MRF275G Data Sheet - CB Tricks

SEMICONDUCTOR TECHNICAL DATA 

Order this document 

by MRF275G/D 

The RF MOSFET Line 

 

N–Channel Enhancement–Mode 

Designed primarily for wideband large–signal output and driver stages from 

100 – 500 MHz. 

• Guaranteed Performance @ 500 MHz, 28 Vdc 

Output Power — 150 Watts 

Power Gain — 10 dB (Min) 

Efficiency — 50% (Min) 

100% Tested for Load Mismatch at all Phase Angles with VSWR 30:1 

• Overall Lower Capacitance @ 28 V 

Ciss — 135 pF 

Coss — 140 pF 

Crss — 17 pF 

• Simplified AVC, ALC and Modulation 

D 

 

150 W, 28 V, 500 MHz 

N–CHANNEL MOS 

BROADBAND 

100 – 500 MHz 

RF POWER FET 

Typical data for power amplifiers in industrial and 

commercial applications: 

• Typical Performance @ 400 MHz, 28 Vdc 


Power Gain — 12.5 dB 

Efficiency — 60% 

• Typical Performance @ 225 MHz, 28 Vdc 


Power Gain — 15 dB 

Efficiency — 65% 

G 

G 

D 

S 

(FLANGE) 

CASE 375–04, STYLE 2 

MAXIMUM RATINGS 

Rating Symbol Value Unit 

Drain–Source Voltage VDSS 65 Vdc 

Drain–Gate Voltage 

(RGS = 1.0 MΩ) 

VDGR 65 Vdc 

Gate–Source Voltage VGS ±40 Adc 

Drain Current — Continuous ID 26 Adc 

Total Device Dissipation @ TC = 25°C 

Derate above 25°C 

PD 400 

2.27 

Storage Temperature Range Tstg –65 to +150 °C 

Operating Junction Temperature TJ 200 °C 

THERMAL CHARACTERISTICS 

Characteristic Symbol Max Unit 

Thermal Resistance, Junction to Case RθJC 0.44 °C/W 

Watts 

W/°C 

NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and 

packaging MOS devices should be observed. 

REV 1 

1

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) 

OFF CHARACTERISTICS (1) 

Drain–Source Breakdown Voltage 

(VGS = 0, ID = 50 mA) 

Zero Gate Voltage Drain Current 

(VDS = 28 V, VGS = 0) 

Gate–Source Leakage Current 

(VGS = 20 V, VDS = 0) 

ON CHARACTERISTICS (1) 

Characteristic Symbol Min Typ Max Unit 

V(BR)DSS 65 — — Vdc 

IDSS — — 1 mA 

IGSS — — 1 µA 

Gate Threshold Voltage (VDS = 10 V, ID = 100 mA) VGS(th) 1.5 2.5 4.5 Vdc 

Drain–Source On–Voltage (VGS = 10 V, ID = 5 A) VDS(on) 0.5 0.9 1.5 Vdc 

Forward Transconductance (VDS = 10 V, ID = 2.5 A) gfs 3 3.75 — mhos 

DYNAMIC CHARACTERISTICS (1) 

Input Capacitance (VDS = 28 V, VGS = 0, f = 1 MHz) Ciss — 135 — pF 

Output Capacitance (VDS = 28 V, VGS = 0, f = 1 MHz) Coss — 140 — pF 

Reverse Transfer Capacitance (VDS = 28 V, VGS = 0, f = 1 MHz) Crss — 17 — pF 

FUNCTIONAL CHARACTERISTICS (2) (Figure 1) 

Common Source Power Gain 

(VDD = 28 V, Pout = 150 W, f = 500 MHz, IDQ = 2 x 100 mA) 

Drain Efficiency 

(VDD = 28 V, Pout = 150 W, f = 500 MHz, IDQ = 2 x 100 mA) 

Electrical Ruggedness 

(VDD = 28 V, Pout = 150 W, f = 500 MHz, IDQ = 2 x 100 mA, 

VSWR 30:1 at all Phase Angles) 

1. Each side of device measured separately. 

2. Measured in push–pull configuration. 

Gps 10 11.2 — dB 

η 50 55 — % 

ψ 

No Degradation in Output Power 

REV 1 

2

A 

B 

+VGG 

C14 R1 C15 C16 

C22 

C17 

L5 

C18 

L6 

C19 

+ 

+28 V 

L1 

L3 

C1 

Z1 

Z3 

D.U.T. 

Z5 

Z7 

C10 

C2 

B1 C5 C6 C7 C8 

C3 

C9 

C11 

C12 

B2 

C4 

Z2 

Z4 

Z6 

Z8 

C13 

L2 

L4 

A 

C20 

C21 

B 

B1 

Balun, 50 Ω, 0.086″ O.D. 2″ Long, Semi Rigid Coax 

B2 

Balun, 50 Ω, Coax 0.141″ O.D. 2″ Long, Semi Rigid 

C1, C2, C3, C4, 

C10, C11, C12, C13 270 pF, ATC Chip Capacitor 

C5, C8 1.0–20 pF, Trimmer Capacitor, Johanson 

C6 

22 pF, Mini–Unelco Capacitor 

C7 

15 pF, Unelco Capacitor 

C9 

2.1 pF, ATC Chip Capacitor 

C14, C15, C16, 

C20, C21, C22 0.1 µF, Ceramic Capacitor 

C17, C18 680 pF, Feedthru Capacitor 

C19 

10 µF, 50 V, Electrolytic Capacitor, Tantalum 

L1, L2 10 Turns AWG #24, 

0.145″ O.D., 106 nH 

Taylor–Spring Inductor 

L3, L4 10 Turns AWG #18, 

0.340″ I.D., Enameled Wire 

Figure 1. 500 MHz Test Circuit 

L5 Ferroxcube VK200 20/4B 

L6 

4 Turns #16, 0.340″ I.D., 

Enameled Wire 

R1 

1.0 kΩ,1/4 W Resistor 

W1 – W4 

20 x 200 x 250 mils, Wear Pads, 

Beryllium–Copper, (See 

Component Location Diagram) 

Z1, Z2 1.10″ x 0.245″, Microstrip Line 

Z3, Z4, Z5, Z6 0.300″ x 0.245″, Microstrip Line 


Board material 0.060″ Teflon–fiberglass, 

εr = 2.55, copper clad both sides, 2 oz. copper. 

Points A are connected together on PCB. 

Points B are connected together on PCB. 

REV 1 

3

TYPICAL CHARACTERISTICS 

300 

160 

, OUTPUT POWER (WATTS) 

Pout 

250 

200 

150 

100 

50 

0 

0 

225 MHz 

5 10 15 

Pin, INPUT POWER (Watts) 

400 MHz 

IDQ = 2 x 100 mA 

VDD = 28 V 

20 

500 MHz 

25 


Pout 

140 

120 

100 

80 

60 

40 

VDS = 28 V 

IDQ = 2 x 100 mA 

20 

Pin = Constant 

f = 500 MHz 

0 

–10 –8 –6 –4 –2 0 2 

VGS, GATE–SOURCE VOLTAGE (V) 

4 

Figure 2. Output Power versus Input Power 

Figure 3. Output Power versus Gate Voltage 

, DRAIN CURRENT (AMPS) 

I D 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

VDS = 10 V 

VGS(th) = 2.5 V 


Pout 

180 

160 

140 

120 

100 

80 

60 

40 

20 

Pin = 14 W 

10 W 

6 W 

IDQ = 2 x 100 mA 

f = 500 MHz 

0 

0 

0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 

VGS, GATE–SOURCE VOLTAGE (V) 

0 

12 

14 16 18 20 22 24 26 28 

VDD, SUPPLY VOLTAGE (V) 

Figure 4. Drain Current versus Gate Voltage 

(Transfer Characteristics) 

Figure 5. Output Power versus Supply Voltage 


Pout 

200 

250 

180 

Pin = 14 W 

12 W 

160 

200 

140 10 W 

10 W 

120 

150 

100 

6 W 

Pin = 4 W 

80 

100 

60 

40 

IDQ = 2 x 100 mA 

50 

IDQ = 2 x 100 mA 

f = 225 MHz 

20 

f = 400 MHz 

0 

0 

12 14 16 18 20 22 24 26 28 

12 14 16 18 20 22 24 26 28 




Pout 



REV 1 

4

TYPICAL CHARACTERISTICS 

C, CAPACITANCE (pF) 

1000 

100 

10 

Coss 

Ciss 

Crss 

VGS = 0 V 

f = 1.0 MHz 

, GATE–SOURCE VOLTAGE (NORMALIZED) 

1.3 

1.2 

1.1 

1 

0.9 

0.8 

VDD = 28 V 

3 A 

ID = 4 A 

2 A 

0.1 A 

1 

0 

5 10 15 20 

VDS, DRAIN–SOURCE VOLTAGE (V) 

25 

30 

VGS 

0.7 

–25 0 25 50 75 100 125 150 175 

TC, CASE TEMPERATURE (°C) 

200 

Figure 8. Capacitance versus Drain–Source Voltage* 

*Data shown applies only to one half of 

device, MRF275G 

Figure 9. Gate–Source Voltage versus 

Case Temperature 

100 

, DRAIN CURRENT (AMPS) 

I D 

10 

TC = 25°C 

1 

1 10 

100 

VDS, DRAIN–SOURCE VOLTAGE (V) 

Figure 10. DC Safe Operating Area 

REV 1 

5

VDD = 28 V, IDQ = 2 x 100 mA, Pout = 150 W 

f = 500 MHz 

f 

(MHz) 

Zin 

Ohms 

ZOL* 

Ohms 

225 1.6 – j2.30 3.2 – j1.50 

400 1.9 + j0.48 2.3 – j0.19 

500 1.9 + j2.60 2.0 + j1.30 

400 

Zin 

f = 500 MHz 

400 

ZOL* 

225 

Zo = 10 Ω 

ZOL* = Conjugate of the optimum load impedance 

ZOL* = into which the device operates at a given 

ZOL* = output power, voltage and frequency. 

Note: 

Input and output impedance values given are 

measured from gate to gate and drain to 

drain respectively. 

225 

Figure 11. Series Equivalent Input/Output Impedance 

REV 1 

6

A 

B 

C14 

L5 

C15 

L6 

BIAS 

C10 C11 R1 C12 C13 

R2 

C18 

28 V 

L3 

C1 

D.U.T. 

L1 C8 

Z1 Z3 Z5 

B1 C3 C4 C5 C6 C7 

B2 

C2 

L2 

Z2 

Z4 

Z6 

C9 

R3 

L4 

A 

C16 

C17 

B 

0.180″ 

B1 

Balun, 50 Ω, 0.086″ O.D. 2″ Long, 

Semi Rigid Coax 

B2 

Balun, 50 Ω, 0.141″ O.D. 2″ Long, 

Semi Rigid Coax 

C1, C2, C8, C9 270 pF, ATC Chip Capacitor 

C3, C5, C7 1.0–20 pF, Trimmer Capacitor 

C4 

15 pF, ATC Chip Capacitor 

C6 

33 pF, ATC Chip Capacitor 

C10, C12, C13, 

C16, C17 0.01 µF, Ceramic Capacitor 

C11 

1.0 µF, 50 V, Tantalum 

C14, C15 680 pF, Feedthru Capacitor 

C18 

20 µF, 50 V, Tantalum 

L1, L2 #18 Wire, Hairpin Inductor 

L3, L4 12 Turns #18, 0.340″ I.D., 

Enameled Wire 

L5 Ferroxcube VK200 20/4B 

L6 

3 Turns #16, 0.340″ I.D., 

Enameled Wire 

R1 

1.0 kΩ, 1/4 W Resistor 

R2, R3 10 kΩ, 1/4 W Resistor 




Board material 0.060″ Teflon–fiberglass, 

εr = 2.55, copper clad both sides, 2 oz. copper. 

0.200″ 


REV 1 

7

BIAS 0 – 6 V 

R1 

C3 

C4 

C8 

C9 

L2 

C10 

+ 

28 V 

– 

R2 

D.U.T. 

T2 

L1 

T1 

C5 

C6 

C1 

C2 

C7 

C1 8.0–60 pF, Arco 404 

C2, C3, C7, C8 1000 pF, Chip Capacitor 

C4, C9 0.1 µF, Chip Capacitor 

C5 

180 pF, Chip Capacitor 

C6 

100 pF and 130 pF, 

Chips in Parallel 

C10 

0.47 µF, Chip Capacitor, 1215 or 

Equivalent, Kemet 

L1 

10 Turns AWG #16, 1/4″ I.D., 

Enamel Wire, Close Wound 

L2 

Ferrite Beads of Suitable Material 

for 1.5 –2.0 µH Total Inductance 

Board material 062″ fiberglass (G10), 

εr 5, Two sided, 1 oz. Copper. 

Unless otherwise noted, all chip capacitors 

are ATC Type 100 or Equivalent. 

R1 

R2 

T1 

T2 

100 Ω, 1/2 W 

1.0 k Ω, 1/2 W 

4:1 Impedance Ratio, RF Transformer 

Can Be Made of 25 Ω, Semi Rigid Coax, 

47–52 Mils O.D. 

1:9 Impedance Ratio, RF Transformer. 

Can Be Made of 15 –18 Ω, Semi Rigid 

Coax, 62 –90 Mils O.D. 

NOTE: For stability, the input transformer T1 should be loaded 

NOTE: with ferrite toroids or beads to increase the common 

NOTE: mode inductance. For operation below 100 MHz. The 

NOTE: same is required for the output transformer. 


REV 1 

8

L5 

B1 

C17 

C18 

+ 

C19 

R1 

C16 

C22 

L6 

C14 

C15 

L1 

L3 

BEADS 1–3 

C1 

C2 

C3 

C4 

C5 

W2 W1 

C6 

W3 W4 

C7 

C8 

C10 

C11 

C9 

C12 

C13 

L2 

C20 

L4 

BEADS 4–6 

B2 

C21 

MRF275G 

JL 

Figure 14. MRF275G Component Location (500 MHz) 

(Not to Scale) 

MRF275G 

JL 

Figure 15. MRF275G Circuit Board Photo Master (500 MHz) 

(Scale 1:1) 

REV 1 

9

NOTE: S–Parameter data represents measurements taken from one chip only. 

Table 1. Common Source S–Parameters (VDS = 12 V, ID = 4.5 A) 

f 

S11 S21 S12 S22 

MHz |S11| φ |S21| φ |S12| φ |S22| φ 

ÁÁÁÁÁ ÁÁÁÁÁ 

30 0.822 –172 

ÁÁÁÁÁ 

6.34 

ÁÁÁÁ 

ÁÁÁÁ 

91 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.027 

ÁÁÁÁ 

3 0.946 

ÁÁÁÁÁ 

–173 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

40 

ÁÁÁÁÁ 

–173 

ÁÁÁÁÁ 

4.32 

ÁÁÁÁÁ 

81 

ÁÁÁÁ 

–6 

ÁÁÁÁ 

–172 

ÁÁÁÁ 

0.846 

ÁÁÁÁ 

0.027 

ÁÁÁÁÁ 

0.859 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

50 

ÁÁÁÁÁ 

0.842 ÁÁÁÁ 

–174 

ÁÁÁÁÁ 

3.62 

ÁÁÁÁÁ 

79 ÁÁÁÁ 

0.027 

ÁÁÁÁÁ 

–8 

ÁÁÁÁ 

0.863 ÁÁÁÁÁ 

–175 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

60 

ÁÁÁÁÁ 

–175 

ÁÁÁÁÁ 

3.03 

ÁÁÁÁÁ 

79 

ÁÁÁÁ 

–5 

ÁÁÁÁ 

–177 

ÁÁÁÁ 

0.838 

ÁÁÁÁ 

0.027 

ÁÁÁÁÁ 

0.923 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

70 

ÁÁÁÁÁ 

0.836 ÁÁÁÁ 

–175 

ÁÁÁÁÁ 

2.76 

ÁÁÁÁÁ 

80 ÁÁÁÁ 

0.028 

ÁÁÁÁÁ 

–3 

ÁÁÁÁ 


–178 

80 –176 2.43 78 –4 –178 

ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 

90 

100 

110 

ÁÁÁÁ 

0.841 

0.849 –176 

0.857 

0.864 

–176 

–176 

2.19 

74 

1.89 

1.66 

68 

63 

ÁÁÁÁÁ 

0.029 

0.029 

–7 

ÁÁÁÁÁ 

1.080 

1.150 –176 

ÁÁÁÁÁ 

ÁÁÁÁÁÁÁÁ 





120 

130 

0.868 

0.871 

–176 

–176 

1.43 

1.25 

60 

59 

ÁÁÁÁÁ 






140 

150 

0.874 

0.876 

–176 

–176 

1.15 

1.11 

59 

59 

ÁÁÁÁÁ 






160 

170 

0.880 

0.885 

–176 

–177 

1.06 

1.01 

59 

55 

ÁÁÁÁÁ 






180 

190 

0.891 

0.896 

–177 

–177 

0.96 

0.87 

51 

45 

ÁÁÁÁÁ 






200 

210 

0.900 

0.904 

–177 

–177 

0.77 

0.69 

43 

42 

ÁÁÁÁÁ 






220 

230 

0.907 

0.909 

–177 

–177 

0.63 

0.60 

43 

43 

ÁÁÁÁÁ 






240 

250 

0.912 

0.915 

–178 

–178 

0.58 

0.58 

44 

42 

ÁÁÁÁÁ 






260 

270 

0.918 

0.922 

–178 

–178 

0.56 

0.54 

40 

34 

ÁÁÁÁÁ 






280 0.925 –179 0.49 

32 

0.014 –27 1.130 –180 

ÁÁÁÁÁ 





ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 



ÁÁÁÁ 

290 0.927 –179 0.43 

28 

–27 

–178 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁ ÁÁÁÁÁ 

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 

300 0.930 

–179 0.41 

ÁÁÁÁÁ 

30 

ÁÁÁÁÁ 

–23 

ÁÁÁÁÁ 

–178 

ÁÁÁÁÁ 

310 

ÁÁÁÁ 

0.932 –179 0.40 

ÁÁÁÁÁ 

32 

ÁÁÁÁ 

–14 

ÁÁÁÁ 

–178 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.028 

0.026 

0.024 

0.023 

0.023 

0.023 

0.023 

0.023 

0.023 

0.022 

0.020 

0.018 

0.017 

0.018 

0.017 

0.017 

0.016 

0.015 

–13 

–19 

–19 

–19 

–17 

–16 

–17 

–18 

–23 

–26 

–26 

–25 

–23 

–23 

–22 

–20 

–20 

–24 

0.013 


ÁÁÁÁÁ 

0.013 


ÁÁÁÁÁ 

1.110 

1.050 

0.958 

0.905 

0.914 

0.969 

1.060 

1.130 

1.190 

1.140 

1.050 

0.958 

0.924 

0.981 

0.981 

1.040 

1.150 

1.170 

–176 

–177 

–175 

–176 

–177 

–178 

–178 

–177 

–178 

–179 

–177 

–176 

–175 

–178 

–180 

–179 

–180 

179 

1.010 


ÁÁÁÁÁ 

0.936 


ÁÁÁÁÁ 

ÁÁÁÁÁ 

320 

ÁÁÁÁÁ 

0.934 

ÁÁÁÁ 

–180 0.39 


31 

ÁÁÁÁÁ 

ÁÁÁÁ 

–9 


180 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

330 

ÁÁÁÁÁ 

0.936 

ÁÁÁÁ 

–180 0.35 


32 

ÁÁÁÁ 

–9 

ÁÁÁÁ 

180 

340 0.938 180 

0.38 

31 

350 

0.941 

180 

0.35 

28 

0.011 

0.011 –12 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.011 –12 

ÁÁÁÁÁ 

1.000 

1.070 178 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

1.100 180 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 



ÁÁÁÁ ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁÁ 360 0.943 179 

0.33 

23 

0.011 –10 1.120 –180 

370 

0.944 

179 

0.30 

21 

0.011 –4 

ÁÁÁÁÁ 

1.080 180 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 




ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 


ÁÁÁÁ 

ÁÁÁÁÁ 380 0.945 179 

0.29 

21 

0.009 1 

1.020 180 

390 

0.947 

179 

0.28 

22 

0.008 3 

ÁÁÁÁÁ 

0.966 –180 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 




ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 


ÁÁÁÁ 

ÁÁÁÁÁ 400 0.948 179 

0.26 

25 

0.008 4 

0.936 –179 

410 

0.949 

178 

0.26 

24 

0.010 5 

ÁÁÁÁÁ 

1.010 179 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 




ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 


ÁÁÁÁ 

420 

0.951 

178 

0.25 

25 

0.010 11 

ÁÁÁÁÁ 

1.040 178 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 


ÁÁÁÁ 

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 

ÁÁÁÁÁ 

REV 1 

10

Table 1. Common Source S–Parameters (VDS = 12 V, ID = 4.5 A) continued 

f 

S11 S21 S12 S22 

MHz |S11| φ |S21| φ |S12| φ |S22| φ 


430 0.952 178 

ÁÁÁÁÁ 

0.25 

ÁÁÁÁÁ 

ÁÁÁÁ 

22 0.010 

ÁÁÁÁ 

19 ÁÁÁÁÁ ÁÁÁÁÁ 

1.080 

ÁÁÁÁ 

177 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

440 

ÁÁÁÁÁ 

177 

ÁÁÁÁ 

0.24 

ÁÁÁÁÁ 

19 

ÁÁÁÁ 

22 

ÁÁÁÁÁ 

178 

ÁÁÁÁÁ 

0.953 

ÁÁÁÁÁ 


1.100 

ÁÁÁÁ 

ÁÁÁÁ 

450 

ÁÁÁÁÁ 


177 

ÁÁÁÁ 

0.24 

ÁÁÁÁÁ 

16 ÁÁÁÁ 

0.008 21 ÁÁÁÁÁ ÁÁÁÁÁ 

1.100 

ÁÁÁÁ 

179 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

460 

ÁÁÁÁÁ 

177 

ÁÁÁÁ 

0.21 

ÁÁÁÁÁ 

15 

ÁÁÁÁ 

11 

ÁÁÁÁÁ 

177 

ÁÁÁÁÁ 

0.956 

ÁÁÁÁÁ 


1.080 

ÁÁÁÁ 

ÁÁÁÁ 

470 

ÁÁÁÁÁ 


177 

ÁÁÁÁ 

0.20 

ÁÁÁÁÁ 

16 ÁÁÁÁ 


0.992 

ÁÁÁÁ 

178 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

480 

ÁÁÁÁÁ 

176 

ÁÁÁÁ 

0.19 

ÁÁÁÁÁ 

18 

ÁÁÁÁ 

27 

ÁÁÁÁÁ 

179 

ÁÁÁÁÁ 

0.957 

ÁÁÁÁÁ 


0.975 

ÁÁÁÁ 

ÁÁÁÁ 

490 

ÁÁÁÁÁ 


176 

ÁÁÁÁ 

0.19 

ÁÁÁÁÁ 

18 ÁÁÁÁ 


0.974 

ÁÁÁÁ 

178 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

500 

ÁÁÁÁÁ 

176 

ÁÁÁÁ 

0.19 

ÁÁÁÁÁ 

19 

ÁÁÁÁ 

46 

ÁÁÁÁÁ 

177 

ÁÁÁÁÁ 

0.960 

ÁÁÁÁÁ 


1.010 

ÁÁÁÁ 

ÁÁÁÁ 

600 

ÁÁÁÁÁ 


175 

ÁÁÁÁ 

0.18 

ÁÁÁÁÁ 

12 ÁÁÁÁ 

0.007 

ÁÁÁÁÁ 

49 

ÁÁÁÁÁ 

0.940 ÁÁÁÁ 

175 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

700 

ÁÁÁÁÁ 

172 

ÁÁÁÁ 

0.11 

ÁÁÁÁÁ 

14 

ÁÁÁÁ 

61 

ÁÁÁÁÁ 

173 

ÁÁÁÁÁ 

0.958 

ÁÁÁÁÁ 

0.018 

ÁÁÁÁÁ 

0.989 

ÁÁÁÁ 

ÁÁÁÁ 

800 

ÁÁÁÁÁ 


170 

ÁÁÁÁ 

0.10 

ÁÁÁÁÁ 

12 ÁÁÁÁ 

0.029 

ÁÁÁÁÁ 

51 

ÁÁÁÁÁ 

0.967 ÁÁÁÁ 

172 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

900 

ÁÁÁÁÁ 

168 

ÁÁÁÁ 

0.08 

ÁÁÁÁÁ 

16 

ÁÁÁÁ 

72 

ÁÁÁÁÁ 

170 

ÁÁÁÁÁ 

1000 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.965 

ÁÁÁÁÁ 

0.964 

ÁÁÁÁ 

165 

ÁÁÁÁÁ 

0.07 

ÁÁÁÁ 

12 

ÁÁÁÁÁ 

0.021 

ÁÁÁÁÁ 

0.021 

ÁÁÁÁ 

0.973 

ÁÁÁÁ 

1.010 168 

57 

ÁÁÁÁÁ 

ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 

ÁÁÁÁ 

Table 2. Common Source S–Parameters (VDS = 24 V, ID = 0.35 mA) 


ÁÁÁÁ 

f 

S11 S21 S12 S22 

MHz |S11| φ |S21| φ |S12| φ |S22| φ 

30 

0.829 –170 9.20 

92 

0.023 4 

0.915 –171 

ÁÁÁÁÁ 

40 

0.858 

–172 

6.30 

83 

0.022 –4 

ÁÁÁÁÁ 

ÁÁÁÁ ÁÁÁÁÁÁÁÁ 

ÁÁÁÁÁ 


ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 


50 

0.852 –173 5.28 

80 

0.023 –6 

0.836 –174 

ÁÁÁÁÁ 

60 

0.846 

–174 

4.42 

80 

0.023 –3 

ÁÁÁÁÁ 

ÁÁÁÁ 




ÁÁÁÁÁ ÁÁÁÁ 

ÁÁÁÁÁ 



70 

0.843 –175 4.01 

81 

0.024 –1 

0.978 –177 

ÁÁÁÁÁ 

80 

0.847 

–175 

3.53 

80 

0.024 –2 

ÁÁÁÁÁ 

ÁÁÁÁ 





ÁÁÁÁÁ 



90 

0.855 –175 3.18 

76 

0.024 –5 

1.110 –176 

ÁÁÁÁÁ 

100 

0.865 

–176 

2.75 

70 

0.023 –10 

ÁÁÁÁÁ 

ÁÁÁÁ 





ÁÁÁÁÁ 



110 0.872 –176 2.43 

65 

0.022 –16 1.020 –176 

ÁÁÁÁÁ 

ÁÁÁÁ 





ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

120 

ÁÁÁÁÁ 

2.10 

ÁÁÁÁÁ 

62 

ÁÁÁÁ 

–16 

ÁÁÁÁÁ 

–174 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.874 

ÁÁÁÁ 

–176 


ÁÁÁÁ 

130 

ÁÁÁÁÁ 


–176 

ÁÁÁÁ 

1.84 

ÁÁÁÁÁ 

61 ÁÁÁÁ 

0.019 –15 ÁÁÁÁÁ ÁÁÁÁÁ 

0.882 

ÁÁÁÁ 

–175 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

140 

ÁÁÁÁÁ 

1.70 

ÁÁÁÁÁ 

61 

ÁÁÁÁ 

–14 

ÁÁÁÁÁ 

–176 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.878 

ÁÁÁÁ 

–176 


0.834 

0.892 

1.050 

1.080 

–170 

–175 

–177 

–175 

0.932 

ÁÁÁÁ 

0.889 

ÁÁÁÁ 

ÁÁÁÁ 

150 

ÁÁÁÁÁ 


–176 

ÁÁÁÁ 

1.63 

ÁÁÁÁÁ 

61 ÁÁÁÁ 


0.943 

ÁÁÁÁ 

–177 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

160 

ÁÁÁÁÁ 

1.56 

ÁÁÁÁÁ 

61 

ÁÁÁÁ 

–13 

ÁÁÁÁÁ 

–177 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.883 

ÁÁÁÁ 

–176 


1.030 

ÁÁÁÁ 

ÁÁÁÁ 

170 

ÁÁÁÁÁ 


–177 

ÁÁÁÁ 

1.49 

ÁÁÁÁÁ 

58 ÁÁÁÁ 


1.100 

ÁÁÁÁ 

–176 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

180 

ÁÁÁÁÁ 

1.42 

ÁÁÁÁÁ 

53 

ÁÁÁÁ 

–18 

ÁÁÁÁÁ 

–176 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.894 

ÁÁÁÁ 

–177 


1.160 

ÁÁÁÁ 

ÁÁÁÁ 

190 

ÁÁÁÁÁ 


–177 

ÁÁÁÁ 

1.29 

ÁÁÁÁÁ 

47 ÁÁÁÁ 


1.120 

ÁÁÁÁ 

–177 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

200 

ÁÁÁÁÁ 

1.14 

ÁÁÁÁÁ 

45 

ÁÁÁÁ 

–24 

ÁÁÁÁÁ 

–176 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.902 

ÁÁÁÁ 

–177 


1.030 

ÁÁÁÁ 

ÁÁÁÁ 

210 

ÁÁÁÁÁ 


–177 

ÁÁÁÁ 

1.02 

ÁÁÁÁÁ 

44 ÁÁÁÁ 


0.941 

ÁÁÁÁ 

–175 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

220 

ÁÁÁÁÁ 

0.94 

ÁÁÁÁÁ 

46 

ÁÁÁÁ 

–19 

ÁÁÁÁÁ 

–174 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.907 

ÁÁÁÁ 

–177 


0.903 

ÁÁÁÁ 

ÁÁÁÁ 

230 

ÁÁÁÁÁ 


–178 

ÁÁÁÁ 

0.89 

ÁÁÁÁÁ 

45 ÁÁÁÁ 


0.957 ÁÁÁÁ 

–177 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

240 

ÁÁÁÁÁ 

0.87 

ÁÁÁÁÁ 

46 

ÁÁÁÁ 

–15 

ÁÁÁÁÁ 

–179 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.912 

ÁÁÁÁ 

–178 


0.961 

ÁÁÁÁ 

ÁÁÁÁ 

250 

ÁÁÁÁÁ 


–178 

ÁÁÁÁ 

0.86 

ÁÁÁÁÁ 

44 ÁÁÁÁ 


1.020 

ÁÁÁÁ 

–178 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

260 

ÁÁÁÁÁ 

0.83 

ÁÁÁÁÁ 

42 

ÁÁÁÁ 

–17 

ÁÁÁÁÁ 

–178 

ÁÁÁÁ 

ÁÁÁÁÁ 

270 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.918 

ÁÁÁÁ 

–178 

ÁÁÁÁÁ 

0.922 

ÁÁÁÁ 

–178 

ÁÁÁÁÁ 

0.80 

ÁÁÁÁ 

36 

0.014 


ÁÁÁÁÁ 

ÁÁÁÁ 

1.120 

ÁÁÁÁ 

1.140 –180 

–19 

ÁÁÁÁÁ 


ÁÁÁÁ 

REV 1 


ÁÁÁÁ 

11

Table 2. Common Source S–Parameters (VDS = 24 V, ID = 0.35 mA) continued 

f 

S11 S21 S12 S22 

MHz |S11| φ |S21| φ |S12| φ |S22| φ 


280 0.925 –179 

ÁÁÁÁÁ 

0.73 

ÁÁÁÁ 

ÁÁÁÁ 

34 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.013 

ÁÁÁÁ 

–20 1.110 

ÁÁÁÁÁ 

–179 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

290 

ÁÁÁÁÁ 

–179 

ÁÁÁÁÁ 

0.65 

ÁÁÁÁÁ 

32 

ÁÁÁÁ 

–18 

ÁÁÁÁ 

–177 

ÁÁÁÁ 

0.927 

ÁÁÁÁ 

0.011 

ÁÁÁÁÁ 

0.994 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

300 

ÁÁÁÁÁ 

0.929 ÁÁÁÁ 

–179 

ÁÁÁÁÁ 

0.62 

ÁÁÁÁÁ 

32 ÁÁÁÁ 

0.011 

ÁÁÁÁÁ 

–15 

ÁÁÁÁ 


–177 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

310 ÁÁÁÁÁ –179 ÁÁÁÁÁ 


34 ÁÁÁÁ –9 ÁÁÁÁ –177 

ÁÁÁÁ 

0.931 ÁÁÁÁ 



ÁÁÁÁÁ 

320 ÁÁÁÁÁ 

0.932 ÁÁÁÁ 

–180 ÁÁÁÁÁ 


33 ÁÁÁÁ 


–6 ÁÁÁÁ 0.934 ÁÁÁÁÁ 

–180 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 



34 ÁÁÁÁ –4 ÁÁÁÁ –180 

ÁÁÁÁ 

0.934 ÁÁÁÁ 



ÁÁÁÁÁ 


0.937 ÁÁÁÁ 180 ÁÁÁÁÁ 


33 ÁÁÁÁ 



179 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

350 ÁÁÁÁÁ 180 ÁÁÁÁÁ 


30 ÁÁÁÁ 0 ÁÁÁÁ –179 

ÁÁÁÁ 

0.939 ÁÁÁÁ 



ÁÁÁÁÁ 




25 ÁÁÁÁ 


0 ÁÁÁÁ 1.110 ÁÁÁÁÁ 

–178 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 




ÁÁÁÁ 

0.943 ÁÁÁÁ 



ÁÁÁÁÁ 




22 ÁÁÁÁ 



–179 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 




ÁÁÁÁ 

0.945 ÁÁÁÁ 



ÁÁÁÁÁ 




27 ÁÁÁÁ 



–178 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 



26 ÁÁÁÁ 20 ÁÁÁÁ –180 

ÁÁÁÁ 

0.947 ÁÁÁÁ 



ÁÁÁÁÁ 




26 ÁÁÁÁ 



179 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 



23 ÁÁÁÁ 25 ÁÁÁÁ 179 

ÁÁÁÁ 

0.950 ÁÁÁÁ 



ÁÁÁÁÁ 




21 ÁÁÁÁ 



180 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 



18 ÁÁÁÁ 28 ÁÁÁÁ –180 

ÁÁÁÁ 

0.953 ÁÁÁÁ 



ÁÁÁÁÁ 




17 ÁÁÁÁ 



178 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 




ÁÁÁÁ 

0.955 ÁÁÁÁ 



ÁÁÁÁÁ 




19 ÁÁÁÁ 



–179 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 




ÁÁÁÁ 

0.957 ÁÁÁÁ 



ÁÁÁÁÁ 




20 ÁÁÁÁ 



178 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 




ÁÁÁÁ 

0.956 ÁÁÁÁ 



ÁÁÁÁÁ 




13 ÁÁÁÁ 



174 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 




ÁÁÁÁ 

0.963 ÁÁÁÁ 



ÁÁÁÁÁ 




11 ÁÁÁÁ 



171 


0.969 ÁÁÁÁ 

ÁÁÁÁÁ 


0.09 ÁÁÁÁ 

7 


70 ÁÁÁÁ 

ÁÁÁÁÁ 

1.000 169 


ÁÁÁÁÁ 

Table 3. Common Source S–Parameters (VDS = 28 V, ID = 0.39 mA) 


ÁÁÁÁÁ 

f 

S11 S21 S12 S22 

MHz |S11| φ |S21| φ |S12| φ |S22| φ 


30 0.834 –169 ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

10.08 93 0.021 ÁÁÁÁÁ ÁÁÁÁ 

4 0.807 ÁÁÁÁÁ 

–171 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 



83 ÁÁÁÁ –4 ÁÁÁÁ –170 

ÁÁÁÁ 

0.863 ÁÁÁÁ 



ÁÁÁÁÁ 

50 ÁÁÁÁÁ 

0.857 ÁÁÁÁ 



81 ÁÁÁÁ 



–173 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 



81 ÁÁÁÁ –3 ÁÁÁÁ –175 

ÁÁÁÁ 

0.851 ÁÁÁÁ 



ÁÁÁÁÁ 

70 ÁÁÁÁÁ 

0.848 ÁÁÁÁ 



82 ÁÁÁÁ 



–177 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 



80 ÁÁÁÁ –1 ÁÁÁÁ –177 

ÁÁÁÁ 

0.852 ÁÁÁÁ 



ÁÁÁÁÁ 

90 ÁÁÁÁÁ 

0.860 ÁÁÁÁ 



77 ÁÁÁÁ 



–176 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 



71 ÁÁÁÁ –9 ÁÁÁÁ –175 

ÁÁÁÁ 

0.869 ÁÁÁÁ 



ÁÁÁÁÁ 

110 

ÁÁÁÁÁ 

0.876 ÁÁÁÁ 


2.68 

ÁÁÁÁÁ 

66 ÁÁÁÁ 


–14 

ÁÁÁÁ 


–176 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

120 

ÁÁÁÁÁ 


2.31 

ÁÁÁÁÁ 

63 

ÁÁÁÁ 

–14 

ÁÁÁÁ 

–174 

ÁÁÁÁ 

ÁÁÁÁ 

0.878 

ÁÁÁÁ 

0.879 

130 

ÁÁÁÁÁ 

–176 ÁÁÁÁÁ ÁÁÁÁÁ 

2.03 

ÁÁÁÁ 

62 



–15 

ÁÁÁÁ 



–175 


ÁÁÁÁÁ 

REV 1 

12 


ÁÁÁÁÁ

Table 3. Common Source S–Parameters (VDS = 28 V, ID = 0.39 mA) continued 

f 

S11 S21 S12 S22 

MHz |S11| φ |S21| φ |S12| φ |S22| φ 


140 0.881 –176 

ÁÁÁÁÁ 

1.87 

ÁÁÁÁÁ 

ÁÁÁÁ 

62 0.018 

ÁÁÁÁ 

–13 ÁÁÁÁÁ ÁÁÁÁÁ 

0.884 

ÁÁÁÁ 

–176 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

150 

ÁÁÁÁÁ 

1.79 

ÁÁÁÁÁ 

62 

ÁÁÁÁ 

–11 

ÁÁÁÁÁ 

–177 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.883 

ÁÁÁÁ 

–176 


0.934 

ÁÁÁÁ 

ÁÁÁÁ 

160 

ÁÁÁÁÁ 


–177 

ÁÁÁÁ 

1.72 

ÁÁÁÁÁ 

62 ÁÁÁÁ 


1.020 

ÁÁÁÁ 

–177 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

170 

ÁÁÁÁÁ 

1.64 

ÁÁÁÁÁ 

58 

ÁÁÁÁ 

–12 

ÁÁÁÁÁ 

–176 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.890 

ÁÁÁÁ 

–177 


1.090 

ÁÁÁÁ 

ÁÁÁÁ 

180 

ÁÁÁÁÁ 


–177 

ÁÁÁÁ 

1.56 

ÁÁÁÁÁ 

54 ÁÁÁÁ 


1.150 

ÁÁÁÁ 

–176 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

190 

ÁÁÁÁÁ 

1.42 

ÁÁÁÁÁ 

48 

ÁÁÁÁ 

–21 

ÁÁÁÁÁ 

–177 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.901 

ÁÁÁÁ 

–177 


1.110 

ÁÁÁÁ 

ÁÁÁÁ 

200 

ÁÁÁÁÁ 


–177 

ÁÁÁÁ 

1.26 

ÁÁÁÁÁ 

46 ÁÁÁÁ 


1.030 

ÁÁÁÁ 

–176 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

210 

ÁÁÁÁÁ 

1.13 

ÁÁÁÁÁ 

45 

ÁÁÁÁ 

–14 

ÁÁÁÁÁ 

–175 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.907 

ÁÁÁÁ 

–177 


0.938 

ÁÁÁÁ 

ÁÁÁÁ 

220 

ÁÁÁÁÁ 


–177 

ÁÁÁÁ 

1.03 

ÁÁÁÁÁ 

47 ÁÁÁÁ 

0.013 

ÁÁÁÁÁ 

–13 

ÁÁÁÁÁ 

0.897 ÁÁÁÁ 

–174 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

230 

ÁÁÁÁÁ 

0.99 

ÁÁÁÁÁ 

46 

ÁÁÁÁ 

–15 

ÁÁÁÁÁ 

–176 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.910 

ÁÁÁÁ 

–178 

0.014 

ÁÁÁÁÁ 

0.948 

ÁÁÁÁ 

ÁÁÁÁ 

240 

ÁÁÁÁÁ 


–178 

ÁÁÁÁ 

0.96 

ÁÁÁÁÁ 

47 ÁÁÁÁ 

0.014 

ÁÁÁÁÁ 

–13 

ÁÁÁÁÁ 

0.956 ÁÁÁÁ 

–179 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 

250 

ÁÁÁÁÁ 

0.95 

ÁÁÁÁÁ 

45 

ÁÁÁÁ 

–10 

ÁÁÁÁÁ 

–178 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.916 

ÁÁÁÁ 

–178 

0.014 

ÁÁÁÁÁ 

1.020 

ÁÁÁÁ 

ÁÁÁÁ 

260 

ÁÁÁÁÁ 


–178 

ÁÁÁÁ 

0.93 

ÁÁÁÁÁ 

42 ÁÁÁÁ 

0.013 

ÁÁÁÁÁ 

–12 

ÁÁÁÁÁ 

1.120 ÁÁÁÁ 

–178 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 270 ÁÁÁÁÁ 


37 ÁÁÁÁ –15 ÁÁÁÁÁ –179 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.922 ÁÁÁÁ 

–179 


1.140 ÁÁÁÁ 



–179 ÁÁÁÁ 




1.110 ÁÁÁÁ –178 

ÁÁÁÁÁ 

ÁÁÁÁ 



33 ÁÁÁÁ –16 ÁÁÁÁÁ –176 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.927 ÁÁÁÁ 

–179 


0.988 ÁÁÁÁ 







0.944 ÁÁÁÁ –177 

ÁÁÁÁÁ 

ÁÁÁÁ 



35 ÁÁÁÁ 5 ÁÁÁÁÁ –177 

ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.931 ÁÁÁÁ 

–179 


0.920 ÁÁÁÁ 






16 ÁÁÁÁÁ 

0.936 ÁÁÁÁ –180 

ÁÁÁÁÁ 

ÁÁÁÁ 




ÁÁÁÁ 

ÁÁÁÁÁ 

ÁÁÁÁÁ 

0.934 ÁÁÁÁ 

–180 


0.989 ÁÁÁÁ 



180 ÁÁÁÁ 



3 ÁÁÁÁÁ 

1.050 ÁÁÁÁ 180 

ÁÁÁÁÁ 

ÁÁÁÁ 

ÁÁÁÁ 350 ÁÁÁÁÁ 180 ÁÁÁÁ 



ÁÁÁÁÁ 



1.080 ÁÁÁÁ 



179 ÁÁÁÁ 



8 ÁÁÁÁÁ 

1.110 ÁÁÁÁ –178 

ÁÁÁÁÁ 

ÁÁÁÁ 




ÁÁÁÁÁ 



1.070 ÁÁÁÁ 



179 ÁÁÁÁ 



17 ÁÁÁÁÁ 

1.010 ÁÁÁÁ –178 

ÁÁÁÁÁ 

ÁÁÁÁ 




ÁÁÁÁÁ 



0.949 ÁÁÁÁ 



178 ÁÁÁÁ 



20 ÁÁÁÁÁ 

0.922 ÁÁÁÁ –178 

ÁÁÁÁÁ 

ÁÁÁÁ 




ÁÁÁÁÁ 



0.995 ÁÁÁÁ 



178 ÁÁÁÁ 



29 ÁÁÁÁÁ 

1.030 ÁÁÁÁ 179 

ÁÁÁÁÁ 

ÁÁÁÁ 



24 ÁÁÁÁ 41 ÁÁÁÁÁ 179 

ÁÁÁÁÁ 



1.060 ÁÁÁÁ 



177 ÁÁÁÁ 



40 ÁÁÁÁÁ 

1.090 ÁÁÁÁ 180 

ÁÁÁÁÁ 

ÁÁÁÁ 




ÁÁÁÁÁ 



1.090 ÁÁÁÁ 



177 ÁÁÁÁ 



26 ÁÁÁÁÁ 

1.070 ÁÁÁÁ 178 

ÁÁÁÁÁ 

ÁÁÁÁ 




ÁÁÁÁÁ 



0.983 ÁÁÁÁ 



176 ÁÁÁÁ 



43 ÁÁÁÁÁ 

0.964 ÁÁÁÁ –180 

ÁÁÁÁÁ 

ÁÁÁÁ 




ÁÁÁÁÁ 



0.956 ÁÁÁÁ 



176 ÁÁÁÁ 



65 ÁÁÁÁÁ 

0.993 ÁÁÁÁ 178 

ÁÁÁÁÁ 

ÁÁÁÁ 




ÁÁÁÁÁ 



0.926 ÁÁÁÁ 



172 ÁÁÁÁ 



64 ÁÁÁÁÁ 

0.984 ÁÁÁÁ 174 

ÁÁÁÁÁ 

ÁÁÁÁ 




ÁÁÁÁÁ 



0.961 ÁÁÁÁ 



168 ÁÁÁÁ 


9 ÁÁÁÁ 0.028 ÁÁÁÁÁ 81 ÁÁÁÁÁ 

0.967 ÁÁÁÁ 171 



ÁÁÁÁ 


0.10 ÁÁÁÁ 

6 


73 ÁÁÁÁÁ 

ÁÁÁÁ 

0.997 169 


ÁÁÁÁ 

REV 1 


ÁÁÁÁ 

13

Figure 16. MRF275G Test Fixture 

RF POWER MOSFET CONSIDERATIONS 

MOSFET CAPACITANCES 

The physical structure of a MOSFET results in capacitors 

between the terminals. The metal oxide gate structure determines 

the capacitors from gate–to–drain (Cgd), and gate–to– 

source (Cgs). The PN junction formed during the fabrication 

of the MOSFET results in a junction capacitance from drain– 

to–source (Cds). 

These capacitances are characterized as input (Ciss), output 

(Coss) and reverse transfer (Crss) capacitances on data 

sheets. The relationships between the inter–terminal capacitances 

and those given on data sheets are shown below. The 

Ciss can be specified in two ways: 

1. Drain shorted to source and positive voltage at the gate. 

2. Positive voltage of the drain in respect to source and zero 

volts at the gate. In the latter case the numbers are lower. 

However, neither method represents the actual operating 

conditions in RF applications. 

GA TE 

Cgd 

Cgs 

DRAIN 

Cds 

SOURCE 

Ciss = Cgd + Cgs 

Coss = Cgd + Cds 

Crss = Cgd 

The Ciss given in the electrical characteristics table was 

measured using method 2 above. It should be noted that 

Ciss, Coss, Crss are measured at zero drain current and are 

provided for general information about the device. They are 

not RF design parameters and no attempt should be made to 

use them as such. 

DRAIN CHARACTERISTICS 

One figure of merit for a FET is its static resistance in the 

full–on condition. This on–resistance, VDS(on), occurs in the 

linear region of the output characteristic and is specified under 

specific test conditions for gate–source voltage and drain 

current. For MOSFETs, VDS(on) has a positive temperature 

coefficient and constitutes an important design consideration 

at high temperatures, because it contributes to the power 

dissipation within the device. 

GATE CHARACTERISTICS 

The gate of the MOSFET is a polysilicon material, and is 

electrically isolated from the source by a layer of oxide. The 

input resistance is very high — on the order of 109 ohms — 

resulting in a leakage current of a few nanoamperes. 

Gate control is achieved by applying a positive voltage 

slightly in excess of the gate–to–source threshold voltage, 

VGS(th). 

Gate Voltage Rating — Never exceed the gate voltage 

rating (or any of the maximum ratings on the front page). Exceeding 

the rated VGS can result in permanent damage to 

the oxide layer in the gate region. 

Gate Termination — The gates of this device are essentially 

capacitors. Circuits that leave the gate open–circuited 

or floating should be avoided. These conditions can result in 

turn–on of the devices due to voltage build–up on the input 

capacitor due to leakage currents or pickup. 

Gate Protection — These devices do not have an internal 

monolithic zener diode from gate–to–source. If gate protection 

is required, an external zener diode is recommended. 

Using a resistor to keep the gate–to–source impedance 

low also helps damp transients and serves another important 

function. Voltage transients on the drain can be coupled to 

the gate through the parasitic gate–drain capacitance. If the 

gate–to–source impedance and the rate of voltage change 

on the drain are both high, then the signal coupled to the gate 

REV 1 

14

may be large enough to exceed the gate–threshold voltage 

and turn the device on. 

HANDLING CONSIDERATIONS 

When shipping, the devices should be transported only in 

antistatic bags or conductive foam. Upon removal from the 

packaging, careful handling procedures should be adhered 

to. Those handling the devices should wear grounding straps 

and devices not in the antistatic packaging should be kept in 

metal tote bins. MOSFETs should be handled by the case 

and not by the leads, and when testing the device, all leads 

should make good electrical contact before voltage is applied. 

As a final note, when placing the FET into the system it 

is designed for, soldering should be done with grounded 

equipment. 

DESIGN CONSIDERATIONS 

The MRF275G is a RF power N–channel enhancement 

mode field–effect transistor (FETs) designed for HF, VHF and 

UHF power amplifier applications. M/A-COM RF MOSFETs 

feature a vertical structure with a planar design. 

M/A-COM Application Note AN211A, FETs in Theory and 

Practice, is suggested reading for those not familiar with the 

construction and characteristics of FETs. 

The major advantages of RF power FETs include high 

gain, low noise, simple bias systems, relative immunity from 

thermal runaway, and the ability to withstand severely mismatched 

loads without suffering damage. Power output can 

be varied over a wide range with a low power dc control signal. 

DC BIAS 

The MRF275G is an enhancement mode FET and, therefore, 

does not conduct when drain voltage is applied. Drain 

current flows when a positive voltage is applied to the gate. 

RF power FETs require forward bias for optimum performance. 

The value of quiescent drain current (IDQ) is not critical 

for many applications. The MRF275G was characterized 

at IDQ = 100 mA, each side, which is the suggested minimum 

value of IDQ. For special applications such as linear amplification, 

IDQ may have to be selected to optimize the critical 

parameters. 

The gate is a dc open circuit and draws no current. Therefore, 

the gate bias circuit may be just a simple resistive divider 

network. Some applications may require a more elaborate 

bias system. 

GAIN CONTROL 

Power output of the MRF275G may be controlled from its 

rated value down to zero (negative gain) by varying the dc 

gate voltage. This feature facilitates the design of manual 

gain control, AGC/ALC and modulation systems. 

REV 1 

15

PACKAGE DIMENSIONS 

R 

E 

K 

1 2 

3 4 

D 

U 

G 

N 

5 

Q RADIUS 2 PL 

–B– 

J 

0.25 (0.010) M T A M B M 

NOTES: 

1. DIMENSIONING AND TOLERANCING PER ANSI 

Y14.5M, 1982. 

2. CONTROLLING DIMENSION: INCH. 

INCHES MILLIMETERS 

DIM MIN MAX MIN MAX 

A 1.330 1.350 33.79 34.29 

B 0.370 0.410 9.40 10.41 

C 0.190 0.230 4.83 5.84 

D 0.215 0.235 5.47 5.96 

E 0.050 0.070 1.27 1.77 

G 0.430 0.440 10.92 11.18 

H 0.102 0.112 2.59 2.84 

J 0.004 0.006 0.11 0.15 

K 0.185 0.215 4.83 5.33 

N 0.845 0.875 21.46 22.23 

Q 0.060 0.070 1.52 1.78 

R 0.390 0.410 9.91 10.41 

U 1.100 BSC 27.94 BSC 

H 

–A– 

C 

–T– 

SEATING 

PLANE 

STYLE 2: 

PIN 1. DRAIN 

2. DRAIN 

3. GATE 

4. GATE 

5. SOURCE 

CASE 375–04 

ISSUE D 

Specifications subject to change without notice. 

• North America: Tel. (800) 366-2266, Fax (800) 618-8883 

• Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 

• Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 

Visit www.macom.com for additional data sheets and product information. 

REV 1 

16

MRF275G Data Sheet - CB Tricks

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