Silicon-based solar cells Characteristics and production processes ...
Silicon-based solar cells Characteristics and production processes ...
Silicon-based solar cells Characteristics and production processes ...
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<strong>Silicon</strong>-<strong>based</strong> <strong>solar</strong> <strong>cells</strong> – characteristics <strong>and</strong> <strong>production</strong> <strong>processes</strong><br />
Rear Locally diffused). Although it is made on a 4 cm 2 plate, its basic parameters, such<br />
as: V oc = 0,706 V, J sc = 42,2 mA/cm 2 i FF = 0,828, determine the level of values to<br />
which one should refer their results in the field of silicon cell construction. The cell,<br />
manufactured in the photolithographic technology, has such excellent parameters<br />
due to the following factors: a very small value of the reflection coefficient ~ 2 %,<br />
obtained as a result of selective etching of the front surface, a high resistance of the<br />
n-layer between the front contacts – above 200 Ω/□, an additional donor impurity of<br />
the n + -type under the front contacts <strong>and</strong> an additional acceptor impurity of the p + -<br />
type under the local rear contacts. One of the more interesting concepts are the <strong>cells</strong><br />
with buried contacts, type BCSC (Buried Contact Solar Cell), which have been<br />
produced since the beginning of the 1990s, under license of the English company<br />
BP Solar [65].<br />
Fig. 30. Cross-section of a mono-crystalline silicon <strong>solar</strong> cell with buried contacts (BCSC).<br />
The highest conversion efficiency, 22 %, was obtained for a mono-crystalline<br />
BCSC cell, type FZ. The basis for achieving such a high efficiency is the application<br />
of the front electrode contacts made of a nickel-copper-silver layer, deposited by<br />
means of a chemical bath in the ~ 30 ÷ 50 μm deep laser-cut grooves. Applying a<br />
second donor diffusion through the mask makes it possible to create a strongly doped<br />
n +- type area under the contacts, with the laminar resistance at the level of 20 Ω/□,<br />
which affects the reduction of the series resistance. The high-resistant emitter R ρ<br />
~ 120 ÷ 200 Ω/□, between the thin leading electrodes, reduces the disadvantageous<br />
effect of the Auger recombination process <strong>and</strong> allows for a significant improvement<br />
of the cell’s current density.<br />
Another cell type, combining the mono-crystalline silicon with the amorphous<br />
one, is the HIT-type <strong>solar</strong> cell (Heterojunction with Intrinsic Thin layer), whose<br />
construction scheme is presented in Fig. 31.<br />
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