ANSYS Solution to the Electronics Industry
ANSYS Solution to the Electronics Industry
ANSYS Solution to the Electronics Industry
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<strong>ANSYS</strong> <strong>Solution</strong> <strong>to</strong> <strong>the</strong> <strong>Electronics</strong><br />
<strong>Industry</strong><br />
Fadi Ben Achour<br />
<strong>ANSYS</strong> Inc<br />
Direc<strong>to</strong>r of <strong>Electronics</strong> <strong>Industry</strong> Marketing<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 1 <strong>ANSYS</strong>, Inc. Proprietary
Presentation Outline<br />
• <strong>ANSYS</strong> Multiphysics solutions<br />
– <strong>Electronics</strong> cooling solutions<br />
– Structural mechanical solutions<br />
– Electromagnetic solutions (Ansoft)<br />
• New <strong>ANSYS</strong> R12 and WB 2.0 capabilities<br />
• New Icepak 12.0 capabilities<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 2 <strong>ANSYS</strong>, Inc. Proprietary
<strong>ANSYS</strong> <strong>Solution</strong>s <strong>to</strong> <strong>the</strong> <strong>Electronics</strong><br />
<strong>Industry</strong><br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 3 <strong>ANSYS</strong>, Inc. Proprietary
<strong>ANSYS</strong> and <strong>the</strong> <strong>Electronics</strong> Design<br />
Flow<br />
IC Design<br />
(EDA industry)<br />
IC Manufacturing<br />
Metal Chemical Vapor Deposition<br />
Courtesy Novellus systems<br />
Package<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 4 <strong>ANSYS</strong>, Inc. Proprietary
<strong>ANSYS</strong> and <strong>the</strong> <strong>Electronics</strong> Design<br />
Flow<br />
Printed Circuit Board (PCB)<br />
End Product<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 5 <strong>ANSYS</strong>, Inc. Proprietary
Thermal Management with Icepak<br />
Semiconduc<strong>to</strong>rs: Ball Grid Array (BGA)<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 6 <strong>ANSYS</strong>, Inc. Proprietary
Thermal Management with Icepak<br />
Communication : Server and Routers<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 7 <strong>ANSYS</strong>, Inc. Proprietary
Advanced CFD and Multiphysics<br />
Simulation<br />
Micro channels<br />
Piezoelectric fan<br />
Blower and fan modeling<br />
Thermo-Electric cooler<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 8 <strong>ANSYS</strong>, Inc. Proprietary
Thermal mechanical Stress:<br />
BGA Solder and Lead frame<br />
Exaggerated deformation due <strong>to</strong> <strong>the</strong> CTE mismatch between <strong>the</strong> different materials<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 9 <strong>ANSYS</strong>, Inc. Proprietary
Moisture Induced Stress<br />
Uses Fick’s Law of Diffusion <strong>to</strong> simulate moisture content and resultant<br />
hygroscopic strain<br />
Images courtesy PADT Inc.<br />
¼ Symmetry model<br />
Moisture content<br />
Moisture swelling - displacements<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 10 <strong>ANSYS</strong>, Inc. Proprietary
Random Vibration<br />
PSD<br />
vibration<br />
excitation<br />
plane<br />
Fixed support<br />
Equivalent stress<br />
Deformation<br />
Acceleration<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 11 <strong>ANSYS</strong>, Inc. Proprietary
Drop Test Simulation with <strong>ANSYS</strong><br />
Explicit STR: Cell Phone Example<br />
Absolute displacement Von Mises stress<br />
After 6ms<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 12 <strong>ANSYS</strong>, Inc. Proprietary
Ansoft Simulation <strong>Solution</strong>s<br />
Signal & power integrity<br />
RF & Microwave<br />
Name Value<br />
FEA1.FEA_STEPS<br />
SIMPARAM1.RunTime [s] 26.41k<br />
SIMPARAM1.TotalIterations 34.51k<br />
SIMPARAM1.TotalSteps 6.00k<br />
IC design & verification<br />
10.00<br />
Torque Output<br />
ICA: LL:=922u LDUM:=10m<br />
7.80<br />
RA:=2.991<br />
0<br />
LA.I [A]<br />
0<br />
LB.I [A]<br />
PWM_T:=60<br />
LC.I [A]<br />
PWM_PER:=180<br />
Electromechanical systems<br />
-10.30<br />
I_TARG:=9<br />
-14.50<br />
0 20.00m<br />
30.00m<br />
I_HYST:=0.2<br />
0 20.00m<br />
30.00m<br />
1500 rpm<br />
400 V<br />
302.00k<br />
200.00k<br />
-30.00k<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 13 <strong>ANSYS</strong>, Inc. Proprietary<br />
Q1<br />
FEA Outputs<br />
0 20.00m 30.00m<br />
Q4 Q6<br />
FEA1.WIRE<br />
FEA1.CORE<br />
FEA1.Isourc<br />
FEA1.Vsour<br />
FEA1.EIsou<br />
FEA1.FLUX<br />
FEA1.Isourc<br />
FEA1.Vsour<br />
FEA1.EIsou<br />
FEA1.FLUX<br />
FEA1.Isourc<br />
FEA1.Vsour<br />
FEA1.EIsou<br />
FEA1.FLUX<br />
FEA1.PHI<br />
FEA1.OMEG 8.50<br />
5.00<br />
0<br />
Q3 Q5<br />
0 20.00m<br />
30.00m<br />
Q2<br />
LA.I<br />
-LC.I<br />
LB.I<br />
-LA.I<br />
LC.I<br />
INPUT := -LB.I<br />
THRES1 := I_TARG - I_HYST<br />
THRES2 := I_TARG + I_HYST<br />
Y0 := 1<br />
RA Ohm LL H<br />
VAL1 := 1<br />
VAL2 := 0<br />
THRES := PWM_T<br />
QS1<br />
QS2<br />
QS3<br />
QS4<br />
QS5<br />
Q1.CTRL +<br />
Q2.CTRL +<br />
Q3.CTRL +<br />
Q4.CTRL +<br />
Q5.CTRL +<br />
Q6.CTRL<br />
QS6<br />
sourceA1<br />
sourceA2<br />
sourceB1<br />
sourceB2<br />
sourceC1<br />
sourceC2<br />
VAL[0] := mod( INPUT[0] ,INPUT[1] )<br />
EQUBL<br />
EQUBL<br />
EQUBL<br />
EQUBL<br />
EQUBL<br />
EQUBL<br />
INPUT[1] := PWM_PER<br />
8.50<br />
5.00<br />
Magnet01<br />
Magnet02<br />
FEA<br />
GAIN<br />
57.3<br />
CONST<br />
CONST<br />
CONST<br />
CONST<br />
CONST<br />
+<br />
Φ<br />
-30+PWM_PER<br />
-60+PWM_PER<br />
-90+PWM_PER<br />
-120+PWM_PER<br />
-150+PWM_PER<br />
+<br />
ω<br />
ANGRAD<br />
0<br />
0 20.00m<br />
30.00m<br />
QS1.VAL +<br />
QS2.VAL +<br />
QS3.VAL +<br />
QS4.VAL +<br />
QS5.VAL +<br />
QS6.VAL
Evolution of Multiphysics<br />
Engineering Simulation<br />
11.0 12.0 13.0<br />
Geometry<br />
Modeler<br />
CAD<br />
Interface<br />
Geometry<br />
Workbench<br />
Meshing<br />
Meshing<br />
CFX<br />
Setup<br />
FLUENT<br />
Setup<br />
Structural<br />
Setup<br />
Modeling<br />
Struct<br />
FLUENT<br />
Therm Emag<br />
Multiphysics<br />
Solvers<br />
Scripting<br />
Optimization Optimization<br />
Data Integration<br />
Parameterization<br />
FLUENT New Scalable Supports Common Workbench Integrated & All Adaptable CFD Simulation 2.0 Postprocessor<br />
In<strong>to</strong> Architecture!<br />
Framework Workbench Services<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 14 <strong>ANSYS</strong>, Inc. Proprietary<br />
CFX<br />
Fluids<br />
Post<br />
Structural<br />
Post<br />
Post<br />
Processing<br />
Data &<br />
Process<br />
Mgmt<br />
Add-ins
Evolution of Multiphysics<br />
Engineering Simulation<br />
11.0 12.0 13.0<br />
Project Management Simulation Workflow<br />
CAD<br />
Interface<br />
Geometry<br />
Workbench<br />
Meshing<br />
Meshing<br />
Structural<br />
Setup<br />
Modeling<br />
Therm Emag<br />
Multiphysics<br />
Solvers<br />
Scripting Optimization<br />
Data Integration Parameterization<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 15 <strong>ANSYS</strong>, Inc. Proprietary<br />
Struct<br />
FLUENT<br />
CFX<br />
Structural<br />
Post<br />
Post<br />
Processing<br />
Data &<br />
Process<br />
Mgmt<br />
Add-ins<br />
Innovative Workflow System Accelerates Innovation
Evolution of Multiphysics<br />
Engineering Simulation<br />
11.0 12.0 13.0<br />
Turbo<br />
CAD<br />
Interface<br />
Geometry<br />
Offshore<br />
<strong>Electronics</strong><br />
Workbench<br />
Meshing<br />
Meshing<br />
Polymers<br />
…<br />
Project Management Simulation Workflow<br />
Structural<br />
Setup<br />
Modeling<br />
Therm Emag<br />
Multiphysics<br />
Solvers<br />
Scripting Optimization<br />
Data Integration Parameterization<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 16 <strong>ANSYS</strong>, Inc. Proprietary<br />
Struct<br />
FLUENT<br />
CFX<br />
Structural<br />
Post<br />
Post<br />
Processing<br />
Data &<br />
Process<br />
Mgmt<br />
Add-ins<br />
Vertical Products Designed <strong>to</strong> Address <strong>Industry</strong> Needs
Evolution of Multiphysics<br />
Engineering Simulation<br />
11.0 12.0 13.0<br />
Turbo<br />
Geometry<br />
Modeler<br />
CAD<br />
Interface<br />
Geometry<br />
Offshore<br />
<strong>Electronics</strong><br />
3rd Party<br />
Meshing<br />
Workbench<br />
Meshing<br />
Meshing<br />
Polymers<br />
…<br />
CFX<br />
Setup<br />
FLUENT<br />
Setup<br />
Multiphysics Structural<br />
Setup<br />
Modeling<br />
Therm Emag<br />
Multiphysics<br />
Solvers<br />
Scripting Optimization<br />
Data Integration Parameterization<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 17 <strong>ANSYS</strong>, Inc. Proprietary<br />
Struct<br />
FLUENT<br />
CFX<br />
<strong>ANSYS</strong><br />
3 rd<br />
Party<br />
Fluids<br />
Post<br />
Multiphysics Structural<br />
Post Post<br />
Post<br />
Processing<br />
…<br />
3rd Party<br />
Fatigue<br />
Tool<br />
Project Management Simulation Workflow<br />
Data &<br />
Process<br />
Mgmt<br />
Add-ins<br />
Fully Integrated Multiphysics Simulation Environment
Complete Analysis Systems<br />
The Analysis Systems group<br />
contains a set of pre-defined<br />
systems listed by analysis<br />
type (and solver)<br />
Drag <strong>the</strong> desired analysis type<br />
on<strong>to</strong> <strong>the</strong> Project Schematic<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 18 <strong>ANSYS</strong>, Inc. Proprietary
Using <strong>ANSYS</strong> Workbench 2.0 “Edi<strong>to</strong>rs”<br />
Edit operation launches <strong>the</strong><br />
application associated with <strong>the</strong><br />
cell <strong>to</strong> define details.<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 19 <strong>ANSYS</strong>, Inc. Proprietary
Using <strong>ANSYS</strong> Workbench 2.0 “Edi<strong>to</strong>rs”<br />
Smart<br />
Engineering<br />
Simulation<br />
Process<br />
Compression<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 20 <strong>ANSYS</strong>, Inc. Proprietary
Post-Processing Results<br />
All cells are now up <strong>to</strong> date.<br />
The simulation is complete.<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 21 <strong>ANSYS</strong>, Inc. Proprietary
Adding <strong>to</strong> Your Project<br />
Smart<br />
Engineering<br />
Simulation<br />
Now, let’s add a Structural<br />
Select Static Structural.<br />
simulation with loads<br />
Drag<br />
transferred it in<strong>to</strong> your<br />
from project.<br />
CFD.<br />
Virtual<br />
Pro<strong>to</strong>typing<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 22 <strong>ANSYS</strong>, Inc. Proprietary
Consider a More Complex Project<br />
Smart<br />
Engineering<br />
Simulation<br />
Engineered<br />
Scalability<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 23 <strong>ANSYS</strong>, Inc. Proprietary
New in 12.0<br />
Random Vibration<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 24 <strong>ANSYS</strong>, Inc. Proprietary
New in 12.0<br />
Introduce <strong>ANSYS</strong> Explicit STR<br />
New Product at <strong>ANSYS</strong> 12.0<br />
►<strong>ANSYS</strong> Explicit STR<br />
►WB product integrated in<strong>to</strong> simulation<br />
►<strong>ANSYS</strong> AUTODYN solver<br />
Benefits<br />
►First explicit capabilities native <strong>to</strong> WB<br />
►Include CAD connectivity, WB meshing<br />
<strong>to</strong>ols, contact detection<br />
► Post process in WB and Data sharing<br />
with DM, DX applications<br />
Applications<br />
• Drop tests of consumer electronics<br />
• On board electronics in projectiles<br />
• <strong>Electronics</strong> in au<strong>to</strong>motive crash<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 25 <strong>ANSYS</strong>, Inc. Proprietary
<strong>ANSYS</strong> Icepak<br />
<strong>ANSYS</strong> Icepak is robust and powerful computational<br />
fluid dynamics (CFD) software for electronics<br />
<strong>the</strong>rmal management of packages, boards and<br />
systems.<br />
• Steady State and Transient<br />
– Conjugate Heat Transfer<br />
– Conduction<br />
– Convection<br />
– Radiation<br />
• Package, Board, and<br />
System Level Analysis<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 26 <strong>ANSYS</strong>, Inc. Proprietary
<strong>ANSYS</strong> Icepak 12.0:<br />
Overview of Major Enhancements<br />
• GUI enhancements with <strong>ANSYS</strong> WB graphics options<br />
• Meshing enhancements<br />
– Multi-level meshing<br />
• Modeling enhancements<br />
– Multiple Reference Frame (MRF) modeling of fans<br />
• <strong>ANSYS</strong> Iceboard integration<br />
– Trace Joule heating and SIwave import of powermaps<br />
• <strong>ANSYS</strong> Icechip Integration<br />
– ECAD import of various packages with detailed component<br />
modeling<br />
• <strong>ANSYS</strong> Workbench integration<br />
– CFD Post as an additional post-processing option<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 27 <strong>ANSYS</strong>, Inc. Proprietary
Meshing:<br />
Mesher-HD - Uniform Params<br />
Mesher-HD for <strong>ANSYS</strong> Icepak 12.0:<br />
• New feature “Uniform Params”<br />
effectively blocks interactions<br />
between sub-blocking meshes<br />
– Non-conformal mesh in subblocks<br />
– Uniform mesh sizes<br />
– Lower mesh count<br />
– Improved quality<br />
Mesh Count ~ 20k<br />
Lowest quality= 0.026<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 28 <strong>ANSYS</strong>, Inc. Proprietary
Multi-level Meshing: An Example<br />
No Multi-level Mesh<br />
Mesh size = 0.4 mm; Count = 931k<br />
Multi-level Mesh<br />
Mesh size = 2 mm; Count = 343k<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 29 <strong>ANSYS</strong>, Inc. Proprietary
Meshing:<br />
Multi-level meshing - Global Controls<br />
• Setting number of<br />
meshing levels<br />
– Au<strong>to</strong>matically<br />
– Per-object basis<br />
• Au<strong>to</strong>matic levels<br />
– Proximity<br />
– Curvature<br />
• Per-object levels<br />
– Can set levels for<br />
every object<br />
independently<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 30 <strong>ANSYS</strong>, Inc. Proprietary
Advanced in PCB Design<br />
• Electrical power distribution engineering<br />
using SIwave<br />
• Thermal Management & Engineering using<br />
Icepak<br />
– With component layout from IDF format neutral<br />
file.<br />
– With Accurate Board Conductivity distribution<br />
from metal layers imported from Cadence .brd<br />
file<br />
– Joule heat distribution of <strong>the</strong> metal layers<br />
imported from <strong>ANSYS</strong> SIwave<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 31 <strong>ANSYS</strong>, Inc. Proprietary
Advanced PCB Model: First layer<br />
with <strong>the</strong> <strong>the</strong>rmal map<br />
© 2009 <strong>ANSYS</strong>, 32 Inc. All rights reserved. 32 <strong>ANSYS</strong>, Inc. Proprietary
<strong>ANSYS</strong> Icepak 12.0: Board design<br />
• New options<br />
– Import TCB file<br />
– Resize PCB block based on information in ECAD file<br />
– Trace heating<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 33 <strong>ANSYS</strong>, Inc. Proprietary
Trace Heating<br />
• Trace heating panel<br />
– Display list of traces on<br />
each layer in order of<br />
areas (descending)<br />
– Filtering based on area<br />
(default 20% of max area)<br />
– Selecting trace in list<br />
highlights trace in GDA<br />
– Creation of trace block<br />
based on geometry criteria<br />
• Trace angle<br />
• Trace arm length<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 34 <strong>ANSYS</strong>, Inc. Proprietary
Trace Heating Boundary Conditions<br />
• Set current/voltage for atleast two sides of poly block<br />
• Create sources (2D) at any location on block surface<br />
– New current/voltage spec for source object<br />
• If sources used <strong>to</strong> specify current /voltage<br />
– Ensure current flow is conserved<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 35 <strong>ANSYS</strong>, Inc. Proprietary
Meshing of Trace Blocks<br />
• HD Mesher recommended – body fitted mesh necessary<br />
• Enclose trace block in non-conformal assembly<br />
• Use appropriate mesh sizes and minimum gap values<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 36 <strong>ANSYS</strong>, Inc. Proprietary
Trace Heating - Example<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 37 <strong>ANSYS</strong>, Inc. Proprietary
Package Object : MCM import<br />
• Enhanced Package Object<br />
– Import trace and via geometry,<br />
wirebonds, solder ball, solder bumps,<br />
etc from MCM database<br />
– Control package location<br />
– Component visibility<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 38 <strong>ANSYS</strong>, Inc. Proprietary
Package Object: Solder Ball and<br />
Solder Bump Array Import<br />
• Import of solder ball and solder bump arrays<br />
– Location and number<br />
– User can specify height and diameter<br />
– Cylindrical or prismatic geometry<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 39 <strong>ANSYS</strong>, Inc. Proprietary
Package Object: Die and Wirebonds<br />
• Wirebond import<br />
– Geometry approximated as polygonal thin plates<br />
• Die location and dimensions imported<br />
– For MCM, can be modified for each die<br />
Wirebonds<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 40 <strong>ANSYS</strong>, Inc. Proprietary
<strong>ANSYS</strong> Provides <strong>the</strong> <strong>Industry</strong> with<br />
Unmatched Breadth and Depth<br />
•Comprehensive multiphysics and multi-scale simulation<br />
capabilities<br />
�Only company offers complete structural, fluids and Electromagnetic<br />
simulation capabilities<br />
�Multiscal package, board and system level simulation capabilities<br />
•Tools that enables innovation, speed and accuracy<br />
�DesignXplorer offers comprehensive optimization, design of<br />
experiment and design for six sigma capabilities<br />
�Continues improvements in solvers speed and accuracy and in HPC<br />
�Vertical application focused products like: <strong>ANSYS</strong> Icepak, SIwave<br />
•Integrated EDA and CAE platforms<br />
�WB 2.0 provides a platform for integrating <strong>ANSYS</strong> and third party<br />
EDA and CAE <strong>to</strong>ols<br />
�Simplorer provides a multi-domain system level simulation <strong>to</strong>ol for <strong>the</strong><br />
design of high-performance electromechanical systems<br />
© 2009 <strong>ANSYS</strong>, Inc. All rights reserved. 41 <strong>ANSYS</strong>, Inc. Proprietary
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