ANSYS Solution to the Electronics Industry

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Moisture Induced Stress Uses Fick’s Law of Diffusion to simulate moisture content and resultant hygroscopic strain Images courtesy PADT Inc. ¼ Symmetry model Moisture content Moisture swelling - displacements © 2009 ANSYS, Inc. All rights reserved. 10 ANSYS, Inc. Proprietary
Random Vibration PSD vibration excitation plane Fixed support Equivalent stress Deformation Acceleration © 2009 ANSYS, Inc. All rights reserved. 11 ANSYS, Inc. Proprietary
Page 1 and 2: ANSYS Solution to the Electronics I
Page 3 and 4: ANSYS Solutions to the Electronics
Page 5 and 6: ANSYS and the Electronics Design Fl
Page 7 and 8: Thermal Management with Icepak Comm
Page 9: Thermal mechanical Stress: BGA Sold
Page 13 and 14: Ansoft Simulation Solutions Signal
Page 15 and 16: Evolution of Multiphysics Engineeri
Page 17 and 18: Evolution of Multiphysics Engineeri
Page 19 and 20: Using ANSYS Workbench 2.0 “Editor
Page 21 and 22: Post-Processing Results All cells a
Page 23 and 24: Consider a More Complex Project Sma
Page 25 and 26: New in 12.0 Introduce ANSYS Explici
Page 27 and 28: ANSYS Icepak 12.0: Overview of Majo
Page 29 and 30: Multi-level Meshing: An Example No
Page 31 and 32: Advanced in PCB Design • Electric
Page 33 and 34: ANSYS Icepak 12.0: Board design •
Page 35 and 36: Trace Heating Boundary Conditions
Page 37 and 38: Trace Heating - Example © 2009 ANS
Page 39 and 40: Package Object: Solder Ball and Sol
Page 41: ANSYS Provides the Industry with Un

ANSYS Solution to the Electronics Industry

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