3D ranging camera module with electronics and interface

RELIABLE APPLICATION SPECIFIC DETECTION
OF ROAD USERS
WITH VEHICLE ON-BOARD SENSORS
DOCUMENT
DELIVERABLE NUMBER D4.6 DUE DATE 30/06/2011
ISSUED BY IMEC ACTUAL DATE 31/01/2012
CONTRIBUTING WP/TASK WP4 / TASK 4.5 PAGES 11
CONFIDENTIALITY STATUS PUBLIC ANNEXES -
PROJECT
GRANT AGREEMENT NO. 216049
ACRONYM
ADOSE
TITLE
CALL
FUNDING SCHEME
RELIABLE APPLICATION SPECIFIC DETECTION OF ROAD
USERS WITH VEHICLE ON-BOARD SENSORS
FP7-ICT-2007-1
STREP
DELIVERABLE D4.6
3D RANGING CAMERA MODULE WITH ELECTRONICS AND INTERFACE
AUTHORS
APPROVAL
WORK PACKAGE LEADER
IMEC D. SAN SEGUNDO
BELLO
IMEC
D. SAN SEGUNDO
BELLO
PROJECT COORDINATOR CRF N. PALLARO
AUTHORISATION
PROJECT OFFICER EUROPEAN COMMISSION I. HEIBER
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DELIVERABLE D4.6
3D RANGING CAMERA MODULE WITH ELECTRONICS AND INTERFACE
Ver. 1.0
Date 31/01/2012
Page 2 of 11
Revision History
Ver. Date Pag. Notes Author
1.0 28/02/2012 All Moved content from D4.7 D. San Segundo
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DELIVERABLE D4.6
3D RANGING CAMERA MODULE WITH ELECTRONICS AND INTERFACE
Ver. 1.0
Date 31/01/2012
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TABLE OF CONTENTS
1. INTRODUCTION ......................................................................................................................................... 4
2. THE 3DCAM HYBRID CAMERA ............................................................................................................... 5
3. THE 3DCAM SYSTEM BOARD ................................................................................................................. 6
4. THE 3DCAM SENSOR BOARD ................................................................................................................ 7
5. SUMMARY .................................................................................................................................................. 10
6. BIBLIOGRAPHY ........................................................................................................................................ 11
7. LIST OF FIGURES ..................................................................................................................................... 11
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DELIVERABLE D4.6
3D RANGING CAMERA MODULE WITH ELECTRONICS AND INTERFACE
Ver. 1.0
Date 31/01/2012
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1. INTRODUCTION
WP4 addresses the development of a 3D ranging camera prototype characterized by high
spatial resolution, high fill factor (which means higher sensitivity) and low-cost. In particular, a
ranging camera integrating optical CMOS and laser radar technologies for short range ADAS
requirements (high-speed object recognition and distance measurement, e.g. for Pre-crash) is
being developed.
Details on the design and functionality of the building blocks of the system can be found in the
previous deliverables [1, 2, 3, 4, 5]. This document briefly describes the complete module which
combines all the elements. Deliverable D4.7 will describe the evaluation of this module.
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DELIVERABLE D4.6
3D RANGING CAMERA MODULE WITH ELECTRONICS AND INTERFACE
Ver. 1.0
Date 31/01/2012
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2. THE 3DCAM HYBRID CAMERA
The two main building blocks of the sensor board are the photo-detector and the CMOS
electronic chip. Their design was described in detail in deliverable D4.3 [3]. Figure 1 shows the
layout of the electronics chip, and Figure 2 shows a photograph of the chip.
PADS FOR DETECTOR BIAS
ALIGNMENT MARKS
BIAS
OUTPUT
BUFFER
Figure 1: Layout of the chip.
Figure 2: Photograph of the ADOSE 3DCAM ROIC.
Figure 3 shows side by side the layot and a photograph of a sub-array of 2 by 2 pixels.
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DELIVERABLE D4.6
3D RANGING CAMERA MODULE WITH ELECTRONICS AND INTERFACE
Ver. 1.0
Date 31/01/2012
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(a)
(b)
Figure 3: (a) Microphotograph of a sub-array of 2 by 2 pixels; (b) Layout of a sub-array of 2 by 2
pixels.
The photo-detector and the electronics chip are hybridized as described in deliverable D4.5 [5]
to obtain the camera module. Figure 4 shows a microphotograph of the hybrid showing the
alignment marks which are required in the CMOS chip to perform the hybridization.
Figure 4: Top right corner of the chip, showing the alignment mark needed for the processing of
the wafer.
3. THE 3DCAM SYSTEM BOARD
The 3DCAM system board was described also in detail in deliverable D4.3 [3]. A photograph of
this board can be seen in Figure 5. The system PCB design and manufacture was outsourced to
a PCB design house.
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DELIVERABLE D4.6
3D RANGING CAMERA MODULE WITH ELECTRONICS AND INTERFACE
Ver. 1.0
Date 31/01/2012
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Figure 5: Photograph of the ADOSE 3DCAM PCB.
4. THE 3DCAM SENSOR BOARD
The system board includes two connectors in order to connect the sensor. The reasons for this
choice of sensor connection were the following. First, due to delays in the plan it was decided to
have the system board ready before the chip. From the first specifications it was clear that the
size of the sensor would be quite large (more than 2 cm on one side). As no standard chip
package was found that could house such a device, instead of a custom package we decided to
bond the chips directly on a “sensor” PCB which would then be connected on the system board
via some mechanical connector. One reason for this choice was the fact that the in-house costs
of bonding the chips either on a package or on a PCB were the same. Additionally, although all
the interface signals were already chosen, there was the possibility that additional functionality
would be needed around the chip. These additional components could easily be added to the
sensor PCB. Because this sensor PCB would be much simpler than the system PCB, its design
and manufacture costs would also be minimized. Finally, bonding the chip on the PCB allowed
the use of standard lens mounts. If a large custom package had been chosen, a custom lens
mount would have also been needed due to the large size. The sensor PCB was designed by
imec.
Figure 6(a) shows a photograph of a hybridized 3DCAM sensor mounted and wire-bonded on its
corresponding sensor PCB. Figure 6(b) shows a non-hybridized 3DCAM CMOS chip also
mounted on its sensor PCB.
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DELIVERABLE D4.6
3D RANGING CAMERA MODULE WITH ELECTRONICS AND INTERFACE
Ver. 1.0
Date 31/01/2012
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(a)
(b)
Figure 6: Hybrid ADOSE 3DCAM mounted on its PCB
Besides the hybrid module itself, the sensor PCB includes decoupling capacitors for the power
supplies and reference voltages, jumpers for measuring the current consumption of the different
chip supplies, additional connectors to override the supply voltage coming from the sensor board
(for debugging reasons), a connector for the sensor bias voltage, and two connectors to
generate the delayed clock needed for calibration explained in [3]. Although in [3] the plan was
to include the delay on chip, it was not possible due to time constraints and reliability concerns,
as it was a critical component for the final distance measurements. A component was originally
found which could be used for this purpose [6]. The connectors for the delayed clock generation
were needed once it was discovered that the component originally planned to generate the
delayed clock was not available any more. It was then decided to use external equipment to
generate the delay.
Figure 7 shows the schematic of this board.
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RELIABLE APPLICATION SPECIFIC DETECTION
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WITH VEHICLE ON-BOARD SENSORS
Figure 7: Schematic of the ADOSE 3DCAM sensor PCB
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RELIABLE APPLICATION SPECIFIC DETECTION
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WITH VEHICLE ON-BOARD SENSORS
Figure 8 shows two photographs of the ADOSE 3DCAM sensor board with all components
mounted.
(a)
(b)
Figure 8: ADOSE 3DCAM sensor board mounted
Figure 9 shows the sensor module mounted on the main system board.
Figure 9: The ADOSE 3DCAM sensor board mounted on the 3DCAM system board.
5. SUMMARY
We have described the camera module with electronics and interface. Most of the building
blocks (detector, CMOS ROIC and system board) had already been described in detail in the
previous deliverables [3,4,5].
The characterization of the module will be reported in deliverable D4.7.
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DELIVERABLE D4.6
3D RANGING CAMERA MODULE WITH ELECTRONICS AND INTERFACE
Ver. 1.0
Date 31/01/2012
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6. BIBLIOGRAPHY
[1] “Deliverable D4.1: Concept design of 3D camera”, ADOSE collaboration, 2009
[2] “Deliverable D4.2: Preliminary Design report for 3D ranging camera detector”, ADOSE
collaboration, 2010
[3] “Deliverable D4.3: Detailed Design report for 3D ranging camera detector”, ADOSE
collaboration, 2011
[4] “Deliverable D4.4: Hardware components for 3D Ranging Camera”, ADOSE collaboration,
2011
[5] “Deliverable D4.5: Verified concept for package and integration”, ADOSE collaboration,
2011
[6] “DS1123L, 3.3V, 8-Bit, Programmable Timing Element”, Maxim Integrated Products, 2007
7. LIST OF FIGURES
Figure 1: Layout of the chip. ........................................................................................................ 5
Figure 2: Photograph of the ADOSE 3DCAM ROIC. ................................................................... 5
Figure 3: (a) Microphotograph of a sub-array of 2 by 2 pixels; (b) Layout of a sub-array of 2 by 2
pixels. .......................................................................................................................................... 6
Figure 4: Top right corner of the chip, showing the alignment mark needed for the processing of
the wafer. .................................................................................................................................... 6
Figure 5: Photograph of the ADOSE 3DCAM PCB. ..................................................................... 7
Figure 6: Hybrid ADOSE 3DCAM mounted on its PCB ................................................................ 8
Figure 7: Schematic of the ADOSE 3DCAM sensor PCB ............................................................ 9
Figure 8: ADOSE 3DCAM sensor board mounted ..................................................................... 10
Figure 9: The ADOSE 3DCAM sensor board mounted on the 3DCAM system board. ............... 10
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