Focused ion beam technology, capabilities and ... - FEI Company
Focused ion beam technology, capabilities and ... - FEI Company
Focused ion beam technology, capabilities and ... - FEI Company
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12<br />
Figure 21: Cantilever with proof-mass<br />
machined from a Si 2N 3 membrane.<br />
Figure 22: Image of a spring, supporting the<br />
proof-mass of a MEMS accelerometer. The<br />
support spring has been weakened by <strong>ion</strong><br />
<strong>beam</strong> removal of half of the spring thickness.<br />
Figure 23: Image of the spring, that has now<br />
been strengthened with <strong>ion</strong> <strong>beam</strong> deposited<br />
SiO 2.<br />
Courtesy: “University of Birmingham, Research Centre<br />
for Micro Engineering <strong>and</strong> Nano-<strong>technology</strong>.<br />
Figure 24: Low magnificat<strong>ion</strong> SE image of a<br />
fungal infect<strong>ion</strong> in wood. This untreated<br />
sample was imaged at low magnificat<strong>ion</strong> <strong>and</strong><br />
low <strong>beam</strong> current for 30 minutes without<br />
noticeable deteriorat<strong>ion</strong>.<br />
manufacturing process matures. New<br />
product development can be ramped<br />
up <strong>and</strong> product introduct<strong>ion</strong> cycles<br />
shortened by including direct device<br />
customizat<strong>ion</strong> into the product<br />
development process. Demonstrate<br />
funct<strong>ion</strong>ing devices <strong>and</strong> debug your<br />
control systems while the product<strong>ion</strong><br />
process is fine-tuned. For example,<br />
change the spring constant of an<br />
accelerometer or simply create a new<br />
structure in <strong>and</strong> on a thin film.<br />
Optical MEMS<br />
Check the structure, the robustness<br />
<strong>and</strong> the failure mechanisms of optical<br />
devices. Monitor the applied<br />
process <strong>and</strong> maximize the yield for<br />
cost effective product<strong>ion</strong>.<br />
Routers, multiplexers, wave-guides<br />
<strong>and</strong> transmiss<strong>ion</strong> media all rely on<br />
exact dimens<strong>ion</strong>s for their performance.<br />
High aspect ratio microstructures<br />
provide convent<strong>ion</strong>al top down<br />
metrology solut<strong>ion</strong>s with unavoidable<br />
physical restrict<strong>ion</strong>s. Only by<br />
progressing to three-dimens<strong>ion</strong>al<br />
characterizat<strong>ion</strong> can a true underst<strong>and</strong>ing<br />
of the manufacturing performance<br />
be acquired.<br />
The metrology of wave-guides can be<br />
automated <strong>and</strong> process failures identified<br />
<strong>and</strong> eliminated before costly<br />
device yield is affected. The communicat<strong>ion</strong><br />
b<strong>and</strong>width requirements for<br />
optical devices are continuously<br />
increasing <strong>and</strong> therefore process control<br />
is becoming increasingly important.<br />
Now the device producer can<br />
switch to the enhanced control <strong>and</strong><br />
cost savings already enjoyed by the<br />
semiconductor industry.<br />
Figure 25: Image of a biopsy of bone material.<br />
The biopsy-to-be is completely created by<br />
FIB milling only.<br />
Figure 26: Bone material biopsy after extract<strong>ion</strong>.<br />
Figure 27: An AFM tip, CVD gold coated <strong>and</strong><br />
then FIB machined to remove the gold on the<br />
pyramid slope to leave only a gold tip at the<br />
point of surface contact. Different bio-materials<br />
can be grown here as they easily bind to<br />
the gold <strong>and</strong> the forces exerted on this specimen<br />
during subsequent interact<strong>ion</strong>s can be<br />
directly monitored.