DISPENSING TECHNOLOGY

DISPENSING TECHNOLOGY
FOR PRINTED CIRCUIT BOARD ASSEMBLY

TOTAL DISPENSING SOLUTIONS
FOR PCB ASSEMBLY
TOTAL SOLUTION CAPABILITIES FOR AN EVOLVING INDUSTRY
For you to achieve exacting manufacturing processes, you require automated fluid dispensing systems
that are fast, accurate, flexible, and simple-to-use. At Nordson and Asymtek, we develop innovative,
application-specific dispensing solutions for industries all over the world. The breadth and
depth of our experience enables us to apply the best technologies to your dispensing applications.
We design and manufacture our own positioning systems, pumps, and valves — and have been
awarded more than 2,000 patents. Our solutions to your dispensing challenges offer unsurpassed
precision and speed, reducing your overall cost per unit.
PLATFORM SOLUTIONS
With thousands of units
shipped, we continue to
refine our dispensing
systems with platforms to
fit every task. We offer
benchtop units with
batch processing for
process development and
mid-range production, and high-speed, inline systems for
high-volume production. Each of these versatile platforms
offers a broad range of capabilities. If your requirements
start small but grow over time, our systems let you scale
lab work and prototype development into full factory
production runs utilizing the same software, subsystems,
and process controls. If you need help along the way, our
dispensing experts will assist you with everything from
simple production requirements to complex process control
issues. You will also benefit from innovative features such
as our patented Mass Flow Control system. In addition, our
specialized functions save you time, improve your yields,
and fit your requirements. From low- to high-volume production
and simple to complex dispensing, we have what
you need to grow your business.
Combining industry-leading dispensing technology with flexible
system platforms, Asymtek has solutions for a wide range of
dispensing applications for printed circuit board assembly.
SMT ADHESIVE
SOLDER PASTE
FLIP CHIP UN

CENTURY SMT
MILLENNIUM 2000 SERIES CENTURY FLUX MILLENNIUM 600 SERIES CENTURY CONFORMAL COAT
CENTURY BATCH
FLUID APPLICATOR SOLUTIONS
Each of your applications
requires a different type
of dispensing, and each
type of dispensing is best
done with the proper
applicator. At Asymtek,
we have the valves,
pumps, and other technologies
to meet the specific demands of your applications.
These solutions include rotary positive displacement (auger)
pumps, linear positive displacement pumps, non-contact
jets, and conformal coating dispense heads. Our auger
pumps — the DV Series — are ideal for dots, lines, and prototype
applications. Our linear pumps — the DP Series —
are ideal for underfill and encapsulation where accuracy
and speed are important. Our patented non-contact jets —
the DispenseJet ® Series — are well suited for high-speed dots
or selective fluxing. And our wide range of conformal coating
dispense heads meet your specific coating requirements,
from batch processing to high-volume, inline production. In
every case, we employ our years of experience over thousands
of applications to deliver the specialized tools that
precisely match your requirements.
SOFTWARE SOLUTIONS
Unlike generic or multiple-use
programs, our
software is specifically
written for dispensing
applications.
Our software developers
designed Fluidmove ® for
Windows NT ® (FmNT) to
work for a wide range of dispensing processes. Specialized
routines allow you to develop your program easier and
faster. FmNT includes “pipelined fiducial finds,” line and
pattern routines, control over line weights, coordinated
moves, data logging, operator/engineer password levels,
and many other enhanced functions. CADImport software
is also standard on our SMT platforms.
Easy Coat ® for Windows
NT ® , specifically designed
for conformal coating
systems, features controls
and functions not
normally found on other
dispensing equipment.
Precise control over edge
definition, thickness, “keep-out” areas, and many other
capabilities give you the flexibility and ease-of-use to program
more efficiently than any other software.
DERFILL
SELECTIVE FLUX
CONFORMAL COAT
DIE ATTACH
DAM & FILL
SOLDER MASK
3

PCB COMPONENT
ATTACHMENT APPLICATIONS
PCB MANUFACTURING REQUIRES ALL TYPES OF DISPENSING
You are continually fine-tuning your process in order to balance costs and yield. As your partner,
Asymtek has pioneered the latest technologies to support your critical production parameters. At
every point in the evolution of SMT dispensing, we have delivered you the latest solutions exactly
when you needed them. We’ve developed vision systems, height sensors, multiple dispensing heads,
patented closed-loop process controls, and jetting technologies that set the industry standards. Our
leading-edge dispensing solutions are designed to support your position as a manufacturing leader.
SOLDER PASTE DISPENSING
Discrete devices require
fast, accurate deposition
of solder paste. Our inline,
SMEMA-compatible
and batch dispensers
are fully programmable,
single-point dispensing
systems and are easily
adaptable to most production settings. These versatile dispensers
will meet and exceed your accuracy and speed
requirements.
Rotary Positive Displacement Dispensing
The DV Series rotary positive displacement (auger) pumps
are optimal for your solder paste dispensing needs. The
DV-7000 Series Pump uses a floating cartridge design
(patent pending) and standoff needle to ensure accurate
and repeatable dispense heights. The floating cartridge
design allows rapid dispensing as well as quick and easy
maintenance.
The Heli-flow DV-7000 Series Pump features
a removable cartridge for quick and easy
cleaning and requires no tools for disassembly.

0
2
4
LOADER SMT DISPENSER CHIP SHOOTER OVEN INVERTER UNLOADER
NON-CONTACT SMT ADHESIVE JETTING
As SMT production techniques
have matured,
your need for dispensing
speed and accuracy has
reached unprecedented
levels. Some PCB designs
demand higher speeds
and greater accuracy
than are possible with traditional time/pressure or auger
pump dispensing systems. Similarly, complex PCB designs
demand more flexibility than screen printing techniques can
offer. The solution is our non-contact jetting technology, only
available with Asymtek’s patented DispenseJet ® head. It is
simply the fastest, most flexible adhesive dispenser available
today. When mounted on either our Century ® or Millennium ®
Series dispensing platforms, the DispenseJet ® head delivers
the speed and throughput necessary to keep pace with your
highly automated SMT production lines.
Non-contact Jet Dispensing
Jetting surface mount adhesive with the DispenseJet ®
head is the fastest way to apply dots to a substrate.
The DispenseJet ® head moves at a uniform height above the
PCB as dots of adhesive are fired from the nozzle. This
breakthrough approach in surface mount adhesive dispensing
delivers unparalleled throughput and accuracy.
It also offers greater control over dot size and profile and
eliminates needle standoff (foot) and Z-axis movement
problems associated with needle dispensing.
DHP
80,000
70,000
60,000
50,000
40,000
30,000
20,000
10,000
1 SHOT
2 SHOT
3 SHOT
5 SHOT
6
8
10
PITCH
12
14
16
18
20
The non-contact DispenseJet ® head delivers
single or multiple shots to achieve precise dot
sizes at significantly higher speeds than are
possible with needle dispensing.
Non-contact means less operator assistance. As shown above, the action of the jet
requires no needles or underboard support, thereby reducing the time spent
on assistance and maintenance.
5

PCB AREA ARRAY
ATTACHMENT APPLICATIONS
AREA ARRAY PROCESSES DEMAND ADVANCED TECHNOLOGY
AND APPLICATIONS EXPERTISE
As the leader in underfill dispensing for area array packaging, Asymtek has the expertise you need
to manage your process, no matter how challenging. This knowledge, combined with Asymtek’s
industry-leading technology, provides you the power to execute precise dispense patterns, manage
fluid characteristics, and deliver the throughput your applications demand. Whether you need
repeatable dispensing of underfill materials or ultra-accurate dispense patterns for selective flux
operations, Asymtek has the solution.
SELECTIVE FLUX JETTING
As flip chip on board
becomes a commonplace
assembly process, selective
flux jetting offers
increased throughput
and quality over printing
techniques and doctor
blade operations. Using
Dot Mode
a dedicated fluxing system
maximizes production
speed and increases
machine utilization by
as much as 30 percent. It
also eliminates contamination
of the flux itself.
The dispenser controls
Coaxial Air Dot Mode
the amounts of flux
applied on-the-fly for small or large chips. Flux residue is
minimized, part reliability and speed are increased, and
cleaning is reduced or eliminated. With minimal maintenance,
you’ll achieve maximum uptime.
Flux DispenseJet ® Increases Flexibility
The DJ-2200 Flux DispenseJet ® head offers
three modes for jetting flux and fulfills all your
requirements for throughput, quality, flexibility,
and maintenance.
Depending on your requirements for pattern, thickness,
throughput, and edge definition, the DJ-2200 Flux
DispenseJet ® head offers three different modes for noncontact
dispensing: dot, coaxial-air dot, and coaxial-air line.

LOADER FLUX DISPENSER MOUNTER OVEN UNDERFILL DISPENSER
OVEN
UNLOADER
UNDERFILL ENCAPSULATION
To manufacture reliable,
high-quality products
that utilize flip chip
and chip scale package
applications, you need
to dispense repeatably
precise quantities of
underfill. For years,
Asymtek has been a leader in these applications. Our
patented, closed-loop Mass Flow Calibration technology
closely monitors the dispensing process and ensures precise
underfill dispensing.
Asymtek offers a range of products that feature the same
controls for batch processing as for inline production.
These controls enable you to take full advantage of our
reliable, high-speed dispensing. Using the same parameters
and equipment set-up, you can first develop the process,
then move into full production.
Precision Linear Positive Displacement Dispensing
One of the best for precision positive displacement
dispensing, the DP-3000 Linear Pump maintains
accuracy and speed for shot sizes from a few
milligrams to over 300 mg.
Our innovative DP-3000 Linear Pump delivers precise
amounts of material at high speed, regardless of fluid
viscosity. This third-generation pump has redefined the
industry standard for speed and accuracy, providing flow
rates to 500 mg/sec with accuracy of ±1% at 3-sigma
repeatability. Performance accuracy and speed of volume
deposition is precisely maintained for applications ranging
from very large BGA to very small flip chip die.
7

HIGH-RELIABILITY COATINGS
DISPENSING APPLICATIONS THAT IMPROVE PRODUCT RELIABILITY
As more electronics are used outside the controlled office environment, you will face new
challenges to your board assembly processes. Conformal coatings significantly enhance the reliability
of your finished product. Once a board is fully assembled, the application of conformal
coating creates an effective environmental seal for components, greatly increasing the functional
life span of any PCB subjected to air, moisture, or particulate contamination.
The Swirl Coat ® conformal coat dispense head
offers a choice of three modes that can be switched
on-the-fly to meet the demands of even the most
complex PCB layouts.
CONFORMAL COAT DISPENSING
When it comes to conformal
coating operations,
PCB manufacturers
are continually
challenged by the need
to balance throughput,
material, and labor
investments, while addressing
the regulatory and environmental concerns associated
with the process. Traditional methods for applying
conformal coatings, such as dipping and air spray, have
always been expensive in terms of material quality and
labor. And the expense of solventless materials has driven
costs even higher.
At every production level, Asymtek’s selective coating systems
provide you with a host of advantages. These flexible,
programmable, integrated coating and curing systems
provide precise application of conformal coating and
IR/convection or UV curing. A choice of patented dispensing
heads allows system configurations that meet your
specific requirements. Our Easy Coat ® for Windows NT ®
software offers flexibility far exceeding generic motion
control or dispensing packages, and yields significant cost
savings and increased throughput and productivity. In
addition, the equipment meets National Fire Protection
Association (NFPA) 33 and 496 standards, as well as all CE
European requirements.

FEED
CONVEYOR
INVERTER CONFORMAL
COATER
OVEN
TRI-MODE SWIRL COAT ® DISPENSE HEAD
The revolutionary Swirl
Coat ® conformal coating
dispense head features
three unique dispensing
modes and allows you to
switch modes on-the-fly
to meet the demands of
complex PCB layouts.
Bead Mode
In bead mode, a narrow
stream of material is dispensed,
offering extremely
precise fluid control
close to “keep-out” areas
and for dispensing under
components.
Spiral Monofilament Mode
In spiral monofilament
mode, a continuous bead
of material is spun on its
axis and shaped by lowpressure
air. The spiraling
dispense pattern provides
excellent edge definition,
complete coverage,
and thin film Swirl Mode
builds.
SELECT COAT ® FILM COATER
Using patented dispensing
technology, the
Select Coat ® film coater
applies conformal coating
material as a controlled,
uniform film
rather than as an atomized
spray. Material is
directed under low pressure through a patented dispensing
nozzle and applied to the circuit board. Overspray, masking,
and rework are minimized because the conformal
coating material is not atomized. And with transfer
efficiencies exceeding 99 percent, the film coater improves
material utilization by 30 to 50 percent.
A variety of nozzles are available to dispense film pattern
widths from 6 to 19 mm (0.25 to 0.75 in.). Thickness varies
from 0.5 to 8.0 mils for solvent-based materials to
4 to 8 mils for 100 percent solids materials. Each delivers
excellent edge definition with a tolerance of ±0.76 mm
(±0.030 in.).
Using higher air pressure to create a swirling, conical spray
pattern, the swirl mode creates centrifugal forces to help
contain overspray better than conventional air spray methods.
Extremely thin film builds — 1 to 4 mils with solventless
materials and 0.5 to 3 mils with solvent-based materials
— can be achieved, making swirl mode well suited for your
mil-spec applications.
The flexibility of the Swirl Coat ® dispense head makes it the ideal tool for
coating complex PCB layouts.
9

PCBA DISPENSING SOLUTIONS
FOR ALTERNATIVE PROCESSES
ADVANCED DISPENSING PROCESSES HELP SOLVE COMPLEX PROBLEMS
Alternative materials and processes may be required to solve your difficult assembly challenges
and ensure the quality of your finished product. Our systems offer you a wide range of platforms,
pumps, valves, and other subsystems that have proven results in real-world production environments.
We have the experience to help you find or develop the solution you need.
CONDUCTIVE ADHESIVE DISPENSING
Whether you need to
apply conductive epoxies
and anisotropic
adhesives to attach
active die or create conductive
paths from
devices to laminate, we
have the proven solutions
for you. Materials such as these often require a range
of preprogrammed dispense patterns. They also demand
precise control over fluid volumes and material weights.
You can rely on your Asymtek applications engineering
partners to provide the latest expertise and systems to meet
these complex applications.
If you have unique board requirements that range from
batch to high-speed, inline production, look to Asymtek for
the latest solutions. You can excel in these challenging
applications by taking advantage of our complete range of
products, platforms, and experience that is unmatched in
the industry.

EXPERIENCE COUNTS
We understand your dispensing challenges. As one of the world’s largest manufacturers of dispensing systems, Asymtek has a proven track
record of providing total process solutions over a wide variety of dispensing applications. More than just an equipment supplier, we have
partnered with the industry’s leaders to first develop and perfect the processes and put them into full production. We have the experience.
Please contact us today. We may already have the solution for all your dispensing challenges.
ENCAPSULATION
Flexibility is the key to
successfully encapsulating
components. You
may be applying glob
top that requires precise
profiles and complete
coverage. Or, you may
have a cavity-fill application
that requires a precision dam to be written, then
quickly and accurately filled. Asymtek offers proven solutions
for both glob top and dam & fill encapsulation of
chip-level components in the PCB assembly process. Our DP
Series Linear Pump works independently of fluid viscosity,
enabling you to dispense consistent volumes of encapsulant
even as fluid viscosity changes over time. And, our applications
engineers work with you to define and optimize your
dispensing process. As a result, labor and set-up time are
reduced, part appearance is improved, and consistency and
yield are increased.
FLEXIBLE SOLDER MASK DISPENSING
Solder mask is used to
prevent solder from
reaching specific contact
points on the PCB during
the wave soldering
process. Solder mask dispensing
is often done
manually. Automating
this process provides several benefits. Quality is improved
because the mask pattern is applied consistently every time,
resulting in higher yields and less rework. Equipment set-up
time is shortened. Programming and reprogramming are
simplified. And, you can quickly integrate design changes,
especially in a high-mix environment, thereby reducing
labor and rework costs. Asymtek’s automated solder mask
dispensing systems provide flexible solutions that are easily
adapted to your specific requirements.
Fluidmove ® , Millennium ® , Century ® , DispenseJet ® , and Asymtek ® are trademarks of Asymtek.
Easy Coat ® , SwirlCoat ® , Select Coat ® , and Nordson ® are trademarks of Nordson, Inc.
Windows ® and Windows NT ® are trademarks of Microsoft, Inc.
Asymtek reserves the right to make design changes to products to improve their function. These
changes may occur between printings.
Contact Asymtek for your specific application requirements.
©2000 Asymtek, all rights reserved.
11

YOUR BEST PARTNERS FOR DISPENSING SOLUTIONS
Long recognized individually for excellence in our chosen
markets, Asymtek and Nordson Corporation decided to
combine forces in 1996. This decision was the result of a
focused strategy to bring our joint technology and process
knowledge to a wider range of production solutions in
electronics assembly. The combined company, with current
sales of more than $700 million, is the world’s largest manufacturer
of dispensing systems and total process solutions
for dispensing applications.
Nordson’s worldwide strength, solidity, and customer service
infrastructure have significantly augmented Asymtek’s
existing commitment to serve the dispensing needs of PCB
assembly technologies. Our combined process knowledge
in SMT adhesives, solder paste, solder mask, flux, thermal
compounds, conformal coating, as well as chip-level PCB
processes including die attach, underfill, and dam & fill,
provide our customers with unmatched product and application
expertise.
Through a combination of leading-edge technology solutions
and customer-partnering capabilities, Asymtek leads
the PCB assembly industry to higher levels of production
efficiency and design flexibility. Our Centers of Excellence
provide localized applications support for customers around
the globe.
With operations in more than 57 countries, we assist in local
business management, applications development, and system
service support. Asymtek employees are dedicated to
finding solutions that best meet your requirements, minimize
cost-of-ownership, and help grow your business. It is
this commitment to you, our customer, that makes us an
invaluable partner for reliable production dispensing.
Gain the competitive advantage. Put Asymtek’s Total
Dispensing Solutions to work for you today.
Please contact these locations for the
name of your local representative.
HEADQUARTERS
2762 Loker Avenue West
Carlsbad, CA 92008-6603 USA
U.S. (toll free): 1-800-ASYMTEK
Tel: (760) 431-1919
Fax: (760) 431-2678
Email: info@asymtek.com
INTERNATIONAL SALES
Europe: +31 (0) 43-352-4466
Japan: +81 (0) 3-5762-2801
Korea: +82-31-766-8321
S.E. Asia: +65 (0) 7782511
Taiwan: +886-2-82001268
www.asymtek.com
Asymtek is ISO 9001 Certified
ASL-00-2091 Rev A 10/00