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ANSYS Solution to the Electronics Industry

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Package Object : MCM import<br />

• Enhanced Package Object<br />

– Import trace and via geometry,<br />

wirebonds, solder ball, solder bumps,<br />

etc from MCM database<br />

– Control package location<br />

– Component visibility<br />

© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 38 <strong>ANSYS</strong>, Inc. Proprietary

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