. MS Word document with full contact information for all authors.54 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013
2013 <strong>IEEE</strong> International Topical Meeting onMicrowave <strong>Photonics</strong> (MWP)October 28 - 31, 2013Alexandria, Virginia, USACall For ParticipationMicrowave <strong>Photonics</strong> (MWP) is an inter-disciplinary field <strong>of</strong> studythat concerns the interactions between microwave and opticalwaves for the generation, processing, control and distribution <strong>of</strong>microwave, millimeter-wave and THz-frequency signals. Microwavephotonics serves as an enabling technology in a wide variety <strong>of</strong>applications such as signal generation and distribution, high-speedwireless communication networks, radar systems, sensors, andmodern instrumentation. The 2013 International Topical Meeting onMicrowave <strong>Photonics</strong> (MWP 2013) will provide a forum for thepresentation <strong>of</strong> new advances in this multi-disciplinary researcharea, ranging from novel devices to system field trials. MWP 2013is now soliciting papers for the conference.Conference Scope:• Radio-over-fiber systems• Photonic techniques for microwave backhaul• Photonic systems for antennas and beamforming• Optical technologies for high-frequency wireless systems andUWB systems• Microwave photonic technologies for biomedical applications• High-speed and/or broadband photonic devices• Integration technologies for microwave photonic devices• Optical analog-to-digital converters• Optical probing and sensing <strong>of</strong> microwave properties• Optical generation <strong>of</strong> RF, microwave, millimeter-wave and THzwaves and optoelectronic oscillators• Optical processing and control <strong>of</strong> analog and digital signals• Optical distribution <strong>of</strong> subcarrier multiplexed voice, data, and video• Innovative applications <strong>of</strong> microwave photonicsGeneral ChairEdward AckermanPhotonic Systems, Inc.TPC ChairPaul MatthewsNorthrop Grumman Corp.FinanceRobert Alongi<strong>IEEE</strong> Boston SectionPublicityYifei LiUMass DartmouthSponsorshipAdil KarimJohns Hopkins UniversityExhibit CoordinatorVincent UrickNaval Research LaboratoryStudent Paper ContestTom ClarkJohns Hopkins UniversityWebsiteKathleen BallosBallos AssociatesLocal Arrangements:Dalma NovakRod WaterhousePharad USAConference VenueHotel Monaco - Alexandria480 King StreetAlexandria, VA 22314 USA<strong>August</strong> 2013 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER 55
ADVERTISER’S INDEXThe Advertiser’s Index contained in this issue iscompiled as a service to our readers and advertisers.The publisher is not liable for errors or omissionsalthough every effort is made to ensure itsaccuracy. Be sure to let our advertisers know youfound them through the <strong>IEEE</strong> <strong>Photonics</strong> <strong>Society</strong>Newsletter.Advertiser . . . . . . . . . . . . . Page #General <strong>Photonics</strong> . . . . . . . . . . . . . .CVR 2Woodhead Publishing LTD . . . . . . . . . . 17<strong>IEEE</strong> Marketing Department . . . . . . . . 23NANOLN . . . . . . . . . . . . . . . . . . . .CVR 3Optiwave Systems Inc . . . . . . . . . . .CVR 4<strong>Photonics</strong> <strong>Society</strong>Mission Statement<strong>Photonics</strong> <strong>Society</strong> shall advance the interests<strong>of</strong> its members and the laser, optoelectronics,and photonics pr<strong>of</strong>essional community by:• providing opportunities for informationexchange, continuing education, andpr<strong>of</strong>essional growth;• publishing journals, sponsoring conferences,and supporting local chapter andstudent activities;• formally recognizing the pr<strong>of</strong>essionalcontributions <strong>of</strong> members;• representing the laser, optoelectronics,and photonics community and serving asits advocate within the <strong>IEEE</strong>, the broaderscientific and technical community, andsociety at large.<strong>Photonics</strong> <strong>Society</strong>Field <strong>of</strong> InterestThe Field <strong>of</strong> Interest <strong>of</strong> the <strong>Society</strong> shall be lasers,optical devices, optical fibers, and associatedlightwave technology and their applicationsin systems and subsystems in which quantumelectronic devices are key elements. The <strong>Society</strong>is concerned with the research, development,design, manufacture, and applications <strong>of</strong> materials,devices and systems, and with the variousscientific and technological activities whichcontribute to the useful expansion <strong>of</strong> the field <strong>of</strong>quantum electronics and applications.The <strong>Society</strong> shall aid in promoting close cooperationwith other <strong>IEEE</strong> groups and societiesin the form <strong>of</strong> joint publications, sponsorship<strong>of</strong> meetings, and other forms <strong>of</strong> informationexchange. Appropriate cooperative efforts willalso be undertaken with non-<strong>IEEE</strong> societies.<strong>IEEE</strong> <strong>Photonics</strong><strong>Society</strong> NewsletterAdvertising Sales Offices445 Hoes Lane, Piscataway NJ 08854www.ieee.org/ieeemediaImpact this hard-to-reach audience in their own <strong>Society</strong>publication. For further information on product andrecruitment advertising, call your local sales <strong>of</strong>fice.MANAGEMENTJames A. VickSr. Director, AdvertisingPhone: 212-419-7767Fax: 212-419-7589jv.ieeemedia@ieee.orgSusan E. SchneidermanBusiness DevelopmentManagerPhone: 732-562-3946Fax: 732-981-1855ss.ieeemedia@ieee.orgMarion DelaneyAdvertising Sales DirectorPhone: 415-863-4717Fax: 415-863-4717md.ieeemedia@ieee.orgPRODUCTADVERTISINGMidatlanticLisa RinaldoPhone: 732-772-0160Fax: 732-772-0161lr.ieeemedia@ieee.orgNY, NJ, PA, DE, MD, DC,KY, WVNew England/South Central/Eastern CanadaJody EstabrookPhone: 774-283-4528Fax: 774-283-4527je.ieeemedia@ieee.orgME, VT, NH, MA, RI, CT,AR, LA, OK, TXCanada: Quebec, Nova Scotia,Newfoundland, Prince EdwardIsland, New BrunswickSoutheastThomas FlynnPhone: 770-645-2944Fax: 770-993-4423tf.ieeemedia@ieee.orgVA, NC, SC, GA, FL, AL,MS, TNMidwest/Central CanadaDave JonesPhone: 708-442-5633Fax: 708-442-7620dj.ieeemedia@ieee.orgIL, IA, KS, MN, MO, NE,ND, SD, WI, OHCanada: Manitoba,Saskatchewan, AlbertaMidwest/Ontario, CanadaWill HamiltonPhone: 269-381-2156Fax: 269-381-2556wh.ieeemedia@ieee.orgIN, MI. Canada: OntarioWest Coast/Northwest/Western CanadaMarshall RubinPhone: +1 818 888 2407;Fax: +1 818 888 4907mr.ieeemedia@ieee.orgAZ, CO, HI, NM, NV,UT, AK, ID, MT, WY,OR, WA, CA. Canada:British ColumbiaEurope/Africa/Middle EastHeleen VodegelPhone: +44-1875-825-700Fax: +44-1875-825-701hv.ieeemedia@ieee.orgEurope, Africa, Middle EastAsia/Far East/Pacific RimLouise SmithPhone: +44-1875-825-700Fax: +44-1875-825-701les.ieeemedia@ieee.orgAsia, Far East, Pacific Rim,Australia, New ZealandRECRUITMENTADVERTISINGMidatlanticLisa RinaldoPhone: 732-772-0160Fax: 732-772-0161lr.ieeemedia@ieee.orgNY, NJ, CT, PA, DE, MD,DC, KY, WVNew England/Eastern CanadaLiza ReichPhone: +1 212 419 7578Fax: 212-419-7589e.reich@ieee.orgME, VT, NH, MA, RICanada: Quebec,Nova Scotia,Prince Edward Island,Newfoundland,New BrunswickSoutheastCathy FlynnPhone: 770-645-2944Fax: 770-993-4423cf.ieeemedia@ieee.orgVA, NC, SC, GA, FL, AL,MS, TNMidwest/Texas/CentralCanadaDarcy GiovingoPhone: 847-498-4520Fax: 847-729-4269dg.ieeemedia@ieee.org;AR, IL, IN, IA, KS, LA,MI, MN, MO, NE, ND,SD, OH, OK, TX, WI.Canada: Ontario,Manitoba, Saskatchewan,AlbertaWest Coast/Southwest/Mountain States/AsiaTim MattesonPhone: 310-836-4064Fax: 310-836-4067tm.ieeemedia@ieee.orgAZ, CO, HI, NV, NM,UT, CA, AK, ID, MT,WY, OR, WA.Canada: British ColumbiaEurope/Africa/Middle EastHeleen VodegelPhone: +44-1875-825-700Fax: +44-1875-825-701hv.ieeemedia@ieee.orgEurope, Africa,Middle East56 <strong>IEEE</strong> PHOTONICS SOCIETY NEWSLETTER <strong>August</strong> 2013