MICROSYSTEMS TECHNOLOGY IN GERMANY - AHK

MICROSYSTEMS TECHNOLOGY
IN GERMANY
2008
2008
MIKROSYSTEMTECHNIK
IN DEUTSCHLAND

Table of Contents
4
6 Welcoming Address
Grußwort
Dr. Annette Schavan
Federal Minister for Education and Research
Bundesministerin für Bildung und Forschung
8 Positioning in International
Competition
Zur Positionierung im
internationalen Wettbewerb
10 VDE-GMM: Microsystems Technology Drives
Innovation in Leading Markets
Mikrosystemtechnik – Innovationstreiber
für Leitmärkte
13 Contributions to
Topical Fields of Innovation
Beiträge zu aktuellen
Innovationsfeldern
14 Helmut Seidel, Universität des Saarlandes:
Microactuators
16 Peter Woias, IMTEK:
MicroEnergy Harvesting – Energy Supply for distributed
embedded Microsystems
18 Jürgen Mohr, Forschungszentrum Karlsruhe:
Micro-Optics
20 OSRAM Opto Semiconductors:
High Brightness LEDs for Light Engines
22 Thomas Stieglitz, IMTEK:
Intelligent Implants
24 Johannes Dehm, DGBMT im VDE:
Latest Results and Solutions in Preventive
Micromedicine
26 Reiner Wichert, Fraunhofer-Verbund Mikroelektronik:
The Fraunhofer Alliance „Ambient Assisted Living“
28 Katrin Gaßner, VDI/VDE-IT:
Smart Labels for Logistic Applications
30 Hartmut Strese, VDI/VDE-IT:
Intelligent Technical Textiles
32 Herbert Reichl, Fraunhofer IZM, at al:
More than Moore, Hetero System Integration
and Smart System Integration –
Three Approaches – one Goal: Smarter Products
and Processes
38 The 2 nd German Congress
on Microsystem Technologies
2007
Der 2. Deutsche Mikrosystemtechnik-Kongress
2007
40 Thomas Gessner, TU Chemnitz:
Review of the 2 nd German Congress on
Microsystem Technologies
42 Roland Zengerle, IMTEK, et al:
Microfl uidic Platforms for Miniaturization, Integration
and Automation of Biochemical Assays
44 Christian Voss, Jörg Müller, TU Hamburg-Harburg:
A Mechanical Microsystem for Restoration of
Spinal Cord Continuity after Paraplegia
46 Kathrin Knese, Robert Bosch GmbH, et al:
Novel Surface Micromachining Technology
for Fabrication of Capacitive Pressure Sensors
Based on Porous Silicon
48 Thomas Otto, Ray Saupe, Fraunhofer IZM, et al:
Forensic Investigation Using MEMS-Spectrometers
50 Anna Gerken, Johannes Paul, Sensitec GmbH:
Use of the Tunnelmagnetoresistive Effect for Sensor
Applications
52 Katrin Müller, Motorola GmbH:
Nutriwear – Nutrition Management Using Smart Textiles

54 Jan-Uwe Schmidt, Fraunhofer IPMS, et al:
Technology Development for 1 Megapixel-Micromirror
Arrays with High Optical Fill Factor and Stable
Analogue Defl ection
57 Associations and Networks
Verbände und Netzwerke
58 ZVEI
60 AMA
62 IVAM
64 Mikrotechnik Thüringen with
∙ Micro-Hybrid Electronic GmbH
∙ Hermsdorfer Institut für Technische Keramik e. V.
68 Zentrum für Mikrosystemtechnik Berlin
71 Current Results and Portfolios
of Research Institutions
Aktuelle Ergebnisse und
Leistungen aus Forschungseinrichtungen
72 Fraunhofer IFAM
74 ZfM Zentrum für Mikrotechnologien Technische
Universität Chemnitz
76 NMI Naturwissenschaftliches und Medizinisches
Institut an der Universität Tübingen, Reutlingen
78 IPHT Institut für Photonische Technologien, Jena
80 IMM Institut für Mikrotechnik Mainz
82 Hahn-Schickard-Gesellschaft
84 IMN Institut für Mikro- und Nanotechnologien
der Technischen Universität Ilmenau
86 Fraunhofer IKTS
87 Current Innovations and
Competencies of Companies
Aktuelle Innovationen und
Kompetenzen aus Unternehmen
Inhaltsverzeichnis
Microsystems Technology Products and Solutions
Mikrosystemtechnische Produkte und Lösungen
88 Infi neon Technologies AG
90 Carl-Zeiss MicroImaging GmbH
92 UST Umweltsensortechnik GmbH
93 Greiner Bio-One GmbH
94 Plan Optik AG
96 MMT Micro Mechatronic Technologies GmbH
97 pro-micron GmbH & Co. KG
Products and Solutions for Microsystems Technology
Produkte und Lösungen für die Mikrosystemtechnik
98 Carl Zeiss Industrielle Messtechnik GmbH
100 Lumera Laser GmbH
101 Physik Instrumente (PI) GmbH & Co KG
102 Polytec GmbH
104 3D-Micromac AG
105 Rohwedder AG
106 LIMO Lissotschenko Mikrooptik GmbH
108 SONOSYS Ultraschallsysteme GmbH
109 MPD GmbH Microelectronic Packaging Dresden
110 technotrans AG
112 SCHUNK GmbH & Co. KG Spann- und
Greiftechnik
113 ZMD Zentrum Mikroelektronik Dresden AG
114 Impressum
Photo Credits/Bildnachweise
5

Welcoming Adress
With the introduction of the High-Tech
Strategy for Germany just over a year
ago, the Federal Government gave a
clear signal that it intended to strengthen
our country’s innovative strength in the
long term. For the fi rst time ever, we
have a national strategy covering all
fi elds of politics and aimed at leading
Germany to the top in the most important
markets of the future.
One priority of the High-Tech Strategy,
which is coordinated by the Federal
Ministry of Education and Research, is
the fi eld of microsystems technology.
This cutting-edge fi eld has enormous
potential. Microsystems technology
can be used in almost all branches of
industry to develop new products and
improve existing ones.
At the same time, microsystems technology
is increasingly becoming a key
technology for tackling diverse societal
challenges, such as the problems of demographic
change and climate change.
Microsystems technology supplies the
technical solutions to these problems.
6
With an annual growth rate of 16 percent
and a turnover of more that 277
billion Euros, microsystems technology
is one of the major job machines in our
country today. Some 680,000 jobs in
Germany are closely connected with
microsystems technology: fi fty thousand
of them are in the immediate production
of microsystems. And the trend is rising.
For example, the fi eld of sensor technology,
an important area of microsystems
technology, is creating more jobs than
ever before. More than 13,000 new jobs
were created in 2007 alone.
It is smaller fi rms in particular that are
responsible for growth in this area.
The technological development of
microsystems technology is in no way
complete: its potential for application
has by no means been exhausted.
In order to use this potential in Germany,
the Federal Ministry of Education and
Research is making project funding
worth over 220 million Euros available
between 2004 and 2009 under the “Microsystems”
framework programme.
Dr. Annette Schavan,
Federal Minister of
Education and Research
Bundesministerin für
Bildung und Forschung
Close cooperation between industry and
science is an important precondition for
the successful use of the opportunities
linked with microsystems technology.
The Federal Research Ministry therefore
organized the Microsystems Technology
Congress in conjunction with the VDE
(Association for Electrical, Electronic &
Information Technologies) for the second
time in October 2007. More than 1000
experts at the Dresden conference set
the course for Germany’s future as a
location for microsystems technology.
Our aim is clear: Germany is to once
again become the country with the best
innovations. In the fi eld of microsystems
technology we are on the right track.
Dr Annette Schavan, MdB
Federal Minister of Education
and Research

Mit der „Hightech-Strategie für Deutschland“
hat die Bundesregierung vor etwas
mehr als einem Jahr ein klares Signal
gesetzt, die Innovationskraft unseres
Landes nachhaltig zu stärken. Erstmals
gibt es eine nationale Strategie über alle
Politikfelder hinweg, um unser Land an
die Weltspitze der wichtigsten Zukunftsmärkte
zu führen.
Ein Schwerpunkt der Hightech-Strategie,
die vom Bundesministerium für Bildung
und Forschung koordiniert wird, ist die
Mikrosystemtechnik. In dieser Zukunftstechnologie
steckt enormes Potenzial,
denn mit Hilfe der Mikrosystemtechnik
lassen sich in nahezu allen Industriebranchen
neue Produkte entwickeln und
bestehende verbessern.
Gleichzeitig wird die Mikrosystemtechnik
immer mehr zu einer Schlüsseltechnologie
für die Lösung vielfältiger gesellschaftlicher
Herausforderungen, die
etwa durch die demografi sche Entwicklung
oder den Klimawandel auf uns zukommen.
Die Mikrosystemtechnik liefert
dafür die technologischen Ansätze.
Mit jährlich 16 Prozent Wachstum und
einem Umsatzvolumen von mehr als
277 Milliarden Euro gehört die Mikrosystemtechnik
zu den Jobmaschinen
unseres Landes. Heute sind rund
680.000 Arbeitsplätze in Deutschland
mit der Mikrosystemtechnik eng verbunden,
davon knapp 50.000 direkt in
der Produktion von Mikrosystemen. Die
Tendenz ist steigend: Beispielsweise die
Sensorik-Branche, ein wichtiges Feld
der Mikrosystemtechnik, schafft so viele
Arbeitsplätze wie nie zuvor. Allein im Jahr
2007 entstanden hier über 13.000 neue
Jobs. Dieses Wachstum wird vor allem
durch die kleineren Firmen getragen.
Die technologische Entwicklung der
Mikrosystemtechnik ist bei weitem nicht
abgeschlossen; ihre Anwendungspotenziale
noch lange nicht ausgeschöpft.
Um diese Potenziale in Deutschland zu
nutzen, stellt das Bundesministerium für
Bildung und Forschung darum mit dem
Rahmenprogramm „Mikrosysteme“ von
2004 bis 2009 über 220 Mio. Euro an
Projektfördermitteln zur Verfügung.
Grußwort
Eine wichtige Voraussetzung für die
erfolgreiche Nutzung der mit der Mikrosystemtechnik
verbundenen Chancen
ist eine enge Kooperation zwischen
Industrie und Wissenschaft. Bereits zum
zweiten Mal veranstaltete das Bundesforschungsministerium
deshalb im
Oktober 2007 gemeinsam mit dem VDE
den Mikrosystemtechnik-Kongress. Über
1000 Expertinnen und Experten stellten
in Dresden die Weichen für die Zukunft
des Mikrosystemtechnik-Standorts
Deutschland.
Unser Ziel ist klar: Deutschland soll
wieder das Land mit den besten Innovationen
werden. In der Mikrosystemtechnik
sind wir auf dem besten Weg.
Dr. Annette Schavan, MdB
Bundesministerin für Bildung
und Forschung
7

Positioning in International Competition
Kapitelüberschrift
Positioning
in International
Competition
8

Positioning in International Competition
Positionierung
im internationalen
Wettbewerb
9

Positioning in International Competition
Microsystems Technology –
Drives Innovation
in Leading Markets
VDE: Microsystems technology drives economic
and technical progress in Germany and Europe
With a worldwide market volume in
the triple-digit billion-euro range and
double-digit growth rates, microsystems
technology (MST) is one of the biggest
markets of the future. And the leveraging
effect of MST applications – estimated
at 25 times that volume – is even more
important. All in all, MST ranks as one of
the leading cross-disciplinary technologies
of the 21st century. In the VDE’s
2007 Innovation Monitor, VDE business
and research experts consider micro-
and nanotechnologies to be the primary
stimulus for innovations.
Microtechnical components are long
since a mass market, and appear
in products such as ink-jet pressure
injectors, CD/DVD scanners, acceleration
sensors for triggering airbags,
10
and laser measurement systems for
automation systems, minimally invasive
medical procedures and in optics. MST
also makes possible new production
processes in nanometer dimensions,
and is transforming traditional industries
such as high-precision engineering and
tool manufacturing for state-of-the-art
injection molding.
Germany has long been the technology
leader for integrated systems solutions
and continues to hold an outstanding
position in the fi eld of microsystems
technology as the most important European
home by far for microelectronics
and microtechnology. The VDE Innovation
Monitor indicates that Germany
will be able to continue defending its
excellent technology position even
though Europe is in
a neck-to-neck race
with the U.S. in micro-
and nanotechnology
innovations, and
East Asia is gaining
ground. Microsystems
technology will
undoubtedly continue
to be a major key to
Germany’s success in
leading markets of the
future.
In particular, microsystems
technology
drives industries in
which Germany and
Europe are traditionally
strong, such as the
automotive industry,
medical engineering and the information
and communications sector. In the future,
the “Internet of things” will not only
be used to transport data, but to directly
operate a wide range of devices. Smart
labels (RFIDs), for example, are the fi rst
step toward networking IT systems and
enabling independent interaction among
intelligent devices (machine-to-machine
communication), such as in the multimedia
sector.
To optimally exploit the potential of German
science and build bridges between
research and future markets, the German
government’s high-tech strategy
has designated microsystems technology
as the forerunner for intelligent
products. It is orienting its MST program
toward meeting important needs in

Dr.-Ing. Dr. sc. techn.
Klaus-Dieter Lang
stellv. Vorstandsvorsitzender
der VDE/VDI
Gesellschaft GMM
Fraunhofer Institut
Zuverlässigkeit und
Mikrointegration (IZM),
Deputy Director
the areas of environment, healthcare
and resource effi ciency. The VDE and
the Federal Ministry for Education and
Research (BMBF) are already partners in
many areas, such as the VDE/BMBF Microsystems
Technology Congress and
in precompetitive networking projects
like micromedicine.
The VDE/VDI Society of Microelectronics,
Micro and Precision Engineering
(GMM) comprises a broad network
Die Mikrosystemtechnik ist mit einem
weltweiten Marktvolumen im dreistelligen
Milliardenbereich und zweistelligen
Wachstumsraten einer der großen
Zukunftsmärkte. Von noch größerer
Bedeutung ist der bemerkenswerte
Hebeleffekt für MST-Anwendungen, der
auf das 25-fache geschätzt wird. Damit
zählt die MST zu den wichtigsten Querschnittstechnologien
des 21. Jahrhunderts.
VDE-Experten aus Unternehmen
und Forschungsinstitutionen sehen nach
dem VDE Innovationsmonitor 2007
die Mikro- und Nanotechnik sogar als
Hauptimpulsgeber für Innovationen.
Längst haben mikrotechnische Komponenten
einen Massenmarkt geschaffen:
z.B. als Tintenstrahl-Druckknöpfe, als
CD/DVD-Abtastköpfe, als Beschleuni-
of microsystems technology experts
organized in a number of specialist
divisions. The GMM serves as a crucial
interface for the cross-disciplinary
exchange of expertise, and supports the
growth of microsystems technology in
Germany with position papers, workshops,
conferences and promotional
initiatives.
The optimal focus and fi ne-tuning of
innovation policies is especially impor-
gungssensoren zur Auslösung von
Airbags, in Lasermesssystemen in der
Automation, in der minimal invasiven
Medizin oder in der Optik. Darüber
hinaus entstehen durch Mikrosystemtechnik
auch neue Fertigungs- und
Produktionsverfahren, die bis in den
Nanometerbereich reichen. Diese verändern
derzeit traditionelle Branchen wie
die Feinwerktechnik oder die Herstellung
von Werkzeugen für den modernen
Spritzguss.
Deutschland ist seit vielen Jahren Technologieführer
bei integrierten Systemlösungen
und in der Mikrosystemtechnik
nach wie vor hervorragend aufgestellt.
Die Bundesrepublik ist mit Abstand der
bedeutendste europäische Standort für
Mikroelektronik und Mikrotechnik. Diese
Zur Positionierung im internationalen Wettbewerb
Dipl.-Ing. Dipl. Wirtsch.-
Ing. Dirk Friebel
Vorstandsvorsitzender
der VDE/VDI Gesellschaft
GMM
NOKIA, Research Center
Germany, Bochum,
Laboratory Director,
General Manager
tant for microsystems technology, since
the fi eld also has a major impact on
Germany’s competitive position in other
key technologies and markets. In order
to fully utilize the impressive potential
of microsystems technology, one must
further develop and expand the knowledge
network, give highest priority to
research needs in innovation fi elds, and
tackle hindrances to innovation such
as bureaucracy and the shortage of
engineers.
Mikrosystemtechnik –
Innovationstreiber für Leitmärkte
gute Technologieposition kann Deutschland
laut VDE Innovationsmonitor auch
künftig verteidigen, wenngleich sich
Europa bei Innovationen der Mikro- und
Nanotechnik ein Kopf-an-Kopf-Rennen
mit den USA liefert und Ostasien an
Boden gewinnt. Ohne Zweifel bleibt die
Mikrosystemtechnik für Deutschland ein
wichtiger Schlüssel zum Erfolg in den
Leitmärkten der Zukunft.
Insbesondere treibt die Mikrosystemtechnik
Branchen an, in denen Deutschland
und Europa traditionell stark sind,
so zum Beispiel den Automobilbau und
die Medizintechnik. Weitere Leitmärkte
sind in der IKT-Branche auszumachen.
So werden im künftigen „Internet der
Dinge“ nicht nur Daten, sondern auch
viele Geräte direkt über das Internet
11

Positioning in International Competition
genutzt. Die „Funketiketten“
(Smart Labels, RFID) sind
erste Ansätze in Richtung
einer Vernetzung von
IKT-Systemen und zur
eigenständigen Interaktion
intelligenter Endgeräte
(Machine-to-Machine
Kommunikation), etwa im
Multimediabereich.
Um das Potenzial der
deutschen Wissenschaft
optimal zu nutzen und
Brücken zwischen Forschung
und Zukunftsmärkten
zu schlagen, hat die
Bundesregierung die Mikrosystemtechnik
als Wegbereiter
für intelligente Produkte
in die Hightech-Strategie
aufgenommen und das
Technologieprogramm Mikrosystemtechnikkontinuierlich
auf die wichtigen gesellschaftlichen
Bedürfnisse
in den Bereichen Umwelt, Gesundheit
und Ressourceneffi zienz ausgerichtet.
In vielen Bereichen arbeiten VDE und
BMBF gerade in der Mikrosystemtechnik
sehr erfolgreich zusammen, etwa im
Rahmen des VDE/BMBF Mikrosystemtechnik
Kongresses und vorwettbewerblich
angesiedelten Netzwerk-Projekten
z.B. in der Mikromedizin.
12
Sub-nanometer
resolution
Low settling
time
QuickLock
adapter
Die VDE/VDI-Gesellschaft Mikroelektronik,
Mikro- und Feinwerktechnik
(GMM) vereinigt ein weit verzweigtes
Expertennetz auf dem breiten Gebiet
der Mikrosystemtechnik, das sich in
der GMM in einer Vielzahl von Fachgremien
organisiert hat. Damit leistet
die GMM einen wesentlichen Beitrag,
um als Schnittstelle den fachübergrei-
High-precision
flexure
guidance
Highly
compact
Look Sharp!
PIFOC ® —High Dynamics Piezo Nanofocusing Systems
These extremely precise focusing systems are unique for their extra-long travel ranges
and sub-nanometer resolution. With their minimal settling times and outstanding
focus stability, they are winning over users in Life Sciences and Metrology.
■ Travel Ranges up to 460 μm
You, too, can look sharp. info@pi.ws
■ Resolution < 1 nm ■ Linearity to 0.03 %
Physik Instrumente (PI) GmbH & Co. KG · Tel. +49-721-4846-0
fenden Austausch von Expertenwissen
zu gewährleisten. Die GMM trägt mit
Positionspapieren, Workshops, Tagungen
und Initiativen zur Förderpolitik
dazu bei, der Mikrosystemtechnik in
Deutschland Zukunftsperspektiven zu
geben.
Die richtige Fokussierung und Justierung
innovationspolitischer Maßnahmen
ist gerade in der Mikrosystemtechnik
von herausragender
Bedeutung. Denn sie wirkt sich auch
auf die Wettbewerbs position
Deutschlands in weiteren Spitzentechnologien
und Leitmärkten aus.
Deshalb müssen die Wissensnetzwerke
weiter aus gebaut, die Forschungsför
derung auf Innovationsfeldern mit
höchster Priorität versehen und Innovationshemmnisse
wie Büro kratie und
Ingenieurmangel abgebaut werden.
Nur so können die beachtlichen Potenziale
der Mikrosystemtechnik voll
ausgeschöpft werden.
VDE/VDI-Gesellschaft Mikroelektronik,
Mikro- und Feinwerktechnik (GMM)
Dr. Ronald Schnabel
Stresemannallee 15
D – 60596 Frankfurt
Phone +49(0)69-6308-227 / 330
Fax +49(0)69-6308-9828
Mail gmm@vde.com
Web www.vde.com/gmm

Beiträge
zu aktuellen
Innovationsfeldern
Contributions
to Topical Fields
of Innovation

Contributions to Topical Fields of Innovation
Microactuators
Microactuators are not only characterized
by their smaller size in comparison
to classical actuators, but defi ne themselves
much more prominently by their
way of production, which is derived from
microsystem technology and is based
on batch-processing steps. By their very
nature, microactuators allow only small
displacements and forces. Thus they
have the largest application potential
where only small forces are needed and
where miniaturization is an advantage
per se, e.g. because an array setup is
required. Examples are applications that
are aimed at the switching of small electrical
currents, at the manipulation of light
or of small volumes of fl uids. The ink-jet
printer head, which controls the ejection
of tiny droplets of ink onto the print medium,
is amongst the most successful
high volume devices in all microsystem
14
technology. Similarly, analytical devices
in life science applications, including
control valves and micropumps, are rapidly
gaining importance. Another highly
successful microactuator is the digital
mirror device from Texas Instruments.
Switches and high frequency micromechanical
oscillators for microwave applications
in the GHz domain are rapidly
gaining importance, even defi ning a new
subclass of microsystem technology,
called RF-MEMS.
The principles used for generating
forces in microactuators are the same
as those encountered in classical
actuators. However, due to the different
scaling behaviour and the different
compatibility with microsystem technologies,
other forces dominate the scene.
The most dominant driving mechanism
Fig. 1
A silicon microvalve with
combined magnetic/electrostatic
actuation used for
fl ow control in ion thrusters
for satellite propulsion.
a) schematic cross section.
b) upper silicon chip with
movable membrane for
closing the valve.
Prof. Dr. Helmut Seidel
Chair of Micromechanics,
Microactuators/Microfl uidics,
Department of Mechatronis –
Saarland University
in conventional actuators is the electromagnetic
force, with electrostatic forces
only playing a side roll. Although they
can also be generated quite easily in
a parallel capacitor plate confi guration,
their strength decreases inversely proportional
to the distance of the plates.
When we now look at the laws of scaling
of these forces down to smaller dimensions,
the situation observed in conventional
actuators gets to be reversed.
The electrostatic force is a surface force
and therefore scales with the square of
the length scale l involved in a system.
Since volumes and inertial masses are
scaled down by l³, electrostatic forces
are actually gaining in relative strength
by reducing the size of a structure,
whereas electromagnetic forces scale
much more unfavourable because of the
limitations of current density and heat
transfer from a coil to the surrounding
environment.
For some applications the simultaneous
incorporation of two actuation principles
in a hybrid way can be of interest. An
example for this is the combined use of
electromagnetic and electrostatic forces
in a microvalve, which was developed
by the author’s group for controlling a
xenon gas fl ow in ion thrusters used for
satellite propulsion (Fig. 1). The electromagnetic
force is applied for generating
large displacements in opening or closing
the valve, whereas the electrostatic
force can keep the valve in its closed
position with very little power consumption.
The best known and most widespread
microfl uidic system today is the ink-jet

Fig. 2
Digital Mirror Device
from Texas Instruments.
printer. The printer head as the enabling
component is an example of a true
microactuator that made it to a readily
available product with overwhelming
commercial success, being produced in
ever increasing numbers. The principle
setup of this device can be described
as follows: An ink reservoir feeds a pressure
chamber which is in direct contact
with a linear arrangement of microscopic
nozzles, shooting out droplets of ink on
demand towards the print medium. In
the more traditional setup a piezoelectric
element is employed as an actuation
principle to contract a wall of the
chamber, thus increasing the pressure
which leads to the ejection of an ink
droplet. As an alternative, the application
of a phase-change thermopneumatic
principle has become very popular. A
short heating pulse (< 10 μs) induced by
an electric resistor vaporizes the ink in
the chamber, generating a gas bubble
which leads to a substantial increase in
pressure, causing a small droplet of ink
to be ejected from the nozzle.
Microactuators have a large potential
in optical applications, since no large
forces are required for the manipulation
of light. The digital micromirror device
(DMD) is one of the most successful
microsystem devices ever produced
from an economical point of view. Its
idea goes back to an invention made
by L.J. Hornbeck at Texas Instruments
in 1987. At its heart stands a pixelated
array of defl ectable micromirrors that can
be addressed and actuated individually
to display an image on a projector
screen, when combined with the
illumination and optics required for this
purpose. The mirror structures are fabricated
after the completion of the CMOS
process fl ow that creates all the underlying
circuit elements required for driving
Contributions to Topical Fields of Innovation
and ultimately displacing
the mirrors
by electrostatic
forces. The micromirrors
are squares
with 10-20 microns
length, made out
of a highly refl ective
aluminium alloy.
A micrograph of a
group of micromirrors
can be seen
in Fig. 2. One
element has been
removed to provide
visual access to the
underlying hingesupport
structure.
The addressing
circuitry under each mirror pixel is a
memory cell (a CMOS SRAM) that
drives two electrodes under the mirror
with complementary voltages.
Ink-jet printer heads and digital mirror
devices can presently be regarded
as the most successful microsystems
on the market. This demonstrates the
extraordinary commercial potential of
microactuators in an impressive way.
Saarland University
Department of Mechatronics
Prof. Dr. rer. nat. Helmut Seidel
D – 66123 Saarbrücken
Phone +49(0)681-302-3979
Fax +49(0)681-302-4699
Mail seidel@lmm.uni-saarland.de
Web www.lmm.uni-saarland.de
15

Contributions to Topical Fields of Innovation
Micro Energy Harvesting –
Energy Supply for distributed
embedded Microsystems
Today we live in a highly
networked information
society. The internet
spectacularly metamorphoses
into a worldwide
wireless information
system. Just as rapidly,
the number of distributed
embedded systems
grows, in production
technology, building
technology, medical
technology, security
technology, or transportation
technology, without
which modern society
would be inconceivable.
Radio communication
is used more and more
within these systems
since it offers, just like
in the world wide web,
fl exible expansion and
mobility. Power supply for
the system nodes is still
done via cable or battery,
increasingly causing disadvantages.
In factories,
buildings, and vehicles,
power and data cables
for the distributed systems
have become a signifi
cant cost factor. These
cable networks can be
faulty, heavy and expensive;
they must be laid,
extended and serviced
manually. Rarely are batteries
a useful alternative.
From a technical point of
view, temperature, vibration
or corrosion set tight
16
Prof. Dr. Ing. Peter Woias
IMTEK
Speaker of the DFG Research
Training Group GR 1322
“Micro Energy Harvesting“
Bio fuel cell for a direct
metabolism of glucose
Organic PV cell on
a glass substrate
Piezoelectric vibration
harvester fabricated
in polymer-composite
technology
Piezoelectric vibration
harvester with a stressoptimated
beam shape
limits, so do maintenance and disposal
from an economical point of
view. Therefore, there is an urgent
need to solve the energy problem
for distributed embedded systems
given their increasing complexity
and widespread use.
“Micro Energy Harvesting”,
“Energy Harvesting” or “Energy
Scavenging” are buzz words for a
completely new concept for reliable
energy supply to distributed
systems – preferably small, robust
and low-power microsystems
– without cables or batteries.
Basically, Micro Energy Harvesting
follows the principles of biological
energy systems. The required
electrical energy is “harvested”
from the immediate environment
of the system node. Mechanical
energy from vibrations, sounds
or fl ows can be used through
piezoelectric, electromagnetic or
capacitive generators, heat energy
can be used via thermoelectric
converters, energy from light with
solar cells, and chemical binding
energy with bio fuel cells. The
harvested energy is collected in
storage and is rationed with an
intelligent energy management
such that the system node can
operate reliably.
The resulting vision of an energy
autonomous embedded system
is enticing: the system nodes
supply themselves with energy
during their life span, i.e. cable

networks and battery changes become
obsolete. They work at previously hard
or impossible to reach locations, e.g.
inside car tires, in medical prostheses
and implants, at high voltage lines or
building fronts. The extension of distributed
systems happens through simple
installation of new system nodes. Hybrid
combinations of wired network hubs and
energy-autonomous nodes allow high
data rates as well as widely distributed
systems.
Tapping into environmental energy also
enables new product concepts:
One can imagine – and, partially, these
are already reality – alarm triggers which
obtain their energy from the disturbances
which they monitor, medical
monitoring systems operated through
our body heat and motion, smart pills
which get their energy from the chemical
processes in the digestive tract, but
just as well energy-autonomons MP3
players.
In general, biological energy systems
use the principle “function follows energy”,
in contrast to the technical priority
“energy follows function”. Therefore, the
long term consequences of Energy Harvesting
are revolutionary new, biologically
inspired, embedded systems. These
systems will live a “technical life“ in their
environment. Design and operational
concept are, in analogy to biological
principles, “life adapted”, ensuring function
also under varying energy and data
supplies. Like biological organisms, they
adapt their activity to the energy supply,
use different energy sources, are aware
of their own resources, and utilize these
effi ciently. This radical switch to energy
and data adaptive design principles
promises – over and above energy
autonomy – a drastically increased operational
reliability of embedded systems
and opens up totally new perspectives.
The visions outlined here set ambitious
goals and require varied and multidisciplinary
research efforts, for example to
develop new materials for most effi cient
energy transformers and energy storage,
energy effi cient ultra low power microelectronics,
or energy effi cient software
algorithms and monitoring strategies.
First steps have been made in Germany
and Europa: Since October 2006, the
DFG Research Training Group “Micro
Energy Harvesting“ works in Freiburg on
innovative technologies and concepts
for energy transformation, storage and
management. Just recently, the BMBF
included development and application
of Energy Harvesting in their calls for
proposals “Energy autonomous Microsystems”
and “Research for Civil Safety”.
Contributions to Topical Fields of Innovation
MEMS with energy
harvesting
Likewise, the current EU framework program
calls Energy Harvesting one of the
key technologies for research support.
At the moment, Energy Harvesting is
one of the notable future technologies
of MST. Nobody denies the high
relevance of this new energy technology
for distributed embedded microsystems
of tomorrow. An interesting question is
if and when we will begin to utilize other
successful principles of nature for more
advanced and truly bioinspired embedded
microsystems.
Albert-Ludwigs-University Freiburg,
Department of Microsystems Energeering
(IMTEK)
Laboratory for Design of Microsystems
Prof. Dr. Ing. Peter Woias
Georges-Köhler-Allee 102
D – 79110 Freiburg
Tel. +49(0)761-203-7490
Fax +49(0)761-203-7492
Mail woias@imtek.de
Web www. imtek.de/konstruktion
17

Contributions to Topical Fields of Innovation
Micro-Optics
Micro-optics is one of the technological
foundations of photonics, which is
considered a key technology for the
21st century. Micro-optical technologies
are important especially in information
technology, life sciences, and sensor
technology. Being the basis for technological
developments and their applications,
they have led the way in important
innovations in all future-oriented industries.
Examples are DVD players, cell
phone cameras, backlit projectors, or
handheld analyzers.
Miniaturization and increased system
integration drive innovations, by increasing
functionality of optical systems and
reducing costs.
Micro-optics includes both wave guide
as well as free space optical components
and systems manufactured
with micro-technological processes.
Because of the associated variety of
possibilities, one fi nds micro-optical
components in many applications. This
was in evidence on the Microsystems
Technology Congress 2007 in Dresden.
In communication technology, optical
data transfer is the only way to satisfy
the steadily growing need for transmission
capacity. Furthermore, optical data
transmission is brought ever closer
to the subscriber, opening up new
applications for micro-optics. To this
end, micro-optics delivers a multitude
of micro-optical components like, e.g.,
simple switches, micro-optical lenses,
prisms, fi lters or light wave guides in
glass and in polymers, but also complex
optical switches and switch matrices.
18
Especially in sensor technology, the
potential of micro-optics as pacesetter
is evident. Together with other microsystems
technologies, compact, highly
functional, low-noise, zero-contact and
non-destructively measuring sensors
can be implemented. Their application
reaches from automotive technologies,
security and automation technologies, to
medical diagnosis and analysis technologies.
Examples for micro-optical
systems are optical gas sensors, light
and image sensors in photo technology,
fi ber-optical tension sensors in building
and bridge construction, and optical
pressure or distance sensors. Work at
the research center Karlsruhe is concen-
Dr. Jürgen Mohr,
Research Center
Karlsruhe, Institute
for Microsystems
Technology
trated in the latter areas. Based on a
modular concept, micro-spectrometers
or distance sensors were developed.
The modular assembly of micro-optical
sensor systems is based on a separation
of different functions (beam formation,
light generation and detection,
beam modulation) into different modules.
Since these are implemented using
specifi c technologies, a higher degree
of optimization becomes possible. The
worlds smallest micro-spectrometer,
developed at the research center, is
successfully being manufactured since
a few years (Boehringer Ingelheim
microParts), and is applied from the
UV to the infrared. At the moment, a
Confocal
micro-optical
distance
sensor to
measure
inside tiny
holes

Concept of a biophotonic
plattform
with integrated
laser source,
photodetector,
fl uid channels and
sensor structures
miniaturized interferometer incorporating
a micro-actor is being developed.
Micro-optics has become a decisive
factor for success, also in beam formation
of laser light.
Only after high-quality micro-optics
became available, high power diode
lasers came to the forefront. Both in
laser structuring and in high resolution
lithography, beam formation with microoptical
components or precise imaging
with micro-lenses have become an
important aspect.
In the promising technology area of bio
photonics a huge potential for microoptics
with excellent market chances
has developed. Of special interest is the
possibility to reduce costs in health care
through micro-optics. The application
spectrum ranges from medical diagnosis
to control of innovative medicaments.
Besides the development of new
imaging processes for the micro and
nano range, optical analysis procedures
based on micro-optical components
(with potential to work in parallel) for
spectral analysis or detection of fl uorescent
markers become necessary. Microoptics
makes small and cost effective
systems, directly combining fl uidics and
optics, possible. The Karlsruhe Institute
for Technology (KIT), a joint venture of
the Research Center and the university
within the German “excellence initiative”
for universities, has created a new
research group in this fi eld. Opto-fl uidic
polymer chips are being developed
there. Fluidic structures, wave guide
structures, polymer lasers, and detectors
are combined into a single chip. Insertion
of suitable transducer structures
into the opto-fl uidic interaction region is
meant to allow simple ways to analyze
bodily fl uids, cells or other organisms
relevant in illnesses. Implementation of
Contributions to Topical Fields of Innovation
chips using lithographic or
molding techniques allow
manufacture of low cost
disposable sensors. The
European Union has realized
the importance of this
application area for optics
and, since the middle of this
year, funds the Euro pean
excellence network Photonics4Life.
The fact that micro-optics
in Germany has reached a
very high state of development
was pointed out not
just on the microsystems
technology congress. German
research institutions
working in this fi eld are at the forefront
worldwide. The industrial utilization of this
research is pushed especially by small
and medium enterprises. They gain
ever larger importance as OEM manufacturers
and sources of micro-optical
components. This trend will continue in
the coming years, leading to a signifi cant
share for micro-optics in the predicted
40% increase in the labor force in optics
by the year 2010.
Forschungszentrum Karlsruhe
Institut für Mikrosystemtechnik
Dr. Jürgen Mohr
Hermann-von-Helmhotz-Platz 1
D – 76344 Eggenstein-Leopoldshafen
Phone +49(0)7247-82-4433
Fax +49(0)7247-82-4331
Mail Juergen.Mohr@imt.fzk.de
Web www.imt.fzk.de
19

Contributions to Topical Fields of Innovation
High Brightness LEDs for Light Engines
Fig 1: OSTAR LE x H3A for projection light engines
Abstract
The ability to increase the output
performance of LED-powered projectors
is imminent. A mixture of advanced
LED chip and packaging technologies,
optimised light extraction and improved
optical aspects of LED-based projection
light engines allows improved brightness
by up to a factor of 10.
Introduction
When LED-powered projectors were
commercialised, they delivered only 10
to 15 real lumens; subsequent product
development has therefore focused on
increasing brightness.
Chip performance increased with the
introduction of the Thinfi lm technology.
High refl ective internal mirrors combined
with thin epi layers and textured surfaces
are causing less internal photon
reabsorption as light travels through the
chip. In recognition of this outstanding
20
scientifi c and technical achievements in
this Thinfi lm technology and related Ostar
packaging and optics technologies
OSRAM was awarded with the German
Future Prize.
This chip technology negates prior
limitations of total internal refl ection by
scattering refl ected light back into the
chip. By increasing the current spreading
capability of the epitactical layers,
LED effi ciency at higher currents does
not drop as dramatically as conventional
structures; the thermally induced rollover
of InGaAlP LEDs is enhanced from
about 1.5 A/mm² to far beyond 3 A/m².
This improved chip performance also
requires package improvements. Fig. 1
shows an Ostar for projection light
engines. Six power LED chips are
mounted to a highly thermally conductive
ceramic heat sink, which is attached
to a metal-core printed circuit board also
containing a connector, surge protection
devices and temperature sensor.
Changing the interconnect material and
replacing the aluminium core material
with copper decreases thermal resistance;
fi nite element simulation promised
a drop from 2.8 K/W down to 1.7 K/W.
These values could be also demonstrated
in measurements where the old
assembly version showed 2.75 K/W
and new components only about 1.8
K/W. More important: The new concept
maintains that low value after 1,000 thermal
cycles from – 40°C to + 100 °C.
Other improvement comes from
implementing enhanced light extraction,
which raises total fl ux from a green
or blue Ostar by about 25%. The new
light extraction also creates additional
directionality, with total emission within
+/- 80°. This leads to an increasing
probability that most current optics can
pick up the light.
On screen lumens are not only defi ned
by the light source. There are also tradeoffs
at the light engine level, dictated by
the law of etendue conservation.
The projector’s micro display etendue is
determined by its area A and the angle
+/- theta at which the lens system can
project to the screen. The refractive
index n is important, but in most cases
the reference media is air.
The formula can be used to determine
usable LED source area. Some LEDs
are lambertian emitters and emit at a
level of +/- 90°. If we assume that the
optical system collect the light over

Diag. 1: Captured fl ux from led source over collection angle, corresponding required chip area and gain vs. pure
lampertian source with considering lens system transmission.
the entire angle the etendue equation
defi nes the max. usable LED area. But
almost no optical system can collect all
that light. Therefore it is better to cut off
higher radiation angles and increase the
chip area.
The best approach to optimize the system
is to fold our Ostar’s angular intensity
distribution with the relative angular
transmission of the optical system.
Diag. 1 varies the collection angle from
the LED source from 0° to 90°. Blue
shows the percentage of collected fl ux
of the LED source. Orange shows the
corresponding usable chip area for a
0.55” 3:4 imager at an F# of 2.4. Pink
shows the relative system effi ciency.
This shows that for a collection angle
from 30° to 60°, the gain is stable at
about 20%, but with varying chip area.
For example the solution with 6.0 mm²
chip area and 55° collection angle offers
20% higher system brightness compared
to the solution with 4.0 mm² chip
area and 90° collection angle.
We also compared three illumination
projector confi gurations. First, we used a
single-channel single Ostar module with
three colours on one board – allowing
1-to-1 replacement of a lamp with the
LED module. A second approach of
a two-channel illumination confi guration
requires only one dichroic mirror to
superimpose the green light from one
Ostar with the mixed blue and red light
from a second Ostar.
In a third approach, two optimised
dichroic mirrors combine the light of
three monochrome Ostars. Fig. 2 shows
estimated on screen fl ux based on previously
discussed LED improvements,
a DLP-based projector using a 0.55“
Imager and a light engine effi ciency of
22%. Without special driving schemes
for the LEDs in a pure sequential opera-
Contributions to Topical Fields of Innovation
Fig 2: On Screen Lumens with different illumination
regimes for the projector output.
tion of the colours, the single channel
delivers more than 50 lm, the twochannel
gives more than 100 lm and
the three-channel solution surpasses
150 lm.
The new Ostar Projection LE x G3W and
LE x H3W open the door for next-generation
LED projectors in the range of
150 + Lumens on screen. With optimized
systems, LED projectors of 200
to 300 lumens are possible this year.
OSRAM Opto Semiconductors GmbH
Stefan Grötsch
Leibniz Str. 4
D – 93055 Regensburg
Phone +49(0)941-850-1700
Mail stefan.groetsch@osram-os.com
Web www.osram-os.com
21

Contributions to Topical Fields of Innovation
Intelligent Implants
Monitoring of signals from natural sensors and
actuators can be used to control intelligent implants in
therapy and rehabilitation.
Technical aids are essential parts of
modern medicine. Microsystems engineering
is amongst the enabling technologies
for complex intelligent implants
with small size and high functionality that
will improve quality of life and treatment
effi cacy.
Miniaturization and integration
of sensors, actuators,
and microcomputers will
be combined to adapt
intelligent implants to the
changing physiological
environment in real-time. Local
monitoring of metabolic
and electrical signals and
their use as control variable
will combine diagnosis with
patient specifi c therapy.
According to technical
standards and approval pro-
22
cedures, “active implants” belong to the
most complex class of medical devices.
For Europe, legal requirements are summarized
in the “Active Medical Device
Directive” (AIMD). In clinical practice,
however, many implants are classifi ed as
non-active. Joint endoprostheses, drug
delivery devices driven by gas pressure
or osmosis, and implantable valves for
hydrocephalus help a large number of
patients but do not have an electrical
power supply nor do they exchange
electrical energy with the human body.
In clinical practice, active implants
are mainly established in cardiology
and neurology. Heart pacemakers to
treat rhythm or conduction disorders
help millions of patients to live their life
light-heartedly. Implantable defi brillators
detect fi brillation and shoot the heart
back into its regular rhythm. In neurology,
more than 140,000 spinal cord
stimulators have been implanted to treat
chronic pain and urge incontinence.
Electrical stimulation of the vagal nerve
helps more than 17,000 patients with
Prof. Dr.-Ing. Thomas Stieglitz
IMTEK
Laboratory for Biomedical
Microtechnology
medical refractory epilepsy and severe
depression. Deep brain stimulation alleviates
the symptoms of Parkinson’s disease
like tremor and dyskinesis in more
than 20,000 cases. Neuroprosthetic
implants to restore motor and sensor
functions are of high interest but many
of them are still under development.
The most successful application is the
cochlea implants to restore hearing with
more than 100,000 devices worldwide.
The technological race for the fi rst vision
prosthesis has entered the clinical trial
phase with German companies at the
cutting edge.
Nowadays implants are successful due
to their robustness: Titanium housings
with a limited number of hermetic feedthroughs,
robust precision mechanics
cables and electrodes led to safe chronic
implants. However, this construction
paradigm limits the complexity and
degree of miniaturization. More complex
implants need different technological
solutions.
Intelligent
Implants are
established
in therapy
as well as in
rehabilitation.

Novel applications of intelligent implants
in orthopedics and in neurology, dealing
with the treatment of large common
diseases and specifi c diseases of an
aging society are of high interest. The
specifi cations of long-term stability and
functionality over decades are still unsolved
for implantable microsystems and
require solutions for key components like
energy supply and data transmission,
biocompatible assembly and packaging
technologies as well as novel hermetic
encapsulation concepts for miniaturized
implants.
Let us have a more detailed view on
some key aspects:
The material-tissue interface is among
the most challenging tasks within an
active intelligent implant. So far, bioinert
behavior resulting in a thin fi brous tissue
layer on the electrode is the best result
one can obtain. Highly complex microimplants,
e.g. intracortical multishank
electrodes, often fail solely due to the
foreign body reactions following the
implantation procedure that separate the
nerve cells from the recording electrodes.
The development of tailor-made
surfaces and better mechanical adaptation
of the technical system to the brain
tissue might lead to better performance.
The miniaturization of implants is driven
by limited anatomical space. The selection
of the adequate technology should
only be determined by the degree of
miniaturization necessary for the specifi
ed system complexity. So far, clinical
implants have a low complexity combined
with excellent robustness. They
use approved materials and hermetic
housing components. Having medium
complexity, laser structuring is a good
method to obtain smaller structure size
while still using the same materials.
Only when smallest structure sizes and
large numbers of sensors or actuators
are needed, the use of microsystem
technology is advantageous. In general,
silicon and polymers are suitable for
implantation but these materials do not
have approval for the use in implantable
medical devices. Evaluation in accredited
test laboratories has to accompany
the device development.
Novel energy supply concepts will have
strong impact of on intelligent implants.
If implants have to record continuously
data from the body to interact with the
environment, batteries or inductive
coupling might not be suffi cient to power
the system at a high degree of miniaturization.
New research lines focus on
energy harvesting approaches (see con-
Contributions to Topical Fields of Innovation
The complexity of an
application determines the
degree of miniaturization and
the adequate manufacturing
technology
tribution of P. Woias)
to develop autonomous energy supply
solutions for microsystems.
The measurement of state variables from
implants might help to monitor loosening
of hip and knee prostheses and
to quantify forces in dental brackets.
Telemetric data from force and acceleration
sensors integrated into the implants
would help improve diagnosis and will
prevent unnecessary surgical re-interventions.
Microsystem technologies will signifi -
cantly contribute to intelligent implants
and patient specifi c therapies.
A manifold of developments will converge
to build long-term stable and
functional intelligent implant of the future
that will be less recognized as a foreign
body than actual clinical implants.
IMTEK – University of Freiburg
Department of Microsystems Engineering
Prof. Dr.-Ing. Thomas Stieglitz
Georges-Koehler-Allee 102
D – 79110 Freiburg
Phone +49(0)761-203-7471
Fax +49(0)761-203-7472
Mail stieglitz@imtek.uni-freiburg.de
Web www.imtek.de/bmt
23

Contributions to Topical Fields of Innovation
Latest Results
and Solutions in Preventive
Micromedicine
Introduction
On account of its potential for miniaturisation
and its high degree of functional
density, microsystems technology can
play a major role in the development of
new products and services for prevention
and monitoring, and also in improving
the integration of therapy monitoring.
Microsystems such as those used
in implantable or extracorporeal sensor
systems can enable continuous
progress monitoring for a whole range of
indications such as high blood pressure,
palpitations or blood sugar. In the
case of chronic disease, continuous
monitoring of parameters is crucial for
a therapy‘s success, both in terms of
managing the treatment and also detecting
any deterioration in the condition.
Current state-of-the-art
A range of physiological parameters
need to be monitored in order e.g. to
assess the condition of the cardiovascular
system. The current state-of-the-art is
Hyper-IMS blood pressure sensor. Source: Fraunhofer-IMS
24
best shown from the example of the two
key vital parameters: blood pressure and
cardiac rhythm.
Measuring blood pressure is the keystone
for the diagnosis, management
and treatment of arterial high blood
pressure (hypertonia). Any decisions
concerning aspects of arterial hypertonia
are infl uenced positively or negatively by
the precision of the measurements. Besides
the indirect measurement of blood
pressure by the doctor („occasional
measurement“), measurements can
also be taken while patients go about
their daily business, i.e. during their daily
activities and while sleeping, by means
of 24 hour blood pressure measurement.
The high measurement frequency
throughout the day (every 15 minutes)
and the night (every 30 minutes) means
that the 24 hour measurement provides
signifi cantly improved therapy monitoring
in comparison to occasional measurements
taken by a doctor. This applies in
Dipl.-Ing. Johannes Dehm
VDE Initiative MikroMedizin
particular to diffi cult-to-gauge hypertonia
patients. It helps optimise the dosages
of a combination of different medicines,
or prevent over or under treatment.
Innovative methods are required to
monitor the blood pressure of patients
over a longer-term and on a stress-free
basis without the use of a compression
cuff. Extracorporeal methods include the
recording of the cardiovascular parameters
of blood fl ow and pulse-wave
velocity. This allows the blood pressure
to be measured pulse by pulse using
intelligent signal processing.
Work is progressing rapidly on the development
of marketable telemetric sensors
(intra or extracorporeal) for measuring
blood pressure in the BMBF „Preventive
MicroMedicine“ (PMM) project. An
implantable and subsequently removable
telemetric pressure measurement
system is being developed for hospital
use for the long-term blood pressure
monitoring of hypertonia patients whose
medication requirements are diffi cult to
gauge. The advantage for patients lies
in the fact that, in contract to external
measurement techniques, the system,
once implanted, is not perceptible and
therefore does not diminish the patient‘s
quality of life. Animal-based tests are
currently being carried out on the biocompatibly
coated prototype, consisting
of pressure and temperature sensors,
assessment electronics, a telemetry unit
and an external reading station.
Given the range of transmission technologies
now available such as ISDN,
DSL, GSM, UMTS and their IP pro-

tocols, it is possible to organise safe
and secure communication between
patients‘ homes and hospitals using e.g.
Virtual Private Networks (VPNs). However,
there are many different standards
for local wireless connections – e.g.
WLAN, Bluetooth or ZigBee – each offering
widely differing bandwidths, power
consumption levels, costs, complexity,
data and tapping protection and specifi c
advantages and disadvantages in their
use.
Products with electrodes are therefore
now being developed which provide
precise and reliable measurements but
which can be carried on the human
Contributions to Topical Fields of Innovation
Source: Universität Karlsruhe (TH)
body 24 hours a day without reducing
the patient‘s quality of life (mobility).
Innovation barriers
The aforementioned measurement
recording technologies are no longer in
their infancy, rather they are now fully
mature and ready to be used in marketable
products.
However, the journey from initial idea
through to return on investment often
takes ten years. Even well researched
technologies need a period of cost
and time-intensive industrial research
and development in order to meet all
the offi cial requirements. These include
such aspects as biocompatibility, longterm
stability, power supply, interfaces,
measurement quality, integration and
miniaturisation, usability,
data storage, electrodes.
It is often not possible for
small and medium-size
companies to carry the
associated risks alone. National
technology initiatives
bring together medical
engineering companies in
joint industrial projects and
help to overcome innovation
barriers.
There is, however, a second
key innovation barrier
of a non-technical nature.
Its effects are seen mainly
in the fi elds of approvals/
market access and medical
integration/support.
There are considerable
risks involved in obtaining
approval for a medical
product, in the reimbursement
of the investor, and in the therapeutic
acceptance. This barrier requires
the development of standards which
then, however, will also apply beyond
the confi nes of such joint projects.
VDE VERBAND DER ELEKTROTECHNIK
ELEKTRONIK INFORMATIONSTECHNIK e.V.
VDE Initiative MikroMedizin
Stresemannallee 15
D – 60596 Frankfurt am Main
Phone +49(0)69-6308-355
Fax +49(0)69-9631-5219
Mail dgbmt-imm@vde.com
Web http://www.vde.com
25

Contributions to Topical Fields of Innovation
The Fraunhofer Alliance
»Ambient Assisted Living«
The Fraunhofer Gesellschaft (FhG) considers
the concept of Ambient Assisted
Living as one of the major visions of the
future. Different institutes of Fraunhofer
are combining their strengths towards
the realization of technologies that are
based on the concepts and ideas of
the Ambient Intelligence research initiatives.
Already at a very early stage of
this processes the Fraunhofer institutes
identifi ed the major impact but also
the research challenges of this main
future research topics. The Fraunhofer
Institutes defi ne Ambient Intelligence as
the provision of individualized information
and support through
miniature electronics,
as well as crosslinked
services. Such
intelligent environments
are able to
adapt themselves
independently, proactively
and situationaware
to the goals
and needs of the
user. The realization of
these visions turns the
focus of technology
development away
26
Fig. 2
Innovative
User Interfaces
for controlling
household
systems
Fig 1
The Fraunhofer
Innovation Center
for Intelligent Room
and Building Systems
inHaus
from devices – or rather from device
operation-dependent usage paradigms
– to a goal-oriented, context-sensitive
environment, in which all available
devices come together to from an
intelligent environment. In order to reach
these goals, numerous Fraunhofer Institutes
are concentrating their individual
expertise in collaboration with external
partners. Thereby, concrete application
areas are in the focus, such as production,
health care, servicing and maintenance,
home and offi ce, emergency
assistance, recreation, gaming/games,
logistics, automobile and transportation.
Dr. Reiner Wichert
Coordinator Fraunhofer
Alliance Ambient
Assisted Living
Six Fraunhofer Institutes have founded
the Fraunhofer Alliance „Ambient Assisted
Living“ (AAL) that concentrates on
the development of assistive environments
to support persons with special
needs [1]. These technologies and
solutions comprise convenience functions
and user support in the areas of
independent living and home care, but
also inpatient care in a nursing home or
the provision of mobile services. Another
focus relies in the areas of rehabilitation
and preventative for disabled persons.
The main goals are the development
of a system concept that integrates
available AAL technologies both to gain
added value and to allow an integrated
market penetration. This comprises the
implementation of AmI technologies,
like communication technology, energy
supply, sensory systems and actuators
that fi nally form the foundation for future
development of intelligent products. The
aimed tool chain will additionally include
technologies for capturing current situations
of the environment and the users,
as well as the aggregation and integra-

Fig. 3
The different
AAL spaces of
PERSONA
tion of contextual information. The usage
of knowledge-based systems and interpreters
in order to realize systems that
are able to „understand“ the contextual
information and to infer user’s goals and
needs as well as to develop appropriate
strategies for supporting the user.
Finally this Fraunhofer alliance will make
available development of methods and
processes for data and device security
in mobile and decentralized network
structures.
The institutes of the Fraunhofer Alliance
Ambient Assisted Living are already
engaged in national and international
research projects that realize AAL technologies
and scenarios. The EU IST Integrated
Project PERSONA [2] is aiming
for promoting the independence life of
elderly, people with disabilities and their
relatives (see fi gure3). PERSONA seeks
to enable the different spaces of users
(indoor, outdoor, social environments)
with AAL technology in order to make
available personalized AAL Services to
each individual user. The BelAmI project
(a bilateral German-Hungarian research
collaboration on Ambient Intelligence
Systems) [3] set up six research proj-
ects and one
demonstrator
project on German
side have
been started.
Additionally
four research
projects and
four demonstrator
projects
on Hungarian
side have been
established. The projects are dealing
with human-computer interaction, software
engineering, mobile communications
and microelectronics and sensors.
All together BelAmI seeks to establish
innovative assistive systems for health
care prevention, assistance and the
support of new interaction paradigms for
household systems (see fi gure 2).
The Fraunhofer Alliance Ambient Assisted
Living is optimally positioned to cover
the complete AAL technology chain
from the development and evaluation of
concepts and methods for assistive environments
to the provision of concrete
technology solutions and the buildup of
integrated smart environments prototypes.
The next steps of the alliance are
the establishment of a business plan
that defi nes the entire value chain using
the Ambient Intelligence use cases and
projects of the participating Fraunhofer
institutes. The plans for the following
three years provides the generation of a
technology platform for AAL that will be
offered as a complete AAL package and
turn-key solution. Having this in mind,
the Fraunhofer Alliance will furthermore
represent the FhG in any Ambient As-
Contributions to Topical Fields of Innovation
sisted Living related research fi elds and
will carry out supporting strategic market
analyses and studies. Since the Alliance
is covering various competencies, the
estimated infl uence on R&D programs
and the realization of joint research
projects is enormous. The Alliance AAL
opens up the possibility to integrate
individual technologies into a complete
solution package and to offer a fully integrated
technology platform. Furthermore
for testing and evaluation purposes of
the AAL concepts and solutions the
collaboration of the institutes’ individual
laboratories (e.g. Fraunhofer IMS laboratory
inHaus [4], see fi gure 1) leads to the
establishment of complementary labs
that are world-wide unique today.
[1] Fraunhofer Alliance Ambient Assisted Living, http://www.
fraunhofer.de/institute/allianzen/ambientassistedliving.jsp
[2] EU IST Project PERSONA, http://www.aal-persona.org,
2007 – 2010
[3] BelAmI Project, http://www.belami-project.org/index.html,
2004 – 2008
[4] Fraunhofer inHaus, Innovationszentrum der Fraunhofer-
Gesellschaft, http://www.inhaus-zentrum.de/
Department Head Interactive Multimedia
Appliances
Fraunhofer Institute for Computer Graphics
Dr. Reiner Wichert
Fraunhoferstrasse 5
D-64283 Darmstadt
Phone +49(0)6151-155-574
Fax +49(0)6151-155-480
Mail reiner.wichert@igd.fraunhofer.de
Web www.fraunhofer.de:80/EN/
institutes/alliances/
ambientassistedliving.jsp
27

Contributions to Topical Fields of Innovation
Smart Labels
for Logistic Applications
Germany is one of the most important
global drivers for RFID technology. Both,
technology development and the use of
RFID attract more and more attention.
Especially for logistic applications RFID is
quite attractive. Experts are anticipating
a wide range of use of RFID for pallets
and containers by the year 2010. The
effi ciency, the dynamics and the security
of logistic processes shall be increased
by the use of RFID. These goals are
mainly achieved by a high-grade automation
of the information fl ow as data
exchange, data logging, monitoring and
controlling. Altogether around 2.6 million
Fig. 1
Left Side:
Bistable E-Ink
display for
passive RFID.
Right Side: The
antenna of the
passive RFID
transponder.
Source:
G. Stönner
employees work in logistics and the
annual turnover amounts to 180 billion
Euros.
RFID technology allows the unique and
contactless identifi cation of objects. In
the context of logistic processes these
objects are goods. A RFID system
consists of three main components as
RFID tag, RFID reader and a connected
EDV system. A tag – also called smart
label – always contains a chip and an
antenna where the latter is the basis for
a contactless coupling of the reader and
the tag. In order to read the tag data the
reader induces a charge at the tag by
28
means of a corresponding antenna via
an electromagnetic fi eld.
Today, logistics is the main sector which
really uses RFID because benefi ts can
directly be utilized and relevant economic
effects are expected. Another reason
is caused by an enormous pressure of
competition whereon the whole sector
currently reacts with strong changes
regarding process management and
additional services. RFID technology is
often compared to barcodes but this is
incorrect for several aspects. By barcodes
it is not possible to achieve the
same degree of process automation as
it would be possible by RFID. Therefore,
RFID can also be characterized as a
rationalization technology. The use of
RFID positively infl uences several steps
of a logistic process:
✦ Mobile assets and goods can be
tracked and localized.
✦ The state of goods can be continuously
monitored by sensors, potentially
integrated into the smart labels.
✦ Processes can be better analyzed
because of logged data.
✦ Real-time data can be used for the
dynamic control of processes.
✦
✦
✦
Dr. Katrin Gaßner
Logged data can be used to clarify
liability issues.
Wrong deliveries can be reduced.
The information fl ow along the fl ow of
goods can be automated.
RFID is a complex system technology.
For most applications specialized
solutions are needed that require for
substantial developments. Nonetheless,
a wide range of RFID solutions already
exists. The adoption of RFID technology
by a company often causes primarily
non-technical problems. For example
the return of investment is diffi cult to
document because full process analyses
would be needed. Also the co-ordination
with other companies of the value
chain is complex and time-consuming.
That needs to invest in a compatible
infrastructure which is a requirement for
company-spanning logistic processes.
RFID is the main means of an Internet of
things that supports the information fl ow
across companies. Via RFID real world
items are connected to further data and
digital “brains”. Therefore Object Name
Services (ONS) are to be developed to
enable an internet access to the good
data. This approach is currently advanced
by EPCglobal. EPCglobal is one
main driver of the development of the
Internet of things and associates main
representatives of consumer goods
industry and retailing.
Still a drawback for the intensive
introduction of RFID is the cost of the
single smart labels. This is especially
true for the item tagging of low-priced
products. As organic materials are much
cheaper, research in polymer technolo-

gies is under way. Polymers are fl exible
and therefore easier to adapt, to soft
or curve surfaces, and they bear the
potential to be printed by simple print
processes. But polymers are still far from
being industrial produced and used. The
number of integrated transistors is still to
low and they are still not reliable.
Research regarding the RFID microsystems
comprises tasks as assembly
and manufacturing solutions, the energy
storage, harvesting and management,
miniaturization, tags with extended functions
as sensors, actuators and dis-
Fig. 2
Prototype of a RFID-Tag
with integrated Sensors for
humidity and temperature.
Source:
Fraunhofer IPM
plays, intelligent tags, networks of tags
or sensors, polymers and materials.
Within the funding programme „Mikrosystemtechnik
für Smart-Label-Anwendungen
in der Logistik (MST-Smart-Label)“
the Bundesministerium für Bildung
und Forschung (BMBF) grants 9 projects
with 15 Mio. €. E.g. the project Parifl ex
develops a bistable display for passive
RFID technology (cf. Fig.1). This display
is activated and controlled by a passive
tag. It works with the E-Ink technology.
Another project, the track project, develops
and integrates multiple sensors to
one tag (cf. Fig.2). The sensor detects
Contributions to Topical Fields of Innovation
temperature, humidity, light, acceleration
and shocks. The project Prisma investigates
into printing methods for polymeric
labels.
VDI/VDE
Innovation + Technik GmbH Berlin
Dr. Katrin Gaßner
Steinplatz 1
D – 10623 Berlin
Phone +49(0)30-310078-177
Mail gassner@vdivde-it.de
Web www.vdivde-it.de
29

Contributions to Topical Fields of Innovation
Intelligent Technical Textiles
Defi nition
Smart or intelligent textiles are textile
materials with integrated micro-systems
(or Micro-Electro-Mechanical Systems,
MEMS). So there is included a combination
of electronic circuits, sensors
and/or actuators, which allows to sense,
transfer and process data and to react
correspondingly.
30
Usually news is about smart clothes,
but intelligent technical textiles have
much broader possibilities.
By including MEMS into technical
textiles it is expected to realise a signifi -
cant enhancement of possible functions
and noticeable benefi t for the users.
Technical textiles include special fi bres
and yarns, fabrics, (3d-)interlaced yarns,
Fig. 1
Textile
transponder.
Source:
TITV Greiz
Fig. 2
Textiles with
integrated
warning
function.
Source:
TITV Greiz
Dr. Hartmut Strese
non-wovens and textiles with special
coatings. Besides organic (vegetable or
animal) also synthetic and inorganic (e.
g. metallic) fi bres can be used. Fig. 1
shows an example of a woven antenna
for RFID-tags.
Market
Textile and clothing industry is among
the 10 leading sectors in Germany.
In 2004 the textile industry employed
about 95.000 workers in more than
900 companies and reached a turnover
of 13,38 bn €; the clothing industry
had about 44.700 employees in 429
companies with 8,99 bn € turnover.
Germany is specialised on high-quality
products, the export rate is over 35 %.
As a segment in the textile sector the
technical textiles have an exceptional
position. For years now the segment is
growing, with several application niches
and high-tech innovative solutions. Every
third German textile company is active
in this sector, the turnover was 4 bn €.
Expected is a growth rate of more than
6 % p.a.
Application fi elds of technical textiles are
heterogeneous and address different
markets. So e. g. the following can be
distinguished:
✦ MedTex (medicine)
✦ ProTex (protection)
✦ BuildTex (building industry)
✦ MobilTex (automotive, aircraft)
✦ EcoTex (environment)
✦ PackTex (packaging)
E. g. in the car industry (seat cover,
roofl iner or top) the potential for intelligent
technical textiles is high. Already
today 45 Mio. m² of textiles are used in

the car industry, growth rates of 5 to 10
% are expected.
Funding by the BMBF
The combination of high-tech in the
fi elds of micro-systems as well as
textiles opens new perspectives for the
mainly small and medium textile companies
in Germany. Promising application
fi elds for the near future are health
system and safety and security.
In the health system, textile solutions
could help to lower costs as well as to
improve the medical treatment, rehabilitation
or prevention. Micro-system
technology may help because of the
miniaturisation potential and the high
functional density of the systems. E.
g. smart textile sensors are able to
measure vital data from blood pressure,
pulse, heart beat, breathing and ECG
to nutrition status. So the monitoring
would be easier and more comfortable
for the patient. Another fi eld could be the
therapy of chronic wounds. For these
applications the biocompatibility of the
smart textiles is important, furthermore
usual textiles care has to be possible.
The safety of persons as well as valuable
assets is a central task of the
society. Protective clothing of fi re fi ghters
protects from heat, cold, water, chemi-
cals, gas or radiation and might control
the climatisation autonomously. Integrated
localisation functions may help
to guide or to fi nd the person in cases
of emergency. In transportation textiles
may take over active warn functions (see
fi g. 2), a roadmans vest could warn and
be warned by an approaching car. And
the seat cover in the car measures the
weight of the passenger and adapts
correspondingly the seat belt or even
the airbag, so improving the safety for
the car occupants.
Besides the realization of such applications
for health, safety and security the
ministry funds also the development of
new textile based micro-system technologies,
as e. g. new sensors, lighting
textiles and new integration technologies.
For the development of intelligent textiles
the Bundesministerium für Bildung und
Forschung (BMBF) announced in the
funding programme „Microsystems“ to
grant 15 Mio. €. Industry and research
submitted 47 proposals for ambitious
research projects in this fi eld to VDI/VDE
Innovation + Technik GmbH (VDI/VDE-
IT), the project managing agency of the
ministry. After a scoring process a dozen
of these projects were chosen to submit
full proposals. It is expected that all of
them can be funded. For seven projects
Contributions to Topical Fields of Innovation
the ministry already signed the funding
agreement, the other applications are in
progress.
One of the funded projects is called Nutriwear.
In this research project, a mobile
system will be developed using smart
textiles to monitor the nutrition and water
conditions of human bodies.
The monitoring system exploits the
bio-impedance-spectroscopy integrated
into body near clothes to determine the
percentage of water, muscle and fat.
The Nutriwear system is the fi rst to
enable the continuous mobile measurement
of nutrition parameters, 24 hours
a day, 7 days a week for a large part
of the body surface. The advantages
offered by textiles facilitate its integration
into working routines and day-to-day life
(see fi g. 3).
Fig. 3
Scheme of the Nutriwear system.
Source: Motorola
VDI/VDE Innovation + Technik GmbH
Dr. Hartmut Strese
Steinplatz 1
D – 10623 Berlin
Phone +49(0)30-310078-204
Mail strese@vdivde-it.de
Web www.vdivde-it.de
31

Contributions to Topical Fields of Innovation
More than Moore, Hetero System Integration
and Smart System Integration – Three Approaches – one Goal:
Smarter Products and Processes
Prof. Dr.-Ing. Dr.-Ing. E.h. Herbert Reichl 1,2 , Dr. Klaus-Dieter Lang 1 , Dipl.-Phys. Rolf Aschenbrenner 1 , Dipl.-Ing. Karl Friedrich Becker 1 ,
Dipl.-Ing. Tanja Braun 1 , Dipl.-Ing. Alexander Neumann 1 , Dipl.-Ing. Andreas Ostmann 1 , Dipl.-Ing. Harald Pötter 1
Abstract
Experts predict that the progress in
silicon technologies will follow to some
extend the well known “Moore’s law” in
the next decade, too. This trend can be
characterized by “More Moore”. However,
in many cases the cost effi cient
micro-electronic standard technologies
cannot be applied for future multifunctional
systems. Non-electronic and many
radiofrequency functions require alternative
materials and special processes.
These additional process steps often
reduce the yield or require special
process developments which result in
a tremendous cost increase. Therefore
the future will be a combination of “More
Moore” – or “System on-Chip”-solutions
and advanced system integration
solutions such as “More than Moore”,
“Heterogeneous Integration” or “Smart
System Integration”. To illustrate these
integration technologies, two examples
for such advanced system integration
technologies will be given.
32
1 Fraunhofer IZM
The Fraunhofer Institute for Microintegration and Reliability
(IZM) is one of the leading R&D centers in electronic packaging
and electronic system integration worldwide. Together
with its cooperation partner Technische Universität Berlin,
Fraunhofer IZM focuses on application specifi c topics, such
as Wafer Level System Integration, 3D Packaging, MEMS
and Photonic Packaging, RF & Wireless, Micro Reliability as
well as Lifetime Estimation and Thermal Management.
2 Technische Universität Berlin (TU Berlin)
In close cooperation with Fraunhofer IZM, TU Berlin is
conducting internationally recognized basic research
in electronic packaging and electronic system integration.
Areas of excellence are Wafer Level System Integration,
3D Packaging, Photonic Packaging, RF & Wireless as
well as Lifetime Estimation.
System Integration Technologies –
Basis for Smarter Products
System integration technologies bridge
the gap between electronics and its
derived applications. Two main forces
drive progress in this area – emerging
device technologies and new application
requirements. New technologies and
architectures are under development to
integrate the progress made in nanoelectronics,
microsystem technologies
as well as in bio-electronic and photonic
component technologies into smart
electronic systems or MEMS. In terms
of integration, different approaches are
available:
More than Moore
“More than Moore” solutions are aiming
at single component solutions. Unlike
System on Chip solutions, additional
functions are added on a processed
wafer (back-end of line) with “non-base-
Figure
1.1-1:
System in
Package
(SiP) in
“via in via”
technology
line” CMOS processes. Typical examples
of “More than Moore” solutions are
the integration of RF (radio-frequency)
components in wireless transceivers for
mobile phones or high-voltage solidstate
switches for use in transportation
electronics.
Heterogeneous Integration
Heterogeneous Integration combines
several components or functionalities
with a very high degree of miniaturization
and fl exibility at reasonable costs
in one package (System in Package or
SiP), that is specifi cally adapted to the
application environment.
Smart System Integration
Smart System Integration uses “More
than Moore” as well as Heterogeneous
Integration solutions and integrates
these solutions into application systems.
Because smart system integration is
not restricted to a certain scale these

Figure 1.1-2:
Electronically
enhanced
Scrabble game
Technologies for
Heterogeneous
System Integration
components may be integrated in largearea
substrates, generally using organic
materials. With these so called largearea
electronics, for example, electronics,
displays with a sensor keyboard and
solar cells for power management with
conventional fl exible silicon circuits can
be combined.
In terms of applications, a strong link
exists for all integration approaches between
development of components and
system-oriented integration technologies.
Due to the fact that the operation
environment is nowadays increasingly
determined by the application (such as
automotive under the hood) and due to
the increasingly central role of electronics
in ensuring system reliability and life
time, system integration and packaging
technologies have to ensure the reliability
of electronic systems.
In terms of technology, heterogeneous
integration as well as smart system integration
combine different components
and technologies into one package or
substrate and also provide an interface
to the application environment. While
“More Moore” and “More than Moore”
technologies are based on CMOScompatible
processes and are therefore
limited to a certain set of materials,
heterogeneous as well as smart system
integration technologies have the advantage
that components based on very
different technologies and materials can
be integrated, such as power devices,
photonic or RF components, energy
harvesting or storage components, or
smart displays.
Technologies for Heterogeneous
System Integration
Wafer Level System Integration
Wafer Level System Integration performs
all assembly and packaging steps at
wafer level. Often the fi nal package size
is identical with the footprint of the die.
Wafer Level redistribution processes
add additional routing layers to transform
peripheral I/O pads on the die into an
area array to create solder bump pads
with a larger standardized pitch. The fi nal
wafer bumping turns the component
into a surface mount compatible device
(SMD), which fi ts into a standard assembly
process (pick & place and refl ow).
On chip assembly and wafer level molding
will lead to an even higher degree of
integration. In addition, future systems
will require functional layers or building
blocks e.g. for radio-frequency and nonelectronic
functions such as sensors,
actuators, power supply components,
passives and displays (MEMS integration),
which often require the use of
alternative materials and new processes.
Contributions to Topical Fields of Innovation
A number of wafer level integration
technologies are being researched to
achieve these goals (Figure 2.1-1).
Module or Board Level System Integration
Nowadays electronic systems are
realized on module level using organic
printed wiring boards, on which individual
components are placed. Future
board and substrate technologies have
to ensure a cost-effi cient integration of
highly complex systems, with a high
degree of miniaturization and suffi cient
fl exibility to allow them to be adapted for
different applications. Their functionality
will be considerably extended by the
integration of non-electronic functions
such as MEMS, antennas or optical
components. New production methods
will ensure a high throughput at very low
cost. To ensure high data transmission
and processing rates, new cost-effective
cooling technologies and 3D-packaging
concepts will ensure a stable operation
mode.
Technologies for embedded devices,
such as MEMS, passive or active components,
antennas and power management
will be key to highly integrated
modules. To make this possible, new
materials for substrates, embedding and
encapsulation have to be developed
such as high-K and low-K dielectrics
and high Tg polymers, and the coeffi
cient of thermal expansion (CTE) of
these materials must be adjusted to
the dies and substrates in question.
Additionally, substrates and interposers
with fi ner lines and smaller vias must
be made available at lower cost. These
advances will be followed by fl exible
33

Contributions to Topical Fields of Innovation
Figure Fi 2.1-1: 2 1 1 Technology T h l roadmap: d wafer-level f l l system packaging k i [5]
substrates for reel-to-reel manufacturing
and integrated optical interconnects. In
a long term, printable wiring and circuitry
printable on organic substrates will
increase productivity and lower environmental
impact.
Embedding of passive components
The embedding of passive components
into the printed wiring board is a
promising approach for increasing the
functional density of assembled electronic
systems [1, 2]. Printing technology
for polymer thick fi lm (PTF) components
Figure 1.3-7:
Functional packaging
for a cost-optimized
radar sensor for active
driver assistance
systems [7]
34
is mainly used for fabricating resistors
(although capacitors can also be
produced with this technology). With
appropriate paste compositions and
component layout, resistors in the range
between 10 Ω and 10 MΩ can be realized
with tolerances of ± 20 %. Resistors
and capacitors can also be produced
using sequential lamination and photo
structuring. The variances are generally
smaller than those of PTF components.
However, the value range of embeddable
resistors has tighter limits (10 Ω
to 10 kΩ) and capacitance strongly
depends on the used material (commercially
available capacitors sheets are
around 1 nF/cm 2 ).
Chip embedding into rigid substrates
A new concept for the integration of
active components is the so-called chipin-polymer
(CiP) technology [3], which is
based on the embedding of thin chips
into built-up layers of printed circuit
boards (PCBs). This technique can be
used to fabricate 3D-stacks of multiple
dies, too. To achieve a contact pad
surface on the wafer suitable for PCB
metallization, Al
contact pads have
to be covered by
copper bumps. To
ensure that bare
dies can be embedded
into buildup
layers, wafers
are thinned down
to 50 μm. Subsequently,
the chips
are die-bonded
using an adhesive.

Figure 2.2-1: Technology roadmap for module level system integration [5]
Precise thickness control of the bond
line is essential for maintaining uniform
thicknesses of the build-up dielectric
on top of the chip. Here, new thin chip
handling and assembly solutions using
die attach fi lm or adhesive paste printing
have been explored.
RCC (resin coated copper) layers with
thin Cu are used for the lamination.
Process parameters had to be fi netuned
to prevent damage to the chips
during lamination. The chip contacts are
produced with laser-drilled micro-vias
followed by PCB-compatible Cu plating.
All process steps in this technology
have been optimized for large scale
manufacturing, using panel sizes of 18”
x 24” in combination with high-accuracy
positioning methods using local fi ducials
for die placement, laser drilling and laser
direct imaging. Reliability evaluations of
embedded chips have demonstrated
excellent reliability. For the evaluation,
chips of 2.5 x 2.5 mm 2 size were embedded
in 10 x 10 cm 2 test vehicles with
0.5 mm FR4 core. All chips passed the
following tests without any defect:
✦ Temperature storage at 125 °C for
1000 hours
✦ Thermal shock condition; air-to-air
-55 / +125 °C; 2000 cycles
✦ Humidity storage at 85 °C / 85 % rel.
humidity for 2000 hours
✦ Jedec moisture sensitivity, level 3
Chip embedding into fl exible substrates
By embedding chips into fl exible wiring
boards, the functional density of
electronic systems can be even more
increased. However, to maintain the
basic fl exible substrate characteristics,
the build-up with an integrated chip has
to be as fl at as possible. Chips with a
thickness of less than 30 μm are used
and the interconnection should not exceed
5-10 μm. This technology relies on
a fl ip chip type mounting of the thin chip
onto the fl ex substrate and lamination of
the structure on both sides. Contacts
to outer layers are realized by through
holes. Further layers can be added to
the build-up. The electrical interconnections
are extremely thin and the
mechanical coherence of the chip to the
Contributions to Topical Fields of Innovation
substrate is ensured by nofl ow-underfi ller.
Process technologies for embedding
passive are also being developed and
investigated in European Union funded
project [4].
Advanced Examples for Heterogeneous
Integration Technologies
Embedding Technologies for the next
generation of radar sensors
One example for the advantages of
embedding technologies is a radar sensor
for the safety cocoon of a car which
is currently being developed by several
partners as part of a project supported
by the German Federal Government
(Figure 1.3-7). To equip mid-size cars
with this sensor technology, production
cost is projected to be signifi cantly lower
than that of the predecessor model,
which is presently used in the luxury
class only. This is to be made possible
by a combination of two innovative embedding
technologies. First, active and
passive components are integrated into
a plastic package by means of mold-
35

Contributions to Topical Fields of Innovation
Microwell Cross Cut Principle of dielectrophoretic multi-well sensor Implementation in PCB-Technology
ing (‚Chip in Duromer‘ [8]). This method
ensures highly precise and fast mounting
of the components. The subsequent
molding process evens out the various
component heights and makes lasting,
precise alignment between the components
possible.
The modules are then embedded into
a PCB in the same way as described
above in the “Chip-in-Polymer”-paragraph
and are bonded by means of a
technique that ensures HF suitability
(Substrate Embedding or Chip in Polymer
[3]). A second layer of HF-suited
PCB materials are laminated on top of
the fi rst layer and the respective antenna
structures are realized by standard PCB
processes. The two layers are electrically
connected by means of μ-vias.
Due to the low thermal mismatch, this
embedding process promises high
reliability with simultaneously improved
HF characteristics as a result of shorter
electrical contacts, which have been
adjusted to impedance requirements [7].
36
Using PCB-Technologies for Lab on Substrate
– Cochise
Merging new fabrication techniques and
handling concepts with microelectronics
enables the realization of intelligent microwells
suitable for future applications,
e.g. improved cancer treatment [9]. For
the implementation of a dielectrophoresis
enhanced microwell device a technology
based on standard PCB technology
has been developed in a European
project, funded by the EU (Figure 3.2-1).
Because materials from PCB technology,
such as copper or FR4, are not
biocompatible, new materials have to be
selected. Aluminium has been selected
as base conducting metal layer and
structured by laser micro machining in
combination with etching and laminated
successively to obtain minimum registration
tolerances of the respective layers.
The microwells are also laser machined
into the laminate, allowing capturing,
handling and sensing individual cells
as well as cell to cell interactions within
a dielectrophoretic cage realized by
Literatur
[1] AEPT Final Report, ed. by NCMS, Ann Arbor MI, 2003
[2] Shift (Smart High-Integration Flex Technologies), http://www.vdivde-it.de/portale/shift/default.html
[3] Rolf Aschenbrenner, Andreas Ostmann, Alexander Neumann, Herbert Reichl; Process Flow and Manufacturing Concept for Embedded
Active Devices, Proceedings EPTC 2004, Singapore, December 8 – 10, 2004
[4] Thomas Löher, Barbara Pahl, M. Huang, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl; An Approach in Microbonding for Ultra
Fine Pitch Applications, Proceedings Technology and Metallurgy, The 7th VLSI Packaging Workshop of Japan, Kyoto, 2004
[5] Strategic Research Agenda 2007; White Paper by ENIAC – European Technology Platform on Nanoelectronics
[6] Herbert Reichl, Rolf Aschenbrenner, Harald Pötter, Stefan Schmitz; More than Moore, Hetero System Integration and Smart System
Integration – Three Approaches – One Goal: Smarter Products and Processes; Productronic 2007, Frankfurt 2007, VDMA-Verlag
[7] http://www.mstonline.de/foerderung/projektliste/detail_html?vb_nr=V3FAS032 (Status 19.12.07)
[8] K.-F. Becker, T. Braun, A. Neumann, A. Ostmann, M. Koch, V. Bader, E. Jung, R. Aschenbrenner, H. Reichl; Duromer MID Technology for
System-in-Package Generation; IEEE Trans. on Electronics Packaging Manufacturing, 2005, Vol. 28, Iss. 4, pp. 291-296
[9] Tanja Braun, Lars Böttcher, Jörg Bauer, D. Manessis, Erik Jung, Andreas Ostmann, Karl-Friedrich Becker, Rolf Aschenbrenner, Herbert
Reichl, R. Guerrieri, R. Gambari; Microtechnology For Realization Of Dielectrophoresis Enhanced Microwells For Biomedical Applications
the structured aluminium. Furthermore,
surface treatments for hydrophobic and
hydrophilic surface modifi cation with
e.g. thiols and fl uorinated acrylates on
different materials were evaluated and
analyzed by surface tension and wetting
analysis to allow designing the microfl uidic
networks required for the microwell
device.
Conclusion
Smart innovative systems used in an
extremely broad range of applications
are the future of electronics. They will
contain electrical and non-electrical
functions. The task of heterogeneous
integration will be integrating such functions
into one system.
For the fabrication of heterogeneous
systems, new architectures and system
integration technologies are necessary,
which have to ensure the realization of
reliable systems at minimal sizes and at
low production costs. Adequate interfaces
for different application environments
have to be created.
Fraunhofer IZM
Prof. Dr.-Ing. Dr. E.h. Herbert Reichl
Gustav-Meyer-Allee 25
D-13355 Berlin
Phone +49(0)30-46403-100
Fax +49(0)30-46403-111
Mail info@izm.fraunhofer.de
Web www.izm.fraunhofer.de

Carl Zeiss Industrial Metrology is the world’s leader in CNC
coordinate measuring machines and complete solutions for
multidimensional metrology in the metrology lab and production.
The company is a recognized partner to the automotive
industry and its suppliers. Approximately 1500 employees at
three manufacturing locations and more than 100 sales and
service centers supply customers around the world.
The offering encompasses bridge-type, horizontal-arm and inline
measuring machines, as well as form, contour and surface
measuring machines. All relevant modules, such as controllers,
software, measuring systems and sensors are developed
and manufactured in-house. New developments include a
system to measure extremely small parts and a computer
tomograph for industrial quality assurance.
The extensive CALYPSO software library enables users of
ZEISS measuring technology to perform almost any measuring
task. The effi cient Navigator technology is of particular
importance for maximum accuracies and simultaneously high
Die Carl Zeiss Industrielle Messtechnik GmbH ist Weltmarktführer
bei CNC-Koordinatenmessmaschinen und Komplettlösungen
der mehrdimensionellen Messtechnik in Messlabor
und Fertigung. Das Unternehmen ist ein anerkannter Partner
der Automobilindustrie und ihrer Zulieferer. Von drei Fertigungsstandorten
und mehr als 100 Vertriebs- und Service-Zentren
aus sind 1.500 Beschäftigte für die Kunden weltweit tätig.
Das Angebot umfasst Portalmessgeräte, Horizontalarmmessgeräte,
Fertigungsmessgeräte, Form- Kontur- und
Oberfl ächen-Messgeräte. Alle systemrelevanten Module wie
Steuerung, Software, Messsysteme und Sensoren werden
selbst entwickelt und hergestellt. Jüngste Entwicklungen sind
Carl Zeiss Industrial Metrology
measuring speeds. The offering is rounded off with extensive
customer services, contract measurements, part inspection
using computer tomography and online services to ensure
optimum machine uptimes.
ein System für das Messen mikrosystemtechnisch gefertigter
Kleinstteile und ein Computer-Tomograf für die industrielle
Qualitätssicherung.
Die umfangreiche Software-Bibliothek CALYPSO gestattet den
Anwendern von ZEISS Messtechnologie, praktisch jede Messaufgabe
zu lösen. Von besonderer Bedeutung ist die effi ziente
Navigator-Technologie für höchste Genauigkeiten bei gleichzeitig
hohen Messgeschwindigkeiten. Umfassende Dienstleistungen,
Lohn- und Auftragsmessungen, Teileprüfung mit Hilfe der
Computer-Tomografi e und Online-Services zur Sicherung der
Maschinenverfügbarkeit, vervollständigen das Angebot.
Production sites
Germany
USA
People’s Republic of China
Carl Zeiss
Industrielle Messtechnik GmbH
Carl Zeiss Group
D – 73446 Oberkochen
Sales +49(0)736420-6336
Service +49(0)736420-6337
Fax +49(0)736420-3870
Mail imt@zeiss.de
Web www.zeiss.com/imt

38
Organization:

The 2 nd German Congress
on Microsystems Technology
2007

The 2 nd German Congress on Microsystem Technologies 2007
Review of the 2 nd German Congress
on Microsystem Technologies
Prof. Dr. Thomas Gessner
Chairman of the congress 2007
Microsystem technology belongs to the
most innovative fi elds worldwide. According
to international trend analysis an
annual growth rate of 11 % is expected
for micro systems technology till 2011.
The design and development of new
microsystems, the integration of recent
developments in nanoscience in new
functionable nanosystems as well as the
integration of the systems themselves in
a so-called macro system, for instance
in a handy, a machine tool, a car or a
medical instrument are main tasks of
micro system technology. New functionalities,
new materials, new principles
require not only interdisciplinary work of
experts but also the development and
integration of different technologies, new
approaches concerning system and
component design as well as reliability
and test. Germany belongs to the leading
countries in micro system technologies
and is especially well-known for the
development of high quality and secure
systems and system solutions.
40
Annette Schavan, the Federal Minister of Research
and Education (left) , VDE-President Prof. Josef
Nossek (right), and Prof. Peter Gruenberg, the new
German Nobel Laureate in physics (in the middle ).
The GMR effect of Prof Gruenberg is used in magnetic
Microsystems.
During a press conference
at the congress the trends
of microsystem technologies
have been presented
by the German Federal
Ministry of Education and
Research (BMBF) and the
Association for Electrical,
Electronic and Information
Technologies (VDE).
Prof. Thomas Gessner,
chairman of the congress
(left), MinDir. Dr. Wolf-
Dieter Lukas, Head of
the Department Key
Technologies – Research
for Innovation of the
BMBF (in the middle),
VDE-President Prof. Josef
Nossek (right)
Currently, nearly 680000 jobs are related
to micro system technology in Germany.
There exist 20 regional clusters for
microsystem technologies in Germany,
two of them (Dresden and Chemnitz)
are located in Saxony, where the 2 nd
congress on microsystem technologies
took place.
To keep this position in the coming
years, the German Federal Ministry
of Education and Research (BMBF)
together with one of the biggest German
technical associations, the Association
for Electrical, Electronic and Information
Technologies (VDE) for second time
hosted this central showcase on MST in
Germany.
The second German congress on
microsystem technologies “Mikrosystemtechnik-Kongress
2007” was
held from October 15 th to October 17 th
2007 in Dresden. The 3 day congress,
consisting of plenary sessions, lectures
and poster sessions, an exhibition and
a young scientist´s forum, was a forum
for research and industry, producers
and users, trainers and trainees, policy
makers and networks. The opening
address was given by Annette Schavan,
the Federal Minister of Research and
Education, VDE-President Prof. Josef
Nossek, the Prime Minister of Saxony
Prof. Georg Milbradt, VW research
director Prof. Juergen Leohold and Prof.
Peter Gruenberg, the German Nobel
Laureate in physics 2007. The importance
of the microsystem technology for
Saxony had been pointed out by Christian
Esser Director Technology Development
of Infi neon Technologies GmbH &

Co KG Dresden and the chairman of the
congress Prof. Thomas Gessner, Director
of the Center for Microtechnologies
of the Chemnitz University of Technology
and Head of the Chemnitz Branch
of Fraunhofer Institute for Reliability and
Microintegration.
The congress and the accompanying
exhibition provided a good insight in the
latest results in research and development.
More than 1000 participants took
part. Within the scientifi c section of the
congress experts from leading enterprises,
from SMEs and research institutions
presented the current status in various
fi elds of microsystem technologies from
the point of systems, applications and
methods. In 29 sessions with more than
120 lectures the variety of application
fi elds of microsystems technology was
clearly illustrated. Especially health and
independent living, but also RFID and
energy technologies, were topics of high
interest for the participants. But also
micro and nano integration, microoptics,
microfl uidics, magnetic microsystems,
new materials, advanced packaging,
test and reliability as well as microsystems
for biotechnology were addressed
during the congress.
Beside of large enterprises like Bosch
and Siemens the development and the
application of microsystems are mainly
pushed by small and medium size enterprises.
The perspectives of formation
of such small high tech companies, the
aspects of national and international networks
and new concepts to ensure the
training of skilled people were discussed
in separate sessions.
The 2 nd German Congress on Microsystem Technologies 2007
The winner of “Invent a Chip” got their
prizes during the opening session of the
Congress. More than 1500 pupils took
part at this competition. The best teams got
the possibility to design their chip during a
workshop at the University Hannover.
Parts of the congress were especially
dedicated to young people. To attract
as many young people as possible the
congress gave students and children
the opportunity to establish fi rst contacts
with industry and research. The
so-called VDE YoungNet Convention
informed about central questions concerning
training and job opportunities
for students and young professionals.
Moreover overviews to special topics of
microsystem technology and occupational
image of an engineer were given.
Within the public part of the congress 20
institutes and companies showed technical
principles and fascinating products
of microsystems technology. They were
First prize got Johannes
Burghard (Siegen, in
the middle), Dr. Annette
Schavan (left), Prof.
Milbradt (right)
Third prize for the
twins Christiane ands
Sabine Kurra (left), Prof.
Milbradt( in the middle),
Prof. Nossek (right)
supported by the BMBF nano truck and
the exhibition “micro worlds”.
The programme, photos and other
information concerning the congress are
available at:
www.mikrosystemtechnik-kongress.de
Chemnitz Branch of Fraunhofer IZM and
Chemnitz University of Technology
Center for Microtechnologies
Prof. Dr. Thomas Gessner
D – 09107 Chemnitz
Phone + 49(0)371-531-33130
Mail Thomas. Gessner@
zfm.tu-chemnitz.de
Web www.izm.fraunhofer.de
41

The 2 nd German Congress on Microsystem Technologies 2007
Microfluidic Platforms for Miniaturization, Integration
and Automation of Biochemical Assays
Dipl. Ing. Stefan Häberle1 , Dr. Jens Ducrée1 , Dr. Felix von Stetten2 1, 2
, Prof. Dr. Roland Zengerle
1 Institut für Mikro- und Informationstechnik der Hahn-Schickard-Gesellschaft (HSG-IMIT), Wilhelm-Schickard-Straße 10, 78052 Villingen-Schwenningen
2 Universität Freiburg, Institut für Mikrosystemtechnik (IMTEK), Lehrstuhl für Anwendungsentwicklung, Georges-Koehler-Allee 106, 79110 Freiburg
Introduction
The impact of microfl uidic technologies
within microelectromechanical systems
(MEMS) has dramatically increased
during the last years. This is quite amazing
since microfl uidics is no product a
consumer wants to buy itself. Microfl uidics
should be merely considered as a
toolbox, which is needed to develop innovative
new products in such different
application areas as the biotechnology,
diagnostics, medical or pharmaceutical
industry.
The component oriented approach
The history of microfl uidics dates back
to the early 1950s when the basis for
today’s ink-jet technology has been developed.
Following these pioneer workings,
thousands of researchers spent a
lot of time to develop new microfl uidic
components for fl uid transport, fl uid metering,
fl uid mixing, valving, or concentra-
42
Example of a
disposable disk for
centrifugal microfl
uidics (Source:
IMTEK, Freiburg)
tion and separation of molecules within
miniaturized quantities of fl uids within the
last two decades. Meanwhile hundreds
of different types of micropumps,
mixers, microvalves etc. have been
published, but almost no standards are
defi ned in terms of interconnections etc.
It seems to be the right time to raise the
question if we really need more of those
components? Due to our opinion for
exploring the huge potential of different
applications in the lab-on-a-chip fi eld, a
component based microfl uidic approach
is much too slow and the R&D effort
as well as the products are much too
expensive. Therefore we want to promote
the use of an “integrated system
approach” or in other words, the use of
integrated microfl uidic platforms.
The microfl uidic platform approach
Very similar to the ASIC industry in microelectronics
which provides validated
The Cardiac® Reader
(Source: Roche, Basel, CH)
and three different test strips
(with permission).
elements and processes to make electronic
circuitries, a dedicated microfl uidic
platform comprises a reduced set of
validated microfl uidic elements. These

Vision of
the BioDisk
player based
on centrifugal
microfl uidics
(Source:
HSG-IMIT,
IMTEK Freiburg)
elements have to be able to perform
the basic fl uidic unit operations required
within a given application area. Such
basic fl uidic unit operations are, for
example, fl uid transport, fl uid metering,
fl uid mixing, valving, and separation or
concentration of molecules or particles.
Those elements have to be amenable to
a well established fabrication technology
and have to be connectible, ideally in a
monolithically integrated way.
Examples
The most prominent examples of microfl
uidic platforms which are established or
under development are:
✦ “capillary test stripes”, based on
capillary forces in paper like materials,
known from diabetes and
pregnancy testing,
✦ “centrifugal microfl uidics” based on
rotating substrates using centrifugal
and capillary forces
✦ “Microfl uidic large scale integration”
based on the use of PDMS technology
and soft lithography
✦ “Droplet based microfl uidics” in a
channel based (multiphase fl uidics)
or surface based confi guration
(electrowetting on dielectrics)
The microfl uidic platforms mentioned
above enable to combine validated
fl uidic unit operations by simple proved
technologies. They allow to design and
fabricate application specifi c systems
easily and will lead to a paradigm shift
from a component based research to a
system oriented approach.
Prof. Dr.-Ing. Roland Zengerle
Laboratory for MEMS Applications
Department of Microsystems Engineering
(IMTEK)
University of Freiburg
Georges-Koehler-Allee 106
D – 79110 Freiburg
Phone +49(0)761-203-7477
Fax +49(0)761-203-7539
Mail zengerle@imtek.de
Web www.imtek.de/anwendungen/
Maximum
performance in the
smallest space
The outer diameter of the smallest
brushless DC micro motor with
micro planetary of FAULHABER
gear measures just 1.9 mm.
In addition to this micro drive
system, the FAULHABER Group
offers the most extensive selection
of miniaturized drive solutions
for the realization of innovative
applications in the area of microtechnology.
Micro-Systems
Starter Kit
See the efficiency
of these highly
developed microdrive
technologies for yourself
with the micro-systems starter kit.
It contains a full drive system,
consisting of optionally either
a FAULHABER, a penny, or a
smoovy ®-motor, as well as the
associated micro-systems control.
DR. FRITZ FAULHABER
GMBH & CO. KG
Tel. +49 7031 638-0
www.faulhaber-group.com/microsystems
43

The 2 nd German Congress on Microsystem Technologies 2007
A Mechanical Microsystem for Restoration of
Spinal Cord Continuity after Paraplegia
Dipl.-Ing. Christian Voss, Prof. Dr. Jörg Müller
Institute for Microsystems Technology, Technical University Hamburg-Harburg
Introduction
In this project, a joining device is produced
consisting of microstructures with
a very large number of parallel pipes with
a diameter of 50-500 μm and a length
of 1-2 mm. With such a device it should
become possible to adapt a cut spinal
cord such that a dedicated growth along
those pipes will allow actual healing.
This component is augmented by a
system of micro channels through which
the healing can be medicinally controlled
and, thereby, scarring and the inhibition
of sprouting can be prevented. These
channels also allow the homogeneous
implantation of the neuro-structures
through application of a small under
pressure.
Medical Basis
Spinal Cord Lesions
Injuries of the central nervous system
generally lead to irreversible damage
and bodily constraints. The reason is
44
The polymer fi lled
silicon die after the
polishing prozess
REM-Image of the
silicon die
that scar tissue forms quickly in the
lesion, which inhibits sprouting of the
severed nerves and, therefore, prevents
a regeneration of their functionality.
Contrary to the peripheral nerve system,
the central nerve system is not stimulated
to restore the synaptic contact
following a Waller degeneration. Nerve
cells of the central nerve system die as
soon as their functionality is ended when
the tissue is cut. Because of degeneration
the axon ends remain some
distance apart.
Medicinal Treatment
Work at the neurological clinic of the
University Hospital Düsseldorf has
shown that a slowing of the scar growth
and, thereby, a functional regeneration
can be achieved using substances suppressing
the collagen synthesis.
One can observe growth of the axons
as well as a large improvement in the
affected motor capabilities.
Design of the Microsystem
Function of the Microsystem
The microsystem intended for treatment
must fulfi ll two functions:
✦ Guiding and bonding the severed
tissue
✦ Delivery and removal of the medicinal
substances
A large number of parallel pipes with a
diameter between 50 and 500 μm allows
a deliberate guidance of the tissue
structures. In order to insert the tissue
into the structures a hollow space is
created in their middle in which a low
pressure can be generated. With pipe
lengths of initially about 250 μm and a
circular diameter of the entire pipe system
of 2 mm a surface of up to 5mm2
is available to bond the sucked in tissue.
Using appropriate surface structures the
bonding can be improved further. In order
to treat the injured tissue, the chamber
must allow supply and removal of

medicinal substances. Those structures
are also used to create the low pressure
in the chamber.
Molding
The decisive step for this project is the
construction of the system chamber
from a bio-compatible polymer. In the
future, the system chamber is intended
to be constructed from a biodegradable
material.
Conventional Molding Method
Hot molding and injection molding are
standard procedures. Forms for these
techniques can be fabricated directly
in silicon or, for instance, with a Bosch
LIGA process in metal. Special requirements
arise because of the high aspect
ratios of the honeycomb structure. In
order to cleanly separate form and mold
all surfaces must have low adhesion
and are, ideally, formed slightly conically.
Otherwise the form would be destroyed
The 2 nd German Congress on Microsystem Technologies 2007
Microscope
picture of the
system made of
PMMA
Microscope
picture of the
honeycomb
structure with
a thickness of
25 micrometers
an a aspect
ratio of 12.
during separation. Adhesive surfaces
of the tall honeycomb structures are,
however, desired for pinning the spinal
cord inside the system. Therefore, easy
molding and the desired functionality are
mutually exclusive.
Destructive Molding
Destructive molding means that the
mold is preserved while the form
is destroyed. With such a process
structures with a structure angle even
or greater than 90° can be cast even
when the material has an unfavorable
thermal expansion coeffi cient, since
the mechanical separation of form and
mold does not apply. This enables an
increase of the surface area through
deliberate structuring. The forms for the
destructive molding are etched in silicon
using a Bosch process. The individual
etching steps are optimized using long
cycles and high power in order to
achieve maximally structured surfaces.
Finally, a selective etching is used which
decomposes the silicon but does not
affect the polymer used. Polymers suitable
considering bio compatibility and
molding are PMMA and polycarbonate.
The form can be dissolved using a 40%
KOH solution at 70°C.
This project is funded under project no.
01EZ0604 by the BMBF.
Technische Universität Hamburg-Harburg
Mikrosystemtechnik (E7)
Prof. Dr. Jörg Müller
Eißendorfer Straße 42
D – 21073 Hamburg
Phone +49(0)40-42878-3229
Fax +49(0)40-42878-2396
Mail j.mueller@tuhh.de
Web www.tu-harburg.de/mst
45

The 2 nd German Congress on Microsystem Technologies 2007
Novel Surface Micromachining Technology for Fabrication
of Capacitive Pressure Sensors Based on Porous Silicon
K. Knese, S. Armbruster, H. Benzel
Robert Bosch GmbH, Engineering-Sensor Technology Center, Reutlingen, Germany
H. Seidel
Lehrstuhl für Mikromechanik, Mikrofl uidik/Mikroaktorik, Universität des Saarlandes, Germany
Introduction
Monocrystalline silicon membranes
for MEMS- (Micro Electro Mechanical
System) applications are commonly fabricated
by anisotropic etching with KOH
[1]. This technology, however, requires
expensive back side and wafer bonding
processes. On the other hand, the fabrication
of silicon membranes by epitaxial
growth on sintered porous silicon offers
some crucial benefi ts, such as compatibility
with CMOS fabrication and self
sealing of the vacuum cavity. This APSM
(Advanced Porous Silicon Membrane)
technology is applicable to piezoresistive
as well as to capacitive and thermal
sensors.
46
APSM-Process
The core of the process is the so-called
anodization, during which the silicon
substrate is locally porosifi ed by electrochemical
etching in concentrated
hydro-fl uoric acid (HF). The process fl ow
is shown in Fig. 1.
First, the p-Si-substrate is locally doped
with a deep n+-ring enclosing a n-doped
micro grid. These defi ne the membrane
region (Fig. 1a)). During the subsequent
anodization the p-Si is etched porous
through the grid holes of the n-doped
regions. Thus, a mono-crystalline nmicro
grid is generated, supported by a
matrix of porous silicon (Fig. 1b). Next,
the substrate is exposed to a hydrogen
Fig 1
Schematic process fl ow:
Si-substrate
a) before anodization,
b) after anodization,
c) after hydrogen prebake,
d) after epitaxy
atmosphere in an epitaxial reactor. At a
temperature between 900° and 1100°C
the porous silicon starts to rearrange,
leaving an empty cavity (Fig. 1c). Subsequently,
a monocrystalline Si-layer is
deposited epitaxially, using the n-micro
grid as a seed layer. In the course of the
deposition the grid holes are sealed by
lateral overgrowth (Fig. 1d). The thickness
of the epitaxial layer defi nes the membrane
thickness.
Figure 2a) shows a cross-sectional SEM
micrograph of the cavity region after the
anodization. The p-Si was etched porous
through the grid holes. Due to the local
distribution of the electrical fi eld, the
micro grid is fully underetched, resulting
in a monocrystalline layer. Figure 2b)
shows the membrane and cavity after the
epitaxial growth. The porous silicon was
completely thermally rearranged, creating
a vacuum cavity. Furthermore, the
Si-epitaxy grew perfectly monocrystalline
onto the n-doped micro grid and the grid
holes are completely overgrown.
Recently, the APSM technology was
successfully embedded into a standard
mixed-signal process to fabricate an
integrated piezoresistive pressure sensor
for automotive applications [2].
Capacitive pressure sensor
By separating and, hence, electrically
insulating the membrane from the substrate
the APSM technology is enhanced
by enabling capacitive sensors. The
schematic process fl ow is shown in
fi gure 3.
At fi rst, a dielectric stack is deposited on
top of the monocrystalline membrane,
which subsequently serves as a suspension
for a silicon boss (Fig. 3a). To avoid

uckling the stress and thickness of the
single layers is set in such a way, that the
complete stack is slightly under tensile
stress. At the edge of the membrane
access holes are anisotropically etched
into the dielectric stack by plasma etching
(Fig. 3b). Next, the Si-membrane
is isotropically etched by ClF3 or SF6
Fig 2
Cross-sectional SEMmicrograph
of a cavity
a) after anodization,
b) after epitaxy
The 2 nd German Congress on Microsystem Technologies 2007
through the holes in the dielectric
stack and therefore insulated
against the substrate (Fig. 3c).
Afterwards, electrical contact is
generated to the membrane and
the substrate by depositing a
metallization layer. Also, the etch
holes are sealed by a dielectric
passivation layer (Fig. 3d)). Finally,
the capacitance between the
pressure-sensitive, monocrystalline
membrane block and the substrate
can be measured. Figure 4 shows
a cross-sectional SEM micrograph
of a monocrystalline membrane
after isotropic etching. The
membrane boss has been
fully electrically insulated
against the substrate and
suspended from a dielectric
layer stack.
Summary
By thermal rearrangement of porous
silicon and epitaxial growth
on a micro grid, self-sealing
monocrystalline Si-membranes
covering a vacuum cavity can
be created. This technique was
integrated in a standard mixed-
Fig 3
Schematic process fl ow:
a) deposition of dielectric stack,
b) etching of access holes,
c) isotropic etch of silicon membrane,
d) metallization and passivation
Fig 4
a) Cross-sectional SEM–micrograph
of monocrystalline
membrane after isotropic
etching,
b) close-up of isotropically
etched trench
signal process to fabricate a monolithic
piezoresistive pressure-sensor. Furthermore,
the APSM-technology is enhanced
to enable electrically insulated monocrystalline
membranes for capacitive sensors.
References
[1] H.-J. Kreß, F. Bantien, J. Marek, M. Willmann, Sensors and
Actuators A 25 (1991) 21
[2] S. Armbruster, “Micromachinig of Monocrystalline Silicon
Membranes for Sensor Applications Using Porous Silicon”,
Dissertation, Der Andere Verlag 2005
Robert Bosch GmbH
Engineering – Sensor Technology Center
Automotive Electronics
Kathrin Knese
Tübinger Str. 123
D – 72762 Reutlingen
Phone +49(0)7121-35-6275
Fax +49(0)7121-35-30239
Mail Kathrin.Knese@de.bosch.com
Web www.bosch.de
47

The 2 nd German Congress on Microsystem Technologies 2007
Forensic Investigation Using MEMS-Spectrometers
Dr.-Ing. habil. Thomas Otto, Fraunhofer IZM, Chemnitz
Dipl.-Ing. (FH) Ray Saupe, Fraunhofer IZM, Chemnitz
Dipl.-Wirt.-Ing. Alexander Weiß, TU Chemnitz, Chemnitz
Dipl.-Phys. Volker Stock, COLOUR CONTROL Farbmesstechnik, Chemnitz
Prof. Dr. Dr. h. c. mult. Thomas Geßner, Fraunhofer IZM, Chemnitz
Introduction
Driven by a rising number of industrial
applications as well as by the demand
of shorter analysing times near infrared
(NIR) – spectroscopy has developed
to a helpful and indispensable analysis
method during the last years. Nevertheless
due to the dominating large and
costly FT- and diode array spectrometers
the NIR-market is not tapping its full
potential.
To close this gap miniaturized and economic
spectrometers based on micro
electrical mechanical systems (MEMS)
are suited well. Various fi elds of application
can be seen in food industry, environmental
control, medical diagnostics
and forensic investigations. Especially
forensic determination of drugs, e.g.
heroine and amphetamine is crucial for
crime combat. Forensic activities require
fast, convenient analytical devices for
distinguishing between active and non
active components or to quantify active
compositions.
Functional principle
The spectrome ter is realized in a simple
optical set-up according to conventional
scan ning spectrometers (fi gures 1
Fig 1
48
Fig 2
and 2). The MEMS spectrometer
employs an electrostatically driven micro
mirror that moves in constant resonant
oscillation. It periodically defl ects polychromatic
radiation to a diffraction grating
and monochromatic light to single
element detectors. There is radiation
coupling either directly or by using fi ber
optics, which allows an easy attachment
of substance samples. Detectors can
be thermoelectrically cooled depending
on the application. Lowest noise preamplifi
ers enable high-precise measurements
over a wide dynamic range. Data
NIR-MEMS-spectrometer
wavelength range 660 – 1730 nm / 910 – 2100 nm
spectral resolution 9 – 13 nm
measuring time (@ single measurement) 4 ms
SNR (@ single measurement) 7000:1 / 1000:1
wavelength accuracy

ecorded. Furthermore the amplitude
deviation (ΔT) is better than 0,1%.
Permanent observation of the mirror
angle by a position sensor increases the
reproducibility thereby.
Data Treatment/Chemometrie
Data treatment was accomplished both
by principal component analysis (PCA)
for qualitative analysis and partial least
square calibration (PLS) for quantitative
determination. Principle Component
Analysis (PCA) is a linear dimensionality
Fig 3
Fig 4
Fig 5
The 2 nd German Congress on Microsystem Technologies 2007
reduction technique, which identifi es orthogonal
directions of maximum variance
in the original data, and projects the
data into a lower-dimensionality space,
formed of a sub-set of the highestvariance
components. Similar spectra
create a cluster, different spectra will be
defi ned by the PCA. Using PLS relations
between component quantities are
described. The PLS calibration is based
on main components of the argument X
and the dependant variables Y.
For matrix X and Y the principle components
are separately computed and the
regression model between the scores of
the principle components is provided.
Measurements and results
Forensic determinations of intoxicants
are important regarding a quick identifi
cation of the appropriate substances.
In collaboration with the Saxony state
offi ce of Criminal Investigation 123 single
substances (heroine, 60; methampethamine,
63) have been provided for a
spectroscopic investigation (fi gures 3
and 4). Sample presentation has been
done in diffuse refl ection. Active components
were clustered against 9 household
articles for checking conformity via
PCA. Calculations were performed by
OPUS/Quant2 (Bruker Optik GmbH,
Ettlingen). As can be seen in fi gure 5
online distinctions of active components
are in connection with quantitative
analysis (fi gures 6-8) undemanding. PLS
calibrations for diacetylmorphine, monoacetylmorphine
with composition of narcotine,
paracetamole, paverine, caffeine
and acetylcodeine were performed.
RMSECV for DAM amounts 1.18%, for
MAM 2.22% respectively.
Fig 6
Fig 7
Fig 8
Summary / Perspectives
Functional principal of a novel MEMS
spectrometer and characteristic parameter
were presented. Flexible set-up,
portability, cost effi ciency and short scan
time are features which offer advantages
in comparison with conventional
spectrometers. The overall measurement
results (e.g. in forensic) show the
applicability of the MOEMS spectrometer.
Thus the small sized and competitive
NIR device could assist economic
effi ciency in many application fi elds.
Fraunhofer IZM, Institutsteil Chemnitz
Dr.-Ing. habil. Thomas Otto
Reichenhainer Str. 88
D – 09126 Chemnitz
Phone +49(0)371-5397-1928
Fax +49(0)371-5397-1310
Mail thomas.otto@
che.izm.fraunhofer.de
Web http://www.izm.fraunhofer.de
49

The 2 nd German Congress on Microsystem Technologies 2007
Use of the Tunnelmagnetoresistive Effect
for Sensor Applications
Anna Gerken and Johannes Paul, Sensitec GmbH
Abstract
Magnetoresistive (MR) sensors are well
suited for measuring a magnetic fi eld
as their electrical resistance depends
upon the strength and the direction of
an external magnetic fi eld. The sensor
dimension as well as the absolute
value of the MR-signal differ signifi cantly
between the different MR-sensor types.
Tunnelling magnetoresistive (TMR) sensors,
with their huge MR-signal, can
lead to innovative products, e.g. arrays
of pixelsensors for magnetic imaging
techniques.
TMR-Effect
Electrons may pass through an insulating
layer if this fi lm is very thin (< 5 nm);
this is called quantum tunnelling. If
such an insulating layer is sandwiched
between two ferromagnetic layers, the
tunnelling magnetoresistive effect can be
observed: The resistance depends upon
the relative orientation of the magnetization
direction of the electrodes.
In general the resistance is low for parallel
orientation and high in the antiparallel
state.
A magnetic tunnelling junction (MTJ)
consists of an insulating barrier, typically
made of Al 2O 3 or MgO, which is
sandwiched between two ferromagnetic
electrodes i.e. made of CoFe or CoFeB.
For sensor applications it is desirable to
pin the magnetization of one electrode at
a fi xed direction (reference layer).
The magnetization of the second electrode
is able to follow the external fi eld
freely. Therefore the second electrode
is called detecting layer. Such a design
results in resistance changes when an
external fi eld is applied because the
50
relative orientation between the magnetizations
of the two electrodes changes
with the magnetic fi eld. Magnetic pinning
is obtained by an antiferromagnetic fi lm
like IrMn or PtMn; the TMR stack is completed
by seed and cap layers. Figure 1
displays a typical layer stack for an MTJ.
The decisive advantage of TMR com-
Fig 1
Schematic view of a typical MTJ. The current passes
through the stack perpendicular to the layer plaanes.
Here F stands for ferromagnetic, AF for antiferromagnetic
layer. The arrows indicate the direction of the
magnetization. The reference layer is stable whereas
the magnetization of the detecting layer changes with
an external fi eld.
pared to standard MR sensors like AMR
and GMR is the huge resistance change
(ΔR/R) which can reach several hundred
percent at room temperature. Furthermore,
the size of the elements and
characteristics like temperature stability
are favourable (see table 1).
Production challenges
Although the TMR effect has been known
since the 1970s, it was not possible
to reproducibly prepare good samples
until the early 1990s. Since then TMR
has been an active fi eld of research
and during the last couple of years a lot
of progress has been made [Ref]. The
greatest challenge during the production
process of an MTJ is the fabrication of
the tunnelling barrier. Every tiny defect in
this nanometer-thin layer creates a pinhole,
a local short-circuit in the barrier.
In addition the deposition and oxidation
process for the barrier holds the risk of
oxidizing the underlying electrode. This
would signifi cantly reduce the TMR effect.
The best results so far are achieved
with single-crystalline MgO-barriers in
(100) orientation. To obtain such an
ordered MgO-barrier, the neighbouring
electrodes, the seed layer and the annealing
process are of great importance.
Results
Our examined MTJs had the following
layer sequence: Seed / PtMn (20) /
CoFe (4) / MgO (2.5) / CoFe (2) / NiFe
(5) / Ta (10) (all thicknesses in nm).
The fi lms were deposited by magnetron
sputtering, only the seed layer was
deposited by ion beam deposition. The
MgO barrier was sputtered in a twostep-process:
At fi rst a metallic Mg-fi lm
was deposited, secondly an MgO layer
was sputtered reactively in an argon
oxygen atmosphere. During the reactive
sputtering process the metallic Mg-fi lm
protects the underlying CoFe electrode
from being oxidized.
With this TMR layer stack circular magnetic
tunnelling junctions with diameters
between 16 and 150 μm were fabricated
in a manufacturing line suited for the
production of AMR and GMR sensors at
Sensitec in Mainz/Germany.
The measurement of the characteristic
curve allows the study of the electric

properties of a tunnelling junction.
If electron tunnelling is the dominant
contribution to the current of the device
the IU curve is non linear (see fi gure 2).
A numerical model (Brinkman fi t) allows
to derive the barrier thickness from the
characteristic curve. In our systems we
calculated a barrier thickness of 3 nm
which is 0,5 nm more compared to
Table 1
Comparison of
properties between
giant magnetoresistance
(GMR),
anisotropic magnetoresistance
(AMR)
and tunnelling
magnetoresistance
(TMR)
The 2 nd German Congress on Microsystem Technologies 2007
Fig 2
Characteristic
curve for a
tunnelling
junction
Fig 3
Resistance as
function of the
applied magnetic
fi eld. At around
zero fi eld the
magnetization
of the softmagnetic
detecting
layer switches,
which in turn leads
to the jump in the
resistance of the
MTJ.
the deposited thickness of MgO. This
indicates slight overoxidation.
The magnitude of the TMR effect is
deduced from the measurement of the
resistance as a function of the applied
magnetic fi eld. A typical MR curve is
shown in fi gure 3. Around zero magnetic
fi eld the function shows a large jump of
12.4 % in the resistance. Here the mag-
GMR Spinvalve AMR TMR
MR effect (RT) Up to 14 % 3 % Up to 800 %
resistance low low high
Annealing
temperature
265 °C 265 °C 300 – 380 °C
geometry meander meander dot
Volume
production
yes yes To be implemented
netization of the detecting layer switches
its orientation by following the orientation
of the external fi eld. This leads to
the switch from parallel to antiparallel
orientation of the magnetizations of
the electrodes. The antiparallel state is
stable up to -500 Oe.
Yield
Pinholes in the barrier will result in an
ohmic conductance and the IU curve
will be linear. Therefore the nonlinearity of
the characteristic curve can be regarded
as a criterion for a “good” element. For
circular MTJs with a diameter of 60 μm
or less highly promising yields of 90 %
or more are obtained. This is a strong
argument, that TMR based sensors will
be developed for future sensor products
and produced in industrial scale.
Outlook
TMR elements offer new properties
which pave the way for new applications,
especially when high MR effects
are required. Additionally TMR sensors
are expected to be more temperature
stable than other MR sensors.
Ref: Jian-Gang Zhu, Chando Parker, materials today, vol. 9 no. 11 p.
36-45 (2006)
Sensitec GmbH
Dr. Johannes Paul
Technology Development
Hechtsheimerstraße 2
D – 55131 Mainz
Mail johannes.paul@naomi-mainz.de
Web www.sensitec.com
51

The 2 nd German Congress on Microsystem Technologies 2007
Nutriwear – Nutrition Management Using Smart Textiles
Katrin Müller, Motorola GmbH
Introduction and Motivation
Nutrition and hydration have a major
infl uence on the physical and mental
health of a person. The natural aging
process, sport activities and/or ill health,
often lead to a changing body composition
or dehydration with partly severe
consequences. Especially elderly people
risk of suffering from dehydration and
protein-energy-defi cits. But also tumor
patients, especially after chemotherapy,
or people with eating disorder are affected.
This reduces their quality of life,
lengthens hospital stays and drastically
increases the mortality rate. To avoid
such serious effects and to improve the
quality of life for everyone concerned,
it is important to control the nutritional
status and water balance of the body
continuously.
Over the last 10 years bio-impedance
spectroscopy (BIS) has become a widely
accepted method for the determination
of body composition due to its simplicity,
speed and non-invasive nature.
This method is used in several fi elds of
application such as dietary and nutrition
therapies, sport medicine, training diagnostic
and control as well as anti-aging
medicine and consultancy. However, the
accuracy of results is sensitive to certain
measurement conditions and reference
data are only available for healthy
persons. There is only limited experience
with elderly as well as with effects from
different factors such as medication,
illness or even implants. Today, bio-impedance
spectroscopy devices are too
large and heavy to be used as portable
system for long term monitoring. Currently
no system is known, capable
of interpreting BIS signals as well as
52
communicating and providing feedback
and personalised recommendations
independent of location and consultancy
of a medical professional. The Nutriwear
project will develop a mobile monitoring
system using smart textiles to manage
the nutrition and water conditions of the
human body. The monitoring system
exploits the bio-impedance-spectroscopy
integrated into body near clothes
to determine the percentage of water,
muscle and fat. The advantages offered
by textiles facilitate its integration into
working-routines and day-to-day life.
Requirements and functions
of Nutriwear system
The analysis of user groups and application
fi elds based on questionnaires,
interviews and use case descriptions
has been used as a starting point for the
system development. The user groups
have been divided into (a) prevention
focusing on athletes and elderly and (b)
therapy focusing on patients suffering
from cachexia. Both user groups re-
quire an easy-to-use handling and
usability, a clear and useful interpretation
of the existing body composition
distinguishing fat, muscle and water
portion, and a trend analysis. Especially
for the textile based system the bio
compatibility and pleasant skin contact
of the electrodes shall be ensured for
long time application. Besides continuous
monitoring a one-spot-measurement
on demand is desired. However,
there are differences between the users.
The elderly prefer clothes which are not
skin tight. They do not control their body
composition or even their body weight.
However, care givers and relatives
highlighted the importance of an easy
control of hydration. Fixed daily routines
provide good measurement conditions.
Athletes are quite open to use and
integrate monitoring systems into their
clothes or sports equipment. Portable
devices are already used to monitor the
training performance. To know more
about the related change and infl uence
of body composition is desired. The use
Fig 1
Nutriwear
System

of synthetic fi bres in sport clothes results
in additional challenges regarding static
electricity charge and interferences.
The key elements of a mobile system for
continuous monitoring of body composition
for prevention and therapy assessment
are (Figure 1):
1. Textile electrodes for bio-impedance
spectroscopy and
2. Electrical conductors in highly elastic
textiles with high wearing comfort
3. Reversible interface between textile
and microelectronic and massproduced
clothing with integrated
electrical conductors
4. Measurement electronic for signal
capturing, processing and wireless
transmission
5. Control of measurement, data analysis,
communication and feedback
on mobile device and/or by service
provider
The system will conduct a tetra polar
bio-impedance spectroscopy (BIS) using
a sinusoidal alternating current in a
frequency range from 10 kHz to 1MHz.
Limits will be maintained according EN
60601-1 and a measurement accuracy
of 1%. Acceleration sensors will help to
The 2 nd German Congress on Microsystem Technologies 2007
Fig 2
Knitting Process of
Conductive Yarns
detect and fi lter the motion artefacts.
The data transmission will be based on
serial Bluetooth profi le.
Textile electrodes
The two major material parameters of
textile yarns for electrodes are (a) the
conductivity and (b) the process capability
in the textile mass production. Textile
electrodes with different material composition
have been produced and tested.
Conductivity has been compared to
commercial BIS electrodes under different
conditions determining the infl uence
of temperature, humidity and pressure.
Humidity plays the most important role
for increasing the conductivity and
lowering the skin/electrode resistance.
However, higher temperature and pressure
result in higher skin moisture and
therefore contribute indirectly.
A higher contact pressure to the skin
and a limitation of humidity transportation
in the clothing is rather contradictory
to the comfort requirement. Therefore a
knitting process is preferred to produce
a highly bidirectional elastic fabric.
Experiences from processing have been
summarized in Figure 2.
Outlook
The next steps focus on the structuring
of the fabric to solve the contradictory
challenges and the integration into the
textile mass production. Besides the
manufacturing of textile electrodes and
conductors, the reversible interface
between textile and microelectronic as
well as effective data analysis algorithm
and suitable reference data will be
developed.
The project Nutriwear is conducted in
close collaboration between Motorola
GmbH, RWTH Aachen, Philips Technologie
GmbH, Elastic GmbH and suprima
GmbH. The work is supported by German
Federal Ministry of Education and
Research under contract #16SV3478.
Project partners:
✦ Motorola GmbH, Taunusstein
✦ Philips GmbH, Aachen
✦ RWTH Aachen, Aachen
✦ Elastic GmbH, Neukirchen
✦ suprima GmbH, Bad Berneck im
Fichtelgebirge
Motorola GmbH
Physical and Digital Realization
Research Center – Europe
Dr. Katrin Müller
Heinrich-Hertz-Str. 1
D – 65232 Taunusstein
Phone +49(0)6128-70-2284
Fax +49(0)6128-70-4407
Mail katrin.mueller@motorola.com
Web www.motorola.de
53

The 2 nd German Congress on Microsystem Technologies 2007
Technology Development for 1 Megapixel-Micromirror Arrays
with High Optical Fill Factor and Stable Analogue Deflection
Jan-Uwe Schmidt, Martin Friedrichs, Thor Bakke, Benjamin Voelker, Dirk Rudloff, Hubert Lakner
Fraunhofer Institute for Photonic Microsystems, Dresden
Introduction
The fabrication of lithographic masks for
semiconductor technology is costly and
time consuming. Recently through the
Swedish company Micronic Laser Systems,
a laser-mask writer using a micromechanical
system for pattern generation
has become commercially available
as a more fl exible, more productive
alternative to conventional mask writers.
The tool employs a spatial light modulator
(SLM), i.e. a programmable array of
micromechanical tilt-mirrors. These arrays
are being developed and fabricated
at Fraunhofer IPMS Dresden according
to ISO9001:2000 standards. Three
essential features of the SLM are the
addressing scheme permitting an analogue
defl ection of the 2048 x 512 pixels
with a dimension of 16 μm x16 μm, the
integration of the array on top of a high
54
voltage CMOS ASIC, which enables to
rewrite the complete chip at a frame rate
of 2 kHz, and the capability to operate in
the DUV (248 nm). Figure 1 shows the
working principle of the SLM-based pattern
generator for mask writing.
Apart from the requirement of pixel planarity,
a stable defl ection-voltage relation
is essential to ensure a reliable function
of the SLM. This is why mechanical
creep in the torsional-hinges is one of
the key issues for SLM with analogue
defl ection. Pure aluminium is a rather
soft and creep-prone MEMS material.
Even moderate temperature and strain
levels trigger a movement of dislocations
resulting in a strain reduction. As
a consequence the defl ection-voltage
characteristics of pure Al-actuators are
likely to be instable. Therefore for the
current SLM generation an Al-alloy with
a refi ned grain structure, an improved
creep resistance is used as actuator
material, accepting a slightly lower
refl ectivity than for pure Al. In case of the
mask writing application, the use of this
Al-alloy, the low strain levels resulting
from small mirror defl ection amplitudes
(< 70 nm), and the intermittent operation
at low duty cycle jointly ensure a stable
operation of the array.
However, other potential applications,
e.g. adaptive optics require both higher
actuator defl ection amplitudes, and a
continuously defl ected actuator, which
leads to a risk of defl ection instabilities
due to material creep even for Al-alloy
actuators. Therefore, currently new
actuator technologies are being investigated.
Fig 1
Optical setup of the SLM-based mask writer.
A pulsed 248 nm laser is illuminates the SLM
chip via a beam splitter. The surface of the SLM
is imaged with a 200x reduction onto the mask
blank with a NA of 0.87. The specularly refl ected
light is fi ltered and exposes the photoresist on the
mask blank. The micro-mirrors act as a diffraction
grating with adjustable blaze angle.
Each pixel can be inclined in 64 levels. Thereby
intensity is redistributed to higher diffraction
orders, blocked by the aperture in the Fourier
plane. This way the exposure dose can be
gradually controlled, which enables gray-scale
edge control of exposed features.
The stage with the mask blank moves continuously
and the interferometer commands the laser
to fl ash when it reaches the position for the next
fi eld.
Because of the short fl ash time, around 20 ns,
the movement of the stage is frozen and a sharp
image of the SLM is produced in the resist.
The complete pattern is stitched together from
the sequentially exposed fi elds. Insets show
images of the current SLM chip and a Chrome
mask patterned with 150 nm lines/spaces.

The 2 nd German Congress on Microsystem Technologies 2007
Fig 2
The fabrication of 1-level SLM, i.e. a device made using only a
single structural layer for mirrors and hinges is illustrated in Fig. 2:
On top of a planarized passivation layer on the CMOS substrate,
electrodes are deposited, patterned, passivated and planarized by
CMP (1). Then the actuator is fabricated: A polyimide sacrifi cial
layer (SL) is spun on, and via holes for the later mirror supports
are patterned (2). The structural layer for mirror and springs is
deposited on top of the SL and into the vias and patterned by
reactive ion etching (3). After deposition of a protective resist, the
chips are diced and separated (4). The protective resist and the
dicing debris are removed by a jet of liquid solvent. Finally the SL
is removed in a CF4/O2-plasma (5).
Experimental
The current technology of 1-level actuators,
fabricated from a single Al-alloy structural layer,
is illustrated in Figure 2. One alternative approach
is, to use two separate structural layers for spring
elements and mirror plates. This allows, to shape
spring elements out of a creep resistant but not
necessarily refl ective thin fi lm material. To hide
the springs under the mirror plate simultaneously
improves the optical fi ll factor. For details on the
fabrication of the 2-level actuator see [1]. For
2-level actuators, the mirror plates can be much
thicker than the springs, which increases bending
stiffness and improves pixel planarity. As a spring
material, TiAl thin fi lms have been used. The
material has been selected due to a favourable
combination of structural, mechanical and chemical
properties, for details see [2].
Figure 3 shows a SEM image of released pixels
with 750 nm Al-alloy mirror plates and 200 nm TiAl
hinges. To enable inspection of otherwise hidden
structures (springs, driving electrodes and oxide
stoppers) the mirrors were locally removed.
Fig 3
SEM image of SLM chip with two-level-actuators fabricated in
thin fi lm technology using two different structural layers for hinges
and mirror plates respectively. Locally the mirror plates (M) have
been removed for inspection of hinges (H), address electrodes
(AE) used to individually defl ect the mirror pixels and counterelectrodes
(CE) used to adjust the zero-position of the defl ection
voltage relation.
55

The 2 nd German Congress on Microsystem Technologies 2007
Another approach is to prepare 1-level
actuators using mono-crystalline silicon
as structural material. Hereby a thin
silicon membrane is transferred to a
CMOS substrate by low-temperature
wafer bonding. Figure 4 shows a SLM
chip with 290nm thick mono-crystalline
Si actuators fabricated via low-temperature
wafer bonding. A detailed description
of the used technology can be
found in [2,3].
Results
The characterization of pixel planarity
and stability of the defl ection-voltage
relation, an optical interferometer was
used.
2-level mirrors with TiAl hinge and Al-alloy
mirror plate: Due to residual topology
after CMP of the second sacrifi cial layer,
a faint (2 nm high) print-through of the
underlying torsion spring has been found
in the mirror plate. Still the RMS pixelplanarity
of the array is 2 nm. To evaluate
the drift stability of the torsion springs,
the mirrors were defl ected to about
80 nm at fi xed voltage for 30 min. The
56
Fig 4
SEM image of SLM chip with
one-level-actuators fabricated
using a mono-crystalline
silicon structural layer. The Si
structural layer was transferred
to the CMOS wafer by lowtemperature
wafer bonding.
defl ection was monitored over time by
sequential interferometric measurements
taken at a time interval of about 3 s. The
drift rate is very low (

Associations
and Networks
Verbände
und Netzwerke

Associations and Networks
German Electrical and Electronic
Manufacturers´ Association (ZVEI)
Micro electric mechanical systems
(MEMS) are intelligent miniature products
combining materials, components and
functions. They are used for processing
data and are also connected to their
natural environments through sensors
and actuators.
Germany holds a leading position on
the MEMS world market. Control and
automation requirements of industrial
and automotive customers are steadily
increasing and the intensifi ed use of
MEMS in medical technology will further
foster this development. MEMS are
prime movers for the competitiveness of
the German industry and stand for the
Source/Quelle: Binder Elektronik GmbH
58
Source/Quelle:
microFAB
Bremen GmbH
creation and safety of future-oriented
work in Germany.
This positive outlook is confi rmed by
the MEMS producers organised in
the German Electrical and Electronic
Manufacturers‘ Association ZVEI. These
range from leading automotive suppliers
and semiconductor manufacturers
to industrial MEMS makers and nichemarket
SMEs (small and medium-sized
companies).
The group activities of the ZVEI membership
focuses on the joint development
of basic technologies and tools, acting
as key drivers for innovation. Their efforts
are dedicated at adding to the strengths
of German MEMS and promoting a
sustainable growth of the yet young
technology in a pre-competitive environment
through cooperation.
The ZVEI Electronic Components and
Systems Association hosts an own
industry group for MEMS technology
as an ideal platform for the representatives
of the branch to share experience
and be kept up to date with the latest
developments. Furthermore, the group
prepares political position papers that
are communicated to the relevant decision-makers
in a most targeted way. The
effi ciency of the ZVEI in this respect is
indeed a valuable asset. The partner organisations
AMA Association for Sensor
Technology and IVAM Microtechnology
Network further strengthens the cooperation
of all companies related to MEMS.
Furthermore, this makes it possible to
transport nationally generated content in
a larger, international context through the
pro-active input of our membership on
the European level.
The many victories of committed association
activities that have been won
for and together the member companies
show how attractive the input of the association
is for the industry.
Source/Quelle: Sensitec GmbH

Source/Quelle: microFAB Bremen GmbH
Die Mikrosystemtechnik verknüpft Materialien,
Komponenten und Funktionen
zu intelligenten miniaturisierten Gesamtsystemen.
Diese dienen der Informationsverarbeitung
und sind zudem über
Sensoren und Aktoren mit der natürlichen
Umgebung verbunden.
Deutschland hat im Bereich der Mikrosysteme
eine führende Position auf dem
Weltmarkt. Der zunehmende Regelungs-
und Automatisierungsbedarf der Industrie-
und der Automobiltechnik sowie der
vermehrte Einsatz von Mikrosystemen in
Source/Quelle: Robert Bosch GmbH
Associations and Networks
ZVEI – Zentralverband Elektrotechnikund
Elektronikindustrie e.V.
der Medizintechnik wird diese Stellung
weiter fördern. Die Mikrosystemtechnik
leistet somit einen wichtigen Beitrag zur
Wettbewerbsfähigkeit der deutschen
Industrie und ermöglicht die Schaffung
und Sicherung zukunftsorientierter Arbeitsplätze
in Deutschland.
Dieses positive Bild bestätigen die im
Zentralverband der Elektrotechnik- und
Elektronikindustrie e.V. (ZVEI) organisierten
Mikrosystemtechnikunternehmen.
Hierzu gehören neben großen Kfz-Zulieferern
und Halbleiterunternehmen
auch industrielle Mikrosystemtechnik-
Anbieter bis hin zu hoch spezialisierten
Klein- und Mittelstandsunternehmen
(KMU).
Im Vordergrund des Verbandsengagements
unserer Mitgliedsfi rmen steht
das Ziel, die Basistechnologien und
Werkzeuge gemeinsam weiterzuentwickeln
sowie Innovation und Entwicklung
zu unterstützen. Ziel ist es, eine weitere
Stärkung der Mikrosystemtechnik
in Deutschland und das langfristige
Wachstum dieser noch jungen Technik
im vorwettbewerblichen Umfeld partnerschaftlich
weiter zu fördern.
Der ZVEI bietet hierzu mit der Fachgruppe
Mikrosystemtechnik im Fachverband
Electronic Components and Systems
eine geeignete Plattform, die den
Vertretern der Branche einen intensiven
Erfahrungsaustausch sowohl auf
fachlicher Ebene als auch zu aktuellen
Themen ermöglicht. Darüber hinaus
werden Positionspapiere erarbeitet, die
gezielt und wirkungsvoll bei politischen
Entscheidungsträgern platziert werden.
Hierbei konnte sich die Effi zienz des
ZVEI als Vertreter der Branche bewäh-
ren. Durch die Partner „AMA Fachverband
für Sensorik e.V.“ und „IVAM e.V.
Fachverband für Mikrotechnik“ wird die
Zusammenarbeit aller in Deutschland an
der Mikrosystemtechnik interessierten
Unternehmen weiter gestärkt.
Darüber hinaus können national erarbeitete
Verbandsthemen auch im internationalen
Kontext durch die Aktivität der
Mitgliedsfi rmen auf europäischer Ebene
dargestellt werden.
Die vielen Erfolge engagierter Verbandsarbeit,
welche zusammen mit und für die
Mitgliedsunternehmen erzielt wurden,
zeigen die Attraktivität der Verbandsaktivität
für die Industrie.
ZVEI – Zentralverband Elektrotechnik-
und Elektronikindustrie e.V.
Fachverband Electronic Components and
Systems
Christoph Stoppok, Geschäftsführer
Lyoner Straße 9
D – 60528 Frankfurt am Main
Phone +49(0)69-6302-276
Fax +49(0)69-6302-407
Mail zvei-be@zvei.org
Web www.zvei.org
59

Associations and Networks
Sensorics – Technology Driver
for Applied Microsystem Technology
Industrial automation reinforced the
demand for electronic measuring
systems because automation depends
on reliable measuring values. The want
list of measuring parameters quickly
increased: to improve industrial processes,
for safety reasons, or just for the
sake of convenience – and technological
development took care of the rest.
Sensor technology turned out to be a
key industry with a steep economic and
technological advance.
In Central Europe, practically
every application
is suited for automation
thanks to the available
potential. That is why
the systems developed
here, are characterized
by an exceptionally wide
physical, technological,
and application-specifi c
diversity.
Electromechanical
measuring systems
were almost completely
superseded by electronic
systems based on a variety
of physical principles,
60
True Color
Sensor „MTC-
SiCS“ from the
JENCOLOR
product family
Source/Quelle:
MAZeT
True Color
Sensor „MTC-
SiCS“ der
JENCOLOR-
Produktfamilie
depending on the application. Thus, on
today’s market you can fi nd electronic
pressure measurement systems, for
instance, based on piezoelectric, capacitive,
resistive, inductive, optical, and
other methods. What all these methods
have in common, however, is their utilization
of microtechnology.
Any modern measuring system is
a result of applied microsystem
technology. This is why sensorics
with its diversity and dynamics has
become such an important technology
driver – and its market position
makes it one of the major applications
for microsystem technology.
The steep development in sensor and
microsystem technology was tied in with
a boom in business start-ups. Many
sensor enterprises were founded within
the last 30 years and companies with
mechanical measuring systems successfully
diversifi ed into electronics.
Today, Central European suppliers of
sensor elements, “binary” sensor technology,
and “measuring sensorics”, have
evolved into guarantors of a over 30%
world market share and have attested
the importance of Central European
microsystem technology.
The AMA Association for Sensor Technology,
founded in 1980 and boasting
440 members, refl ects the value chain
in this industry. The AMA trade fair,
SENSOR+TEST, is by far the biggest
meeting point for sensor technology
solutions. The structure of the measuring
industry is still comprised of SMEs
with their specialized knowledge of
measuring principles, microtechnology,
and application diversity – all prerequisites
for an outstanding position on the
global market. The AMA Association,
the industry’s representative, and the
SENSOR+TEST (www.sensor-test.com)
are perhaps the most signifi cant markers
for applied microsystem technology.
Power supply
of energy self-suffi
cient microsystems
using thermoelectric
devices
Stromversorgung von
energie-autarken Mikrosystemen
mit Hilfe
thermoelektrischer
Bauteile
Souce/Quelle:
Fraunhofer IPM

Die industrielle Automatisierung bestärkte
die Forderung nach elektronischen
Messsystemen, denn ohne zuverlässige
Messwerte kann man nicht automatisieren.
Immer mehr Messparameter kamen
auf die Wunschliste der Automatisierer:
zur Verbesserung des industriellen Prozesses
selbst, aus Sicherheitsgründen
oder zur Komfortverbesserung – und die
Technologieentwicklung tat ein Übriges.
Mit der Sensorik entstand eine Schlüsselbranche,
die eine anhaltend rasante
wirtschaftliche und technologische
Entwicklung nahm. Da in Mitteleuropa
nahezu jede Anwendung für die
Automatisierung, d.h. ausreichendes
Potenzial, vorhanden ist, zeichnen sich
mitteleuropäische Messsysteme durch
besonders hohe physikalische, technologische
und anwendungsspezifi sche
Vielfalt aus.
Die anfangs elektromechanischen Messsysteme
wurden nahezu vollständig
durch elektronische Systeme abgelöst,
bei denen – je nach Anwendung – un-
Prototype of a paramagnetic
gas sensor chip
– winner of the SENSOR
Innovation Award 2007
of AMA Fachverband für
Sensorik e.V., Source:
ABB AG
„Paramagnetischer
Gassensor – ausgezeichnet
mit den SENSOR
Innovationspreis 2007
des AMA Fachverbandes
für Sensorik e.V.“, Quelle:
„ABB AG Forschungszentrum
Deutschland“
Associations and Networks
Sensorik – Technologietreiber
für angewandte Mikrosystemtechnik
terschiedliche physikalische Wirkprinzipien
eingesetzt werden. So gibt es
heute z.B. für die elektronische Druckmessung
piezoelektrische, kapazitive,
induktive, strahlen- und faseroptische,
mehrere resistive Methoden am Markt.
All diesen Systemen ist gemeinsam,
dass sie Mikrotechnologien nutzen.
Heute steht jedes moderne Messsystem
für angewandte Mikrosystemtechnik,
so dass die Sensorik
mit ihrer Vielfalt und ihrer hohen
Dynamik als ganz wesentlicher
Technologietreiber und wegen
ihrer Marktbedeutung als eine der
wichtigsten Anwendungen für die
Mikrosystemtechnik gilt.
Mit der steilen Entwicklung der Sensortechnologien,
auch der Mikrosystemtechnik,
ging eine Gründungswelle
einher. Viele Sensorik-Firmen wurden in
den letzten 30 Jahren gegründet, und
Firmen mit mechanischen Messsyste-
men diversifi zierten erfolgreich in Elektronik.
Heute haben sich die mitteleuropäischen
Hersteller von Sensorelementen,
von „binärer Sensorik“ sowie die vor
allem mittelständisch geprägten Firmen
der „messenden Sensorik“ als Garanten
für einen Weltmarktanteil von deutlich
über 30 % und für die große Bedeutung
der mitteleuropäischen Mikrosystemtechnik
entwickelt.
Der 1980 gegründete AMA Fachverband
für Sensorik e.V. ist mit seinen
über 440 Mitgliedern ein Abbild der
Wertschöpfungskette der Sensorik
und ihrer Technologien, und die AMA
Messe SENSOR+TEST ist der mit
Abstand größte Treff der Sensorik und
ihrer vielfältigen Lösungen. Die Struktur
der Messsystem-Branche ist unverändert
mittelständisch mit spezifi schem
Know-how für physikalische Messprinzipien,
Mikrosystemtechnik und Anwendungsvielfalt
– Grundvoraussetzung
für eine herausragende Position am
Weltmarkt auch in Zukunft. Der Branchenvertreter
AMA Fachverband und die
SENSOR+TEST (www.sensor-test.com)
sind bedeutende, wenn nicht gar die
wichtigsten Marker für die angewandte
Mikrosystemtechnik.
AMA Fachverband für Sensorik e.V.
Dr. Dirk Rein
Friedländer Weg 20
D – 37085 Göttingen
Phone +49(0)551-21-695
Fax +49(0)551-25-155
Mail info@ama-sensorik.de
Web www.ama-sensorik.de
61

Associations and Networks
Bridge between High-Tech Suppliers and Users:
IVAM Microtechnology Network
Microsystems technology offers a
tremendous bandwidth of application
opportunities in fi elds such as medical
technology, automotive industry, and
consumer goods. Companies and institutes
meet the challenge to bring such
complex high-tech innovations to market
day by day. They are supported by organizations
like the IVAM Microtechnology
Network.
IVAM consolidates about 300 members
from the fi elds of microtechnology,
nanotechnology and advanced materials.
As a communicative “bridge” IVAM
accelerates the transfer from innovative
ideas into profi table products. Besides
technology marketing, IVAM’s activities
include lobbying and opening up international
markets.
Micromirror
Mikrospiegel.
Souce/Quelle:
Fraunhofer IZM/TU
Chemnitz (Uwe Meinhold).
62
Publications and economic data
As editor of the high-tech magazine
»inno« and the E-mail newsletters Mikro-
Media and NeMa-News, IVAM presents
the latest products from microtechnology,
nanotechnology and the materials’
sector. The IVAM directory contains
profi les and contact details from all the
members, and is used as a data base
by potential customers and partners.
Also in the IVAM directory online at www.
ivam.de interested persons can select
by industries and technologies. Anybody
looking for the latest economic data and
trends will fi nd it under www.ivam-research.com.
Here, the market research
division of IVAM provides studies on
micro and nanotechnology.
Trade shows and events
IVAM organizes the Product Market “Micro,
Nano & Materials” at the MicroTechnology/HANNOVER
MESSE, the largest
market place for microsystems technology.
A highlight is the new area “Laser
for micro-material processing”. Suppliers’
products for the medical technology
industry can be found at the IVAM joint
pavilion “High-tech for Medical Devices”
during COMPAMED/MEDICA. Organizing
business workshops in context of
NANO KOREA and Exhibition Micro
Machine/MEMS, IVAM also initiates contacts
to Asia. With the Microtechnology
Summer School (www.mikrotechniksummerschool.de),
IVAM brings together
students with potential employers.

Die Mikrosystemtechnik bietet eine
ungeheure Bandbreite an Anwendungsmöglichkeiten
– von der Medizintechnik
über den Automobilbereich bis hin zu
Konsumgütern. Tagtäglich stellen sich Unternehmen
und Institute der Herausforderung,
ihre komplexen Hightech-Produkte
zu vermarkten. Unterstützung erhalten
sie dabei durch Netzwerke wie den IVAM
Fachverband für Mikrotechnik.
Unter dem Dach von IVAM sind derzeit
rund 300 Mitglieder aus den Bereichen
Mikrotechnik, Nanotechnik und Neue
Materialien organisiert. Als kommunikative
„Brücke“ zwischen Technologieanbietern
und -anwendern beschleunigt IVAM die
Umsetzung innovativer Ideen in marktfähige
Produkte. Neben dem Technologiemarketing
gehören Lobbyarbeit und die
Erschließung internationaler Märkte zu den
wichtigsten Aktivitäten des Verbandes.
Associations and Networks
Brücke zwischen Hightech-Anbietern und -Anwendern:
IVAM Fachverband für Mikrotechnik
Conversation
with a customer
at the COMPA-
MED 2007
Kundengespräch
auf der
COMPAMED
2007.
Source /Quelle:
IVAM.
Publikationen und Wirtschaftsdaten
Als Herausgeber des Hightech-Magazins
»inno« und der E-Mail-Newsletter
MikroMedia und NeMa-News stellt
IVAM neue Produkte aus der Mikro-,
Nano- und Werkstofftechnikbranche vor.
Das IVAM directory enthält Profi le und
Kontaktdaten aller Mitglieder und wird
von potenziellen Kunden und Partnern
als Datenbank genutzt.
Auch im IVAM directory online unter
www.ivam.de können Interessenten
gezielt nach Branchen und Technologien
selektieren. Wer hingegen nach
aktuellen Wirtschaftsdaten und Trends
sucht, wird unter www.ivam-research.
de fündig.
Hier bietet der Marktforschungsbereich
von IVAM Studien zum Thema Mikro-
und Nanotechnik an.
Messen und Events
Im Rahmen der MicroTechnology, des
größten Marktplatzes für Mikrotechnik,
organisiert IVAM während der HANNO-
VER MESSE den Produktmarkt „Mikro,
Nano, Materialien“.
Ein Highlight ist dabei der neue Bereich
„Laser für Mikromaterialbearbeitung“.
Zulieferprodukte für die Medizintechnikbranche
fi nden Fachbesucher auf dem
IVAM-Gemeinschaftsstand „Hightech
for Medical Devices“ im Rahmen der
COMPAMED/MEDICA.
Um die Anbahnung von Kontakten
nach Asien zu erleichtern, organisiert
IVAM außerdem Business-Workshops
im Rahmen der NANO KOREA und
der Exhibition Micromachine/MEMS.
Mit der Summer School Mikrotechnik
(www.mikrotechnik-summerschool.de)
bringt IVAM Studierende mit potenziellen
Arbeitgebern zusammen.
IVAM Fachverband für Mikrotechnik
Emil-Figge-Str. 76
D – 44227 Dortmund
Phone +49(0)231-9472-168
Mail info@ivam.de
Web www.ivam.de
www.neuematerialien.de
www.ivam-research.de
63

Associations and Networks
MTT e.V. –
An Example of Regional Networking in Germany
Microsystems technology in Thuringia
has seen many economic and structural
changes in the last few years. Hand in
hand with those changes went an increased
networking of science, technology,
and industry. A result thereof is the
cluster initiative “Mikrotechnik Thüringen
e.V.” (MTT).
This network of scientifi c institutions and
industrial companies aims to generate
increased momentum for innovations,
in order to enhance the Thuringian
infrastructure, and to focus the competencies
in the market segment of
microsystems technology. Innovative
ideas, creative action and interaction
as well as competence in the area of
microsystems technology are typical for
the 21 cluster members, as is transfer of
scientifi c results and new technologies
into the market.
Many Thuringian institutes have their
roots in micro-electronics. By now, different
materials, components, technologies
and functions are being combined
into a single microsystem
by several members of the
Thuringian network. Because
of their small
size, with their
components
sometimes
as small
as a
few
64
micro meters, microsystems can be
used saving space and weight. Thus
they are ready for fl exible and mobile
use. Several complex value-adding networks
developed, using different basis
technologies.
Microsystems technology, with its broad
spectrum of functionality and applications,
is one of the future-oriented
industries in Thuringia, and is steadily
developed further. As a result, it is a core
technology for many new applications.
The technological basis must be secured
and continually developed further
in order to be able to realize the potential.
At the core, the MTT e.V. wants
to establish a broad representation of
microsystems technology in Thuringia.
In the future, the cluster will focus
increasingly on a national
and international presentation
of
Force sensor element with electronics
Thuringian technology companies. Application-oriented
and customer-oriented
workshops at regular intervals will help
to recruit further partners from industry.
Additionally, recommendations for
the economic and technological
policies of Thuringia are being
developed.
Mikrotechnik Thüringen e.V.
D – 07629 Hermsdorf
Heinrich-Hertz-Straße 8
Fon: +49(0)36601-592-100
Fax: +49(0)36601-592-110

Die Thüringer Mikrosystemtechnikszene
erlebte in den zurückliegenden Jahren
vielfältige wirtschaftliche und strukturelle
Veränderungen sowie Neuerungen. Im
Zuge dessen vollzog sich auch eine kontinuierliche
Vernetzung von Forschung,
Technologie und Wirtschaft.
Ein Ergebnis hiervon ist die Cluster-Initiative
„Mikrotechnik Thüringen e.V.“ (MTT).
Dieser Verbund aus Technologiefi rmen
und wissenschaftlichen Instituten macht
es sich zum Anliegen, weitere Impulse
für Innovationen zu setzen, um die
technologische Infrastruktur Thüringens
auszubauen und eine Bündelung von
Kompetenzen im Marktsegment
der Mikrosystemtechnik voranzutreiben.
Associations and Networks
MTT e.V. –
ein Beispiel der regionalen Vernetzung in Deutschland
Geschäftsstelle Ilmenau
Gustav-Kirchhoff-Straße 5
D – 98693 Ilmenau
Fon: +49(0)3677-2010-241
Fax: +49(0)3677-2010-240
www.mikrotechnik-thueringen.de
Innovative Ideen, kreat ives Agieren und
Interagieren sowie kompetentes Handeln
auf dem Gebiet der Mikrosystemtechnik
sind für die 21 Mitglieder des Clusters
ebenso charakteristisch, wie ein Transfer
von wissenschaftlichen Erkenntnissen
und neuen Technologien.
Entwickelt haben sich viele Thüringer
Institute und Unternehmen aus der
Mikroelektronik. Mittlerweile werden
durch zentrale Akteure des Thüringer
Netzwerkes verschiedene Materialien,
Komponenten, Technologien
und Funktionen in einem Mikrosystem
miteinander verbunden. Aufgrund sehr
kleiner Formate, innerhalb derer einzelne
Komponenten zum Teil nur wenige
Mikrometer klein sind, können Mikrosysteme
Raum- und Gewicht sparend
genutzt werden und sind damit fl exibel
sowie mobil einsetzbar. Auf
diese Weise entstanden
komplexe
Wert-
schöpfungsnetzwerke, die verschiedene
Basistechnologien nutzen.
Aufgrund des vielfältigen Spektrums an
Funktionalitäten und Anwendungen ist
die Mikrosystemtechnik eine Zukunftsbranche
Thüringens, mit Ausstrahlung
auf fast alle Bereiche der Wirtschaft.
Dies hat auch zur Folge, dass sie als
eine Kerntechnologie in zahlreiche neue
Anwendungen gelangen kann und wird.
Um die hiermit verbundenen Chancen
nutzen zu können, ist es notwendig,
technologische Grundlagen zu sichern
und stetig weiter zu entwickeln. Im
inhaltlichen Kern besteht ein Hauptanliegen
des MTT e.V. deshalb darin, eine
breite Interessenvertretung für die Mikrosystemtechnik
in Thüringen zu etablieren.
Zukünftig wird der Verein seine
Aktivitäten ausweiten, indem er sich zum
Beispiel stärker auf die nationale und
internationale Präsentation von Thüringer
Technologie-Unternehmen fokussiert.
Regelmäßig durchzuführende applikative
und kundenbezogene Workshops sollen
dazu beitragen, weitere Partner aus dem
industriellen Umfeld zu gewinnen.
Darüber hinaus werden Empfehlungen
für die Thüringer
Wirtschafts- und
Technologiepolitik
erarbeitet.
65

Associations and Networks
Micro-Hybrid Electronic GmbH
Magnetic fi eld sensors are becoming
ever more important in numerous
technological areas. The CMR effect
(colossal magneto resistance) is a large
change in electric resistance in a magnetic
fi eld, occurring in certain ceramic
materials with a Perowskit structure. In
the new Ilmenau branch of Micro-Hybrid
Electronic GmbH, one such development
projects is ongoing. The local
scientifi c environment offers excellent
conditions for the development of new
Magnetfeldsensoren erlangen in zahlreichen
technischen Bereichen eine
wachsende Bedeutung. Beim CMR-Effekt
(engl. collossal magneto resistance
effect) handelt es sich um eine starke
Änderung des elektrischen Widerstandes
im Magnetfeld, die bei bestimmten
keramischen Materialien mit Perowskit-
Struktur auftritt.
In der neu eröffneten Niederlassung der
Micro-Hybrid Electronic GmbH in Ilmenau
wird zu diesem Thema ein aktuelles
Entwicklungsprojekt bearbeitet. Aufgrund
Modellentwurf
eines kontaktlosen
Drehwinkelgebers mit
magnetoresistiver,
keramischer Schicht
66
sensor elements with a short time to
market. Renowned partners, like, e.g.,
the HITK (Hermsdorfer Institut for Technical
Ceramics e.V.), participate in this
project. Materials based on nano-technology
are being developed and already
available for applications with operating
temperatures of up to 150 °C.
The advantage of the CMR-active
materials used is the ability to manufacture
them as a paste: Via a screen
des wissenschaftlichen Umfeldes sind
sehr gute Bedingungen vorhanden, um
innerhalb kurzer Zeit vermarktungsfähige
Sensorelemente zu entwickeln. Namhafte
Partner, wie das HITK (Hermsdorfer
Institut für Technische Keramik e.V.) sind
am Projekt beteiligt. Für Applikationen
mit Dauerbetriebstemperaturen bis
150°C wurden Materialien auf nanotechnologischer
Basis entwickelt und sind
verfügbar.
Der Vorteil bei den zum Einsatz kommenden
CMR-aktiven Materialien
printing process they can be put on
ceramic substrates. This way, any layout
optimized for any specifi c measurement
task can be printed and low-cost sensor
elements can be manufactured.
The possible application areas for CMR
sensors are in measurement of position,
distance, angle and revolutions per minutes.
Application markets are measurement
and automation technology as well
as building monitoring.
Micro-Hybrid Electronic GmbH
besteht in ihrer Herstellbarkeit als
Pasten: Es ist möglich, sie mithilfe des
Siebdruckverfahrens als Dickschicht auf
Keramiksubstrate aufzubringen. Damit
können beliebige, der jeweiligen Messaufgabe
angepasste Layouts gedruckt
und darüber hinaus sehr preiswerte
Sensorelemente gefertigt werden.
Die potentiellen Anwendungsfelder von
CMR-Sensoren liegen in der Erfassung
von Position, Weg, Winkel und Drehzahl.
Zielmärkte sind zum Beispiel die Mess-
und Automatisierungstechnik sowie die
Gebäudeüberwachung.
Micro-Hybrid Electronic GmbH
Heinrich-Hertz-Straße 8
D – 07629 Hermsdorf
Phone +49(0)36601-592-100
Fax +49(0)36601-592-110
Mail contact@micro-hybrid.de
Web www.micro-hybrid.de

Ceramic LTCC Foils
Because of their reliability under extreme
environmental conditions, ceramic multilayer
components (Low Temperature
Co-fi red Ceramics, or LTCC) are of interest
for innovative packaging concepts
in microsystems technology and hybrid
microelectronics. Among those are,
e.g., intelligent sensors, micro reactors,
miniaturized fl uidic systems as well as
ceramic wiring boards.
For these applications, functional LTCC
foils with special application specifi c
Keramische Multilayer-Bauelemente
(Low Temperature Cofi red Ceramics
oder LTCC) sind auf Grund ihrer Zuverlässigkeit
unter extremen Umgebungsbedingungen
für innovative Packaging-
Konzepte in der Mikrosystemtechnik und
der Hybridmikroelektronik von Interesse.
Beispielgebend seien intelligente Sensoren,
Mikroreaktoren, miniaturisierte
fl uidische Systeme sowie keramische
Schaltungsträger genannt. Für diese
properties are being developed at the
Hermsdorfer Institute for Technical Ceramics
e. V.
Among those are ferritic and dielectric
LTCC foils for integration of passive
components in power electronics
modules, as well as bondable LTCC
foils, adapted in their thermal expansion
coeffi cient to silicon and usable as a
crossover between the LTCC multilayer
technology and the CMOS technology.
Associations and Networks
Funktionskeramische LTCC-Folien
Applikationen werden im Hermsdorfer
Institut für Technische Keramik e. V.
funktionale LTCC-Folien mit besonderen
anwendungsspezifi schen Eigenschaften
entwickelt. Dazu zählen ferritische
und dielektrische LTCC-Folien für die
Integration von passiven Bauelementen
in leistungselektronische Module, sowie
eine bondbare LTCC-Folie, die in ihrem
thermischen Ausdehnungskoeffi zienten
an Silizium angepasst ist und als Bin-
LTCC glas ceramics,
bonded on a Si wafer
LTCC-Glaskeramik, gebondet
auf einen Si-Wafer
Miniaturized coil on a ferritic LTCC foil
Miniaturisierte Ringkernspule
auf einer ferritischen LTCC-Folie
The low sintered NiCuZn-Ferrit- or HDK
foils developed as LTCC components at
the HITK for the integration of inductors
and capacitors are known for their high
permeability and dielectric parameters
with matched X7R temperature characteristics.
deglied zwischen der LTCC-Multilayer-
Technologie und der CMOS-Technologie
fungieren kann.
Die im HITK für die Integration von Induktivitäten
und Kapazitäten in LTCC-Bauelemente
entwickelten niedrig sinternden
NiCuZn-Ferrit- bzw. HDK-Folien zeichnen
sich durch hohe Permeabilitäten
und angepasste dielektrische Parameter
mit X7R-Temperaturcharakteristik aus.
Hermsdorfer Institut für Technische
Keramik e. V.
Michael-Faraday-Straße 1
D – 07629 Hermsdorf
Phone +49(0)36601-63902
Fax +49(0)36601-63921
Web www.hitk.de
67

Associations and Networks
Your Partner from the Idea up to the Product
The Center for Microsystems Technology
Berlin (ZEMI) is an association of
research institutes which focuses on
the regional research and development
potential in microsystems technology. As
a one-stop agency, ZEMI is the central
contact for industry co-operation and
particularly supports small and mediumsized
companies via technology transfer.
In order to minimize the high costs of
developing microsystems technology
products, ZEMI supports companies
Source/Quelle: BAM V.4, FBH, BESSY, Fraunhofer, FBH/schurian.com
Das Zentrum für Mikrosystemtechnik
Berlin (ZEMI) ist ein Verbund Berliner Forschungseinrichtungen,
der das regionale
Forschungs- und Entwicklungspotenzial
in der Mikrosystemtechnik (MST) vernetzt.
Die Partner agieren dabei verstärkt
in den Anwendungsfeldern Mess- und
Gerätetechnik, Medizintechnik, Lebensmitteltechnologie
und Biomikrosystemtechnik.
Als Querschnittskompetenzen stehen
umfassendes Material-Knowhow
und fortschrittliche Systemintegrationstechnologien
zur Verfügung.
Im Bereich der Halbleiter mit großer
Bandlücke baut das ZEMI derzeit seine
Kompetenzen für Anwendungen in der
Medizin- und Kommunikationstechnik
aus. Als zentraler Ansprechpartner steht
ZEMI für Industriekooperationen zur
68
from the initial idea right up to the market
mature product.
To achieve this, ZEMI concentrates on
the best practice utilization of stateof-the-art
production technologies for
miniaturized components and systems.
Functionality, production costs and marketability
of the products are the main
focus of attention.
The competencies of ZEMI cover the
entire scope of the value-added chain
Verfügung und unterstützt insbesondere
kleine und mittelständische Unternehmen
durch Technologietransfer.
– from the design and development of
production processes, the production
of prototypes and the realization of small
series up to testing of microsystems.
In addition to competent and extensive
project management, ZEMI also
provides requirement-oriented educational
programs and training, advice
for industry partners and support for
companies in regard to continuing and
further training.
Trainees of the Ferdinand-Braun-Institut für Höchstfrequenztechnik at the clean room.
Auszubildende des Ferdinand-Braun-Instituts für Höchstfrequenztechnik im Reinraum. Source/Quelle: Wiedl
Um den hohen Aufwand bei der
Entwicklung mikrosystemtechnischer
Produkte zu minimieren, begleitet ZEMI

Partner im ZEMI und deren Mikrosystemtechnik-Kompetenzen:
Bundesanstalt für Materialforschung und
-prüfung (BAM)
Fachgruppe Hochleistungskeramik
Fachgruppe Oberfl ächentechnologien
Berliner Elektronenspeicherring-Gesellschaft für
Synchrotronstrahlung m.b.H. (BESSY)
Ferdinand-Braun-Institut für Höchstfrequenztechnik
(FBH)
Fraunhofer-Institut für Produktionsanlagen und
Konstruktionstechnik (IPK) in Kooperation mit
der TU Berlin – Institut für Werkzeugmaschinen
und Fabrikbetrieb (IWF)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration
(IZM) und Forschungsschwerpunkt
Technologien der Mikroperipherik der TU Berlin
(FSP-TMP)
TU Berlin – Institut für Konstruktion, Mikro- und
Medizintechnik (IKMM)
Unternehmen von der Idee bis zum
marktreifen Produkt. Dabei zielt das
Kompetenznetz auf die praxisgerechte
Nutzung modernster Techniken zur Herstellung
miniaturisierter Bauteile und Systeme.
Funktionalität, Fertigungskosten
und Marktfähigkeit der Produkte stehen
im Vordergrund. „Die Entwicklungskompetenz
der Forschungseinrichtungen
verbunden mit dem Know-how innovativer
Unternehmen schafft marktfähige
Systemlösungen.“, erklärt Dr. Klaus-Dieter
Lang, Sprecher des ZEMI-Direktoriums
und Stellvertreter des Institutsleiters
am Fraunhofer IZM.
Die Kompetenzen des ZEMI decken
die gesamte Wertschöpfungskette ab
– vom Entwurf über die Entwicklung von
Herstellungsprozessen, die Fertigung
von Prototypen und Kleinserien bis zum
Test der fertigen Mikrosysteme.
Neben einem kompetenten und umfassenden
Projektmanagement stellt ZEMI
auch bedarfsgerechte Bildungsangebote
bereit, schult und berät Industriepartner
und unterstützt Unternehmen in der Aus-
und Weiterbildung.
Unter Federführung von ZEMI arbeitet
das Netzwerk MANO (Mikrosystemtechnik-Ausbildung
in Nord-Ostdeutschland)
auf allen Bildungsebenen – von der
vorberufl ichen Bildung, gewerblichen
Erstausbildung, Hochschulausbildung
bis zur Fort- und Weiterbildung in der
MST um einen effi zienten Beitrag für die
Fachkräfte- und Nachwuchssicherung
in der Mikrosystemtechnik zu leisten.
Bei Fragen zu Ausbildungsmöglichkeiten
im sich rasant entwickelnden
Hochtechnologie-Bereich bietet das von
ZEMI koordinierte Ausbildungsnetzwerk
Associations and Networks
MST-Forschungskompetenz –
anwendungsorientiert gebündelt
➫ Hochleistungskeramik und Multilayertechnik für Mikrosysteme
➫ Prozess- und Prüftechnik für Hochleistungskeramik
➫ komplexe Prüfung von Sensoren
➫ Oberfl ächen- und Schichttechnik
➫ mechanische Mikrokomponenten mit dem Direkt-LIGA-Verfahren
➫ Röntgenmasken, Resistentwicklung und Optimierung
➫ Herstellung von Biochips
➫ mikrooptische Komponenten und hochpräzise Formwerkzeuge
➫ Hochfrequenz-Bauelemente und Schaltungen auf Basis von III/V-Verbindungshalbleitern
➫ hochbrillante Diodenlaser mit hoher Leistung und Zuverlässigkeit
➫ Untersuchungen an neuen Materialsystemen
➫ Mikrosysteme aus hybriden Diodenlasern und mikrooptischen Bauelementen
➫ innovative Prozesse für die Herstellung von Mikrokomponenten und -strukturen
➫ Schwerpunktthemen: Fertigungstechnologien, Werkzeugentwicklung, Maschinenoptimierung,
Messtechnik / Prozesskontrolle sowie Produktionsorganisation
➫ Methoden, Prozesse und Technologien aus dem Bereich der Systemintegration und der Aufbau-
und Verbindungstechnik von mikroelektronischen und mikrosystemtechnischen Bauteilen
und Gesamtsystemen
➫ Schwerpunktthemen: Waferlevel-, Chip- und Board-Prozesse, die 3D-Integration und Verkapselungstechniken
sowie Zuverlässigkeit- und Lebensdaueruntersuchungen
➫ komplette Präzisionssysteme für die industrielle Applikation mit umfassendem Know-how in der
Mikrotechnik, Elektromechanik, Mikroelektronik und der optischen Systemtechnik
Hochtechnologie Berlin (ANH Berlin)
seine Unterstützung an. Um dem schon
jetzt spürbaren Mangel an Fachkräften in
der Mikrosystemtechnik, den Optischen
Technologien und der Nanotechnologie
entgegenzuwirken, wird ein breites und
praxisorientiertes Spektrum an Dienstleistungen
für die betriebliche Ausbildung
geboten.
Zentrum für Mikrosystemtechnik Berlin
(ZEMI)
Doreen Friedrich
Max-Planck-Straße 5
D – 12489 Berlin
Phone +49(0)30-6392-3391
Fax +49(0)30-6392-3392
Mail zemi@zemi-berlin.de
Web www.zemi-berlin.de
69

We‘re growing in micro.
With great success. Around 40 enterprises with 2,100 specialists in micro-and nanotechnology
have already joined us – a rising trend. Thanks to the second construction
phase of our MST.factory dortmund Centre of Excellence, we have ample space to
accommodate additional pioneers within this field. What is more, our MST-Cluster
- a highly effective network linking commerce and science - offers companies the
best possible business environment.
big in micro. The new Dortmund.
www.hightechguide-dortmund.com
www.microtech-dortmund.com

Current Results
and Portfolios
of Research Institutions
Aktuelle
Ergebnisse und Leistungen
aus Forschungseinrichtungen

Current Results and Portfolios of Research Institutions
Micro Engineering at Fraunhofer IFAM, Bremen
Increased functionality of metal micro parts by micro injection molding
Fig. 1: Replication of the smallest bone in the human body made by highgrade
steel and titanium (cooperation with Krämer Engineering)
Fraunhofer IFAM is manufacturing
since many years micro components
and parts with microstructured surfaces
out of fi ne metal powders. The
used technology is called Micro Metal
Injection Molding (Micro MIM). Nearly
all kind of metals and alloys can be
processed with Micro MIM. Single
injected parts with dimensions of 300
μm and microstructured surfaces with
details in the range of 20 μm could be
achieved so far. Important application
areas are medical technology, automobile
and consumer goods. Applications
are where you need small parts with
more than structural properties in high
quantities, e.g. where magnetic, bioactive,
conducting or resistance properties
play a role. Regarding the trend to
smaller components and devices Micro
Engineering offers a cost-effective series
production for the necessary parts.
Functionality of parts can be increased
on the one hand by structural properties
such as micro channels for fl uidic
applications and bio diagnostics. Micro
72
reactors and micro mixers with channel
sizes of 20 μm to 250 μm have been
manufactured. Due to the microstructures
and the addition of suitable particles
a specifi c and adjusted bonding of
biomolecules becomes possible. On the
other hand special material properties
contribute to further functionalisation.
The replication of the smallest human
bone (see Fig. 1) shows how a medical
implant out of Titanium can be manufactured
cost-effective in series. Micro parts
out of shape memory alloy can act as
sensors or actuators. Targeted material
selection and process control allow
also the production of parts consisting
out of different metallic materials without
additional joining techniques. Here, the
combination of a magnetic with a non
magnetic stainless steel is mentioned
as an example (see Fig. 2). Based on
this development sensors to control
position or to detect rotation can be
produced within one shaping step and
need no further bonding technology.
New material developments include
Fig. 2: Micro tensile sample consisting of a magnetic and non-magnetic portion
manufactured by two-component μ-MIM
pseudo alloys like tungsten-copper and
molybdenum-copper for heat management
applications. With the help of nano
powders tailored optical properties or
enhanced resistance as well as tightness
is adjusted.
Based on fi ne metal powders down to
nano particles tiny metallic components
can be produced in series and additional
functionality can be implemented
into small parts. Fraunhofer IFAM offers
client oriented R&D in the area of Micro
Engineering.
Fraunhofer Institut für Fertigungstechnik
und Angewandte Materialforschung IFAM
Dr. Natalie Salk
Wiener Straße 12
D – 28359 Bremen
Phone +49(0)421-2246-175
Mail salk@ifam.fraunhofer.de
Web www.ifam.fraunhofer.de

Current Results and Portfolios of Research Institutions
Printing of Inks and Adhesives in Microsystems Technology
Fig. 1: Printed antenna of conductive adhesive fi lled with 70 weight%
silver showing the capability of the system print head – adhesive.
In Microsystems Technology ideally passive
and active, electronic and sensor
elements interact in an “intelligent” way.
Today “intelligent” parts are required in
all key industries, but their fabrication is
restricted by demanding, infl exible, and
expensive processes
like lithography or conventional
packaging.
A novel concept for
new functionalities and
simplifying packaging
is Functional Printing,
i.e. the employment
of digital, maskless,
non-contact printing
Fig. 2:
With ink-jet or aerosol printing,
patterns down to 10 μm
or fi lms thinner than 1 μm
are possible onto rigid or
fl exible substrates. Printing
of conducts – replacing wire
bonding – across embedded
components is feasible,
as well as antennae or strain
gauges directly onto parts.
techniques for structuring
of functional materials to
create conductive tracks,
sensing layers and devices
or adhesive bonds.
Functionality is typically
accomplished by treating
the deposited structure by
laser, UV radiation or in a
furnace. Essential advantages
of these printing technologies
are high fl exibility
and integration potential into
existing process chains,
short changeover times and
low cost.
For Functional Printing Fraunhofer IFAM
uses commercial materials and formulates
new printable functional liquids.
Extremely different materials like acidic
inks, viscous adhesives, particle-fi lled
dispersions or biological fl uids can be
tailored for printing. The functional materials,
the substrates, the printing and – if
applicable – the curing processes have
to be adjusted to each other for full functionality
and regarding to the industrial
production environment. We are offering
materials research and development for
new applications by Functional Printing
as well as market related analyses and
feasibility studies.
In many instances, adhesive bonding
is the only feasible technology for fi xing
or mounting micro-objects due to the
great variety of highly specialised materials.
With dispensing technologies the
precise application of minute volumes
of viscous, particle fi lled, dielectric or
conductive adhesive can be achieved
in compatibility with the micro-assembly
process using novel robotic systems.
Fraunhofer IFAM – as the largest independent
group in Europe working on
adhesive bonding technology – offers,
besides the selection and development
of adhesives, the adaptation of special
curing (e.g. rapid cure, two-stage cure)
and quality assurance, i.e. micro-testing
of the joint.
Fraunhofer Institut für Fertigungstechnik
und Angewandte Materialforschung IFAM
Dr. Volker Zöllmer
Wiener Straße 12
D – 28359 Bremen
Phone +49(0)421-2246-114
Mail zoellmer@ifam.fraunhofer.de
Web www.ifam.fraunhofer.de
73

Current Results and Portfolios of Research Institutions
New Generation of Capacitive Inertial Sensors
with High Temperature Stability
Introduction
Inertial sensors are ubiquitous devices
of our life. We fi nd them inside mobile
phones, notebooks, cars and others.
They are used for “freefall” detection,
vibration control, tilt sensing for antitheft,
shock monitoring, airbag release and
dead reckoning. An ever-increasing
range of new applications calls for sensor
systems offering best performance
at low prices. Essential issues for these
devices are: fabrication effort including
yield, signal to area ratio, calibration
effort, signal to noise ratio and temperature
drift. The ZfM of the Chemnitz University
of Technology and the Chemnitz
branch of FHG-IZM have developed a
new generation of inertial sensors fabricated
by the patented AIM-Technology
(Airgap Insulation of Microstructures).
The sensor function in this case is
based on detecting the displacement of
a proof mass by capacitance change.
Fig. 2: SEM picture of the AIM7E low g sensor having a structure height of
50 μm (fi xed electrodes are removed).
74
Fig. Fi 11: Process P fl ow of f AIM ttechnology, h l showing h i th
the
anchor area
Technology Aspects
Most of the requirements mentioned
above can be met by using silicon
technologies with high aspect ratio of
structures (HARM = High Aspect Ratio
Micromachining). Thus using the third
dimension strictly, a large signal to area
ratio can be obtained. Additionally, these
structures offer overdamping as desired
for applications with reduced bandwidth.
Among other HARM technologies, like
certain SOI procedures, the use of thick
epitaxial fi lms or SCREAM (Single Crystal
Reactive Etching and Metallization), the
AIM technology has additional benefi ts:
its relative simple process fl ow and
the minimisation of mechanical stress
caused by thin fi lms or bonded wafers.
Additionally, any particle induced residues
after deep silicon etching (spikes
with diameter not larger than 1.2 μm)
are removed by a special lateral etching
step which is integrated in the AIM pro-
Fig. 3: SEM picture of the cross section of released beams with nearly 100 μm
height

cess fl ow. This means that a yield better
than 90% can be achieved even in a
cleanroom of class 3 or 4 (according to
VDI 2083).
The basic process fl ow is shown in
Fig. 1. After the last patterning process
(step 3), the anchor is electrically
isolated and holds the fl exure as well as
the seismic mass including its electrode
plates. The real sensor structure itself
(fi xed electrodes removed) of the tilt sensor
AIM7E is shown in Fig. 2. The four
anchor structures (at the edges) as well
as the fl exures and the perforated mass
area can be seen. The whole structure
consists of silicon completely. About
95% of the processes can be carried
out within a standard CMOS process.
The only exception is the silicon etching
module at the end of the processing.
Nevertheless it has been demonstrated
that the DRIE etching system can be
used for the polymer spacer based release
etch process as well as the lateral
etching.
Thus any wet etching step or even
HF vapour etching is not required and
technology caused sticking can be
excluded. Depending on the application
and the device specifi cation, the height
of the released structures can be even
more than 50 μm. As shown in Fig. 3
the released silicon beams as fabricated
for test purposes are almost 100 μm
high.
Functional Test and Characterisation
After complete fabrication including capping
by wafer bonding the sensors are
tested at wafer level. Beside an isolation
test, every sensor is excited by a certain
ac voltage at electrode 1. In case the
seismic mass is vibrating the oscillation
can be detected at the electrode 2 using
the second harmonic of the excitation
voltage. This procedure has been
proven to be suffi cient for ensuring the
functionality of every single sensor.
In the following, selected properties of
the AIM low g sensors will be presented.
Fig. 4 shows the frequency response of
the inclination sensor AIM5i. There is a
good correlation obtained between the
calculation (red line) and measurements
for a given damping constant D (green
fi tted line).
As discussed at the beginning, the
thermal behaviour of the AIM sensors
was expected to be excellent due to the
use of crystalline silicon only. Several
sensor types have been characterised
with respect to their sensitivity change
and offset drift vs. temperature. Exemplarily
the zero g offset drift of a dual
axis sensor AIM7E is shown in Fig. 5.
As indicated a coeffi cient as low as 30
μg/K has been achieved. This is a value
which can be reached by other technologies
usually only after sensor calibra-
Current Results and Portfolios of Research Institutions
Fig. 4: Frequency response of
the inclination sensor AIM5i
Fig. 5: Output signal of
a sensor-ASIC systems
(AIM7E+ELMOS M777.04)
versus temperature (-40°C …
85°C) at 39% relative humidity.
tion. Similarly the sensitivity change with
respect to the temperature has been
measured for several AIM sensor types.
Typically, the coeffi cients vary from 0 to
0.025 %/K indicating a decrease of the
spring stiffness with increased temperature
as expected.
Another critical parameter is the noise
density. Calculating the mechanical
noise only, a density of about 5 μg/Hz 1/2
is obtained for the dual axis sensor
AIM5i. Using the system combining the
same sensor and an analogue ASIC
(GEMAC CVC1.0) a total noise density
below 20 μg/Hz 1/2 could be measured. It
is expected that this gap can be further
TU Chemnitz
Zentrum für Mikrotechnologien
D – 09107 Chemnitz
Phone +49(0)371-531-24060
Fax +49(0)371-531-24069
Mail info@zfm.tu-chemnitz.de
Web http://www.zfm.tu-chemnitz.de/
75

Current Results and Portfolios of Research Institutions
Microsystems and Nanotechnologies for the Manipulation and
Analysis of Molecules, Cells, Tissues, and Interfaces
Microsystems technology is a key technology
with a high potential for value creation
in the life sciences area. The NMI Natural
and Medical Sciences Institute develops
and manufactures microsystems using
biostable and biocompatible materials for
its clients in the pharmaceutical research,
biotechnology and biomedical engineering
markets.
Electrophysiological sensor arrays
A core technology of the NMI involves
processes for the fabrication of microelectrode
arrays (MEAs). These are
substrates with surface-embedded
electrodes for the gentle stimulation and
low-noise recording of the electrophysiological
activity of neuronal and cardiac cell
and tissue cultures.
Based on many years of experience,
MEAs on glass and polymer substrates
in application-specifi c designs are generated
in many cases in combination with
microfl uidic components. Enhanced
functionality and new applications are
achieved by combining various materials
and methods.
Micro- and nanoelectrodes for micromedicine
The further development of MEA technology
in turn leads to new micromedical applications.
A current example is a retinal implant
that enables blind people to navigate in
an unknown environment by way of the
electrical stimulation of retinal cells via an
implanted light-sensitive chip.
Nanolithographical methods enable the fabrication
of nanoscale electrodes for highly
sensitive electrochemical sensors integrated
into lab-on-a-chip systems for medical
diagnostics purposes.
76
MEA_1
1 cm
MEA_2
500 μm
MEA_3
10 μm
MEA_4
0,5 μm
MEA_1:
Microelectrode array (MEA) for
electrical stimulation and recording
of electrical activity of living tissues.
The amplifi er contact pads to the 60
electrodes in the center of the chamber
are aligned along the chip sides.
Mikroelektroden Array (MEA) zur
Elektrostimulation und Aufzeichnung
elektrischer Signale in einem Gewebe.
Außen Kontaktpads zu den 60 Elektroden,
die im Zentrum der Messkammer
liegen.
MEA_2:
Brain slice (hippocampus) on a microelectrode
array (MEA). The electrical
activity can be recorded from 60
electrodes simultaneously, thus allowing
the spatial and temporal analysis of the
signal propagation within the brain slice.
Darstellung eines Hirnschnittes (Hippocampus)
auf einem Mikroelektroden
Array (MEA). Die elektrische Aktivität
kann mit 60 Elektroden gleichzeitig
beobachtet werden, um die räumliche
und zeitliche Signalausbreitung im
Gehirnpräparat zu untersuchen.
MEA_3:
A single titanium nitride electrode. The
highly sensitive and long-term stable
electrodes are manufactured at the
NMI.
Einzelelektrode aus Titannitrid. In einem
speziell entwickelten Prozess werden
langzeitstabile und hochempfi ndliche
Elektroden hergestellt.
MEA_4:
The nanostructure of the pin-like
titanium nitride provides a large surface,
a prerequisite for the electrodes’
outstanding characteristics.
Die Nanostruktur des stengelförmigen
Titannitrids schafft eine große innere
Oberfl äche, die Voraussetzung für
die überragenden Eigenschaften der
Elektroden ist.

Current Results and Portfolios of Research Institutions
Mikrosysteme und Nanotechniken zur Manipulation und Analyse
von Molekülen, Zellen, Geweben und Grenzflächen
Titanium nitride
electrode
50 x 50 μm.
Titannitrid
Elektrode
50 x 50 μm
Stimulation pixel.
Stimulationspixel
Die Mikrosystemtechnik ist für die
Lebenswissenschaften eine Schlüsseltechnologie
mit hohem Wertschöpfungspotential.
Das NMI Naturwissenschaftliche
und Medizinische Institut entwickelt
und fertigt für Kunden aus der Pharmaforschung,
Biotechnologie und Biomedizintechnik
Mikrosysteme aus Materialien,
die biostabil und biokompatibel sind.
Elektrophysiologische Sensorarrays
Eine Kerntechnologie des NMI sind
Prozesse zur Fertigung von Mikroelektrodenarrays
(MEAs). Dies sind Substrate
mit in die Oberfl äche eingebetteten
Elektroden zur schonenden Stimulation
und rauscharmen Messung elektrophysiologischer
Aktivität in Zell- und Gewebekulturen
des Nervensystems und von
Herzmuskelzellen. Auf der Basis lang-
jähriger Erfahrung entstehen MEAs auf
Glas- und Polymersubstraten in anwendungsspezifi
schen Ausführungsformen,
vermehrt in Verbindung mit mikrofl uidischen
Komponenten. Neue Funktionalitäten
und Anwendungen werden
durch die Kombination unterschiedlicher
Materialien und Verfahren erreicht.
Mikro-und Nanoelektroden für die Mikromedizin
Weiterentwicklungen der MEA Technik
führen zu neuen Anwendungen in der
Mikromedizin. Aktuellstes Beispiel sind
lichtempfi ndliche Implantate, die Blinden
durch die elektrische Stimulation von
Netzhautzellen eine zur Orientierung in
unbekannter Umgebung ausreichende
Sehfähigkeit ermöglichen. Nanolithographische
Methoden ermöglichen die
Functional diagram of the subretinal implant. Visual information is projected by the
cornea and lens of the eye to a light-sensitive chip which replaces degenerated
photoreceptors. Depending on the local contrast of the image, the retina is electrically
stimulated by the electrodes. This results in spatially resolved activation of the
retinal nerve cells, which is perceived by blind people as a phosphene pattern.
(For more information visit www.retina-implant.de)
Funktionsschema des subretinalen Implantates. Die Bildinformationen werden wie
beim normalen Sehen über den optischen Apparat des Auges auf einen lichtempfi
ndlichen Chip übertragen, der anstelle der degenerierten Sehzellen in die Netzhaut
implantiert ist. Je nach lokalem Kontrast wird die anliegende Netzhaut über die
einzelnen Stimulationselektroden verschieden stark elektrisch gereizt. Dies führt zur
ortsabhängigen Netzhaut-Aktivierung, was als fl ächiges Lichtmuster wahrgenommen
wird. (Weitere Info unter www.retina-implant.de)
Herstellung nanostrukturierter Elektroden
für hochsensitive elektrochemische Sensoren
in Lab-on-a-Chip Systemen für die
medizinische Diagnostik.
NMI Naturwissenschaftliches
und Medizinisches Institut
an der Universität Tübingen
NMI Natural and Medical Sciences
Institute at the University
of Tuebingen
Dr. Alfred Stett
Markwiesenstr. 55
D – 72770 Reutlingen
Phone +49(0)7121-51530-0
Email stett@nmi.de
Web www.nmi.de
Retina
implant.
Retina
Implantat
77

Current Results and Portfolios of Research Institutions
Sensors and Microsystems
from the Institute of Photonic Technology, Jena
The Institute of Photonic Technology
(IPHT) has a long-standing experience
in the fi eld of microsystems technology,
especially in the development of
sensors and chip devices by means of
thin-fi lm deposition and micropatterning
processes as well as in the research on
optical fi bers and optical fi ber microsystems.
Due to its well-skilled staff and its
modern equipment IPHT is meanwhile
well-known as one of the world-wide
leading research facilities on sensorics
and microsystems.
The research activities of IPHT in microsystems
technology cover a wide
scope:
✦ micromachined sensors and sensor
arrays on thin-fi lm fl oating membranes
(bolometers, thermopiles) for
ultrasensitive IR and THz radiation
detection
✦ micromechanical components for
digital switching of light and for coherent
multispot light sources
for compact high-performance
spectrometers and imaging
systems
✦ chip-based assays with micropatterned
spots and detection structures
for bioanalytical applications in
life science and health care with the
focus on point-of-care diagnostics
✦ microfl uidic chip elements for highthroughput
liquid handling in the
micro/nano litre scale and complete
microanalytical devices as, e.g.,
real-time PCR (polymerase chain
reaction) reactors and LabOnChip
systems with optical read out
✦ planar thin-fi lm metallic nanostructures
and molecular well-defi ned
78
✦
✦
✦
✦
✦
arrangements of metal nanoparticles
for the use of plasmonic effects in
spectraloptical analysis and diagnostics
by SERS (Surface-Enhanced
Raman Spectroscopy), TERS (Tip-
Enhanced Raman Spectroscopy),
chip analytics and for fi beroptical
chemo- and biosensors
optical speciality fi bers (including
microstructured and photonic crystal
fi bers) using MCVD technology and
planar optical waveguides using
fl ame hydrolysis technology
active laser fi bers and fi ber lasers for
high power output
fi ber-Bragg-gratings and fi ber- Bragggrating
arrays for sensor applications
and information technology
nanofi bers, nanotapers and nanoprobes
in silica and nanowires in
silicon
optical fi ber sensor systems (single
sensors and distributed/array
sensors) using spectral encoding
techniques for sensor applications in
energy, process control, traffi c systems,
environment or life sciences
Production of
microstructured optical
fi bers is one of the
core competences of
the institute.
Die Herstellung mikrostrukturierter
optischer
Fasern gehört zu den
Kernkompetenzen des
Instituts
✦ sensors for the extremely sensitivedetection
of magnetic fi elds made by
sophisticated thin-fi lm circuits with
superconducting layers for SQUIDsystems
(SQUID: Superconducting
Quantum Interference Device) and
with magnetoresistive multilayer
systems.
Essential basis of these developments is
the stock of technological processes for
preparation and manufacturing at IPHT
which can be divided into two branches:
First, there is a complete line for thin-fi lm
deposition and micro- and nanopatterning
as well as for mounting and assembling.
Second, all preparation steps for manufacturing
and analyzing optical speciality
fi bers and fi ber modules are established.
By this, IPHT with its scientifi c expertise
and technological knowhow in microsystems
offers innovative custom-oriented
solutions for a broad spectrum of industrial
and academic partners around the
world according to its motto „From Ideas
To Instruments“.

Das Institut für Photonische Technologien
(IPHT) verfügt über langjährige
Erfahrungen auf dem Gebiet der
Mikrosystemtechnologie, sowohl in
der Entwicklung von Sensoren und
Chip-Bausteinen mit Hilfe der Abscheidung
dünner Schichten und Mikrostrukturierungsprozessen
als auch in
der Erforschung optischer Fasern und
Fasermikrosystemen. Wegen seiner
hochkompetenten Mitarbeiter und
seiner modernen Ausstattung ist das
IPHT inzwischen als eines der weltweit
führenden Forschungszentren auf dem
Gebiet der Sensorik und Mikrosysteme
bekannt.
Ultrasensitive supraconducting bolometer
array for passive Terahetz-Imaging
Ultraempfi ndliches supraleitendes Bolometerarray
für passive Terahertz-Bildgebung
Die Forschungsaktivitäten des IPHT in
der Mikrosystemtechnologie decken ein
weites Feld ab:
✦ mikrostrukturierte Sensoren and
Sensorarrays auf freischwebenden
Dünnschicht-Membranen (Bolometer,
Thermopile) für ultrasensitive
Detektion von IR and THz Strahlung
✦ mikromechanische Komponenten
für digitale Lichtschaltung und für
kohärente Multispot-Lichtquellen für
leistungsstarke kompakte Spektrometer
und Imaging-Systeme
✦ Chip-basierte Assays mit mikrostrukturierten
Spots und Detektionsstrukturen
für bioanalytischen Anwendungen
in den Lebenswissenschaften
und im Gesundheitswesen mit dem
Schwerpunkt der point-of-care-Diagnostik
✦ mikrofl uidische Chip-Elemente für die
Hochdurchsatzanalyse von Flüssigkeiten
im Mikro- und Nanoliterbereich
sowie komplette mikroanalytische
Bauteile z. B. für Reaktoren für
Current Results and Portfolios of Research Institutions
Sensoren und Mikrosysteme aus dem Institut
für Photonische Technologien, Jena
✦
✦
✦
✦
✦
✦
✦
die Real-Time-PCR (Polymerasekettenreaktion)
und LabOnChip-
Systeme mit optischer Auslesung.
planare metallische Dünnschicht-
Nanostrukturen und molekular klar
abgegrenzte Anordnungen metallischer
Nanopartikel für die Anwendung
plasmonischer Effekte in
der spektraloptischen Analyse und
Diagnostik mittels SERS (Surface-
Enhanced Raman Spectroscopy), in
TERS (Tip-Enhanced Raman Spectroscopy),
in chipbasierter Analytik
und für faseroptische Chemo- und
Biosensoren
optische Spezialfasern (einschließlich
mikrostrukturierter Fasern und
Photonischer Kristallfasern) auf der
Basis der MCVD-Technologie sowie
integriert-optische Wellenleiter auf
der Basis der Flammenhydrolyse-
Technologie
aktive Laserfasern und Faserlaser für
Hochleistungsanwendungen
Faser-Bragg-Gitter und Faser-Bragg-
Gitter-Arrays für die Sensorik und die
Informationstechnik
Nanofasern, Nanotaper und Nanosonden
in Quarzglas und Nanowires
in Silicium
Faseroptische Sensorsysteme
(Punktsensoren und ortsverteilte
Sensoren) auf der Basis von
Faser-Bragg-Gittern, Fabry-Perot-Elementen
und evaneszenter Feldspektroskopie
für Anwendungen z.B.
in der Energie-, Pro zess-, Verkehrs-,
Umwelttechnik und in der Bio- und
Chemosensorik.
Sensoren für die extreme sensitive
Detektion von Magnetfeldern
hergestellt mit anspruchsvollen
Dünnschicht-Schaltkreisen mit
supraleitenden Schichten für SQUID
Systeme (SQUID: Supraleitende
Quanteninterferenzdetektoren) und
mit magnetwiderstandsbeständigen
Multischichtsystemen
Die notwendige Basis für diese Entwicklungen
bildet ein großes Repertoire technologischer
Präparations- und Herstellungsprozesse
am IPHT, das sich in zwei
Bereiche gliedert: Zum einen verfügt das
Institut über eine vollständige Linie für
die Abscheidung dünner Schichten, die
Mikro- und Nanostrukturierung sowie
Aufbau- und Verbindungstechniken.
Zum anderen sind alle Schritte für die
Herstellung optischer Spezialfasern und
Fasermodule einschließlich der dazu
gehörigen Charakterisierungstechniken
etabliert. So ist das IPHT mit seiner
wissenschaftlichen Expertise und seinem
technologischen Knowhow in der Lage,
innovative, kundenspezifi sche Lösungen
für ein breites Spektrum industrieller und
akademischer Partner in der ganzen
Welt anzubieten, seinem Motto folgend,
„From Ideas To Instruments“.
Institut für Photonische
Technologien
Albert-Einsteinstraße 9
D – 07745 Jena
Phone +49(0)3641–206-300
Fax +49(0)3641–206-399
Mail info@ipht-jena.de
Web www.ipht-jena.de
79

Current Results and Portfolios of Research Institutions
Institut fuer Mikrotechnik Mainz
The Institut fuer Mikrotechnik Mainz
(IMM) is a non-profi t research and development
institution of the federal state of
Rhineland-Palatinate. Since more than
15 years IMM is devoted to the development
of microsystems technology
relevant to industry and to the exploration
of technical applications for microstructures,
today with a main focus on
analytics, chemical process and energy
technology. Since 2001, IMM is certifi ed
according to the DIN ISO 9001 standard.
Basically, the business activities of
IMM comprise the whole chain: idea ➫
design ➫ simulation ➫ engineering ➫
packaging ➫ prototyping ➫ validation ➫
complete system development.
Analytical projects are predominantly
motivated by biomedical problems and
questions. A rapidly growing market for
the so called point-of-care or on-site
testing, is defi ning the specifi cations for
sample preparation and processing of
80
a variety of diverse samples (such as
blood, sputum, pap smear, air, water,
soil), for the isolation and purifi cation of
DNA, RNA and proteins as well as for
the fi nally applied detection methods
(frequently optical or electrochemical).
The development of open but integrated
architectures for new, microsystem technology
based, bio diagnostic systems
open up an enormous potential for
improving prenatal diagnostics and early
cancer detection as well as for the monitoring
of the therapy success during the
recovery process.
The chemical process technology division
at IMM is addressing micro process
engineering issues and at the same time
provides a bridge from microstructured
reactor components to process technology
and from the engineering to the application
in chemical industry. The development
of high throughput components
for pilot and production plants, the plant
Micro Mixers with very fi ne Leading Structures and a
Geometrically Reducing Mixing Chamber Result in a
Complete Mixing Within Splits of a Second
all Pictures: IMM)
Mikromischer mit sehr feinen Zuführungsstrukturen
und einer sich verjüngenden Mischkammer führen
zum vollständigen Vermischen in Sekundenbruchteilen
(alle Fotos: IMM)
development, the integration of micro
process engineering components with a
conventional plant periphery as well as
the intensifi cation of existing and the development
of new synthesis routes, also
in unusual and novel process windows,
play a key role.
Energy technology at IMM is mainly
based on hydrogen but as well on
fossil and renewable energy sources.
The research and development work
comprises hydrogen transport with
the aim of liquid hydrogen supply to
households, mobile electricity producers
based on fuel cells and the production
of renewable fuels. Besides the reactor
construction for entire reformer systems
this includes the development of components
(heat exchangers, evaporators,
condensers), the system integration,
the construction of pilot plants, sensor
solutions as well as the improvement of
fabrication technologies and the catalyst
development.

Module for the Lysis of Bacteria
Modul zur Lyse von Bakterien
Micro Falling Film Reactors – Highly Effi cient Micro
Reactors for gas/liquid Reactions from Lab- to Pilot-
and Production Scale
Mikrofallfi lmreaktoren – Hocheffi ziente Mikroreaktoren
für gas/fl üssig Reaktionen vom Labor- bis in den
Pilot- und Produktionsmaßstab
Reformer: Integrated reactor system for the hydrogen
production
Reformer:Integriertes Reaktorsystem zur Herstellung
von Wasserstoff
Das Institut für Mikrotechnik in Mainz
(IMM) ist eine gemeinnützige Forschungs-
und Entwicklungseinrichtung
des Landes Rheinland-Pfalz. Seit mehr
als 15 Jahren widmet sich das Haus der
Entwicklung einer industrierelevanten Mikrosystemtechnik
und der Untersuchung
von technischen Anwendungen für
Mikrostrukturen, heute mit den Schwerpunktsbereichen
Analytik, Chemische
Prozesstechnik und Energietechnik. IMM
ist seit 2001 zertifi ziert nach DIN ISO
9001. Grundsätzlich umfasst das Leistungsspektrum
von IMM die gesamte
Kette: Idee ➫ Design ➫ Simulation ➫
Engineering ➫ Aufbau- und Verbindungstechnik
➫ Prototyping ➫ Validierung
➫ komplette Systementwicklung.
Projekte der Analysetechnik sind überwiegend
durch biologische und medizinische
Fragestellungen motiviert. Ein
rasant wachsender Markt für das sog.
Point-of-Care bzw. On-site Testing defi -
niert die Anforderungen an die Vor- und
Aufbereitung verschiedenster Proben
(Blut, Speichel, Abstriche, Luft, Wasser,
Boden), an die Isolation und Aufreinigung
von DNA, RNA und Proteinen und
letztlich an die zum Einsatz kommenden
Detektionsverfahren (häufi g optisch
oder elektrochemisch). Die Entwicklung
offener aber integrierter Architekturen
neuer, mikrosystemtechnischer, biodiagnostischer
Systeme eröffnet ein großes
Potenzial zur Verbesserung der pränatalen
Diagnostik und der Krebsfrüherkennung,
sowie zur Überwachung des
Therapieerfolges im Genesungsprozess.
Der Bereich Chemische Prozesstechnik
widmet sich der Mikroverfahrenstechnik
und schlägt die Brücke von mikrostrukturierten
Reaktorkomponenten zur
Current Results and Portfolios of Research Institutions
Institut für Mikrotechnik in Mainz
Prozesstechnik und vom Engineering
zur Anwendung in der Chemie. Dabei
nehmen die Entwicklung von Hochdurchsatzkomponenten
für Pilot- und
Produktionsanlagen, die Anlagenentwicklung,
die Integration mikroverfahrenstechnischer
Komponenten in eine
konventionelle Anlagenumgebung sowie
die Intensivierung bestehender und die
Entwicklung neuer Syntheserouten auch
in ungewöhnlichen Prozessfenstern eine
zentrale Rolle ein.
Energietechnik am IMM betrachtet
hauptsächlich Wasserstoff, aber auch
fossile und regenerative Energieträger.
Die Forschungs- und Entwicklungsarbeiten
umfassen den Wasserstofftransport
mit dem Ziel der Flüssigwasserstoffversorgung
von Haushalten,
mobile Stromerzeuger auf der Basis
von Brennstoffzellen und die Produktion
von regenerativen Treibstoffen.
Neben dem Reaktorbau für komplette
Refor mersysteme schließt dies die
Entwicklung von Komponenten (Wärmetauscher,
Verdampfer, Kondensatoren),
die Systemintegration, den Aufbau von
Pilotanlagen, sensorische Lösungen
sowie die Verbesserung von Fertigungstechniken
und die Katalysatorentwicklung
mit ein.
IMM – Institut für Mikrotechnik
Mainz GmbH
Carl-Zeiss-Strasse 18
D – 55129 Mainz
Phone +49(0)6131-990-0
Fax +49(0)6131-990-205
Mail kiesewalter@imm-mainz.de
Web www.imm-mainz.de/
81

Current Results and Portfolios of Research Institutions
Institut für Mikroaufbautechnik
der Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
The Hahn-Schickard-Institute for Microassembly
Technology (HSG-IMAT) is specialized
in assembly- and packaging for
microsystems and miniaturized systems
based on plastic devices, particularly in
Moulded Interconnect Devices (MID).
Das Hahn-Schickard-Institut für Mikroaufbautechnik
(HSG-IMAT) ist spezialisiert
auf Gehäuse- und Verbindungstechniken
für Mikrosysteme und miniaturisierte
Systeme auf der Basis von Kunststoffbauteilen,
insbesondere Moulded Interconnect
Devices (MID).
Das Institut bietet eine professionelle
Dienstleistungspalette und Infrastruktur,
ausgerichtet an den Bedürfnissen der
Industrie.
Unter einem Dach werden am
HSG-IMAT Konstruktion, Simulation,
Werkzeugbau, Spritzguss, Laserstrukturierung,
Metallbeschichtung, Assemblierung
und Test durchgeführt.
Daher kann das HSG-IMAT ganzheitliche
und durchgängige Forschungs- und Entwicklungsdienstleistungen
von der Idee
bis zum geprüften Prototypen anbieten.
82
The Institute offers a professional range
of services such as construction, simulation,
toolmaking, injection moulding,
laser structuring, metal coating, assembling,
testing and the infrastructure
according to the industrial requirements.
Therefore HSG-IMAT can offer holistic
and continuous research and development
services from idea to tested
prototypes.
Areas of operation
Plastics for micro devices
✦ Precision tool making
✦ Micro injection moulding
✦ Two shot injection moulding
MID-Technologies
✦ Hot embossing MID technology
Arbeitsgebiete
Kunststofftechnik für Mikrobauteile
✦ Präzisionswerkzeugbau
✦ Mikrospritzguss
✦ Zweikomponentenspritzguss
MID-Technologien
✦ Heißpräge-MID-Technik
✦ Laser-MID-Technik
✦ Chemische Metallabscheidung
Chip- und SMD-Montage auf MID
✦ Drahtbondtechnik
✦ Flip-Chip-Technik
✦ Bleifreie SMD-Montage
Sensoren und Aktoren
✦ Touchsensoren
✦ Beschleunigungssensoren
✦ Neigungs- und Drehwinkelsensoren
✦ Mikroventile
✦ Laser MID technology
✦ Electroless plating
Chip-and SMD-assembly
✦ Wire bonding
✦ Flip chip-Technique
✦ Lead-free SMD assembly
Sensors and Actuators
✦ Touchsensors
✦ Accelerometers
✦ Inclination sensors and rotary
encoders
✦ Microvalves
HSG-IMAT
Allmandring 9 B
D – 70569 Stuttgart
Phone +49(0)711-685-83712
Fax +49(0)711-685-83705
Mail info@hsg-imat.de
Web www.hsg-imat.de

The Hahn-Schickard-Institute for Micromachining
and Information Technology
(HSG-IMIT) belongs to the leading R&D
partners in Microsystems technology.
Core competencies are the areas of
sensors, microfl uidics, information technology
and defi ned production process.
In trustworthy cooperation with industry
we implement innovative products and
technologies.
Several laboratories and a 600 sqm
cleanroom are equipped with an extensive
infrastructure needed to develop
and fabricate Microsystems.
The service centre provides specifi c
consulting, advanced training, technological
services, feasibility studies,
prototyping, small scale production as
Das Hahn-Schickard-Institut für Mikro-
und Informationstechnik (HSG-IMIT)
zählt zu den führenden Forschungs- und
Entwicklungspartnern im Bereich der
Mikrosystemtechnik.
Die Kernkompetenzen liegen in der Sensorik,
Mikrofl uidik, Informationstechnik,
und defi nierten Herstellungsprozessen.
In vertrauensvoller Zusammenarbeit mit
der Industrie realisieren wir innovative
Produkte und Technologien. Mehrere
Labore und ein 600 m 2 grosser Reinraum
sind mit einer umfangreichen Infrastruktur
ausgestattet – Voraussetzung
zur Entwicklung und Herstellung von
Mikrosystemen. Das Dienstleistungszentrum
bietet kundenspezifi sche Beratung
und Fortbildung, technologische
Dienstleistungen, Machbarkeitsstudien,
Herstellung von Prototypen und Kleinserien
sowie Serienproduktion in Kooperation
mit kommerziellen Partnern.
Current Results and Portfolios of Research Institutions
Institut für Mikro- und Informationstechnik
der Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
well as serial production in cooperation
with industrial companies. HSG-IMIT is
certifi ed after the new process oriented
management system ISO 9001:2000.
Areas of operation
Sensors & Systems
✦ Inertial Sensors
✦ Thermal Sensors
Microfl uidics
✦ Lab-on-a-Chip
✦ Microdosage Systems
Mikro Medical Technology
Energy Autonomous Systems
Prototyping & Production
✦ Wafer Technology
✦ Flexible Microsystems
✦ Assembly & Packaging
Das HSG-IMIT ist zertifi ziert nach dem
neuen prozessorientierten Managementsystem
ISO 9001:2000.
Arbeitsgebiete
Sensoren & Systeme
✦ Inertial Sensoren
✦ Thermische Sensoren
Mikrofl uidik
✦ Lab-on-a-Chip
✦ Mikrodosiersysteme
MikroMedizin
Energieautonome Systeme
Mikrotechnologie
✦ Wafertechnologie
✦ Flexible Mikrosysteme
✦ Aufbau & Verbindungstechnik
Ingenieurtechnische Dienstleistungen
✦ Modelling & Design
✦ Schadensanalytik
✦ Messplatzautomation
✦ Elektronische Systeme
Engineering Services
✦ Modelling & Design
✦ Failure Analysis
✦ Measurement Automation
✦ Electronic Systems
HSG-IMIT
Wilhelm-Schickard-Str 10
D – 78052 Villingen-Schwenningen
Phone +49(0)7721-943-0
Fax +49(0)7721-943-210
Mail info@hsg-imit.de
Web www.hsg-imit.de
83

Current Results and Portfolios of Research Institutions
Institute of Micro- and Nanotechnologies –
Technische Universität Ilmenau
“Technische Universität Ilmenau”, a technical
university in the heart of Germany,
represents a tradition of 110 years in
training and education of engineers.
It started in 1894 with the „Thüringer
Technikum“, a privately organised school
for mechanical and electrical engineering
that developed rapidly into a technical
university with more than 6,400 students
nowadays.
As the biggest institute within the university,
the interdisciplinary Institute of
Micro- and Nanotechnologies (IMN) has
now about 30 member-departments
from four faculties. The main fi elds of
interest focus on multiscale engineering,
i.e. nanotechnologies, microsystems,
micro-nano-integration, micro- and
picofl uidics, polymer electronics and
photovoltaics, materials research and
nanoanalytics.
Besides traditional master programmes
in electrical and mechanical engineering,
as well as materials science the faculties
also offer a joint master programme in
84
Fig. 1
Basic confi guration
for f nanoresonators
for f sensing
applications: a coupled
cantilever for physical
measurements
Micro- and Nanotechnologies. Lectures
from all faculties are part of this master
course that is intended for students with
a bachelor degree in engineering as well
as in physics or related courses.
Most of the technical equipment used
by the departments of the IMN is now
located in a central facility called Center
for Micro- and Nanotechnologies that
Fig. 2
Basic confi guration
for nanoresonators for
sensing applications:
bridge-type resonator
with cultivated
CHO-1 cells
was opened in 2002. It comprises of
about 700 m 2 clean room area and an
overall area of about 2000 m 2 . It also
hosts an S1-laboratory for biological
experiments and many further labs specialised
in different areas of nano- and
microtechnologies. About 110 scientists
and technicians use this facility for their
research.
Work is carried out on various material
systems: pyro- and piezoelectric semiconductors
for use in sensors, polymers
for solar cells or transistors, ceramics for
hybrid assemblies, and the whole range
of silicon technology to meet needs in
fl uidics, sensors and microactuators.
The picture is completed by analytical
equipment capable of carrying out
analysis down to the atomic level.
The integration of micro- and nanotechnologies
into systems is a key approach
of the IMN. Nanostructures are usually
too small for using them directly in
macrosystems with user interfaces. An
effi cient step is the multi-scale integration
of the new functionalities into microscale-based
subsystems that can be
equipped with an interface to our macroworld.
Due to the available technology
chain starting from nano- and microfabrication
and ending up in advanced
nanoanalytics and nanomeasurement
technologies the IMN offers the unique
opportunity to investigate micro-nano-integration
as a complex fi eld of research
at one location and in one facility. Interdisciplinary
expert groups are formed
individually depending on the scientifi c
research problems to be solved. The
administration of the IMN supports this

y an effi cient project management. For
external partners, the IMN is just one
partner although many research groups
may be involved in individual projects.
In the following some samples of micronano-integration
are shown for Nano-
Electro-Mechanical Systems based
on high resolution pattern transfer with
defi ned nano-scale structures, a new
Fig. 3
NEMS-chip with an
array of 128 independently
controlled
proximal scanning
probes
nanoscaled silicon – ceramic interface
and their possible applications of a selfmasking
process for assembly:
Besides the well-known MEMS – microelectro-mechanical
systems – now
NEMS – nano-electro-mechanical
systems – follow in research.
Resonators with dimensions down
to the nanoscale have been realised
successfully (fi g.1, 2).
On the other hand, a highly parallel
approach is investigated by another
group: it has demonstrated self-sensing
cantilevers for a variety of nanoscience
applications, and built a NEMS-chip
consisting of parallel arrays of up to 128
independently controlled proximal scanning
probes (fi g. 3).
Here, the small size of each component
together with a high level of system
integration leads to new, effi cient and
parallel sensing tools.
Furthermore, self-organising structures
are investigated: so-called Black Silicon,
a nano-scale silicon “grass” caused
by plasma etching and nanowires that
are grown on catalytic nanospots on
silicon. Both materials show unique new
properties that are now intensively investigated
(fi g. 4). Also research on carbon
nanotubes (CNT) is part of IMN research
activities (fi g. 5). These investigations are
especially catalysed by a large nanoanalytic
expertise within the institute.
Most of the projects are running in a
close cooperation between at least
two IMN-internal partners and external
partners in national and international
research programmes.
Here, only a small number of examples
can be mentioned from the broad range
Current Results and Portfolios of Research Institutions
Fig. 4
Black Silicon needles
with w
nanowires
connecting the tips
of the needles
Fig. 5
HRTEM picture of
a fullerene fi lled
nanotube
of research currently performed at the
IMN. For more details, please visit the
homepage at www.tu-ilmenau.de/imn.
The annual report is available in the
internet for downloading, as well. It addresses
more details on these topics as
well as the homepages of the 30 member
departments.
For any enquiry, please contact us:
Technische Universität Ilmenau
Prof. Dr. Martin Hoffmann
Institut für Mikro- und Nanotechnologien
Gustav-Kirchhoff-Straße 7
D – 98693 Ilmenau – Germany
Phone +49(0)3677-69-3402
Fax +49(0)3677-69-1840
Mail martin.hoffmann@tu-ilmenau.de
85

Current Results and Portfolios of Research Institutions
Ceramic Multilayer-based
Microelectromechanical Systems (C-MEMS)
Ceramic multilayer technology is currently
used to manufacture highly reliable
and highly integrated 3D circuit boards
for electronic packaging which can be
applied in telecommunications, automotive,
aerospace as well as in medical
industry.
Fraunhofer IKTS works on the extension
of the functionality of LTCC and
HTCC multilayer systems (Low/High
Temperature Cofi red Ceramics) in order
to further develop this technology for
the manufacturing of ceramic MEMS.
Die keramische Multilayertechnik wird
aktuell zur Herstellung hochzuverlässiger
und hochintegrierter 3-D-Verdrahtungsträger
für die Aufbau- und Verbindungstechnik
(AVT) der Elektronik verwendet.
Anwendungsgebiete liegen in den
Bereichen Automotive, Telekommunikation,
Luft- und Raumfahrt sowie Medizintechnik.
Das Fraunhofer IKTS arbeitet an der
Funktionserweiterung von LTCC- und
HTCC-Multilayersystemen (Low/High
Temperature Cofi red Ceramics), um diese
Technologie für die Herstellung von
keramischen MEMS nutzbar zu machen.
Zur Realisierung weiterer Funktionen
können beispielsweise zusätzliche Komponenten
wie Kanäle, Kammern, Balken
(Federn) oder Membranen integriert
werden. Derartige Strukturen lassen sich
auf einfache Weise erzeugen, indem ungesinterte
Einzelfolien mittels Mikrostrukturierungsverfahren
(Laser, Mikrostanzen,
Mikroprägen) mit Layer-spezifi schen
86
Additional functions can be integrated
by the implementation of e.g. channels,
chambers, cantilever or membranes.
Such elements can be simply realized
by structuring green tapes by laser techniques,
micropunching or microstamping.
Thus, structures can be obtained
that range in size from some 10 μm up
to the sub-mm scale. These differently
structured green tapes can be stacked
and laminated resulting in a complex 3D
geometry.
Due to their properties C-MEMS can be
used for various applications in the fi eld
Keramische Multilayer-basierte
Mikro-Elektro-Mechanische Systeme (C-MEMS)
Small, handy and cost-effective: the integrated
ceramic micro fuel cell.
Klein, handlich und kostengünstig: die integrierte
keramische Mikrobrennstoffzelle.
Strukturen versehen werden. Die somit
erreichbaren Strukturgrößen liegen im
Bereich einiger 10 μm und können bis
in den sub-mm-Bereich hineinreichen.
Durch Kombination verschieden strukturierter
Einzelfolien können komplexe
3-D-Geometrien aufgebaut werden. Mit
LTCC-based pressure sensors
LTCC-basierte Drucksensoren
Source/Quelle: Fraunhofer IKTS
of sensor technology (e.g. pressure,
force and acceleration), actuating technology
(adaptive microoptical systems),
microenergy technology (miniaturized
fuel cells), microreaction technology (labon-chip
systems) and chemical analysis
(cyclic voltammetry, electrophoresis).
dem dargestellten Eigenschaftsportfolio
bieten sich C-MEMS für vielfältige Anwendungen
in den Bereichen Sensorik
(z.B. Druck, Kraft und Beschleunigung),
Aktorik (adaptive mikrooptische Systeme),
Mikroenergietechnik (miniaturisierte
Brennstoffzellen), Mikroreaktorik (Lab-on-
Chip-Systeme) und chemische Analytik
(zyklische Voltammetrie, Elektrophorese)
an.
Fraunhofer-Institut für Keramische
Technologien und Systeme
Dr. Uwe Partsch
Winterbergstrasse 28
D – 01277 Dresden
Phone + 49(0)351-2553-513
Fax + 49(0)351-2554-161
Mail Uwe.Partsch@ikts.fraunhofer.de
Web http://www.ikts.fraunhofer.de

Current Innovations and Competencies
of Companies
Aktuelle Innovationen
und Kompetenzen aus Unternehmen

Current Innovations and Competencies of Companies
Small, Economical, and a Great Performer –
MEMS from Infineon Technologies
Infi neon Technologies offers semiconductors
and system solutions for
automotive, industrial electronics, chip
card and security, and communications.
The company has signifi cant expertise in
microsystems and is a leading provider
of innovative solutions based on
Micro-Electro-Mechanical-Systems. Its
MEMS portfolio consists of mechanical
and high-frequency MEMS, including
Infi neon’s „miniature“
MEMS microphone:
microphone cover
(above left), opened
microphone with
the MEMS and the
ASIC (above right)
and back view
(below).
Das „Miniatur“-
MEMS-Mikrofon
von Infi neon:
Deckelansicht (oben
links), geöffnetes
Mikrofon-Gehäuse
mit MEMS und ASIC
(oben rechts) and
Rückansicht (unten).
accelerometers, gyroscopes, pressure
sensors, Bulk Acoustic Wave (BAW)
fi lters, and silicon microphones. Infi neon’s
highly integrated MEMS products
benefi t our customers not only as a
result of cost-effi ciency – thanks to the
integration of a multitude of functions in
one device – but also from low power
consumption and high performance.
The automotive market still includes the
most important applications of MEMS.
One relatively new application is the Tire
Pressure Monitoring System (TPMS),
which is mandatory on all new cars sold
in the US. Infi neon made an early commitment
to TPMS technology. Infi neon’s
88
TPMS builds in the company’s extensive
know-how in sensors, radio-frequency
devices, and microcontrollers. The
incorporation of all major active functions
into a single package makes the system
a very cost-effective and highly reliable
solution. Infi neon is a market leader in
sensors and related integrated circuits
for automotive safety applications,
including TPMS, air bag, ABS, electronic
stability control and roll-over sensors.
Semiconductor-based MEMS also have
found their way into communication and
consumer applications. In 2006, Infi neon
introduced a silicon microphone that
has been optimized for use in mobile
phones.
The Infi neon silicon MEMS microphone
is unique because the company is the
only provider that combines MEMS and
ASIC expertise in one package and
offers the associated production skills
all from a single source. Compared to
conventional microphones, the major
advantages are the great resistance to
heat and the relative immunity to shock
and vibration. Using MEMS technology
makes it possible to equal the acoustic
properties of conventional microphones
while using only a third of the power
at half the size. Another benefi t is the
microphone’s enhanced and cost-reduced
manufacturability. The silicon microphone
is also suitable for automotive
and industrial applications and medical
applications.
MEMS are also used in BAW fi lters. The
BAW fi lter technology is semiconductorbased
and used for performance-critical
applications in cellular handsets. The
technology exploits the piezo-electric
resonator effect to generate Bulk Acoustic
Waves, and guarantees the reception
of the appropriate frequencies. The ongoing
rollout of high-speed 3G wireless
communication networks is spurring
interest in small, lightweight 3G mobile
phones, and fuelling a strong demand
for BAW fi lters. Infi neon is the numberone
supplier and volume leader for the
most advanced BAW fi lter products, and
supplies leading handset manufacturers
and RF module vendors.
Infi neon Technologies AG
Am Campeon 1-12
D – 85579 Neubiberg
Phone +49(0)89-234-65555
Web www.infi neon.com

Infi neon Technologies ist ein Anbieter
von Halbleiter- und Systemlösungen
für Automobil- und Industrieelektronik,
Chipkarten und Sicherheit sowie
Kommunikation. Das Unternehmen
verfügt über eine umfassende Expertise
bei Mikrosystemen und ist ein führender
Anbieter von innovativen Lösungen, die
auf mikroelektromechanischen Systemen
basieren. Das MEMS-Portfolio von
Infi neon besteht aus mechanischen
und Hochfrequenz-MEMS. Dazu zählen
unter anderem Beschleunigungsmesser,
Gyroskope, Drucksensoren, BAW-Filter
(Bulk Acoustic Wave) und Silizium-Mikrofone.
Die MEMS-Produkte von Infi neon
sind hochintegriert – die Kombination
mehrerer Funktionen auf einem einzigen
Bauteil liefert einen bedeutenden
Kostenvorteil. Des weiteren profi tieren
unsere Kunden vom geringen Stromverbrauch
und der hohen Leistungsfähigkeit
der Produkte.
Die Automobilindustrie ist nach wie vor
der wichtigste Anwendungsbereich
von MEMS. Eine relativ neue Applikation
ist das sogenannte Tire Pressure
Monitoring System (TPMS), ein System
zur Überwachung des Reifendrucks. In
den USA müssen alle Neuwagen mit
einem TPMS ausgestattet sein. Infi neon
hat bereits sehr früh auf die TPMS-
Technologie gesetzt. Das TPMS-Produkt
von Infi neon kombiniert Infi neons
umfassendes Know-how bei Sensoren,
Hochfrequenz-Chips and Mikrocontrollern.
Dadurch, dass alle wesentlichen
Komponenten in einem einzigen Gehäuse
integriert werden, ist das System
sehr kostengünstig und dazu äußerst
zuverlässig. Infi neon ist Marktführer bei
Sensoren und integrierten Schaltkreisen
für Sicherheitsanwendungen im Auto
wie zum Beispiel TPMS, Airbag, ABS,
elektronische Stabilitätskontrolle und
Überschlagsensoren.
Halbleiterbasierte MEMS haben auch in
Kommunikations- und Consumer-Anwendungen
Einzug gehalten. Infi neon
hat 2006 ein Silizium-Mikrofon auf den
Markt gebracht, das für den Einsatz in
Mobiltelefonen optimiert wurde. Das
MEMS-Silizium-Mikrofon ist einzigartig:
Infi neon ist der einzige Hersteller, der
seine Expertise bei MEMS und ASIC
in einem Gehäuse kombiniert und die
dazugehörigen Fertigungskompetenzen
aus einer Hand anbietet. Im Vergleich
zu herkömmlichen Mikrofonen zeichnet
sich das Silizium-Mikrofon von Infi neon
unter anderem durch eine hohe
Hitzebeständigkeit aus. Des weiteren
ist es vergleichsweise unempfi ndlich
gegenüber Erschütterungen und
Vibrationen. Dank der Nutzung der
MEMS-Technologie werden dieselben
akustischen Eigenschaften erreicht wie
Current Innovations and Competencies of Companies
Klein, wirtschaftlich und leistungsstark –
MEMS von Infineon Technologies
Tire T Pressure
Monitoring
Systems need
advanced
sensor,
controller
and RF IC
concepts.
Tire Pressure
Monitoring-
Systeme
brauchen
fortschrittliche
Sensor-,
Controllerund
RF-IC-
Konzepte.
bei herkömmlichen Mikrofonen. Gleichzeitig
ist das Silizium-Mikrofon nur etwa
halb so groß wie herkömmliche Mikrofone,
der Stromverbrauch liegt bei rund
einem Drittel. Ein weiterer Vorteil besteht
in der kostengünstigen Fertigung. Das
Silizium-Mikrofon ist auch für den Einsatz
in Automobil-, Industrie- und Medizinanwendungen
geeignet.
MEMS kommen auch in BAW-Filtern
zum Einsatz. Die BAW-Filter-Technologie
ist halbleiterbasiert und wird für leistungskritische
Anwendungen in Mobiltelefonen
eingesetzt. Die Technologie nutzt
den piezo-elektrischen Resonatoreffekt,
um akustische Volumenwellen zu erzeugen
und den Empfang der entsprechenden
Frequenzen sicherzustellen.
Durch den kontinuierlichen Ausbau von
3G-Mobilfunknetzen steigt das Interesse
an kleinen, leichten 3G-Mobiltelefonen
und folglich auch die Nachfrage nach
BAW-Filtern. Infi neon ist führend bei
modernsten BAW-Filtern und beliefert
führende Mobiltelefon-Hersteller und
Anbieter von RF-Modulen.
89

Current Innovations and Competencies of Companies
Microstructured Optics:
Small Dimensions – Great Benefits
Dr. Robert Brunner, Reinhard Steiner
Optical components with structural
sizes in the micrometer and sub-micrometer
ranges provide an extremely
high enabling factor for a wide variety of
applications, permitting functionalities
that would not otherwise be feasible in a
wide diversity of optical devices.
In spectral analysis devices, in particular,
diffractive structures in the form of dispersive
gratings featuring periodicities of
a few micrometers and profi le tolerances
in the order of a few nanometers are the
central, function-critical components.
In this fi eld, Carl Zeiss MicroImaging
GmbH offers its customers a range of
products customized to their requirements
and wishes – from individual,
microstructured components and
spectrometer modules up to complete
application solutions.
A decisive success factor is the ability to
master the entire product chain.
The most important processes in the
concept and development phases of
micro-optical systems are the optics
design, the rigorous electromagnetic
modeling of the micro-optical structures,
the thermomechanical system analysis
and the production chain of the microstructured
components comprising
the mastering, tooling and replication
processes.
In particular, compact spectrometer
modules requiring a very small number
of optical components can be implemented
on the basis of self-focusing,
concave refl ection gratings. These
concave gratings combine dispersing
and imaging properties, which means
that the light is separated into its spectral
90
Range of gratings
from Carl Zeiss
Gittersortiment
von Carl Zeiss
constituents and is at the same time imaged
onto a focal array.
To ensure high fl exibility and the fast
implementation of customer-specifi c
requirements on imaging spectrometer
modules, the close coupling of technology
and optics design is of vital importance.
In addition to the actual design
of the spectroscopic system, the optics
designer also defi nes the exposure
confi guration for the implementation of
the imaging grating.
Replication technologies based on
epoxy resin replicas are used for highquality
grating copies. This replication
method provides both extremely high
accuracy in the local profi le geometry
and outstanding global precision to
achieve the imaging performance of the
concave grating.
Alternative production methods are used
to make spectrometer modules available
in large quantities and at an economy
price. In this process, the concave
grating produced by interference optical
methods is transferred to stable, convex
tools. Injection molding technology is
used for volume production not only of
the diffraction grating, but also its housing.
During the development of the production
method for these modules, the
alignment and assembly of the components
are already taken into account at
the design stage. The thermal behavior
is simulated and optimized using FEM
analysis on the basis of different plastic
materials.

Optische Komponenten mit Strukturgrößen
im Mikro- und Submikrometerbereich
besitzen einen sehr hohen
„Enabling -Faktor“ für vielfältige Anwendungsbereiche
und erlauben in verschiedensten
optischen Instrumenten Funktionalität
die ansonsten nicht erfüllbar
wären.
Insbesondere bei Instrumenten zur spektralen
Analyse bilden diffraktive Strukturen
als „dispersive Gitter“, mit Perioden
von wenigen Mikrometern und Profi ltoleranzen
von wenigen Nanometern,
das zentrale und funktionsbestimmende
Element.
In diesem Umfeld bietet die Carl Zeiss
MicroImaging GmbH ihren Kunden maßgeschneiderte,
an die Forderungen und
Wünsche angepasste Produkte. Diese
reichen von einzelnen mikrostrukturierten
Komponenten, über Spektrometer-Module
bis hin zu kompletten applikativen
Lösungen.
Ein entscheidender Erfolgsfaktor ist
dabei die Beherrschung der kompletten
Produktentstehungskette.
Die wichtigsten Werkzeuge in der Konzeptions-
und Entwicklungsphase der
Possible
grating
profi les
Mögliche
Gitterprofi le
Current Innovations and Competencies of Companies
Mikrostrukturierte Optik:
kleine Dimensionen – große Nutzen
mikrooptischen Systeme sind dabei
das Optik-Design, die rigorose elektromagnetische
Modellierung der mikrooptischen
Strukturen, die mechanischthermische
Systemanalyse, sowie die
Herstellungskette der mikrostrukturierten
Elemente, die „Mastering-“, „Tooling-“
und Replikationsprozess beinhaltet.
Besonders kompakte Spektrometermodule,
die eine sehr geringe Anzahl
optischer Komponenten benötigen,
lassen sich auf der Basis selbstfokussierender,
konkaver Refl exionsgitter
realisieren. Das Konkavgitter vereinigt
dabei dispergierende und abbildende
Eigenschaften, d.h. das Licht wird vom
Gitter in seine spektralen Bestandteile
zerlegt und gleichzeitig auf eine Fokuszeile
abgebildet.
Um eine hohe Flexibilität und schnelle
Umsetzung kundenspezifi scher Wünsche
von abbildenden Spektrometermodulen
zu gewährleisten, ist eine enge
Kopplung zwischen Technologie und
Optikdesign unerlässlich. Neben der
Festlegung des Gerätekonzepts des
spektroskopischen Systems, defi niert
der Optikdesigner auch die Belich-
tungskonfi guration zur Realisierung des
abbildenden Gitters.
Für hochwertige Gitterkopien werden
Replikationstechnologien auf der Basis
von Epoxydharzabformungen angewendet.
Dieses Kopierverfahren erlaubt
extrem hohe Genauigkeiten sowohl im
lokalen Bereich der Profi lgeometrie als
auch eine hohe globale Exaktheit um die
Abbildungsleistung des konkaven Gitters
zu erzielen.
Um Spektrometermodule in hohen
Stückzahlen und kostengünstig zur
Verfügung stellen zu können, werden
alternative Herstellungsverfahren verwendet.
Dabei wird das interferenzoptisch
realisierte Konkavgitter in stabile konvexe
Werkzeuge überführt. Für die Serienfertigung
kommt die Spritzguss-Technologie
sowohl für das Beugungsgitter als auch
für das Gehäuse zum Einsatz. Bei der
Entwicklung des Fertigungsverfahrens für
diese Module werden die Justierung und
Montage der Komponenten schon im
Design berücksichtigt. Das thermische
Verhalten wird mittels FEM-Analysen
unter Berücksichtigung verschiedener
Kunststoffe simuliert und optimiert.
Carl Zeiss MicroImaging GmbH
Optical Sensor Systems
Carl Zeiss Promenade 10
D – 07745 Jena
Phone +49(0)3641-64-2838
Fax +49(0)3641-64-2485
Mail info.spektralsensorik@zeiss.de
Web www.zeiss.de/spektral
91

Current Innovations and Competencies of Companies
TRIPLE Gas Sensor Module – The artificial nose module
Gas sensor arrays are used e.g. in the
air quality monitoring, the leak detection,
the location of smouldering underground
fi res, the detection of dangerous gas air
mixtures or the detection of the lower
explosive limit (LEL).
The patented TRIPLE gas sensor
element of UST Umweltsensortechnik
GmbH (DE 102004060101 B4 / DE
102006033528 B3) measures the concentration
of various types of gases from
the lower ppm range to the Vol% range.
The gas sensor element with three metal
oxide layers (MOS) in innovative interconnection
on one chip realise together
with a miniaturized electronic module
a reasonable-priced gas detector with
highest sensitivity, selectivity and long
term stability. The operation principle is
based on changes of the conductivity of
a heated sensor element during the exposure
of gases. The electronic module
realise the pre-processing of the sensor
signals and the data output through a
digital interface. Safety-relevant functionality,
like error detection during the
measurement process is integrated. The
factory-made customization to various
measurement applications is possible.
92
TRIPLE
gas sensor
module
Exemplary
measurement
of three different
refrigerants and H 2
UST Umweltsensortechnik GmbH,
established in 1991, is a successful
German medium sized company, recognised
internationally as a leading manufacturer
of innovative ceramic sensor
technology. The leading position of the
company is based on the visionary as
well as market-driven development and
production of ceramic sensor elements
for gas and temperature measurements,
together with innovative measuring
instruments.
Product range:
✦ MOS gas sensor elements and
arrays for the detection of CO, H2, C2H5OH, CH4, NO2, O3, NH3, Hydrocarbons
(CxHy), R134a etc.
✦ Platinum temperature sensors elements
from -200°C to +1000°C
(Pt10… Pt2000), also according to
DIN EN 60751
✦ Custom designed semi-fi nished
temperature probes from -100°C
to +1000°C (screw-in temperature
probes, plug-in temperature probes,
immersion temperature probes)
✦ Portable gas detectors for the quick
and selective detection of gases,
like H2, CH4 etc., microdetectors for
the stationary application to detect
concentrations of combustible gases
in the range of a few ppm up to the
LEL in %
✦ Portable gas detector for CO2
based
on a patented photo acoustical operation
principle (DE 19957364 B4)
Main application fi elds of the products
are automotive engineering, industrial
process measurement, energy and
environmental technology, safety and
medical engineering.
UST Umweltsensortechnik GmbH is certifi
ed according to ISO/TS 16949:2002,
DIN EN ISO 14001:2005, ATEX RL
94/9/EG Annex IV DIN EN 13980:2003.
UST Umweltsensortechnik GmbH
Dr. Olaf Kiesewetter
Dieselstr. 2
D – 98716 Geschwenda
Phone +49(0)36205-713-0
Fax +49(0)36205-713-10
Mail info@umweltsensortechnik.de
Web www.umweltsensortechnik.de

Greiner Bio-One is specialised in the
development, design and manufacturing
of disposables for medical applications,
diagnostics and biotechnology. Generic
and proprietary resins are used to
produce catalogue items dedicated to a
wide range of laboratory applications as
well as customised products. The preferred
manufacturing technology is injection
moulding where the hot polymer is
injected into the mould. Based on the
intended application additional process-
es are often applied to treat the surface
for increased wettability or enhanced
attachment of biological probes.
Scientists and engineers from all areas
of biology, chemistry and physics are
working together on the development
of new products and solutions for a
high quality manufacturing process.
Long-term expertise is the backbone to
meet exactly our customer‘s needs as a
generic product or co-developed as an
OEM product. The complete in-house
service at Greiner Bio-One includes
material selection, design, manufacture,
assembly and surface treatment.
As further miniaturisation was requested
Greiner‘s expertise in injection moulding
was a reliable basis to enter into hot embossing
to generate microfl uidic devices
in the micro- and sub-microliter range.
The advantage of microfl uidic channels
is based on a major reduction of reagents
in combination with speed. Test
results are available within a fraction of
time compared to conventional assays
Current Innovations and Competencies of Companies
Microfluidics for your Health
Microchannels
interconnected
to funnel-like
reservoirs were
produced in a
single step.
due to the tiny and short fl ow channels.
In general, these microchannels are
approximately 100 to 500 μm wide and
10 to 500 μm deep and connected inlet
funnels and waste reservoirs in a millimetre
scale. A major challenge amongst
others is the assembling technology and
a surface functionalisation.
But hot embossing with a very long
cycle time makes this technology really
unattractive for mass production and it
became obvious to adapt the product
design to injection moulding and to overcome
the major restrictions in unequal
feature sizes to produce the device in a
single step. The successful combination
of a reliable manufacturing process and
well known polymers makes the microfl
uidic devices ideal for diagnostic chips
in single use applications.
As a consequence, our HTA TM platform
was created to establish DNA-based diagnostics
on a plastic chip. DNA-markers
are spotted onto the treated surface
to allow genotyping of a large variety
of bacteria or viruses simultaneously.
Meanwhile, a combination of biochips
and microfl uidic devices is used for
point-of-care (POC) testing. This procedure
allows on-site testing, gives faster
results, is easy to handle and patients
can be treated right away.
Many applications can be realised using
microfl uidics, where the diagnostic fi eld
is the most fascinating amongst others.
Based on our experience, we can provide
innovative solutions, tailor-made for
your requirements.
Greiner Bio-One GmbH
Maybachstraße 2
D – 72636 Frickenhausen
Phone +49(0)7022-948-0
Fax +49(0)7022-948-514
Mail info@de.gbo.com
Web www.gbo.com/bioscience
93

Current Innovations and Competencies of Companies
Plan Optik AG
Advanced wafers for sophisticated MEMS applications
As a result of many years of experience
in glass processing, comprehensive
technological know-how and an innovative
way of thinking, Plan Optik AG
is able to offer novel products for the
MEMS market. Plan Optik AG, the world
market leader in glass wafer production
for MEMS applications, set the
benchmark for best possible glass wafer
surfaces. All wafers are characterized by
low thickness tolerance, low roughness
and high surface quality.
The introduction of MDF
(Micro Damaging Free) polished
wafers to the market
opened the possibility of
reliable wet etching results
in glass wafers due to the
absence of sub surface
damaging, which leads to
undesirable small cavities
or interconnections between
etched structures.
Besides blank glass wafers
structures in glass are
possible as well. USHD
(ultra sonic high speed
drilled) through holes
or optical cavities in the
wafer surface are typical
products. Another kind of
product are plano-convex
as well as plano-concave
micro lenses in glass. The
combination of such kind
of glass micro lenses to
complex lens systems on
wafer level are one of the
key technologies in future
for packaging of camera
modules in laptops, mobile
phones or in the automo-
94
tive or security market. The combination
of lenses to complex lens stacks is currently
under development.
Since the beginning of MEMS fabrication,
borosilicate glass plays an important
role for MEMS products, because
borosilicate glass is suitable for anodic
bonding with silicon. Both materials have
preferences concerning their machining
and properties and the combination
of silicon and glass is very popular for
countless MEMS products. The specifi c
properties of glass, especially the optical
transparency, the chemical resistance
and electrical insulation, are useful for
the realization of innovative ideas for
new and sophisticated MEMS applications.
The adapted thermal expansion
of borosilicate glass to silicon supports
the combination of both materials.
Today, glass wafers are usually used
Micro lens camera
module in glass with
silicon aperture fabricated
on waferlevel
Through holes in
glass wafer produced
by ultra sonic
high speed drilling
for vacuum sealed
packaging of MEMS
structures to protect
them against dust or
humidity. The growing
trend of wafer level
packaging leads to
an economic production
of MEMS, but
demands suitable
substrates to put new
ideas of MEMS packaging
on wafer level
into practice. Similar
to the research on 3D
interconnects instead
of planar 2D interconnects
regarding
chip size reduction of
integrated circuits (IC),
3D MEMS packaging
also provides many
advantages such as
smaller footprint and
SMT compatibility.
The basic necessity
and challenge of 3D
MEMS packaging
are electrical through
wafer vias which are
often realized by met-

al fi lled DRIE etched holes
in silicon with high aspect
ratio using metal deposition
and electroplating, but
this approach has technical
diffi culties like voids and
mismatched thermal expansion
of silicon and metal.
For non-RF MEMS applications
highly doped silicon
is an acceptable material
alternative for electrical vias
used for voltage supply and
signal transmission.
In this regard Plan Optik
AG developed a unique
technology to combine
silicon and glass for a new
kind of wafer, which allows
new possibilities for MEMS
fabrication and packaging.
These silicon-glass compound
wafers are a mixture of both materials
in one wafer and the composition
of glass and silicon can vary in a wide
range. The main application of these wafers
is wafer level packaging. For this application
different types of silicon-glass
compound wafers are available which
support electrical, vertical vias. Highly
doped silicon is used to achieve small
pins with low resistance, whereby glass
wafers with single vias or silicon wafers
with glass inlets including several silicon
vias are possible. The glass material (insulator)
supports the electrical insulation
of the vertical vias and for redistribution
lines on the wafer surface and offers
possibilities for additional features like
optical windows or cavities. The shape
of silicon inlets in glass wafers and vice
versa is almost free of design rules, only
the minimal structure size is limited to
approximately 50 microns by a typical
wafer thickness between 300 and 400
microns.
These wafers can be used in two different
versions: as cap wafers and as device
wafers. Using a silicon-glass compound
wafer as a cap wafer combines
environmental protection and electrical
connection at the same time. The minimization
of the via resistance is possible
by thinning the cap wafer after bonding
to the device wafer down to less than
100 microns. Using these wafers as
bulk substrates for the device wafer
enables the implementation of through
wafer vias within the MEMS device. In
this case it’s necessary to take account
Current Innovations and Competencies of Companies
Silicon-glass
compound wafer
– glass wafer with
silicon inlets
Silicon-glass
compound wafer
– glass wafer with
highly doped silicon
vias
of process temperatures
regarding the
following process
fl ow. Besides a few
marginal conditions
such as a maximum
process temperature
of 500 degrees
centigrade caused by
the temperature resistance
of the glass,
there are no other relevant
process restrictions
in comparison to
traditional processes.
Since there are
process alternatives
(e.g. Replacing high
temperature LPCVD
layers by PECVD
layers), the design
freedom is restricted
only insignifi cantly.
All packaged devices are SMT compatible
and ready for 3D micro system
integration. Full 3D packaging of MEMS
is possible on wafer level using these
advanced wafers to get all advantages
regarding size reduction and vertical
packaging and stacking of MEMS and
electronic parts like ASIC or IC parts by
fl ip chip bonding.
Plan Optik AG
Ueber der Bitz 3
D – 56479 Elsoff
Phone +49(0)2664-5068-0
Fax +49(0)2664-5068-91
Mail info@planoptik.com
Web www.planoptik.com
95

Current Innovations and Competencies of Companies
Micro Mechatronic Technologies GmbH
Mittels modernster Rapidtechnologien können wir innerhalb
kürzester Zeit Prototypen und Serien herstellen. Unsere Experten
kümmern sich um Messtechnik und Qualitäts sicherung und
entwicken für Sie die optimale Anwendungslösung.
Produkte
Wir entwickeln und produzieren mikromechatronische Geräte
für verschiedenste Anwendungsbereiche.
Als Standardprodukt oder nach Kundenwunsch
✦ Mikro-Aktoren
✦ Mikro-Dosierpumpen
✦ Mikro-Sensoren
✦ Mikro-Schalt- und Absperrventile
✦ Steuerungsmodule
✦ Heiz- und Kühlelemente
Dienstleistungen
Wir verfügen über alle Möglichkeiten, mechanische und mikromechatronische
Bauteile, Geräte, Prototypen und Produkte für
Klein-, Vorserien, Serienanlauf und als Serie herzustellen.
Für uns oder für Ihren Bedarf
✦ Lasersintern
✧ Metall ✧ Polyamid ✧ Flex
✦
96
Vakuumgießen
✦ Spritzgießen
✧ Kunststoffe
✦ mechanische ✧ bohren ✧ drehen ✧ lasern
Präzisionsbearbeitung ✧ fräsen ✧ schleifen
✦ 3D Messen
✧ Grauwert ✧ tastend
✧ Lasertriangulation
✦ Montage
Systeme
Wir suchen bessere Technologien für Ihr Produkt und konzipieren
Ihre Produkte neu mit mikromechatronischen Komponenten.
Besser, kleiner, schneller völlig anders.
Sparen Sie Raum, Zeit, Material und Kosten.
Wir entwickeln und planen für Sie.
Wir analysieren die Wett bewerssituation und die Umsatzaussichten
für Ihr neues Produkt oder für Ihr neues Unternehmen.
✦ komplette Businessplanung
✦ neue Technik / Infrastruktur / Zulieferindustrie
Die Produkte, die uns in der Zukunft umgeben, werden so klein
sein, wie die Funktion der Dinge es zulässt.
MMT Micro Mechatronic
Technologies GmbH
IHW-Park Gebäude M1
Eiserfelder Straße 316
D – 57080 Siegen
Phone +49(0)271-31382-100
Fax +49(0)271-31382-222
Mobil 0170-315 4818
Mail info@micromechatronic.com
Internet www.micromechatronic.com

Due to increasing demands on performance
and competitiveness of industrial
plants the integration of condition and
process monitoring systems into machines
and their components gain more
and more in importance. Especially the
measurement of physical values such
as temperature, force, momentum,
acceleration, etc. on rotating or moving
objects with wireless energy supply and
data communication is of high interest.
The company pro-micron GmbH & Co.
KG, located in Kaufbeuren in Southwest
Bavaria, is specialized on development
and fabrication of wireless condition and
process monitoring systems for use in
engineering and factory automation.
Pro-micron systems are based on micro
system technology and are therefore
very small in size, quite robust and have
low energy consumption. Therefore, the
systems can easily be integrated into
machines and withstand harsh environments.
One example for a pro-micron development
is a tool holder with an integrated
sensor system for measuring forces and
momentums during a drilling or milling
process. The whole sensor system
including sensing elements, highly
Current Innovations and Competencies of Companies
Intelligence in Engineering and Factory Automation –
Customized Wireless Micro Systems for Condition and Process Monitoring
miniaturized electronics, power supply
and modules for radio communication
is fi tted onto the tool holder. With the
sensor system the machining process
can be monitored online due to data are
sent from the tool holder wireless to the
machine control unit. As a result, the
process can be monitored continuously
and enables a process optimization.
With pro-micron’s highly sophisticated
micro systems basically any physical
parameter can be measured on rotating
or moving subjects allowing a comprehensive
monitoring of the condition of a
machine and their components as well
as the machining processes. Active
systems using a battery or an accumulator
as well as passive systems with
permanent wireless energy supply using
inductive coupling are available. Sensor
systems based on new SAW (surface
acoustic waves) sensor technology are
currently being developed and should
be available soon.
In not every case a permanent transmission
of data is required. For these
applications pro-micron developed
mobile data loggers with which physical
parameters are continuously measured
and in the fi rst instance are written in a
non-volatile memory. Afterwards, the
data will be transmitted on customer
request to the control unit and analysed
there. Again the used micro technology
allows a customer specifi c solution
optimized for the application in mind.
Additional pro-micron was appointed by
the German ministry for education and
research as an offi cial application centre
for micro systems with the focus on
bringing micro technical innovations into
solutions ready to go for industrial production.
As a conclusion pro-micron can
offer the service you need “from idea to
product” out of one hand.
pro-micron GmbH & Co. KG
Applikationszentrum
hybride Mikrosysteme
Innovapark 20
D – 87600 Kaufbeuren
Phone +49(0)8341-9164-10
Fax +49(0)8341-9164-20
Mail info@pro-micron.de
Web www.pro-micron.de
97

Current Innovations and Competencies of Companies
First Check the Production Machine,
then Measure the Finished Part
Carl Zeiss Industrielle Messtechnik is a partner in the development
of a micro test workpiece for 5-axis micro-milling machines.
OBERKOCHEN/Germany – 17 September
2007.
In the future, a standard test workpiece
will make it easier to check the accuracy
of a 5-axis micro-milling machine. Carl
Zeiss Industrielle Messtechnik GmbH
in Oberkochen, the Ulm-based company
NC-Gesellschaft e.V. and the wbk
Institute for Production Technology at
the University of Karlsruhe are currently
developing a high precision device of
this type.
Carl Zeiss Industrielle Messtechnik
produced the draft of a micro test workpiece.
It contains all critical geometric
features and also freeform surfaces to
allow the verifi cation and acceptance of
the capabilities of a 5-axis micro-milling
machine. Special elements serve to
determine the interaction and interpolation
accuracy of three axes and the
orientation accuracy of the cutter. The
interaction of all fi ve axes can be tested
in a “crater”. The further enhancement
and optimization of the test piece will
be performed together with micro-milling
machine manufacturers. The goal is
to guarantee the suitability of the future
NCG-2007 test workpiece for practical
use.
F25 from Carl Zeiss as a reference
measuring machine
The reference machine for accuracy
verifi cation is the F25 multisensor coordinate
measuring machine from Carl Zeiss
Industrielle Messtechnik which is already
used by institutes and companies all
over the world. This friction-free 3D coordinate
measuring machine supported
on air bearings has a measuring volume
98
of one cubic decimeter – the draft of the
micro test workpiece was produced with
features in the dimensions of 90 x 90
millimeters accordingly. With a resolution
of 0.25 nanometers, the F25 makes it
possible to conduct tactile measurements
with minimum probing forces and
with a deviation of 250 nanometers.
current test workpiece
with geometric features
for the accuracy verifi cation
of 5-axis micro-milling
machines.

OBERKOCHEN – 17. September 2007.
Künftig soll ein Standardprüfwerkstück
es erleichtern, die Genauigkeit einer
5-Achsen-Mikrofräsmaschine zu überprüfen.
Zurzeit entwickeln die Oberkochener
Carl Zeiss Industrielle Messtechnik
GmbH, die Ulmer NC-Gesellschaft
e.V. und das wbk Institut für Produktionstechnik
der Universität Karlsruhe ein
solches Präzisionsteil.
Die Carl Zeiss Industrielle Messtechnik
fertigte den Entwurf eines Mikroprüfwerkstücks.
Es enthält alle kritischen
Geometriemerkmale und auch Freiformfl
ächen, um die Fähigkeiten einer 5-Achsen-Mikrofräsmaschine
nachzuweisen
und abzunehmen. Spezielle Elemente
dienen dazu, das Zusammenspiel und
Current Innovations and Competencies of Companies
Erst die Fertigungsmaschine prüfen,
dann das fertige Teil messen
Carl Zeiss Industrielle Messtechnik ist Partner bei der Entwicklung
eines Mikroprüfwerkstücks für 5-Achsen-Mikrofräsmaschinen
die Interpolationsgenauigkeit von drei
Achsen und die Orientierungsgenauigkeit
des Fräsers zu bestimmen. In einem
„Krater“ lässt sich das Zusammenspiel
aller fünf Achsen testen. Die weitere
Ausarbeitung und Optimierung des
Prüfkörpers wird zusammen mit Herstellern
von Mikrofräsmaschinen erfolgen.
Damit soll die Praxistauglichkeit des
zukünftigen Prüfwerkstücks „NCG-2007“
gewährleistet werden.
F25 von Carl Zeiss als Referenzmessgerät
Referenzgerät für den Genauigkeitsnachweis
ist das bereits bei Instituten
und Firmen weltweit eingesetzte
Multisensor-Koordinatenmessgerät F25
der Carl Zeiss Industriellen Messtechnik.
Dieses luftgelagerte, reibungsfrei
aufgebaute 3D-Koordinatenmessgerät
hat ein Messvolumen von einem
Kubikdezimeter – entsprechend wurde
der Entwurf des Mikroprüfwerkstücks mit
seinen Merkmalen in den Abmessungen
90 x 90 Millimetern hergestellt. Die F25
ermöglicht es, bei einer Aufl ösung von
0,25 Nanometern mit kleinsten Abtastkräften
taktil bei einer Abweichung von
250 Nanometern zu messen.
Carl Zeiss Industrielle
Messtechnik GmbH
D – 73446 Oberkochen
Phone +49(0)7364-20-3539
Fax +49(0)7364-20-4657
Mail lindmayer@zeiss.de
Web www.zeiss.de/imt
Das aktuelle Prüfwerkstück
mit Geometriemerkmalen
für den
Genauigkeitsnachweis
von 5-Achsen-Mikrofräsmaschinen.
99

Current Innovations and Competencies of Companies
Micro-Processing Materials with Industrial Picosecond Lasers
Thousands of Nd-Lasers are manufactured
every year for industrial applications:
Spot-welding car bodies, cutting
thin steel plates, drilling via-holes in
PCBs, marking wafers or personalizing
golf clubs.
The laser radiation often consists of
pulses with microsecond or nanosecond
duration focussed on a small spot
where the laser heats the material very
fast, melts and vaporizes it.
The negative side-effects of these thermal
processes are micro-cracks, burrs
and recast, which are unacceptable in
high quality micro-machining applications.
It has been known for decades that
ultra-short laser pulses can be used to
avoid these side-effects and allow for
higher quality micro-processing. Until
recently, picosecond- and femtosecond-lasers
were complex, sensitive,
expensive and bulky.
100
LUMERA LASER, a manufacturer of
ultrashort pulse lasers, for the fi rst time
demonstrated an industrially packaged
reliable picosecond laser: The
2,5 W RAPID. It is sealed and thermally
stabilized and the software allows to preprogram
different pulse sequences with
variable delay. These sequences can be
internally triggered with repetition rates
up to 500 kHz or by external TTL pulses,
which makes integration into machining
systems very easy.
Even at 500 kHz repetition rate, the
RAPID provides suffi cient pulse energy
to surpass the ablation threshold. It is
very cost effi cient, with the total cost of
ownership only in the order of 8 Euros
per hour.
LUMERA LASER also offers a 10 W amplifi
ed version of the RAPID that combines
the unrivalled new trigger capabilities
and the 500 kHz rep rate with higher
average power: The SUPER RAPID of-
fers more than 4x the pulse energy for
a price not even 40 % higher than the
2,5 W RAPID. SUPER RAPID means
increased throughput and higher cost
effi ciency. Options for 532 nm, 355 nm
and 266 nm are available for both the
2,5 W and 10 W version.
A new HYPER RAPID with 50 W average
power and repetition rates up to 1 MHz
is going to be launched soon.
LUMERA LASER´s application lab demonstrated
high quality micromachining on
hundreds of materials with application
engineers determining process parameters
for optimized quality.
Generally an energy density of about 1J
per cm² is appropriate for high quality
micromachining by “cold” ablation with
good throughput.
With a 10 W laser, up to 1 mm³ of different
materials can be removed by ablation
within one minute for a total cost of
about 0.20 Euro.
A 30 W prototype removed >10 mm³
of material per minute, using a special
burst mode!
Recently, a new effect with high industrial
potential was reported: Crack-free
micro-welding of glass has been successfully
demonstrated with a RAPID
ps-laser with high process speeds
(Miyamoto et.al., LAMP 2006).
LUMERA-LASER GmbH
Opelstraße 10
D – 67661 Kaiserslautern
Phone +49(0)6301-703-180
Fax +49(0)6301-703-189
Mail info@lumera-laser.com
Web www.lumera-laser.com

Moving the Nano World
Precision Positioning and Linear Drive Technology
As a global market leader Physik Instrumente (PI) has been developing
and manufacturing products in the fi eld of micro- and
nanopositioning technology for more than 35 years.
A great variety of piezo-driven positioning systems is available
as standard, custom or OEM products. PI positioning systems
like translation/rotation stages, PIFOC® microscope objective
positioners, tip/tilt mirrors for beam steering, and 6-axis hexapods
are characterized by their quality and innovation. They
are used in various application areas such as optics/photonics,
metrology, semiconductor technology, inspection systems,
biotechnology and medical devices. PI employs more than
450 staff worldwide and maintains sales, support and service
Examples for
high-precision
nanopositioning
systems for up
to six degrees
of freedom
Beispiele
hochpräziser
Nanopositioniersysteme
für
Bewegungen
in bis zu sechs
Freiheitsgraden
Präzisions-Positioniersysteme und Linearantriebe
Physik Instrumente (PI) nimmt seit mehr als 35 Jahren eine
Spitzenstellung auf dem Weltmarkt für hochpräzise Positioniertechnik
ein. PI entwickelt Standard- und OEM-Produkte
vornehmlich auf Basis von Piezoaktorik: Linear-/Rotationstische,
PIFOC® Proben- und Objektiv-Positionierer für die
Mikroskopie, Piezo-Kippspiegel zur optischen Strahlführung,
Linear antriebe für bis zu 6-achsige Hexapoden. Die hochwertigen
Positioniersysteme und Linearantriebe werden in den
verschiedensten Anwendungen eingesetzt, darunter Optik &
Photonik, Laserbearbeitung, Halbleiterfertigung, Inspektions-
Current Innovations and Competencies of Companies
offi ces in Germany, the USA, England, France, Italy, Japan
and China. In addition, PI has representatives in many other
countries around the world.
systeme, Biotechnologie logie und für Medizingeräte Medizingeräte. Piezoelekt
rische Aktoren ermöglichen Aufl ösungen im Sub-Nanometerbereich
bei Ansprechzeiten von wenigen Millisekunden. Die
klassische Nanostelltechnik nutzt im Bereich weniger Millimeter
genau diese Eigenschaften.
Piezolinearantriebe, die von PI entwickelt und eingesetzt
werden, bieten darüber hinaus unbegrenzte Stellwege. Die
verschiedenen Technologien wie Schreitantriebe oder Ultraschallmotoren
besitzen dabei unterschiedliche Eigenschaften
hinsichtlich der Krafterzeugung, Geschwindigkeit und Präzision.
Allen diesen Antriebsprinzipien ist gemein, dass sie im
Ruhezustand selbsthemmend sind und daher keine Halteströme
benötigen. Sie sind kompakt, prinzipiell vakuumkompatibel
und erzeugen keine Magnetfelder bzw. sie werden von diesen
auch nicht beeinfl usst.
Physik Instrumente (PI) GmbH & Co. KG
Auf der Römerstrasse 1
D – 76228 Karlsruhe
Phone +49(0)721-4846-0
Fax +49(0)721-4846-100
Mail info@pi.ws
Web www.pi.ws
Piezo linear drives
offer different levels of
integrations: RodDrive
(lower left corner), XY
open-frame stages and
Hexapods
Piezolinearantriebe
in verschiedenen
Integrationsstufen: Vom
RodDrive (unten links)
über XY-Kreuztische bis
hin zu Hexapoden
Wir öffnen Nanowelten
101

Current Innovations and Competencies of Companies
The Micro System Analyzer –
an All-In-One Measurement Workstation for Complete
3-D Characterization of MEMS Dynamics and Topography
The Polytec MSA-500 Micro
System Analyzer is the premier
measurement technology
for the analysis and visualization
of structural vibrations
and surface topography in micro
structures such as MEMS
(Micro-Electro-Mechanical
Systems) devices. By fully
integrating a microscope with
Scanning Laser-Doppler
Vibrometry for fast, broadband,
out-of-plane dynamics,
Stroboscopic Video Microscopy
for in-plane motion and
White Light Interferometry for
high resolution topography,
the MSA-500 is designed as
an all-in-one combination of
technologies that clarifi es real
microstructural response and topography.
These technologies are integrated
into a compact, robust and reliable all-inone
measurement head.
Non-Contact Measurements on Microstructures
The MSA-500 Micro System Analyzer
series was developed expressly for
dynamic and static analysis of microstructures
such as MEMS (or MOEMS)
devices. These devices fi nd numerous
applications in the automotive, medical,
biochemical and aeronautic industries.
As a consequence of this wide spread
usage, standardized MEMS testing is
essential for both packaged and unpackaged
devices (single die and waferlevel
testing). For wafer-level testing,
the MSA-500 can easily be mounted
onto manual or fully automated probe
stations.
102
Incorporated in the MEMS design and
test cycle, the MSA-500 provides
precise 3-D data for dynamic response
and static topography that simplifi es
troubleshooting, enhances and shortens
design cycles, improves yield and performance,
and reduces production cost.
Find All Mechanical Resonances
without A-Priori Information
Using wide-band excitation, the highly
sensitive Laser-Doppler technique can
rapidly fi nd all mechanical resonances
(in-plane and out-of-plane) without
a-priori information (a pure machine
vision system could only measure at
user-defi ned, discrete frequency points
with single-frequency excitation). In a
second step, the stroboscopic video
microscopy technique is used to obtain
accurate amplitude and phase information
of in-plane resonances identifi ed by
laser vibrometry.
Convincing Benefi ts
✦ Rapid identifi cation and visualization
of both system resonances and
static topography
✦ Integrated microscope optics with
optimized optical path for best lateral
resolution and highest image quality
✦ Easy integration with MEMS/wafer
probe stations
✦ Simple and intuitive operation, measurement
ready within minutes
✦ Increased productivity through short
measurement cycle
✦ Accelerates product development,
troubleshooting and time-to-market
Polytec GmbH
Polytec-Platz 1-7
D – 76337 Waldbronn
Phone +49(0)7243-604-0
Fax +49(0)7243-699-44
Mail info@polytec.de
Web www.polytec.com

Current Innovations and Competencies of Companies
Der Micro System Analyzer – eine All-in-one Messstation
zur vollständigen 3D-Charakterisierung der dynamischen
Eigenschaften und der Topografie von MEMS
Der Polytec MSA-500 Micro System
Analyzer repräsentiert State-of-the-Art
Messtechnik zur Analyse und Visualisierung
der Schwingungsdynamik
und der Oberfl ächentopografi e von
Mikrosystemen wie z.B. MEMS
(Micro-Electro-Mechanical System)
und MOEMS. Das mikroskopbasierte
MSA-500 integriert ein Mikro-Scanning
Laser-Doppler Vibrometer für die
schnelle, breitbandige Messung der
„Out-of-plane”-Dynamik, ein stroboskopisches
Video-Mikroskop für
„In-Plane“-Bewegungen von MEMS
sowie ein Weisslicht-Interferometer zur
hochaufl ösenden Mikrotopografi emessung
.
Berührungslose Messung
von Mikrostrukturen
Der MSA-500 Micro System Analyzer
wurde speziell entwickelt für die Analyse
dynamischer und statischer Eigenschaften
von Mikrostrukturen wie
MEMS- (oder MOEMS-) Bausteinen.
Derartige Bausteine werden mittlerweile
in unzähligen Anwendungen in der
Automobilindustrie, Medizintechnik,
Biochemie und in der Luft- und Raumfahrt
eingesetzt. Infolge der weiten
Verbreitung und der Anwendung in
sicherheitsrelevanten Bereichen sind
systematische Testverfahren für MEMS-
Mikrosysteme unerlässlich, sowohl an
gekapselten als auch an ungekapselten
Elementen (Single-Die und Wafer-Level-
Testing). Für Anwendungen im Bereich
des Wafer-Level-Testing, kann das
MSA-500 einfach auf eine manuelle
oder auch vollautomatische MEMS-
Probestation montiert werden.
Das MSA-500 integriert sich perfekt in
den MEMS-Design- und -Test-Zyklus
und liefert präzise dynamische und
statische 3D-Daten. Die Ergebnisse
verbessern und verkürzen die Design-
Zyklen, vereinfachen die Fehlersuche,
erhöhen die Ausbeute und Leistung und
senken die Produktionskosten.
Alle mechanischen Resonanzen werden
ohne a-priori-Information gefunden
Bei breitbandiger Anregung fi ndet
die hochempfi ndliche Laser-Doppler-
Technik sehr schnell und ohne a-priori
Infor mation alle mechanischen Systemresonanzen
(sowohl „Out-of-Plane“
(aus der Bauteilebene heraus) als auch
„ In-Plane“ (innerhalb der Bauteilebene)).
(Ein reines „Machine-Vision“ System
könnte nur an benutzerdefi nierten
diskreten Frequenzen mit sinusartiger
Anregung messen.) In einem zweiten
Schritt wird die stroboskopische
Video-Mikroskopie benutzt, um präzise
Amplituden- und Phasen-Informationen
für die In-Plane-Resonanzen zu erhalten,
die durch die Laser-Vibrometrie identifi -
ziert wurden.
Überzeugende Vorteile
✦ Schnelle Identifi zierung, Messung
und Visualisierung sowohl der dynamischen
System-Resonanzen als
auch der statischen Topographie
✦ Integriertes Mikroskop mit optimiertem
optischen Pfad für hervorragende
laterale Aufl ösung und beste
Abbildungsqualität
✦ Einfache Integration mit MEMS-Wafer-Probe-Stations
✦ Einfache und intuitive Bedienung,
messbereit in wenigen Minuten
✦ Erhöhte Produktivität durch kurzen
Messzyklus
✦ Beschleunigt Produktentwicklung,
Troubleshooting und Time-to-Market
103

Current Innovations and Competencies of Companies
Frequency Tuning of Bulk Material by Laser Trimming
3D-Micromac AG
Dipl.-Ing. Jens Hänel
Dr.-Ing. Bernd Keiper
Dipl.-Ing. Karsten Bleul
The demand for increasing precision
and yield of Microsystems requires new
technologies in the fabrication process
of sensors and actuators. In this paper
the trimming of the resonant frequency of
Micro Mirror Devices (MMD) are exemplifi
ed, because MMDs are common
used MEMS devices with a wide range
of applications. Fabrication technologies
cause tolerances in device dimensions
and consequently on key parameters
such as the resonant frequency. The
standard deviation of the resonant frequency
is up to 2.8% for MMDs at wafer
level. The main goal is to trim all micro
mirror elements on a wafer to one certain
frequency value. The Center for Microtechnologies
(ZfM) and the 3D-Micromac
AG have developed a tool for automatic
laser trimming of MEMS by using an ultra
short pulsed laser. The investigations
were done at 1-dimensional and 2-dimensional
micro mirrors. Fig. 1 shows
the FEM layout of the MMDs made in
bulk technology with a detailed view of
the previously etched trimming elements.
A stepwise removal of these elements by
laser cutting at the mirror plate effects a
frequency increase because of mass reduction,
whereas the removal at the torsion
beams effects a frequency decrease
because of a lower beam stiffness.
Fig. 2
SEM-Picture
of the particle
free cutting
edge of a mass
trimming element
processed
under vacuum
conditions
104
Center for Microtechnologies (ZfM)
Dr.-Ing. Christian Kaufmann
Dipl.-Ing. Jens Bonitz
The cutting was done by a picosecond
and a femtosecond laser. In contrast to
conventional long-pulse lasers a trimming
by ultra-short laser pulses is preferred,
because the ablation is accompanied
only by a minimum of heat deposition
into the material and only a narrow heat
affected zone is formed. Though having
longer pulse duration than a femtosecond
laser, the picosecond laser is suitable
for processing silicon micro mirror
devices as well, when using the correct
parameters. The surface contamination of
the wafer is avoided by processing under
Fig. 1
FEM layout of
the devices
with a detailed
view of the
previously
etched
trimming
elements
(above:
1D mirror,
below:
2D mirror)
vacuum conditions, as shown in Fig. 2.
With the presented process it is possible
to shrink the standard deviation at wafer
level down to 0.3%. In addition to the
discrete removing of trimming elements
with a frequency increment of 0.4% the
material ablation on the micro mirror plate
minimizes the standard deviation at wafer
level down to 0.1%. The investigations
prove that the ultra short pulsed lasers
suit the frequency trimming very well and
because of its fl exibility the process can
be transferred to other applications and
materials easily.
3D-Micromac AG
Annaberger Str. 240
D – 09125 Chemnitz
Phone +49(0)371-40043-0
Fax +49(0)371-40043-40
Mail info@3d-micromac.com
Web www.3d-micromac.com

Rohwedder –
Micro Technologies
The division Micro Technologies of the
Rohwedder AG represents within the
Technology Portfolio of the corporation
Group, system solutions for the micro
assembly technique. Micro Technologies
offers his customers complete solutions
out of one hand, beginning at product
development, up to the after Sales and
offers thereby an customer-oriented
service range, which goes far beyond
pure technique solutions.
Rohwedder offers more
Particularly for the assembly of small
and precise parts or units the
MicRohCell® with the MicRohFlex®
concept is a platform, which fulfi lls
the substantial requirements to an
economic assembly:
✦ Flexibility and variability, with module
component system
✦ High re-use degree of all system
components
✦ Precision with continuous quality
✦ Speed in combination with
reliability
Know how & many decades experience
Beside micro assembly technology
3 additional fi elds of operations covers
the activities at the location Bruchsal:
✦ High speed assembly machines for
cycle times of 0,15 s / part
✦ Plastic moulding automation
✦ Automated optical Inspection (AOI)
More than 500 manufacturing units
and production systems for customers,
from the ranges automotives, electronic
industry, medical technology, optics
and Consumer Goods were supplied
worldwide.
MicRohCell® mit MicRohFlex®
Optical Barcode Reader
Rohwedder AG – Micro Technologies
Eisenbahnstraße 11
D – 76646 Bruchsal
Phone +49(0)7521-9824-4390
Fax +49(0)7521-9824-2253
Mail micro@rohwedder.com
Web www.rohwedder.com
Current Innovations and Competencies of Companies
Rohwedder –
Mikrotechnologien
Die Division Micro Technologies der Rohwedder
AG repräsentiert innerhalb des
Technologie Portfolios der Konzern-Gruppe
die Systemlösung für die Mikromontagetechnik.
Micro Technologies bietet
seinen Kunden von der Produktentwicklung,
bis hin zum After Sales, Komplettlösungen
aus einer Hand und bietet damit
ein kundenorientiertes Leistungs-Paket,
das weit über reine Techniklösungen
hinausgeht.
Rohwedder bietet mehr
Speziell für die Montage kleiner und
präziser Teile oder Baugruppen ist die
MicRohCell® mit dem MicRohFlex®-
Konzept eine Maschinenplattform, welche
die wesentlichen Anforderungen an eine
wirtschaftliche Montage erfüllt:
✦ Flexibilität und Variabilität, durch
Modulbaukasten
✦ Hoher Wiederverwendungsgrad aller
System- Komponenten
✦ Präzision bei gleichbleibender Qualität
✦ Schnelligkeit in Kombination mit Zuverlässigkeit
Know-how und viele Jahrzehnte Erfahrung
Neben der Mikromontage-Technologie
prägen 3 weitere Tätigkeitsbereiche die
Aktivitäten am Standort Bruchsal:
✦ Kurztakt-Montageanlagen für
Taktzeiten bis 0,15 sec/Teil
✦ Spritzgussautomation
✦ Automatisierte optische Inspektion
(AOI)
Über 500 Fertigungsanlagen- und
Systeme wurden für Kunden aus den
Bereichen Automotive, Elektronikindustrie,
Medizintechnik, Optik und Consumer
Goods weltweit geliefert.
105

Current Innovations and Competencies of Companies
Beam Shaping expands Laser Processing Potential
High-power laser sources are used in
a large variety of materials processing
applications. Today, the most common
include welding, soldering, cutting,
drilling, laser annealing, micro-machining,
ablation and micro-lithography. As
well as choosing the right laser source,
suitable high-performance optics that
generate the appropriate beam profi le
are critical.
LIMO Lens Array Beam Shaping (LIMO
LABS) improves the performance of
many varieties of lasers: gas, solid-state,
fi bre and diode. The beam shaping
optics can be pre-aligned in compact
and robust modules with well-defi ned
interfaces and integrated into production
systems for use in harsh environmental
conditions.
Various beam shaping principles, such
as phase shifting for single-mode lasers
and beam mixing for multi-mode lasers,
are applied when we design industrial
beam shaping solutions.
Free-form micro-lens surfaces can be
structured cost-effectively on glass
and crystal wafers using LIMO’s unique
Figure 1
Joining of two thin
steel springs by
means of point
welding at 20 W
peak power, spot
size 50 μm, three
pulses of 4 μs
duration.
106
production technology in tandem with
computer-aided design. LIMO can structure
theoretically optimised surfaces into
almost any optical material with high precision,
including fused silica, BK7 and
calcium fl uoride for DUV applications as
well as silicon, germanium and zinc selenide
for CO2 lasers. Applying this technology
to industrial diode laser systems
with excellent beam quality combined
with falling Dollar-per-Watt prices creates
new opportunities, particularly in areas
such as direct-diode welding or cutting
and silicon thin-fi lm crystallization.
x-head: Direct diode applications
Compact and robust high-power diode
lasers are reliable tools for materials
processing. Fibre-coupled devices
with more than 1 kW of output power,
delivered via fi bres with core diameters
ranging from 200 to 600 μm, are readily
available for use in applications such as
plastics welding, heat conduction welding
of stainless steel and soldering in
semiconductor, automotive or electronics
industries.
But the potential scope of direct-diode
laser processing is much larger. New
applications such as micro-welding of
sensor housings or electrical contacts
in PCB production, fi ne cutting of thin
metal sheets and soldering or annealing
processes in semiconductor and display
production illustrate this point.
Fibre-coupled and line-focus industrial
ultra-high brightness diode lasers using
simple interfaces and application specifi
c beam shaping and delivery create
opportunities by increasing throughput
of and easing integration into OEM
production equipment. Beam shaping
and delivery designs that have a high
optical effi ciency translate directly into
lower operating currents and extend the
lifetimes of diodes to 30,000 hours and
beyond, according ISO17526:2003(E).
A low operating current also reduces the
thermal load and allows compact cooling
technologies to be used.
x-head: Welding and cutting
with diode lasers
In the past, pulsed lasers have been
the light sources of choice especially for
micro-materials processing. Pulsed laser
sources with high repetition rates, pulse
durations in the nanosecond range and
high peak intensities show a good penetration
into highly refl ective materials.
However, many applications do not
require these high peak pulse powers. In
conductive welding, this process turns
out to be a disadvantage as the resulting
welding seam can suffer from spilling
and pores.
Figure 1 shows the spot welding of two
steel springs. The micro-welding process

equires only three laser shots, each 4 μs
in duration. A precisely pulsed current
supply controls the laser power accurately
yielding a stable output power with
less than 1% power fl uctuations.
Industrial diode laser system accessories
include process heads with sensors
to increase the process stability and
reliability. In a closed loop circuit fed by
online laser power or process temperature
the diode current is adjusted
with 1 kHz frequency. A vision system
with an integrated camera is deployed
in the process heads to position the
laser beam on the work piece with high
precision. A product example is shown
in fi gure 3.
x-head: Crystallization of semiconductor
thin fi lms
Industrial crystallization of silicon thin
fi lms has traditionally been dominated
by Excimer laser based processes. The
arrival of ultra-homogeneous diode line
beams of up to several meters in length
combined with the design freedom
provided by lens array beam shaping
Figure 2
Crystallites in a recrystallized
500 nm
Si thin fi lm on glass
using a diode laser
courtesy of IPhT,
Jena, Germany.
(LIMO LABS) creates new opportunities
in this application. Falling diode prices
continue to improve the business case
for very large systems with several tens
of kilowatts of power.
Researchers at IPhT in Jena and CIS
in Erfurt, both Germany, have used a
maintenance-free 350 W diode line laser
to treat thin-fi lm solar cells (fi gure 4). Mi-
Current Innovations and Competencies of Companies
Figure 3
Diode laser
processing head
with integrated
sensors: power
meter, pyrometer,
camera, and digital
interfaces to control
the process
Figure 4
350W diode
laser module with
homogeneous
line profi le of
12 x 0,1 mm
used for the
crystallization of
silicon thin fi lms
cro-optic lens arrays are integrated into
the laser head to shape the processing
line making it scalable to several meters.
Crystallization of 200 nm and 500 nm
a-Si fi lms on a SixNy diffusion barrier on
glass has been demonstrated. Large
crystallites of more than 100 μm size
are achieved at a scanning speed of 33
mm/s. The result is shown in fi gure 2.
LIMO Lissotschenko Mikrooptik GmbH
Bookenburgweg 4-8
D – 44319 Dortmund
Phone +49(0)231-22 241-0
Fax +49(0)231-22 241-301
Mail sales@limo.de
Web www.limo.de
107

Current Innovations and Competencies of Companies
Megasonic Cleaning in
Microsystems Technology
and Semiconductor Production
The increasing integration of ever smaller
structures in semiconductors and microsystems
places growing demands on their
cleaning. Smallest particles down to nano
scales need to be cleaned off of sensitive
surfaces. (Fig. 1)
Fig.1: Megasonic nozzle, mounted on a movable arm,
above rotating wafer.
Source: SONOSYS Ultrasonic Systems GmbH
An ultrasonic system with a working
frequency of 1 Megahertz (MHz), also
called megasonic system, is clearly superior
to a conventional, low-frequency
Fig. 2: Principle of megasonic cleaning.
Source: SONOSYS Ultraschallsysteme GmbH.
108
ultrasonic system with, for example, 40
kilohertz (kHz). Because of the signifi -
cantly lower cavity energy, microstructures
are not destroyed and the cleaning
process is optimized. Megasonic
systems are particularly well suited for
use in fl uid processes in manufacture of
semiconductor wafers, substrates, optical
glasses and microsystems.
Ultrasound systems are described as
megasonic systems, if they work at a
frequency range of 700 kHz to 4 MHz.
The cavities and micro currents generated
in fl uids (Fig. 2) allow removal of
adhesive particles with sizes down to
nano scales, for instance from sensitive
substrate surfaces and out of grooves in
microstructures. Particle size and sensitivity
of the substrate surface are criteria
for selection of the appropriate ultrasonic
frequency.
Of similar interest is the process support
in production of micro structures with
high aspect ratio through X-ray lithography.
Fig. Fi 33: Developed D l d micro i structure t t bbefore f and d after ft
megasonic cleaning. Source: SONOSYS Ultraschallsysteme
GmbH / Forschungszentrum Karlsruhe
During the development process, particles
are completely fl ushed out due to
the created microstream and the development
times are reduced by a factor of
7. The depth of fragile structures can be
enlarged by a factor of 2 (Fig. 3).
Our Services – Your Benefi t
In developing our megasonic systems
we relied on a close dialog with our
customers. You will get a system solution,
specifi cally developed and geared
towards your requirements and your
application area, according to the newest
technological developments, from
SONOSYS®.
✦ SONOSYS® is known world wide
for unique and future-proof solutions.
✦ Immersible ultrasonic transducers
or fl oor-mounted systems with a
frequency of 400 kHz to 2 MHz and
megasonic nozzles with a frequency
of 1 / 2 / 3 or 4 MHz guarantee an
unmatched cleaning of particles
down to nano scales while fully prevent
the microstructures.
✦ Some standard confi gurations are
available as test system on rental
basis.
✦ Problem-free integration of our
systems in your production lines and
processes through minimal installation
effort and simple operation.
✦ The modular generator design guaranties
an individually adapted service
and high serviceability.
SONOSYS® Ultraschallsysteme GmbH
Daimlerstrasse 6
D – 75305 Neuenbürg – Germany
Phone +49(0)7082-79184-0
Fax +49(0)7082-79184-99
Mail info@sonosys.de
Web www.sonosys.de

Sophisticated
Opportunity –
Fabrication and Mounting
of Image Sensors
Many of today‘s machines can only
be optimized through miniaturization:
Chip-on-Board technologies
(COB) continue to fi nd even more
new applications. One of these is
the production of camera modules
with image sensors. With COB
technology the ‚naked‘ chip is
adhered to the circuit board and
then connected with bonding wire.
Another option is to mount the
chip in a ceramic housing, using
wire positioning, which can then
be hermetically sealed, as needed.
Both of these methods set high
demands on the processing conditions.
Clean rooms are needed
since even a single speck of dust
can make the optical chip unusable.
Furthermore, the later operational
conditions can be demanding
of the camera module: If built into
an automobile, e.g., the sensors
will need to withstand water spray,
moisture, vibrations or extreme
temperatures and temperature
changes. Additionally, the positioning
precision of the image sensor
is particularly important. In order
to ensure that connections remain
intact despite material expansion,
a good knowledge of materials
essential. The materials used for
producing, e.g., boards or adhesives
play a deciding role in the
quality and reliability of the fi nished
product. Microelectronic Packaging
Dresden has decades of experience
manufacturing microelectronic
components, so-called ‚packaging‘,
and makes this experience available
as a service provider.
Cross section of an image sensor, showing the die, bond
wires, housing and substrate
A complex microsystem: camera module with mixed
signal electronic, image sensor and optical lenses.
Production Facility and Headquarters of MPD in Silicon
Saxony, Germany.
MPD GmbH
Thomas Ruf (Sales Manager)
Grenzstr.22
D – 01109 Dresden
Phone +49(0)351-2136 -033
Fax +49(0)351-2136 -109
Mail Thomas.Ruf@mpd.de
Web www.mpd.de
Current Innovations and Competencies of Companies
Filigrane
Angelegenheit –
Verarbeitung und Montage
von Image-Sensoren
Viele technische Geräte lassen sich
heute nur durch Miniaturisierung weiter
optimieren: Die Chip-on-Board-Technologie
(COB) erobert immer mehr
Einsatzbereiche. Einer davon ist die
Produktion von Kameramodule mit Imagesensoren.
Bei der COB-Technologie
werden die „nackten“ Chips direkt auf
die Leiterplatte geklebt und anschließend
mit Bonddrähten kontaktiert. Eine
andere Möglichkeit ist Draht-positionierte
Montage in Keramikgehäusen,
bei Bedarf mit anschließendem hermetischen
Verschluss. Beide Methoden
stellen hohe Anforderungen an die
Verarbeitungsbedingungen. Reinräume
werden benötigt, denn bereits ein
einziges Staubkorn kann den optischen
Chip unbrauchbar machen. Gleichzeitig
stellen auch die späteren Einsatzbedingungen
hohe Anforderungen an die
Kamera-Module: Beim Einbau im Automobil
z.B. müssen die Sensoren mit
Spritzwasser, Feuchtigkeit, Vibrationen
oder extremen Temperaturen und Temperaturschwankungen
klar kommen.
Zusätzlich ist bei der Verarbeitung des
Image-Sensors die Positioniergenauigkeit
äußerst wichtig. Um sicher zu stellen,
dass trotz Materialausdehnungen
dichte Verbindungen auch dicht
bleiben, ist eine gute Materialkenntnis
unerlässlich. Die eingesetzten Werkstoffe
z.B. für Boards oder Klebstoffe
bestimmen in entscheidendem Maße
die Qualität und Zuverlässigkeit der Aufbauten.
Die Microelectronic Packaging
Dresden hat jahrzehntelange Erfahrung
mit der Verarbeitung von Mikroelektronischen
Komponenten, so genanntes
„Packaging“ und bietet dieses Knowhow
als Dienstleister an.
109

Current Innovations and Competencies of Companies
microform.200 –
The Most Flexible Single Wafer ECD Tool
For almost 20 years
technotrans is renowned
world-wide for its turnkey
electroforming systems
for the production of
mould inserts for optical
storage media such as
CD’s, DVD’s and high
density formats. With
the benefi t of experience
gained over the
years a new system of
the microform.line was
introduced in 2003: the
microform.50.
The basic idea was to develop the
industrially proven technology of optical
disc production for new micro technology
applications. The intention is
to provide the market with a fl exible
development tool: fi rst it could be used
for process development, then for pilot
production and fi nally for series production
of micro components and microstructures.
The aim was to considerably
shorten the “Time-To-Market“ of various
products.
Meanwhile several microform.50 and
100 systems as well as the large format
system microform.500 have been
installed at various R&D facilities in Europe,
the USA and Asia.
In September 2007 the latest development
in the microform product group
was introduced at the SEMICON
Europa: the microform.200. In co-operation
with NXP, one of the leading
manufacturers of semiconductors, chips
and electronic components world-wide,
110
technotrans has developed a highly
fl exible electroplating system, which has
been specifi cally designed for the more
sophisticated requirements in the production
of passive components, fl ip chip
bumping and through-silicon-via plating.
While typical front-end production technology
for such applications generally
provides insuffi cient deposition capacity,
PCB board technology is frequently not
adequately geared toward the requirements
of wafer technology. The microform.200
fi lls this gap. High deposition
rates combined with highest precision
and repeatability within a compact clean
room tool.
The purpose-designed alignment of
anode and cathode at a 45° angle in
combination with the high overfl ow of
the cathode ensures a very thin and
very even boundary layer on the surface
of the wafer. In connection with the
geometric form of the electrical fi eld
between anode and cathode this results
in a very even distribution
of the dissolved metal on
the surface.
The system can be
individually equipped for
process development. For
example all the usual wafer
formats up to 240 mm can
be processed in appropriate
substrate holders. Various
process rectifi ers for
direct current and pulse
plating processes in various
power stages are also
available. Furthermore the
tank system and the circulation system
can be prepared for various electrolytes
and applications.
The important thing for developer and
operator alike is that the operational
concept and the basic design of the
system are identical. For applications in
the semiconductor industry this means
that, regardless whether the customer
processes copper, tin, gold, nickel or
alloys, he can fi rst develop the process
with a unit and then increase capacity to
fulfi l market demands with identical units
– without having to adapt or redevelop
the processes on other units.
technotrans AG
Robert-Linnemann-Strasse 17
D – 48336 Sassenberg
Phone +49(0)2583-301-0
Fax +49(0)2583-301-1030
Mail stefan.knipper@technotrans.de
Web technotrans.de

technotrans ist seit fast zwei Jahrzehnten
weltweit bekannt für seine schlüsselfertigen
Galvaniksysteme zur Herstellung
von Spritzgießwerkzeugeinsätzen für
optische Datenträger wie CD, DVD und
High-Density Formate. Basierend auf
dieser Erfahrung wurde 2003 erstmalig
ein System der microform Linie vorgestellt:
die microform.50.
Kernidee war, die industriell erprobte
Technik der Optical-Disc Fertigung für
neue Anwendungen im Bereich der
Mikrotechnik weiter zu entwickeln. Dem
Markt sollte ein Entwicklungstool an
die Hand gegeben werden, mit dem
zunächst die Prozessentwicklung,
anschließend die Pilotfertigung und
schließlich die erste Serienfertigung von
Mikrobauteilen oder -strukturen
möglich ist. Ziel war es, die „Time-
To-Market“ unterschiedlichster
Produkte erheblich zu verkürzen.
In der Zwischenzeit konnten in
verschiedenen Forschungs- und
Entwicklungseinrichtungen in Europa,
den USA und Asien Systeme
vom Typ microform.50 und 100
sowie das Großformat System
microform.500 in Betrieb gehen.
Im September 2007 wurde im
Rahmen der SEMICON Europa die
neueste Entwicklung der microform
Produktgruppe vorgestellt: die
microform.200. In Kooperation mit
NXP, einem der weltweit führenden
Produzenten für Halbleiter,
Chips und Elektronikbaugruppen,
entstand ein hochfl exibles Galvaniksystem,
welches explizit für die
steigenden Anforderungen bei der
Herstellung von passiven Bauelementen,
Flip-Chip Bumping und Through-Silicon-
Via Plating ausgelegt ist.
Während typische Front-End Produktionstechnik
für diese Anwendungen im
allgemeinen eine zu geringe Abscheidekapazität
hat, ist die Leiterplattentechnik
vielfach nicht ausreichend auf die Anforderungen
der Wafertechnik ausgelegt.
Die microform.200 füllt genau diese
Lücke auf: Hohe Abscheidekapazität
verbunden mit größtmöglicher Präzi sion
und Wiederholgenauigkeit in einem
kompakten Reinraumtool.
Die spezielle Anordnung von Anode
und Kathode im 45° Winkel in Kombination
mit der hohen Überströmung
der Kathode erzeugen eine sehr dünne
Current Innovations and Competencies of Companies
und sehr gleichmäßige Grenzschicht auf
der Oberfl äche des Wafers. In Verbindung
mit der geometrischen Form des
elektrischen Feldes zwischen Anode
und Kathode, ergibt sich so eine sehr
gleichmäßige Verteilung des gelösten
Metalls auf der Oberfl äche.
Für die Prozessentwicklung kann das
System sehr individuell ausgestattet
sein. Zum Beispiel können alle gängigen
Waferformate bis 240mm in entsprechenden
Substrataufnahmen prozessiert
werden. Darüber hinaus stehen diverse
Prozessstromquellen für Gleichstrom
und Puls-Plating Prozesse in unterschiedlichen
Leistungsstufen bereit.
Auch das Tank- und Zirkulationssystem
kann auf verschiedenste Elektrolyte und
Anwendungen ausgelegt werden.
Wichtig sowohl für den Entwickler als
auch für den Bediener einer Produktionsanlage
ist, dass das Bedienkonzept
und der prinzipielle Aufbau des Systems
immer identisch sind. Für die Anwendungen
im Halbleitermarkt heißt das,
egal ob der Kunde Kupfer, Zinn, Gold,
Nickel oder Legierungen verarbeitet,
er kann mit einem identischen Gerät
zunächst den Prozess erarbeiten und
anschließend mit der Marktentwicklung
die Kapazität erhöhen – ohne die Prozesse
auf anderen Systemen erst wieder
neu zu adaptieren oder entwickeln zu
müssen.
111

Current Innovations and Competencies of Companies
Innovation for Micro and Precision Technology
of Tomorrow
For many years, SCHUNK has been
working on an enlargement of its product
program in the areas of toolholding,
workholding, and automation to
meet the requirements of micro-system
technology.
In the areas of toolholding and workholding,
SCHUNK is offering the TRIBOS-
Mini, a toolholder designed for micro
clamping. The TRIBOS-Mini can clamp
shank diameters as small as 0.3 mm
with highest centering accuracy. Another
example for uniqueness pertains to
the customized clamping component,
where two fi ligree clockwork parts are
clamped concentrically to each other on
a few micrometers.
For automated technology, SCHUNK
has enlarged its proven gripper series
MPG and SWG with sizes below
10 (edge length). Simultaneously the
company offers a miniature changing
112
system, MWS, which is the smallest
automated gripper changing system
world-wide. Aside from a large, centered
aperture, it is also equipped with integrated
feedthroughs for pneumatic and
electric hoses.
Together with gripper and rotary
modules, linear axes, or positioning
modules from the SCHUNK modular
system, a compact assembly group for
micro machining can be arranged in a
very short period of time. As a result,
SCHUNK will lead the way as a supplier
of desktop manufacturing components.
In the future, SCHUNK will also further
drive the technological development in
micro-manufacturing by implementing
market-driven innovations.
Managing Directors:
Heinz-Dieter Schunk
Henrik A. Schunk
Year of foundation: 1945
Employees world-wide: more than 1,600
Consolidated turnover of the
organization
in 2006 worldwide: 150 million. Euro
PRODUCT RANGE
Workholding and Toolholding
Technology
✦ Toolholding Systems
✦ Stationary Workholding Systems
✦ Lathe Chucks
✦ Chuck Jaws
✦ Customized Toolholding Solutions
✦ Industry Solutions
Automation
✦ Gripping Modules
✦ Rotary Modules
✦ Linear Modules
✦ Robot Accessories
✦ Mechatronics
✦ System GEMOTEC
✦ Special Automation
✦ Industry Solutions
SCHUNK GmbH & Co. KG
Spann- und Greiftechnik
Bahnhofstr. 106 – 134
D – 74348 Lauffen/Neckar
Phone +49(0)7133-103-0
Fax +49(0)7133-103-2399
Mail info@de.schunk.com
Web www.schunk.com

Impressum
Publisher/Herausgeber
trias Consult
Johannes Lüders
Crellestraße 31
D – 10827 Berlin
Phone +49 (0)30-781 11 52
Mail trias-consult@gmx.de
Translation/Übersetzung
Dr. Otto-G. Richter
Richter IT & Science Consulting
Costa Mesa, CA, USA
Mail: otto@rits-consulting.us
otto@richter-its-consulting.de
Layout
Uta Eickworth, Berlin
Mail: eickworth@onlinehome.de
Printing/Druck
CCC Grafi sches Centrum Cuno, Calbe
2008, Printed in Germany
114
Photo Credits/Bildnachweis
Title/Titel
Micro Mixers with very fi ne Leading Structures and a Geometrically Reducing Mixing
Chamber Result in a Complete Mixing Within Splits of a Second
Mikromischer mit sehr feinen Zuführungsstrukturen und einer sich verjüngenden Mischkammer
führen zum vollständigen Vermischen in Sekundenbruchteilen
Source/Quelle: IMM Institut für Mikrotechnik Mainz
Page/Seite
2/3
ZrO 2-Nozzle-Plate of a Ceramic Micro Turbine – Compared with the Size of an Ant
Düsenplatte einer keramischen Mikroturbine aus ZrO2-Größenvergleich mit einer Ameise
Source/Quelle: Forschungszentrum Karlsruhe
8/9
ESP Sensor Cluster MM3
ESP Sensorcluster MM3
Source/Quelle: Robert Bosch GmbH
13
MagnetoResitive Sensors for Novel Applications in Industrial Automation, Automotive
Applications, Medicine or Bio Analytics
MagnetoResitive Sensoren für innovative Anwendungsfelder in der Industrieautomation,
automotiven Anwendungen,der Medizin und BioAnalytik
Source/Quelle: Sensitec GmbH
38/39
Source/Quelle: Fraunhofer IZM
57
Materials for Circuit Assembly and Semiconductor Packaging
Hochwertige Materialien für die Aufbau und Verbindungtechnik sowie Halbleiterindustrie
Source/Quelle: W. C. Heraeus GmbH
71
Source/Quelle: Ferdinand-Braun-Institut für Höchstfrequenztechnik, Berlin
87
Roll Clad Composite Materials, Contact Materials, Bonding Wires, Solder Pastes and
Conductive Adhesives for Die-attach Applications For Packaging of Integrated Circuits
e. g. for Hydraulic Brake Systems.
Walzplattierte Verbundwerkstoffe, Kontaktmaterialien, Bonddrähte, Lotpasten und Leitkleber
für Die-Attach Applikationen für die Aufbau- und Verbindungstechnik
z. B. für hydraulische Bremssysteme.
Source/Quelle: W. C. Heraeus GmbH

Für Wissenschaft+Innovation
TSB Technologiestiftung Berlin Gruppe
Die TSB
… fördert Wissenschaft und Forschung
… entwickelt und realisiert die Innovationsstrategie
des Landes Berlin
Die TSB GmbH
… berät innovationsorientierte Gründer sowie
kleine und mittlere Unternehmen
… unterstützt den Technologietransfer von
den Hochschulen in die Wirtschaft
Die TSB Initiativen
… vernetzen Wissenschaft und Wirtschaft
… managen Netzwerke und Leuchtturmprojekte
www.technologiestiftung-berlin.de
Unsere Schwerpunkte
… Medizintechnik (TSB Medici)
… Verkehrssystemtechnik (TSB FAV)
… Biotechnologie (BioTOP)
… Informations- und Kommunikationstechnologie
(TSB Adlershof)
… Optische Technologien/Mikrosystemtechnik
(TSB Adlershof)