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Microstructure Analysis on Nanocrystalline Materials COMMISSION ...

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size of metals (Cu, Ni and Fe) is <strong>on</strong>e order of magnitude<br />

larger having a wide distributi<strong>on</strong> and maximum<br />

values in the range 100 – 200 nm. Dislocati<strong>on</strong> densities<br />

are lower than 1 × 10 15 m -2 , usually 6 – 7 × 10 14 m -2 .<br />

111 220<br />

311<br />

HPT Ge<br />

PM 2000<br />

log scale<br />

400<br />

331 422<br />

P<br />

0,060<br />

0,050<br />

0,040<br />

0,030<br />

0,020<br />

0,010<br />

0,000<br />

511 440 531<br />

D = 30 nm<br />

0 20 40 60 80<br />

D[nm]<br />

620 533 444<br />

Fig. 3. Total pattern fitting for partially annealed<br />

(400°C) Ge sample (fitted by the program pm2k).<br />

TEM micrographs (Fig. 4) show highly defected structure<br />

with inhomogeneous distributi<strong>on</strong> of defects (regi<strong>on</strong>s<br />

with high and low dislocati<strong>on</strong> density). Dislocati<strong>on</strong>s<br />

are situated in distorted regi<strong>on</strong>s al<strong>on</strong>g GBs, while<br />

grain interiors are almost free of dislocati<strong>on</strong>s, for detailed<br />

discussi<strong>on</strong> see [23]. On the other hand, UFG Mg<br />

and UFG Mg-10 wt. % Gd exhibit homogeneous distributi<strong>on</strong><br />

of dislocati<strong>on</strong>s throughout whole grain.<br />

Obtained values of the dislocati<strong>on</strong> density<br />

agree quite well with the estimati<strong>on</strong>s made from TEM<br />

for as-deformed samples (Fig. 4a). The crystallite size<br />

distributi<strong>on</strong>s obtained from both methods are not identical<br />

but not much different either. It must be taken into<br />

account that the XRD is sensitive to coherent domain<br />

size and in the case of TEM of str<strong>on</strong>gly deformed materials<br />

it is often rather difficult to define grains <strong>on</strong> the<br />

pictures.<br />

Positr<strong>on</strong> life-time spectra show usually three<br />

major comp<strong>on</strong>ents – comp<strong>on</strong>ent with lifetime well below<br />

100 ps can be obviously attributed to free positr<strong>on</strong>s.<br />

Relative intensity of this comp<strong>on</strong>ent is very<br />

small for most of the as-deformed samples. It clearly<br />

indicates that majority of positr<strong>on</strong>s annihilate from<br />

trapped states at defects. The sec<strong>on</strong>d comp<strong>on</strong>ent is<br />

dominating and comes from positr<strong>on</strong>s trapped at dislocati<strong>on</strong>s.<br />

For example, the lifetime of this comp<strong>on</strong>ent<br />

for UFG Cu and UFG Cu with Al2O3 corresp<strong>on</strong>ds to<br />

the lifetime 164 ps of positr<strong>on</strong>s trapped at Cu dislocati<strong>on</strong>s<br />

[23, 24]. The third comp<strong>on</strong>ent with the l<strong>on</strong>gest<br />

lifetime represents a c<strong>on</strong>tributi<strong>on</strong> of positr<strong>on</strong>s trapped<br />

at micro-voids inside grains [23]. Using theoretical calculati<strong>on</strong>s<br />

in Ref. [23], <strong>on</strong>e obtains that size of the micro-voids<br />

in the as-deformed UFG Cu specimen corresp<strong>on</strong>ds<br />

to 5 m<strong>on</strong>o-vacancies. Larger micro-voids (more<br />

than 10 vacancies) were found in UFG Fe. On the other<br />

hand, no micro-voids were detected in UFG Mg and<br />

UFG Mg-10 wt% Gd.<br />

P<br />

0.009<br />

0.006<br />

0.003<br />

0.000<br />

0 100 200 300<br />

D [nm]<br />

(a)<br />

(b)<br />

(c)<br />

Fig. 4. Typical TEM micrographs of as-deformed ir<strong>on</strong><br />

(a - marked scale – 200 nm), corresp<strong>on</strong>ding histogram<br />

of estimated grain size distributi<strong>on</strong> (b) and log-normal<br />

size distributi<strong>on</strong> corresp<strong>on</strong>ding to the parameters obtained<br />

from the total pattern fitting by the program<br />

pm2k.<br />

THERMAL STABILITY OF THE MICRO-<br />

STRUCTURE<br />

Some results of our studies have been published, e.g. in<br />

[6, 25-27]. Thermal stability of the fine highly defected<br />

microstructure is not very high for pure metals. Usually<br />

strain recovery is followed by the grain growth. For<br />

copper samples, significant drop of line broadening is<br />

21

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