All You Need to Know About Mobile LPDRAM - Micron

All You Need
to Know About
Mobile LPDRAM
Micron ® Mobile LPDRAM
What You Get With Micron Mobile LPDRAM
It’s a more-everything market. Across the board—from mobile
and automotive, to industrial and networking applications—
consumers are demanding more features and more performance.
And, of course, you must design with less money, less time, and
less space. We can help.
So bring us your designs, and we’ll provide you a portfolio of
low-power products—Mobile low-power DRAM (LPDRAM) that
can alleviate the most challenging design conundrums. We’ll
give you more than just the memory you need; we’ll provide
technical support in the form of simulation models, in-house
qualifications, and lab analysis when required.
It’s all here, so take a closer look. We’re dedicated to providing
you with the right low-power, high-performance part at the
right time.
Applications
• Mobile – Mobile handsets, tablets, and ultrathin clients
• Consumer – PDAs, PMP/MP3 players, portable games,
portable navigation devices, digital still cameras
• Networking – USB dongles, WiMAX routers,
WiMAX base stations
• Security – Fingerprint detectors, digital surveillance
• Automotive – In-car entertainment, navigation,
Bluetooth systems
• Industrial/Medical – Patient monitors, defibrillators,
portable ultrasound machines
6 Advantages of
Designing With Micron’s
Mobile LPDRAM
1. Low Power
Ultra-low power supply voltages and ultra-low standby
currents extend battery life.
2. High Performance
The industry’s fastest Mobile LPDDR2 delivers max
clock speeds of up to 533 MHz, enabling data transfer
rates of 1066 MT/s.
3. Temperature Ranges
Extended temperature ranges enable high performance
in extreme environments.
4. Product Breadth
A range of densities and packages enhances
design flexibility and provides a migration path.
5. Testing and Reliability
Our Quality and Assurance Department ensures parts
undergo stringent quality and reliability testing.
6. Technical and Regional Support
Our design engineers and local FAEs have the
expertise to help with your unique design
challenges.

Micron ® Mobile LPDRAM
Densities
Configurations
Core Voltage
Clock
Frequencies
Power
Consumption
Special
Features
Temperature
Ranges
Packages
Contact Us
From the architecture, to the technology, to the supplier—
we’ve got you covered with our entire line of Mobile
LPDRAM devices. Get specific part detail information at
www.micron.com/products/dram/mobile-lpdram.
micron.com
Features Benefits
64Mb to 512Mb (LPSDR)
128Mb to 8Gb (LPDDR)
512Mb to 16Gb (LPDDR2)
x16, x32 (LPSDR and LPDDR)
x32 (LPDDR2)
1.8V (LPSDR and LPDDR)
1.2V (LPDDR2)
Up to 166 MHz (LPSDR)
Up to 200 MHz (LPDDR)
Up to 533 MHz (LPDDR2)
Refer to specific
data sheet
Temperature-compensated
self refresh (TCSR)
Partial-array self refresh
(PASR)
Deep-power down (DPD)
Programmable drive strength
(DS)
–25˚C to +85˚C (wireless)
–40˚C to +105˚C (automotive)
PoP
Known good die
VFBGA
Products are warranted only to meet Micron’s production data sheet
specifications. Products and specifications are subject to change without
notice.
Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are
the property of their respective owners. ©2008 Micron Technology, Inc. All rights reserved.
02/12 EN.L
Provides flexibility for a variety of application designs
Enables the use of fewer components to support wide-bus
architectures
Helps reduce power consumption—a key advantage over
standard DRAM
Provides high performance, high bandwidth, and low power
consumption
Delivers low power consumption in standby and active modes,
plus special mobile features to reduce power for a more
efficient design
Adjusts refresh timing to minimize power consumption at
lower, ambient temperatures
Reduces power by refreshing only critical data
Provides an ultra-low power state when data retention is not
required
Allows adjustment for operation in point-to-point and pointto-2-point
applications
Enables high performance in extreme environments
Saves board space by allowing a Mobile LPDRAM to be stacked
on top of a processor so that the two components require only
one footprint on the board
Supports bare die with edge bond pads for easy stacking in SIP
and MCP solutions
Can reduce footprint by up to 40% relative to standard SDR
and DDR SDRAM for a smaller, more compact design; supports
JEDEC-standard FBGA ballout