2011 CALL FOR ABSTRACTS & PAPERS - CEC-ICMC 2013
2011 CALL FOR ABSTRACTS & PAPERS - CEC-ICMC 2013
2011 CALL FOR ABSTRACTS & PAPERS - CEC-ICMC 2013
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CRYOGENIC ENGINEERING CONFERENCE &INTERNATIONAL CRYOGENIC MATERIALS CONFERENCE<strong>2011</strong> <strong>CALL</strong> <strong>FOR</strong> <strong>ABSTRACTS</strong> & <strong>PAPERS</strong>Spokane Convention CenterSpokane, Washington USA - June 13 - June 17, <strong>2011</strong>http://www.cec-icmc.orgWe invite you to participate in the <strong>2011</strong> Cryogenic Engineering Conference (<strong>CEC</strong>) and International Cryogenic MaterialsConference (<strong>ICMC</strong>) to be jointly held from June 13 to June 17, <strong>2011</strong> at the Spokane Convention Center in Spokane,Washington, USA. The conference program format will consist of plenary, focused, and special sessions with oral andposter presentations covering all aspects of cryogenic engineering and materials. In addition, an extensive exhibit willshowcase the most up-to-date products and technologies in the cryogenic field.Spokane is located in Washington state, and is the largest city between Seattle and Minneapolis. The beautiful SpokaneRiver runs through downtown with spectacular falls on the western end of the city core. Riverfront Park is in the heart ofthe city, and there are numerous places to shop and eat. All of this is located just a short walk from the conventioncenter.<strong>CALL</strong> <strong>FOR</strong> <strong>ABSTRACTS</strong> & <strong>PAPERS</strong>Authors are requested to submit abstracts and papers that address any aspect of cryogenic engineering and cryogenicmaterials research. The submission categories are listed below for the <strong>CEC</strong> and the <strong>ICMC</strong> respectively.The subject matter of submitted abstracts and papers should be technically orientated and feature new, originaldevelopments in cryogenic engineering and materials. Manuscripts will be peer reviewed for possible publication by theAmerican Institute of Physics in the conference transactions, Advances in Cryogenic Engineering. The mode ofpresentation (oral or poster) will have no effect on the review of the submitted paper. Acceptance of an abstract forpresentation does not guarantee publication in the conference transactions.PREPARING <strong>ABSTRACTS</strong>Submission of abstracts for <strong>CEC</strong>-<strong>ICMC</strong> will be entirely electronic, using the conference website, www.cec-icmc.org.Complete information regarding the format of abstracts and submission categories can be found at this website. Thedeadline to submit abstracts is December 24, 2010.ABSTRACT ACCEPTANCE & MANUSCRIPT SUBMISSIONAbstract acceptance letters will be emailed by mid February, <strong>2011</strong>. Instructions on manuscript preparation andsubmission will be posted on the website. The deadline for electronic submission of manuscripts is June 14, <strong>2011</strong>.To allow time for potential foreign participants to file their Visa applications in a timely manner, abstracts generated byforeign participants should be submitted as early as possible. The conference organizers will endeavor to respondquickly to these abstracts as they come in. (Please see the “VISA Requirements” section below.)EXHIBITSA technical exhibition of materials, services, instruments and literature will take place during the conference. If you or yourcompany are interested or would like to receive additional information about the <strong>CEC</strong>-<strong>ICMC</strong> <strong>2011</strong> Exhibition, you may visitthe conference website or contact Centennial Conferences at Phone: (001) 303-499-2299, Fax: (001) 303-499-2599, Email:cecicmc@centennialconferences.com.FINANCIAL SUPPORTA limited amount of financial support in the form of a waived registration is available for students and attendees fromdeveloping countries presenting papers. The guidelines for requesting assistance are available on the webpage. Thedeadline to apply is January 31, 2009.1 of 4
<strong>CEC</strong>-<strong>ICMC</strong> SUBMISSION CATEGORIES<strong>CEC</strong> SUBMISSION CATEGORIES<strong>CEC</strong>-01<strong>CEC</strong>-02<strong>CEC</strong>-03<strong>CEC</strong>-04<strong>CEC</strong>-05<strong>CEC</strong>-06<strong>CEC</strong>-07<strong>CEC</strong>-08<strong>CEC</strong>-09<strong>CEC</strong>-10<strong>CEC</strong>-11<strong>CEC</strong>-12<strong>CEC</strong>-13<strong>CEC</strong>-14<strong>CEC</strong>-15<strong>CEC</strong>-16<strong>CEC</strong>-17<strong>CEC</strong>-18<strong>CEC</strong>-19<strong>CEC</strong>-20<strong>CEC</strong>-21<strong>CEC</strong>-22<strong>CEC</strong>-23<strong>CEC</strong>-24Large-Scale Refrigeration and LiquefactionLarge-Scale Systems, Facilities, and TestingPulse Tube Cryocoolers (non-aerospace)Magnetic, Stirling, and Other Coolers (non-aerospace)Expanders, Pumps, and CompressorsRegeneratorsStirling and Pulse Tube Cryocoolers (aerospace)Magnetic, Sorption, and Other Coolers (aerospace)LTS Superconducting Magnet SystemsHTS Superconducting Magnet SystemsSuperconducting RF SystemsCryogenic Power Cables and LeadsEnergy, Transportation, and FuelsPower Electronics, Materials, and SystemsAerospace and Space LaunchSafety, Reliability, and StandardsFluid Mechanics, Heat Transfer, and Cryogen PropertiesHelium II Properties and SystemsThermal Insulation SystemsInstrumentation and ControlsEnvironmental Process ApplicationsCryogenic Applications in Industry and ManufacturingCryogenics for Medical and Food ApplicationsNovel Concepts and New Devices<strong>ICMC</strong> SUBMISSION CATEGORIES<strong>ICMC</strong>-01<strong>ICMC</strong>-02<strong>ICMC</strong>-03<strong>ICMC</strong>-04<strong>ICMC</strong>-05<strong>ICMC</strong>-06<strong>ICMC</strong>-07<strong>ICMC</strong>-08<strong>ICMC</strong>-09<strong>ICMC</strong>-10<strong>ICMC</strong>-11<strong>ICMC</strong>-12<strong>ICMC</strong>-13<strong>ICMC</strong>-14<strong>ICMC</strong>-15<strong>ICMC</strong>-16<strong>ICMC</strong>-17<strong>ICMC</strong>-18<strong>ICMC</strong>-19<strong>ICMC</strong>-20<strong>ICMC</strong>-21<strong>ICMC</strong>-22<strong>ICMC</strong>-23Ferrous Metals at Cryo Temp'sNon-Ferrous Metals at Cryo Temp'sMaterials for SRF and LinacsPolymers, Resins, and Composites at Cryo Temp'sElectrical Insulation Materials at Cryo Temp'sNb-Ti and Other Alloy SuperconductorsNiobium3-Tin SuperconductorsA-15 and Other Compound SuperconductorsHTS BSCCO Wires and TapesHTS Coated ConductorsMgB2 (Wire and Film)Bulk HTS SuperconductorsThin Film Superconductors (HTS and LTS)Mechanical Properties of HTS MaterialsMechanical Properties of LTS MaterialsSuperconductor Stability and AC LossesMaterials Properties of LTS Cables, Magnets and MachinesNew Superconducting Materials (including Pnictides)Low Temperature Test Methods and StandardizationNovel Materials, Processes and ApplicationsCryogenic Power Electronics, Materials and SystemsFlux PinningMaterials Properties of HTS Cables, Magnets and MachinesPROGRAM SUGGESTIONSSuggestions concerning the technical program, particularly topical workshops and special sessions, should be directed tothe appropriate Conference or Program Chair.<strong>CEC</strong>:Conference ChairAl ZellerFRIB/MSU2121 CyclotronE. Lansing, MI 48824Phone: (517) 908-7395Email: zeller@frib.msu.edu<strong>ICMC</strong>:Conference ChairKenneth MarkenLos Alamos National LaboratoryMailstop K763Los Alamos, NM 87545Phone: (505) 667-0217Email: kmarken@lanl.govProgram ChairMichael SumptionMSE, The Ohio State University477 Watts Hall2041 College RoadColumbus, OH 43210Tel: (614) 688-3684Email: sumption.3@osu.eduProgram ChairJames E. FesmireNASA Kennedy Space CenterMail Code NE-F6KSC, FL 32899Phone: (321) 867-7557Email: james.e.fesmire@nasa.govProgram Vice-Chair (Europe)TBDProgram Vice-ChairFranklin MillerUniversity of WisconsinRoom 1341, Engr. Research Bldg.1500 Engineering DriveMadison, WI 53706Phone: (540) 533-9632Email: fkmiller@wisc.eduProgram Vice-Chair (Asia)TBD3 of 4
DATES TO REMEMBERDecember 15, 2010December 24, 2010January 3, <strong>2011</strong>January 31, <strong>2011</strong>Mid February, <strong>2011</strong>February 18, <strong>2011</strong>March 1, <strong>2011</strong>March 8, <strong>2011</strong>April 4, <strong>2011</strong>April 13, <strong>2011</strong>April 18, <strong>2011</strong>April 29, <strong>2011</strong>April 29, <strong>2011</strong>May 27, 2009June 13 to 17, <strong>2011</strong>June 14, <strong>2011</strong>Samuel C. Collins Award Nomination DeadlineAbstract Submission Deadline<strong>CEC</strong> Board Nominations DeadlineFinancial Support Application DeadlineNotification of Abstract AcceptanceConference Registration OpensHotel Reservation OpensStudent Travel Award Application DeadlineStudent Meritorious Paper Award Application Deadline<strong>ICMC</strong> Lifetime Achievement Award Nomination Deadline<strong>CEC</strong> Klaus Timmerhaus Scholarship Award Application DeadlineHotel Reservation DeadlineEarly Conference Registration Fee DeadlinePre-Conference Registration DeadlineCONFERENCEManuscript Submission DeadlineCRYOGENIC ENGINEERING CONFERENCE &INTERNATIONAL CRYOGENIC MATERIALS CONFERENCESpokane Convention CenterSpokane, Washington USAJune 13 – June 17, <strong>2011</strong><strong>CALL</strong> <strong>FOR</strong> <strong>ABSTRACTS</strong> & <strong>PAPERS</strong>Abstract Submission Deadline: December 24, 20104 of 4
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