HM03145 High Efficiency DC/DC Module

PACKAGE DESCRIPTION
Introduction
Cyntec develops hybrid module (called
HM03145 for short below) products based on
its sufficient development experience of DIP
package. The HM03145 structure belongs to
Plastic Leadless Chip Carrier leads package
(PLCC). This kind of package has some
advantages like good thermal and electrical
conductivity, low weight, small size, etc. As
PLCC structure is suitable for surface
mounting technology, more and more uses in
industry are concerned recently. This
reference shows the PCB layout pattern
design, stencil pattern design and reflow
profile parameters. It is noted that these
guidelines are general design rules. Users
could modify parameters according to their
real application.
Figure 15. Top View
Hybrid Module Package Overview
HM03145 contains several types of devices.
There are resistor, capacitor, inductor and
control IC. The bottom of HM03145 is lead
frame footprint that transmits electrons and
heat effectively. And polymer compound is
covered and formed on the module to protect
these devices. The module has a small size of
8.5mmx11mmx3.85 mm.
(Figure 15, Figure 16, Figure 17)
Figure 16. Bottom View
Figure 17. Side View
TITLE: SPECIFICATION OF HM03145
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