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Focused ion beam technology, capabilities and ... - FEI Company

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12<br />

Figure 21: Cantilever with proof-mass<br />

machined from a Si 2N 3 membrane.<br />

Figure 22: Image of a spring, supporting the<br />

proof-mass of a MEMS accelerometer. The<br />

support spring has been weakened by <strong>ion</strong><br />

<strong>beam</strong> removal of half of the spring thickness.<br />

Figure 23: Image of the spring, that has now<br />

been strengthened with <strong>ion</strong> <strong>beam</strong> deposited<br />

SiO 2.<br />

Courtesy: “University of Birmingham, Research Centre<br />

for Micro Engineering <strong>and</strong> Nano-<strong>technology</strong>.<br />

Figure 24: Low magnificat<strong>ion</strong> SE image of a<br />

fungal infect<strong>ion</strong> in wood. This untreated<br />

sample was imaged at low magnificat<strong>ion</strong> <strong>and</strong><br />

low <strong>beam</strong> current for 30 minutes without<br />

noticeable deteriorat<strong>ion</strong>.<br />

manufacturing process matures. New<br />

product development can be ramped<br />

up <strong>and</strong> product introduct<strong>ion</strong> cycles<br />

shortened by including direct device<br />

customizat<strong>ion</strong> into the product<br />

development process. Demonstrate<br />

funct<strong>ion</strong>ing devices <strong>and</strong> debug your<br />

control systems while the product<strong>ion</strong><br />

process is fine-tuned. For example,<br />

change the spring constant of an<br />

accelerometer or simply create a new<br />

structure in <strong>and</strong> on a thin film.<br />

Optical MEMS<br />

Check the structure, the robustness<br />

<strong>and</strong> the failure mechanisms of optical<br />

devices. Monitor the applied<br />

process <strong>and</strong> maximize the yield for<br />

cost effective product<strong>ion</strong>.<br />

Routers, multiplexers, wave-guides<br />

<strong>and</strong> transmiss<strong>ion</strong> media all rely on<br />

exact dimens<strong>ion</strong>s for their performance.<br />

High aspect ratio microstructures<br />

provide convent<strong>ion</strong>al top down<br />

metrology solut<strong>ion</strong>s with unavoidable<br />

physical restrict<strong>ion</strong>s. Only by<br />

progressing to three-dimens<strong>ion</strong>al<br />

characterizat<strong>ion</strong> can a true underst<strong>and</strong>ing<br />

of the manufacturing performance<br />

be acquired.<br />

The metrology of wave-guides can be<br />

automated <strong>and</strong> process failures identified<br />

<strong>and</strong> eliminated before costly<br />

device yield is affected. The communicat<strong>ion</strong><br />

b<strong>and</strong>width requirements for<br />

optical devices are continuously<br />

increasing <strong>and</strong> therefore process control<br />

is becoming increasingly important.<br />

Now the device producer can<br />

switch to the enhanced control <strong>and</strong><br />

cost savings already enjoyed by the<br />

semiconductor industry.<br />

Figure 25: Image of a biopsy of bone material.<br />

The biopsy-to-be is completely created by<br />

FIB milling only.<br />

Figure 26: Bone material biopsy after extract<strong>ion</strong>.<br />

Figure 27: An AFM tip, CVD gold coated <strong>and</strong><br />

then FIB machined to remove the gold on the<br />

pyramid slope to leave only a gold tip at the<br />

point of surface contact. Different bio-materials<br />

can be grown here as they easily bind to<br />

the gold <strong>and</strong> the forces exerted on this specimen<br />

during subsequent interact<strong>ion</strong>s can be<br />

directly monitored.

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