ANSYS Solution to the Electronics Industry

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Meshing: Mesher-HD - Uniform Params Mesher-HD for ANSYS Icepak 12.0: • New feature “Uniform Params” effectively blocks interactions between sub-blocking meshes – Non-conformal mesh in subblocks – Uniform mesh sizes – Lower mesh count – Improved quality Mesh Count ~ 20k Lowest quality= 0.026 © 2009 ANSYS, Inc. All rights reserved. 28 ANSYS, Inc. Proprietary
Multi-level Meshing: An Example No Multi-level Mesh Mesh size = 0.4 mm; Count = 931k Multi-level Mesh Mesh size = 2 mm; Count = 343k © 2009 ANSYS, Inc. All rights reserved. 29 ANSYS, Inc. Proprietary
Page 1 and 2: ANSYS Solution to the Electronics I
Page 3 and 4: ANSYS Solutions to the Electronics
Page 5 and 6: ANSYS and the Electronics Design Fl
Page 7 and 8: Thermal Management with Icepak Comm
Page 9 and 10: Thermal mechanical Stress: BGA Sold
Page 11 and 12: Random Vibration PSD vibration exci
Page 13 and 14: Ansoft Simulation Solutions Signal
Page 15 and 16: Evolution of Multiphysics Engineeri
Page 17 and 18: Evolution of Multiphysics Engineeri
Page 19 and 20: Using ANSYS Workbench 2.0 “Editor
Page 21 and 22: Post-Processing Results All cells a
Page 23 and 24: Consider a More Complex Project Sma
Page 25 and 26: New in 12.0 Introduce ANSYS Explici
Page 27: ANSYS Icepak 12.0: Overview of Majo
Page 31 and 32: Advanced in PCB Design • Electric
Page 33 and 34: ANSYS Icepak 12.0: Board design •
Page 35 and 36: Trace Heating Boundary Conditions
Page 37 and 38: Trace Heating - Example © 2009 ANS
Page 39 and 40: Package Object: Solder Ball and Sol
Page 41: ANSYS Provides the Industry with Un

ANSYS Solution to the Electronics Industry

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