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3DPO32M08VS1419 is added to 3D PLUS Space Grade PROM ...

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PRESS RELEASE<br />

<strong>3D</strong> <strong>PLUS</strong> ANNOUNCES A NEW 32 Mb <strong>PROM</strong> MEMORY<br />

San Jose, USA, April 2013, 24 th – <strong>3D</strong> <strong>PLUS</strong>, the world leading manufacturer of <strong>Space</strong> Qualified high density<br />

memories introduces a new 32Mb <strong>PROM</strong> - <strong><strong>3D</strong>PO32M08VS1419</strong> <strong>to</strong> its space grade <strong>PROM</strong> family, <strong>to</strong> follow the<br />

successful 64Mb <strong>PROM</strong> launched two years ago.<br />

The <strong><strong>3D</strong>PO32M08VS1419</strong> <strong>is</strong> a highly integrated One-Time-Programmable (OTP) Rom Memory designed <strong>to</strong> s<strong>to</strong>re<br />

configuration bitstreams for FPGA devices, such as Xilinx® Virtex® FPGAs. It <strong>is</strong> organized as 4M x8b, and can<br />

operate in either a serial or byte wide mode. The <strong><strong>3D</strong>PO32M08VS1419</strong> guaranteed 20 years life data retention and<br />

<strong>is</strong> also used as processors Boot and Program <strong>PROM</strong> in a variety of high performance and high reliability<br />

computer boards.<br />

“<strong>3D</strong> <strong>PLUS</strong> <strong>is</strong> a recognized leader in packaging for Rad-Hard and Rad-Tolerant memory products. We have a<br />

longstanding relationship with Xilinx, Inc. as one of their preferred Alliance Members for die packaging and are<br />

very excited <strong>to</strong> be able <strong>to</strong> offer our new 64 Mbit <strong>PROM</strong>s specifically targeted for Xilinx’s Virtex-5QV FPGAs,” said<br />

Timothee Dargnies, CEO at <strong>3D</strong> <strong>PLUS</strong> USA. “The Virtex-5QV, which <strong>is</strong> Rad-Hard by design, <strong>is</strong> being rapidly<br />

adopted by the <strong>Space</strong> community. By coupling Xilinx Virtex-5QV FPGAs with <strong>3D</strong> Plus’ 64 Mbit <strong>PROM</strong>, our mutual<br />

cus<strong>to</strong>mers are achieving the best performance/board area ration for space qualified electronics”.<br />

“The Virtex-5QV device <strong>is</strong> the first of its kind reprogrammable Single-Event-Upset (SEU) hardened FPGA<br />

specifically designed <strong>to</strong> withstand the harshest radiation environments. Since introduced in July 2011, the Virtex-<br />

5QV FPGAs are being adopted by many space programs utilizing the resource rich devices <strong>to</strong> build complex,<br />

high-performance space systems that can be reprogrammed and updated even after launch.” said, Yousef<br />

Khalilollahi, Xilinx Senior Direc<strong>to</strong>r, Segments Marketing. “We are very pleased that our Alliance Member has<br />

introduced these 64 Mbit <strong>PROM</strong>s, which increases the design flexibility of our space-grade FPGAs and provide<br />

our cus<strong>to</strong>mers with one of the most miniaturized space qualified configuration memory devices.”<br />

Here are the main features of th<strong>is</strong> product:<br />

‣ Organized as 4M x 8b<br />

‣ One-time-programmable (OTP) Read-Only-Memory<br />

‣ Power supply +3.3 +/- 0.3V<br />

‣ Simple interface for FPGA configuration Memory<br />

‣ Serial or Parallel configuration modes<br />

‣ 20 year life data retention<br />

‣ Available with military temperature Range -55°C <strong>to</strong> +125°C<br />

‣ Radiation <strong>to</strong>lerance:<br />

o TID > 50 kRad (Si)<br />

o Latch-Up and SEU Immune <strong>to</strong> LET>120 MeV/cm2/mg<br />

‣ Small form fac<strong>to</strong>r with SOP-44 footprint<br />

‣ Light weight: 2.1 gr<br />

<strong>PROM</strong> Memory Product Line:<br />

Part-Number Description Temperature Range Quality <strong>Grade</strong><br />

<strong><strong>3D</strong>PO32M08VS1419</strong>-IB 4M x 8b -40°C <strong>to</strong> +85°C Industrial<br />

<strong><strong>3D</strong>PO32M08VS1419</strong>-MS 4M x 8b -55°C <strong>to</strong> +125°C <strong>Space</strong><br />

<strong>3D</strong>PO64M08VS2299-IB 8M x 8b -40°C <strong>to</strong> +85°C Industrial<br />

<strong>3D</strong>PO64M08VS2299-MS 8M x 8b -55°C <strong>to</strong> +125°C <strong>Space</strong><br />

April 2013 1/3


PRESS RELEASE<br />

Benefits:<br />

‣ SEU Immune Radiation Harden Die<br />

‣ <strong>Space</strong> Qualified<br />

‣ No Glue Logic needed <strong>to</strong> interface with FPGA<br />

‣ Cascadable for s<strong>to</strong>ring longer or multiple Bitstreams<br />

‣ Small Form Fac<strong>to</strong>r<br />

‣ High mechanical res<strong>is</strong>tance<br />

‣ High electrical performance<br />

Example of <strong>Space</strong> savings with Xilinx FPGA Configuration Memories:<br />

Xilinx<br />

FPGA<br />

Configuration Memory<br />

Size<br />

D<strong>is</strong>crete Approach<br />

(CC44)<br />

Virtex-4 (XC4VFX40) 14Mb 1 1<br />

Virtex-4 (XC4VFX60) 25Mb 2 1<br />

<strong>3D</strong> <strong>PLUS</strong> <strong>PROM</strong> Module<br />

32Mb<br />

Virtex-4 (XC4VFX140) 48Mb 3 1<br />

Virtex-5 (FX130T) 50Mb 4 1<br />

Virtex-5 (FX200T) 70Mb 5 2<br />

Virtex-5 (LX330T) 82Mb 6 2<br />

64Mb<br />

D<strong>is</strong>crete Approach<br />

18 18<br />

Actual Size (Both 32&64Mb)<br />

SOP 44 – (Pitch : 0.8 mm)<br />

18<br />

CC44<br />

CC44<br />

18 18<br />

18<br />

CC44<br />

CC44<br />

20 x 14 = 280 mm 2<br />

Size for 32Mb : 2 x 18 x 18 = 648 mm 2<br />

56% <strong>Space</strong> Savings for 32Mb<br />

Size for 64Mb : 4 x 18 x 18 = 1296 mm 2 78% <strong>Space</strong> Savings for 64Mb<br />

April 2013 2/3


PRESS RELEASE<br />

2.1 gr<br />

Weight for 32Mb : 2.9 x 2 = 5.8 gr<br />

Weight for 64Mb : 2.9 x 4 = 11.6 gr<br />

63% Weight Savings for 32Mb<br />

63% Weight Savings for 64Mb<br />

Number of connections : 44<br />

Number of connections for 32Mb : 44 x 2 = 88<br />

Number of connections for 64Mb : 44 x 4 = 176<br />

50% connections Savings for 32Mb<br />

75% connections Savings for 64Mb<br />

About <strong>3D</strong> <strong>PLUS</strong> company:<br />

<strong>3D</strong> Plus <strong>is</strong> a world leading supplier of advanced high density <strong>3D</strong> microelectronic products and Die and Wafer<br />

Level stacking technology meeting the demand for high reliability, high performance and very small size of <strong>to</strong>day’s<br />

and <strong>to</strong>morrow’s electronics.<br />

Thanks <strong>to</strong> its radiation hardened electronics design center and its patented space qualified technology portfolio,<br />

<strong>3D</strong> <strong>PLUS</strong> catalogue products and SiP Solutions are used in diverse computer boards, data recorders boards and<br />

cus<strong>to</strong>m applications for both bus and payloads. They are used for both digital and analog designs, and, for<br />

frequency ranges from few Hz <strong>to</strong> several GHz.<br />

With more than 70 000 modules in <strong>Space</strong>, and with more than 14 years of Flight Heritage with no Failure, <strong>3D</strong> Plus<br />

<strong>is</strong> recognized as one of the largest <strong>Space</strong> qualified catalog products and cus<strong>to</strong>m System-In-Packages (SiPs)<br />

manufacturer.<br />

<strong>3D</strong> <strong>PLUS</strong> space qualified products are used by the major Aerospace Prime Contrac<strong>to</strong>rs, Systems and<br />

Equipments manufacturers, and <strong>Space</strong> Agencies worldwide.<br />

Its Flight Heritage <strong>is</strong> expanding continuously with products launched in <strong>Space</strong> every month and in all application<br />

fields: Telecommunications, Navigation, Earth observation, Launchers and Manned <strong>Space</strong> vehicles and any kind<br />

of Science and Deep <strong>Space</strong> exploration m<strong>is</strong>sions.<br />

About the Xilinx Alliance Program<br />

The Xilinx Alliance Program <strong>is</strong> a worldwide ecosystem of qualified companies collaborating with Xilinx <strong>to</strong> help<br />

cus<strong>to</strong>mers develop products faster and with confidence on Targeted Design Platforms. Leveraging open platforms<br />

and standards, Xilinx has built th<strong>is</strong> ecosystem <strong>to</strong> meet cus<strong>to</strong>mer needs and <strong>is</strong> committed <strong>to</strong> its long-term success.<br />

Compr<strong>is</strong>ed of FPGA IP providers, EDA vendors, embedded software providers, system integra<strong>to</strong>rs, and hardware<br />

suppliers, Alliance members help accelerate the design process while minimizing r<strong>is</strong>k.<br />

Contact:<br />

sales@3d-plus.com<br />

<strong>3D</strong> <strong>PLUS</strong><br />

408, rue Hélène Boucher<br />

78530 Buc - France<br />

+33 1 30 83 26 50<br />

<strong>3D</strong> <strong>PLUS</strong> USA Inc. – Tech Center<br />

43136-108 Chr<strong>is</strong>ty Street<br />

Fremont, CA, 94538 - USA<br />

(510) 824 5591<br />

<strong>3D</strong> <strong>PLUS</strong> USA Inc. – Sales Center<br />

6401 Eldorado Pkwy – Suite 238<br />

McKinney, TX, 75070 - USA<br />

(214) 733 8505<br />

April 2013 3/3

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