Sirion 200 Product Data - FEI Company
Sirion 200 Product Data - FEI Company Sirion 200 Product Data - FEI Company
PRODUCT DATA More from low kV Technologies, materials and samples are changing faster than ever before in Material Science, Life Science and Semiconductors. To speed up research and failure analysis, analytical tools are needed to collect detailed information in Less time. The SirionTM Series from FEI is the advanced, Ultra High Resolution solution for current and future Structural ResearchTM applications. The unique Field Emission Sirion column with through-the-lens detection technology, make it possible to generate ultra-high resolution, Low KV SE and BSE images. Thin samples can be observed with a STEM detector, which makes it possible to do Bright- and Dark Field STEM imaging with a resolution of < 1nm. For Analysis the Sirion microscopes can be equipped with EDX, WDX or EBSD detectors. The Sirion Column is beam blanker prepared, which enables the Sirion to do Lithography experiments. Further more it is possible to install a Gas Injection System (GIS) on the Sirion for E-beam deposition. Sirion 200 Ultra-high resolution For structural research Sirion 200 essential specifications Resolution: Scanning Transmission Electron Imaging (STEM*) • < 1nm at > 10 kV *optional Secondary Electron Imaging (SE) • 1.5 nm at > 10kV • 2.5 nm at 1 kV • 3.5 nm at 500V Backscatter Electron Imaging (BSE) • 5.5 nm at 500V Magnification: • 12x to 1.000.000x Accelerating voltage: • 200V to 30kV Emitter: • In-house Schottky emitter with high stability • Fully automatic operation Maximum probe current • 22nA Vacuum system: • 1x MagLev 250l/s TMP • 1x PVP • Chamber vacuum < 1e-4 mBar • Typical pump down time < 3.5 minutes Detectors: • Through the Lens SE and BSE detector with user selectable energy threshold* • Everhardt-Thornley SED* • IR-CCD* • STEM • Solid-State BSED • Centaurus BSED/CLD
PRODUCT DATA<br />
More from low kV<br />
Technologies, materials and samples are changing<br />
faster than ever before in Material Science, Life Science<br />
and Semiconductors. To speed up research and failure<br />
analysis, analytical tools are needed to collect detailed<br />
information in Less time.<br />
The <strong>Sirion</strong>TM Series from <strong>FEI</strong> is the advanced, Ultra<br />
High Resolution solution for current and future<br />
Structural ResearchTM applications. The unique Field<br />
Emission <strong>Sirion</strong> column with through-the-lens detection<br />
technology, make it possible to generate ultra-high<br />
resolution, Low KV SE and BSE images. Thin samples<br />
can be observed with a STEM detector, which makes it<br />
possible to do Bright- and Dark Field STEM imaging<br />
with a resolution of < 1nm. For Analysis the <strong>Sirion</strong><br />
microscopes can be equipped with EDX, WDX or<br />
EBSD detectors. The <strong>Sirion</strong> Column is beam blanker<br />
prepared, which enables the <strong>Sirion</strong> to do Lithography<br />
experiments. Further more it is possible to install a<br />
Gas Injection System (GIS) on the <strong>Sirion</strong> for E-beam<br />
deposition.<br />
<strong>Sirion</strong> <strong>200</strong><br />
Ultra-high resolution<br />
For structural research<br />
<strong>Sirion</strong> <strong>200</strong> essential specifications<br />
Resolution:<br />
Scanning Transmission Electron Imaging (STEM*)<br />
• < 1nm at > 10 kV<br />
*optional<br />
Secondary Electron Imaging (SE)<br />
• 1.5 nm at > 10kV<br />
• 2.5 nm at 1 kV<br />
• 3.5 nm at 500V<br />
Backscatter Electron Imaging (BSE)<br />
• 5.5 nm at 500V<br />
Magnification:<br />
• 12x to 1.000.000x<br />
Accelerating voltage:<br />
• <strong>200</strong>V to 30kV<br />
Emitter:<br />
• In-house Schottky emitter with high stability<br />
• Fully automatic operation<br />
Maximum probe current<br />
• 22nA<br />
Vacuum system:<br />
• 1x MagLev 250l/s TMP<br />
• 1x PVP<br />
• Chamber vacuum < 1e-4 mBar<br />
• Typical pump down time < 3.5 minutes<br />
Detectors:<br />
• Through the Lens SE and BSE detector with user<br />
selectable energy threshold*<br />
• Everhardt-Thornley SED*<br />
• IR-CCD*<br />
• STEM<br />
• Solid-State BSED<br />
• Centaurus BSED/CLD
300<br />
400<br />
PRODUCT DATA<br />
Chamber:<br />
• 284 mm diameter<br />
• 5 mm analytical WD<br />
• 8 ports<br />
• EDX take-off 35 deg at zero tilt<br />
4-axis motorized stage<br />
• Eucentric goniometer stage<br />
• X = 50 mm<br />
• Y = 50 mm<br />
• Z = 50 mm (25mm motorized)<br />
• T = -15° - + 75° (Motorisation<br />
optional)<br />
• R = 360° continuous<br />
Image processor:<br />
• Up to 3800 x 2800 pixels.<br />
• File type: TIFF, BMP or JPEG<br />
Image display<br />
• 2x 18-inch LCD monitors<br />
• Single frame or 4-quad image<br />
display<br />
• Frame average or integration<br />
620<br />
Extention<br />
Cabinet 1<br />
0<br />
Extention<br />
Cabinet 2<br />
18'' LCD<br />
acc. table top Extention Cabinet<br />
(cable length: 500 cm)<br />
1400<br />
18'' LCD<br />
1000 mm.<br />
750<br />
750<br />
System control:<br />
• <strong>FEI</strong>’s MCTRL user interface with<br />
Windows <strong>200</strong>0TM controlled by<br />
mouse, Keyboard and multifunctional<br />
control panel (optional)<br />
Standard utilities:<br />
• <strong>Data</strong> archive software<br />
• Report generation wizard<br />
• Multiple image alignment software<br />
• Differential Contrast Enhancement<br />
filter<br />
• Image histogram and measurement<br />
software<br />
Accessories:<br />
• External serial control software<br />
• External analog interface<br />
• Multi-user SW shell<br />
• Video hard copy unit<br />
• Electrical feedthrough<br />
• High speed Beam Blanker<br />
(Lithography)<br />
360<br />
1000<br />
900<br />
1000<br />
1000<br />
<strong>FEI</strong> <strong>Company</strong><br />
World Headquarters and<br />
North American Sales<br />
7451 NW Evergreen Parkway<br />
Hillsboro, OR 97124-5830<br />
Tel: +1 503 640 7500<br />
Fax: +1 503 844 2615<br />
e-mail: sales@feico.com<br />
www.feicompany.com<br />
• Gas Injection System (GIS)<br />
for E-beam deposition<br />
• S2-93 compliance kit<br />
• EDX<br />
• WDX<br />
• EBSP<br />
Installation requirements:<br />
• Power:<br />
- 230 V (+6%, -10%)<br />
- Frequency: 50 Hz or 60 Hz (+/- 1%)<br />
- Power consumption: < 16 A<br />
- Earth resistance: < 0.1 Ohm<br />
• Envirionment:<br />
- Room temperature: 20°C +/- 3°C<br />
- Relative Humidity: below 80%<br />
- Stray AC magnetic fields:<br />
< 100 nT a-synchronous<br />
< 300 nT synchronous<br />
- Floor vibration level: according to<br />
graphs in pre-install manual<br />
- Acoustic lvel: according to graphs in<br />
pre-install manual<br />
- Dry Nitrogen supply (venting):<br />
1.2 Bar<br />
- Water cooling: 20° +/- 3°C, stability<br />
< 0.2°C/10 min.<br />
- Door width: > 76 cm<br />
- Weight: 725 kg<br />
European Sales<br />
Tel: +31 40 27 66 429<br />
Fax: +31 40 27 66 786<br />
Asia-Pacific Sales<br />
Tel: +65 351 7671<br />
Fax: +65 354 0644<br />
©<strong>200</strong>3. We are constantly improving the performance of our products, so all<br />
specifications are subject to change without notice. The <strong>FEI</strong> logo, The Structural<br />
Process Management <strong>Company</strong> are trademarks of <strong>FEI</strong> <strong>Company</strong>. Windows is<br />
a trademark of Microsoft Corporation.<br />
Sample: Magnetospirillum<br />
magnetotacticum on PMMA,<br />
courtesy Werner Cebulla,<br />
University of Regensburg.<br />
032-DS00111 01/03
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